Ebyte E01-ML01D User manual

E01C-ML01D User Manual
Si24R1 2.4GHz SPI DIP Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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CONTENTS
1.Overview............................................................................................................................................................2
1.1 Brief introduction....................................................................................................................................2
1.2 Features...................................................................................................................................................2
1.3 Application..............................................................................................................................................2
2. Specification and parameter..............................................................................................................................3
2.1 Limit parameter.......................................................................................................................................3
2.2 Operating parameter................................................................................................................................3
3. Size and pin definition...................................................................................................................................... 4
4.Basic operation...................................................................................................................................................5
4.1 Hardware design................................................................................................................................ 5
4.2 Software editing.................................................................................................................................5
5 Circuit diagram...................................................................................................................................................6
6. FAQ.................................................................................................................................................................. 6
6.1 Communication range is too short.......................................................................................................... 6
6.2 Module is easy to damage.......................................................................................................................6
6.3 BER(Bit Error Rate) is high...................................................................................................................6
7.Soldering guidance.............................................................................................................................................7
7.1 Reflow soldering temperature.................................................................................................................7
7.2 Reflow soldering curve...........................................................................................................................7
8 Packing method for bulk order.......................................................................................................................... 8
Revision history.................................................................................................................................................... 8
About us................................................................................................................................................................8

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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1.Overview
1.1 Brief introduction
E01C-ML01D is a small size DIP module based on Si24R1, operates at
2.4Ghz with PCB antenna, using industrial-grade high-precision 16MHz
crystal oscillator. The RF performance of it and components selection during
R&D are all in accordance with industrial grade standards.
The user needs to use the MCU driver or use a dedicated SPI debugging
tool to develop E01C-ML01D.
1.2 Features
Small size, 12.6x22.6mm；
Communication distance tested is up to 300m；
The maximum transmit power is 5mW, and the software is multi-level adjustable;
Global license-free ISM 2.4GHz frequency band;
2Mbps, 1Mbps and 250kbps air rate;
125 communication channels to meet application requirements such as multipoint communication, grouping, and
frequency hopping;
Connect with MCU through SPI interface, the rate is 0～10Mbps;
2.0～3.6V power supply, power supply greater than 3.3V can guarantee the best performance;
Industrial standard design for long-term use at -40～+85℃;
Comes with PCB onboard antenna, no need for external antenna;
Fully compatible with E01-ML01D in software, hardware and packaging.
1.3 Application
Wearable device；
Smart home and industrial sensors；
Security system, positioning system；
Wireless remote control, drone；
Wireless game remote control；
Healthcare products；
Wireless voice, wireless headset；
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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2. Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supply（V）
0
3.6
Voltage over 3.6V will cause
permanent damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Operating temperature（℃）
-40
85
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operating voltage（V）
2.0
3.3
3.6
≥3.3V ensures output power
Communication level（V）
3.3
For 5V TTL, it may be at risk of
burning down
Operating temperature（℃）
-40
-
+85
Industrial design
Operating frequency（MHz）
2.4
-
2.525
Support ISM band
Power
consumption
Tx current
12
0dBm
Rx current
15
Sleep current
0.7
Software is shut down
Max Tx power（dBm）
-
7
-
Receiving sensitivity（dBm）
-
-83
-
Air data rate is 2Mbps
Air data rate（bps）
250k
-
2M
Controlled via user’s programming
Main parameter
Description
Remark
Distance for reference
300m
Test condition：clear and open area, antenna gain: 5dBi，antenna
height: 2.5m，air data rate: 250kbps
FIFO
32Byte
Max length transmitted each time
Crystal frequency
16MHz
Modulation
GFSK
Package
DIP
Connector
2.54mm pin header
Communication interface
SPI
0-10Mbps
Size
12.6 * 22.6mm
Antenna
PCB antenna
50ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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3. Size and pin definition
Pin No.
Pin item
Pin direction
Pin application
1
GND
Ground
2
VCC
Power supply must be 2.0 ~ 3.6V
3
CE
Input
Chip Enable
4
CSN
Input
SPI Chip select
5
SCK
Input
SPI clock
6
MOSI
Input
SPI master output slave input
7
MISO
Output
SPI master input slave output
8
IRQ
Output
Interrupt request.

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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4.Basic operation
4.1 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and the
module needs to be reliably grounded；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection
may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the maximum
value the module will be permanently damaged;
Please check the stability of the power supply, the voltage can not be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin,
so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts
with large electromagnetic interference;
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it
is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on
the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in
the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the
performance. It is recommended to keep them away from the module according to the strength of the interference. If
necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power
traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the
module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a
risk of damage)；
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that
the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna
extension cable to extend the antenna to the outside；
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.
Conductors or other sources of interference should be avoided around the onboard PCB antenna.
4.2 Software editing
Insert the module into the user circuit board, use the microcontroller to communicate with the module by SPI or serial port,
and operate the control register and the transceiver buffer through the SPI command to complete the wireless data transmit
and receive function.
As interrupt pin for IRQ, it can be used to wake-up MCU and achieve fast response; But the user can get the interrupt
status through SPI (not recommended, it is not conducive to the overall power consumption, and with low efficiency）；
CE pin can be high level for long-term, but it needs to set as POWER DOWN mode when the module writes registers, and
it is recommended that CE is controlled by MCU pin；

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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5 Circuit diagram
6. FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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7.Soldering guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb
Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃to peak temperature
Time to peak temperature for
25℃
6 minutes max
8 minutes max
7.2 Reflow soldering curve

Chengdu Ebyte Electronic Technology Co., Ltd E01C-ML01D User Manual
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8 Packing method for bulk order
Revision history
Version
Date
Description
Issued by
1.0
2020-06-19
Original version
Ren
1.1
2020-06-29
Format updated
Ren
About us
Technical support: suppo[email protected]
Documents and RF Setting download link:：www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: [e-mail]
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