
ICENI/AI-04
INDEX
1FOREWORD............................................................................................................5
2GENERAL USE.......................................................................................................6
2.1 General........................................................................................................6
2.2 Product Condition......................................................................................6
2.3 Signal Connection......................................................................................6
2.4 Module Damage / Repair............................................................................6
3PRODUCT OVERVIEW...........................................................................................7
3.1 Iceni Node...................................................................................................7
3.2 ICENIbus Interface .....................................................................................8
3.3 Field Wiring Interface.................................................................................9
4ICENI/AI-04 KEY FEATURES...............................................................................10
5PRODUCT SPECIFICATION ................................................................................11
5.1 Electrical Properties.................................................................................11
5.1.1 Power Supply Input ......................................................................11
5.1.2 Signal Channels ...........................................................................11
5.1.3 Fault Status Indication..................................................................11
5.1.4 Signal Isolation.............................................................................11
5.1.5 Field Wiring Termination...............................................................12
5.2 Mechanical Properties .............................................................................13
5.2.1 Temperature Range .....................................................................13
5.2.2 Material.........................................................................................13
5.2.3 Weight ..........................................................................................13
5.2.4 Ingress Protection.........................................................................13
5.2.5 Dimensions...................................................................................13
6UNPACKING & INITIAL PREPARATION FOR USE............................................14
6.1 Unpacking.................................................................................................14
6.2 Node Assembly ........................................................................................14
6.3 Node Disassembly ...................................................................................14
6.4 Module Positioning Within a Node .........................................................15
7FIELD WIRING TERMINATION ............................................................................16
7.1 Terminal & Connector Layout.................................................................16
7.2 Wiring Schematic .....................................................................................16
7.3 Earthing / Grounding ...............................................................................17
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