HSPA/UMTS/GSM/GPRS Module Series
UG96&UG95&M95 R2.0 Compatible Design
UG96&UG95&M95 R2.0_Compatible_Design 3 / 42
Contents
About the Document................................................................................................................................ 2
Contents.................................................................................................................................................... 3
Table Index ............................................................................................................................................... 4
Figure Index.............................................................................................................................................. 5
1Introduction....................................................................................................................................... 6
2General Descriptions........................................................................................................................ 7
2.1. Product Description ................................................................................................................7
2.2. Feature Overview ...................................................................................................................8
2.3. Pin Assignment.....................................................................................................................10
3Pin Description................................................................................................................................ 12
4Hardware Reference Design........................................................................................................... 19
4.1. Power Supply ....................................................................................................................... 19
4.1.1. Power Supply Reference Design................................................................................. 19
4.1.2. Decrease Voltage Drop................................................................................................20
4.2. Power-on Circuit...................................................................................................................20
4.3. Power-off Circuit................................................................................................................... 22
4.3.1. Turn off Module Using AT Command...........................................................................22
4.3.2. Turn off M95 R2.0 Using PWRKEY Pin....................................................................... 22
4.3.3. Emergency Shutdown.................................................................................................. 23
4.4. Network Status Indication..................................................................................................... 24
4.5. Operation Status Indication................................................................................................... 25
4.6. (U)SIM Interface ...................................................................................................................25
4.7. UART Interface..................................................................................................................... 26
4.8. USB Interface....................................................................................................................... 27
4.9. Audio Interfaces....................................................................................................................28
4.10. RF Interface.......................................................................................................................... 28
5Recommended Footprint and Stencil Design............................................................................... 30
5.1. Recommended Compatible Footprint...................................................................................30
5.2. Recommended Stencil Design..............................................................................................32
5.3. Installation Sketch Map......................................................................................................... 35
6Manufacturing and Packaging ....................................................................................................... 36
6.1. Manufacturing and Soldering................................................................................................ 36
6.2. Packaging.............................................................................................................................37
7Appendix A References.................................................................................................................. 41