Quectel EG25-GL Supplement

EG25-GL
Hardware Design
LTE Standard Module Series
Version: 1.0.0
Date: 2022-09-09
Status: Preliminary

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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for your failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-09-09
Ethan FANG/Joe MA
Creation of the document
1.0.0
2022-09-09
Ethan FANG/Joe MA
Preliminary

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
1.1 Special Marks..........................................................................................................................12
2Product Overview ..............................................................................................................................13
2.1 Frequency Bands and Functions.............................................................................................13
2.2 Key Features ...........................................................................................................................14
2.3 Functional Diagram .................................................................................................................17
2.4 Pin Assignment........................................................................................................................18
2.5 Pin Description.........................................................................................................................19
2.6 EVB Kit.....................................................................................................................................27
3Operating Characteristics.................................................................................................................28
3.1 Operating Modes.....................................................................................................................28
3.2 Sleep Mode..............................................................................................................................29
3.2.1 UARTApplication Scenario............................................................................................29
3.2.2 USB Application Scenario..............................................................................................29
3.2.2.1 USB Application with USB Remote Wakeup Function ........................................29
3.2.2.2 USBApplication with USB Suspend/Resume and MAIN_RI Function ...............30
3.2.2.3 USBApplication without USB Suspend Function................................................31
3.2.3 Airplane Mode................................................................................................................31
3.3 Power Supply...........................................................................................................................32
3.3.1 Power Supply Pins.........................................................................................................32
3.3.2 Voltage Stability Requirements......................................................................................33
3.3.3 Reference Design for Power Supply..............................................................................34
3.3.4 Power Supply Voltage Monitoring..................................................................................35
3.4 Turn On....................................................................................................................................35
3.4.1 Turn On with PWRKEY..................................................................................................35
3.5 Turn Off....................................................................................................................................37
3.5.1 Turn Off with PWRKEY..................................................................................................37
3.5.2 Turn Off with AT Command............................................................................................37
3.6 Reset........................................................................................................................................38
4Application Interfaces .......................................................................................................................40
4.1 (U)SIM Interface ......................................................................................................................40
4.2 USB Interface ..........................................................................................................................42
4.3 UART Interfaces......................................................................................................................43
4.4 PCM and I2C Interfaces..........................................................................................................46

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4.5 SD Card Interface....................................................................................................................48
4.6 WLAN and BluetoothApplication Interfaces...........................................................................50
4.6.1 WLAN Application Interface...........................................................................................53
4.6.2 Bluetooth Application Interface*.....................................................................................53
4.7 ADC Interfaces ........................................................................................................................53
4.8 SGMII Interface........................................................................................................................54
4.9 Indication Signals.....................................................................................................................56
4.9.1 Network Status Indication..............................................................................................56
4.9.2 STATUS..........................................................................................................................58
4.9.3 MAIN_RI.........................................................................................................................58
4.10 USB_BOOT.............................................................................................................................59
5RF Specifications...............................................................................................................................61
5.1 Cellular Network ......................................................................................................................61
5.1.1 Antenna Interface & Frequency Bands..........................................................................61
5.1.2 Tx Power........................................................................................................................63
5.1.3 Rx Sensitivity..................................................................................................................63
5.1.4 Reference Design ..........................................................................................................65
5.2 GNSS.......................................................................................................................................66
5.2.1 Antenna Interface & Frequency Bands..........................................................................66
5.2.2 GNSS Performance .......................................................................................................67
5.2.3 Reference Design ..........................................................................................................68
5.3 RF Routing Guidelines ............................................................................................................68
5.4 Antenna Design Requirements ...............................................................................................70
5.5 RF Connector Recommendation.............................................................................................71
6Electrical Characteristics and Reliability........................................................................................73
6.1 Absolute Maximum Ratings.....................................................................................................73
6.2 Power Supply Ratings.............................................................................................................74
6.3 Power Consumption................................................................................................................74
6.4 ESD Protection........................................................................................................................79
6.5 Operating and Storage Temperatures.....................................................................................80
7Mechanical Information.....................................................................................................................81
7.1 Mechanical Dimensions...........................................................................................................81
7.2 Recommended Footprint.........................................................................................................83
7.3 Recommended Compatible Footprint......................................................................................84
7.4 Top and Bottom Views.............................................................................................................85
8Storage, Manufacturing and Packaging..........................................................................................86
8.1 Storage Conditions..................................................................................................................86
8.2 Manufacturing and Soldering ..................................................................................................87
8.3 Packaging Specifications.........................................................................................................88
8.3.1 Carrier Tape....................................................................................................................89
8.3.2 Plastic Reel ....................................................................................................................89
8.3.3 Packaging Process ........................................................................................................90

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9. Appendix References........................................................................................................................92

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Table Index
Table 1: Special Marks............................................................................................................................... 12
Table 2: Frequency Bands and Functions .................................................................................................13
Table 3: Key Features of EG25-GL Module............................................................................................... 14
Table 4: I/O Parameters Definition............................................................................................................. 19
Table 5: Pin Description .............................................................................................................................20
Table 6: Overview of Operating Modes...................................................................................................... 28
Table 7: Pin Definition of VBAT and GND Pins.......................................................................................... 32
Table 8: Pin Definition of PWRKEY............................................................................................................35
Table 9: Pin Definition of RESET_N........................................................................................................... 38
Table 10: Pin Definition of (U)SIM Interface............................................................................................... 40
Table 11: Pin Definition of USB Interface................................................................................................... 42
Table 12: Pin Definition of Main UART Interface .......................................................................................44
Table 13: Pin Definition of Debug UART Interface..................................................................................... 44
Table 14: Pin Definition of PCM and I2C Interfaces ..................................................................................47
Table 15: Pin Definition of SD Card Interface............................................................................................ 48
Table 16: Pin Definition of WLAN & BluetoothApplication Interfaces ....................................................... 50
Table 17: Pin Definition ofADC Interfaces.................................................................................................53
Table 18: Characteristic of ADC.................................................................................................................54
Table 19: Pin Definition of SGMII Interface................................................................................................ 54
Table 20: Pin Definition of Network Connection Status/Activity Indication................................................ 57
Table 21: Working State of Network Connection Status/Activity Indication...............................................57
Table 22: Pin Definition of STATUS............................................................................................................ 58
Table 23: Behaviors of MAIN_RI................................................................................................................59
Table 24: Pin Definition of USB_BOOT Interface ...................................................................................... 59
Table 25: Pin Definition ofAntenna Antennas............................................................................................ 61
Table 26: Frequency Bands ....................................................................................................................... 61
Table 27: Tx Power..................................................................................................................................... 63
Table 28: EG25-GL Conducted RF Receiving Sensitivity.......................................................................... 63
Table 29: Pin Definition of GNSSAntenna Interface .................................................................................66
Table 30: GNSS Frequency .......................................................................................................................66
Table 31: GNSS Performance.................................................................................................................... 67
Table 32: Antenna Requirements............................................................................................................... 70
Table 33: Absolute Maximum Ratings........................................................................................................ 73
Table 34: Power Supply Ratings................................................................................................................74
Table 35: EG25-GL Current Consumption.................................................................................................74
Table 36: Electrostatic Discharge Characteristics (25 ºC , 45 % Relative Humidity).................................79
Table 37: Operating and Storage Temperatures........................................................................................ 80
Table 38: Recommended Thermal Profile Parameters.............................................................................. 88
Table 39: Carrier Tape Dimension Table (Unit: mm)..................................................................................89
Table 40: Plastic Reel Dimension Table (Unit: mm)................................................................................... 90
Table 41: Related Documents.................................................................................................................... 92

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Table 42: Terms and Abbreviations............................................................................................................92

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Figure Index
Figure 1: Functional Diagram.....................................................................................................................17
Figure 2: Pin Assignment (Top View).........................................................................................................18
Figure 3: Sleep Mode Application via UART.............................................................................................. 29
Figure 4: Sleep Mode Application with USB Remote Wakeup..................................................................30
Figure 5: Sleep Mode Application with MAIN_RI.......................................................................................30
Figure 6: Sleep Mode Application without Suspend Function................................................................... 31
Figure 7: Power Supply Limits during Burst Transmission........................................................................33
Figure 8: Star Structure of the Power Supply............................................................................................34
Figure 9: Reference Circuit of Power Supply............................................................................................. 34
Figure 10: Turn On the Module by Using Driving Circuit...........................................................................35
Figure 11: Turn On the Module by Using a Button.....................................................................................36
Figure 12: Power-up Timing....................................................................................................................... 36
Figure 13: Power-down Timing .................................................................................................................. 37
Figure 14: Reference Circuit of RESET_N by Using Driving Circuit .........................................................38
Figure 15: Reference Circuit of RESET_N by Using a Button ..................................................................39
Figure 16: Reset Timing............................................................................................................................. 39
Figure 17: Reference Circuit of (U)SIM Interface with an 8-pin (U)SIM Card Connector......................... 41
Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector ........................... 41
Figure 19: Reference Circuit of USB Interface .......................................................................................... 43
Figure 20: Reference Circuit with Translator Chip..................................................................................... 45
Figure 21: Reference Circuit with Transistor Circuit.................................................................................. 45
Figure 22: Primary Mode Timing................................................................................................................46
Figure 23: Auxiliary Mode Timing............................................................................................................... 47
Figure 24: Reference Circuit of PCM and I2CApplication with Audio Codec ...........................................48
Figure 25: Reference Circuit of SD Card Interface....................................................................................49
Figure 26: Reference Circuit of WLAN & BluetoothApplication Interfaces with FC20 Series/FC21 ........ 52
Figure 27: Simplified Block Diagram for EthernetApplication...................................................................55
Figure 28: Reference Circuit of SGMII Interface with PHYAR8033 Application....................................... 56
Figure 29: Reference Circuit of the Network Indication............................................................................. 57
Figure 30: Reference Circuits of STATUS .................................................................................................58
Figure 31: Reference Circuit of USB_BOOT Interface.............................................................................. 60
Figure 32: Timing Sequence for Entering Emergency Download Mode....................................................60
Figure 33: Reference Circuit of RF Antenna Interface............................................................................... 65
Figure 34: Reference Circuit of GNSS Antenna ........................................................................................67
Figure 35: Microstrip Design on a 2-layer PCB......................................................................................... 69
Figure 36: Coplanar Waveguide Design on a 2-layer PCB....................................................................... 69
Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)....................69
Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)....................70
Figure 39: Dimensions of the Receptacle (Unit: mm)................................................................................71
Figure 40: Specifications of Mated Plugs ..................................................................................................72
Figure 41: Space Factor of Mated Connectors (Unit: mm)........................................................................ 72

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Figure 42: Module Top and Side Dimensions............................................................................................ 81
Figure 43: Bottom Dimensions (Bottom View)........................................................................................... 82
Figure 44: Recommended Footprint (Top View)........................................................................................83
Figure 45: Recommended Compatible Footprint (Top View)..................................................................... 84
Figure 46: Top and Bottom Views of the Module.......................................................................................85
Figure 47: Recommended Reflow Soldering Thermal Profile ...................................................................87
Figure 48: Carrier Tape Dimension Drawing.............................................................................................. 89
Figure 49: Plastic Reel Dimension Drawing ..............................................................................................89
Figure 50: Packaging Process...................................................................................................................91

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1Introduction
This document defines EG25-GL module and describes its air interface and hardware interfaces which
are connected with your applications.
With this document, you can quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. The document, coupled with
application notes and user guides, makes it easy to design and set up mobile applications with the
module.
1.1 Special Marks
Table 1: Special Marks
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin
name, AT command, or argument, it indicates that the function, feature, interface, pin, AT
command, or argument is under development and currently not supported; and the asterisk (*)
after a model indicates that the sample of the model is currently unavailable.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1,
SDIO_DATA2, and SDIO_DATA3.

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2Product Overview
2.1 Frequency Bands and Functions
EG25-GL is an LTE/WCDMA/GSM wireless communication module with receive diversity. It provides data
connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, UMTS, EDGE and GPRS
networks. It also provides GNSS and voice functionality for your specific applications. The following table
shows the supported frequency bands, GNSS and digital audio functions of EG25-GL module.
Table 2: Frequency Bands and Functions
With a compact profile of 29.0 mm ×32.0 mm ×2.4 mm, EG25-GL can meet most requirements for M2M
applications such as automation, smart metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EG25-GL is an SMD type module which can be embedded into applications through its 144 LGA
1
pins.
1
LGA form factor is used for EG25-GL module, while LCC is recommended only in the compatible design with EC25
series/EC21 series/EC20-CE/EG21-G/EG25-G/EC200A series modules.
Mode
EG25-GL
GSM
GSM850/EGSM900/DCS1800/PCS1900
WCDMA
(With receive diversity)
B1/B2/B4/B5/B6/B8/B19
LTE-FDD
(With receive diversity)
B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28/B66
LTE-TDD
(With receive diversity)
B34/B38/B39/B40/B41
GNSS (Optional)
GPS, GLONASS, BDS, Galileo, QZSS
Digital Audio (PCM)
Supported
VoLTE (Voice over LTE)
Optional

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2.2 Key Features
The following table describes the detailed features of EG25-GL module.
Table 3: Key Features of EG25-GL Module
Features
Description
Power Supply
⚫Supply voltage: 3.3–4.3 V
⚫Typical supply voltage: 3.8 V
Transmitting Power
⚫Class 4 (33 dBm ±2 dB) for GSM850
⚫Class 4 (33 dBm ±2 dB) for EGSM900
⚫Class 1 (30 dBm ±2 dB) for DCS1800
⚫Class 1 (30 dBm ±2 dB) for PCS1900
⚫Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
⚫Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
⚫Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
⚫Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
⚫Class 3 (24 dBm +1/-3 dB) for WCDMAbands
⚫Class 3 (23 dBm ±2 dB) for LTE-FDD bands
⚫Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
⚫Supports up to non-CACat 4 FDD and TDD
⚫Supports 1.4/3/5/10/15/20 MHz RF bandwidth
⚫Supports MIMO in DL direction
⚫LTE-FDD: Max. 150 Mbps (DL), Max. 50 Mbps (UL)
⚫LTE-TDD: Max. 130 Mbps (DL), Max. 30 Mbps (UL)
UMTS Features
⚫Supports 3GPP Rel-8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
⚫Supports QPSK, 16QAM and 64QAM modulation
⚫DC-HSDPA: Max. 42 Mbps (DL)
⚫HSUPA: Max. 5.76 Mbps (UL)
⚫WCDMA: Max. 384 kbps (DL), Max. 384 kbps (UL)
GSM Features
⚫GPRS:
-Supports GPRS multi-slot class 33 (33 by default)
-Coding scheme: CS 1–4
-Max. 107 kbps (DL), Max. 85.6 kbps (UL)
⚫EDGE:
-Supports EDGE multi-slot class 33 (33 by default)
-Supports GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
-Downlink coding schemes: MCS 1–9
-Uplink coding schemes: MCS 1–9
-Max. 296 kbps (DL), Max. 236.8 kbps (UL)

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Internet Protocol
Features
⚫Supports TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/
SMTP/SSL/MQTT/CMUX/SMTPS/FILE/MMS protocols
⚫Supports PAP and CHAP for PPP connections
SMS
⚫Text and PDU modes
⚫Point-to-point MO and MT
⚫SMS cell broadcast
⚫SMS storage: ME by default
(U)SIM Interface
Supports USIM/SIM card: 1.8 V, 3.0 V
Audio Features
⚫Supports one digital audio interface: PCM interface
⚫GSM: HR/FR/EFR/AMR/AMR-WB
⚫WCDMA: AMR/AMR-WB
⚫LTE: AMR/AMR-WB
⚫Supports echo cancellation and noise suppression
PCM Interface
⚫Used for audio function with external codec
⚫Supports 16-bit linear data format
⚫Supports long frame synchronization and short frame synchronization
⚫Supports master and slave modes in short frame synchronization, and only
supports master mode in long frame synchronization
USB Interface
⚫Compliant with USB 2.0 specification (slave only); the data transfer rate can
reach up to 480 Mbps
⚫Used for AT command communication, data transmission, GNSS NMEA
sentence output, software debugging, firmware upgrade and voice over USB
⚫Supports USB serial drivers for: Windows 7/8/8.1/10/11, Linux 2.6–5.18,
Android 4.x–12.x, etc.
UART Interfaces
⚫Main UART:
-Used for AT command communication and data transmission
-Baud rates reach up to 921600 bps, 115200 bps by default
-Support RTS and CTS hardware flow control
⚫Debug UART:
-Used for Linux console and log output
-115200bps baud rate
SD Card Interface
Supports SD 3.0 protocol
SGMII Interface
⚫Supports 10/100/1000 Mbps Ethernet work mode
⚫Supports maximum 150 Mbps (DL)/50 Mbps (UL) for 4G network
Rx-diversity
Supports LTE/WCDMA Rx-diversity
GNSS Features
⚫Protocol: NMEA 0183
⚫Data update rate: 1 Hz by default
AT Commands
⚫Compliant with 3GPP TS 27.007, 3GPP TS 27.005
⚫Compliant with Quectel enhanced AT commands
Network Indication
⚫Two pins NET_MODE and NET_STATUS to indicate network connectivity
status

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2
Within operating temperature range, the module is 3GPP compliant.
3
Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice,
SMS, data transmission, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not influenced,
while one or more specifications, such as Pout, may exceed the specified tolerances of 3GPP. When the temperature
returns to the operating temperature range, the module meets 3GPP specifications again.
Antenna Interfaces
⚫Main antenna interface (ANT_MAIN)
⚫Rx-diversity antenna interface (ANT_DIV)
⚫GNSS antenna interface (ANT_GNSS)
Physical
Characteristics
⚫Size: (29.0 ±0.2) mm ×(32.0 ±0.2) mm ×(2.4 ±0.2) mm
⚫Package: LGA
⚫Weight: approx. 4.9 g
Temperature Range
⚫Operating temperature range: -35 °C to +75 °C 2
⚫Extended temperature range: -40 °C to +85 °C 3
⚫Storage temperature range: -40 °C to +90 °C
Firmware Upgrade
USB interface or DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive.

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2.3 Functional Diagram
The following figure shows a block diagram of EG25-GL and illustrates the major functional parts.
⚫Power management
⚫Baseband
⚫DDR2+NAND flash
⚫Radio frequency
⚫Peripheral interfaces
ANT_MAIN ANT_DIVANT_GNSS
VBAT_BB
VBAT_RF
PWRKEY
ADCs
VDD_EXT USB (U)SIM PCM UARTsI2C
RESET_N
STATUS
GPIOs
Control
IQ Control
Tx
PRx DRx
WLAN SDBluetooth
SGMII
PMU
19.2M
XO
Transceiver NAND
DDR2
SDRAM
Baseband
APT
SAW
SAW
SAW
Switch
Duplex
PAM
PA
LNA
Figure 1: Functional Diagram

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2.4 Pin Assignment
The following figure shows the pin assignment of EG25-GL module.
34
3
35 36 20 21 22 23 24 25 26 27 28 29 30 31 32 33
1
4
5
6
7
2
WAKEUP_IN
AP_READY
RESERVED
W_DISABLE#
NET_MODE
NET_STATUS
VDD_EXT
GND
GND
DBG_RXD
DBG_TXD
USIM_VDD
USIM_DATA
USIM_CLK
USIM_RST
RESERVED
8
9
10
11
12
13
14
15
16
17
18
19
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55
USIM_GND
GND
RESET_N
PWRKEY
GND
SD_DET
SD_DATA3 SD_DATA2 SD_DATA1 SD_DATA0
SD_CLK SD_CMD
ANT_DIV
GND
GND
USB_VBUS
USB_DM
USB_DP
MAIN_RXD
MAIN_TXD
MAIN_DTR
MAIN_RTS
MAIN_CTS
MAIN_DCD
MAIN_RI
STATUS
VBAT_BB VBAT_BB VBAT_RF
VBAT_RF
GND
RESERVED
GND
GND
ANT_MAIN
GND
ANT_GNSS
GND
ADC1
RESERVED
I2C_SDA
I2C_SCL
ADC0
GND
GND
GND
73
74
75
76
77
78
79
80
81
82
83
84
100
101
102
106
107
111
112
103
104
109
105
110
89
94
98
88
93
97
86
91
96
85
90
95
99
87
92
108
113
RESERVED
RESERVED
117
126
125
124
123
122
121
118
127
128
115 USB_BOOT
RESERVED
116
140
137
136
135
134
133
132
131
130
129
114
SD_PU_VDD
Power Pins Signal Pins
GND Pins
RESERVED
RESERVED
141
142
RESERVED
RESERVED
143
144
119
120
WLAN Pins RESERVED Pins
Bluetooth Pins
PCM_DIN PCM_DOUT PCM_SYNC PCM_CLK
BT_CTS
BT_RXD
BT_TXD
BT_RTS
139
138
SGMII Pins
USIM_DET
Figure 2: Pin Assignment (Top View)
1. BOOT_CONFIG pins (WAKEUP_IN, NET_MODE, WLAN_EN, COEX_RXD, COEX_TXD,
USB_BOOT and BT_CTS*) cannot be pulled up before startup.
2. PWRKEY output voltage is 0.8 V because of the diode drop in the baseband chipset.
3. USB_BOOT and COEX_RXD are connected inside the module and share the same network.
NOTE

LTE Standard Module Series
EG25-GL_Hardware_Design 19 / 96
4. Pins 37–40, 118, 127 and 129–139 are used for WLAN & Bluetooth application interfaces, among
which pins 118, 127 and 129–138 are WLAN function pins, and the rest are Bluetooth function*pins.
5. Pins 119–126 and 128 are used for SGMII interface.
6. Pins 24–27 of PCM interface can be used not only for audio function on EG25-GL module, but also
for Bluetooth function*on FC20 series or FC21 module.
7. Keep all RESERVED pins and unused pins unconnected.
8. GND pin 85–112 should be connected to ground in the design. RESERVED pin 73–84 should not be
designed in schematic and PCB decal, and these pins should be served as a keepout area.
2.5 Pin Description
The following tables show the pin definition of EG25-GL module. DC characteristics include power
domain and rate current.
Table 4: I/O Parameters Definition
Type
Description
AI
Analog Input
AO
Analog Output
AIO
Analog Input/Output
DI
Digital Input
DO
Digital Output
DIO
Digital Input/Output
OD
Open Drain
PI
Power Input
PO
Power Output