Renesas ISL81801DEMO1Z User manual

ISL81801DEMO1Z
Demonstration Board
R16UH0005EU0100 Rev.1.00 Page 1 of 18
Oct.16.20
User Manual
The ISL81801DEMO1Z demonstration board (shown in Figure 8) features the ISL81801, a 80V high voltage
synchronous buck-boost controller that provides external soft-start, independent enable functions, and integrates
UV/OV/OC/OT protection. Programmable switching frequency ranging from 100kHz to 600kHz helps to optimize
the inductor size while the strong gate driver delivers up to 20A for the buck-boost output.
Key Features
• Wide input range: 32V to 80V
• Bidirectional operation
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/PWM operation
• Optional CC/HICCUP OCP protection
• Supports prebias output with soft-start
• PGOOD indicator
• OVP, OTP, and UVP protection
• Parallelable operation
Specifications
The ISL81801DEMO1Z demonstration board is designed for high current applications. The current rating of the
ISL81801DEMO1Z is limited by the FETs and inductor selected. The ISL81801DEMO1Z electrical ratings are
shown in Ta ble 1.
Ordering Information
Related Literature
For a full list of related documents, visit our website:
•ISL81801 product page
Table 1. Electrical Ratings
Parameter Rating
Input Voltage 32V to 80V
Switching Frequency 200kHz
Output Voltage 48V
Output Current 10A
OCP Set Point Minimum 11A at ambient room temperature
Part Number Description
ISL81801DEMO1Z Parallelable high voltage buck-boost controller demonstration board

ISL81801DEMO1Z R16UH0005EU0100 Rev.1.00 Page 2 of 18 Oct.16.20
Figure 1. ISL81801DEMO1Z Block Diagram
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ISL81801DEMO1Z 1. Functional Description
R16UH0005EU0100 Rev.1.00 Page 3 of 18
Oct.16.20
1. Functional Description
The ISL81801DEMO1Z demonstrates the performance of the ISL81801 TQFN IC. The board provides an easy
and complete demonstration of all the IC and board functions.
As shown in Figure 7, 32V to 80V VIN is supplied to J1(+) and J2(-). The regulated 48V output on J4(+) and J5(-)
can supply up to 10A to the load. Because of the high power efficiency, the demonstration board can run at 5A
continuously without airflow at room temperature ambient conditions.
Te s t p o i n ts T P 1through TP28 provide easy access to the IC pin and external signal injection terminals.
As shown in Figure 3, connector J8provides selection of either Forced PWM mode (shorting Pin 1 and Pin 2) or
DEM mode (shorting Pin 2 and Pin 3). Connector J9provides selection of either constant current limit (shorting
Pin 1 and Pin 2) or HICCUP OCP (shorting Pin 2 and Pin 3). Connector J3provides an option to disable the
converter by shorting its Pin 1 and Pin 2.
1.1 Recommended Testing Equipment
The following materials are recommended for testing:
• 0V to 80V power supply with at least 15A source current capability
• Electronic loads capable of sinking current up to 15A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
1.2 Operating Range
The input voltage range is from 32V to 80V for an output voltage of 48V. If the output voltage is set to a lower
value, the minimum VIN can be reset to a lower value by changing the ratio of R2and R3. The minimum EN
threshold that VIN can be set to is 4.5V.
The rated load current is 10A with the OCP point set at minimum 11A at ambient room temperature conditions.
The operating temperature range of this board is from -40°C to +85°C.
Note: Airflow is needed for higher temperature ambient conditions.
1.3 Parallel Operation
The ISL81801DEMO1Z demonstration board can operate in parallel, in a daisy chain setup.
Figure 2 shows the wiring of two units in parallel and Figure 3 shows three units in parallel. The phase shift
between the units are set by J6and J7. Tabl e 2 shows the combination.
Figure 2. Setup for Two Units in Parallel Figure 3. Setup for Three Units in Parallel
ISL81801DEMO1Z #2
J1
J2 J5
J4
J10
J11
VIN
GND
VOUT
GND
ISL81801DEMO1Z #1
J1
J2 J5
J4
J10
J11
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GND
VOUT
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-
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ISL81801DEMO1Z #3
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J4
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J11
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GND
VOUT
GND
ISL81801DEMO1Z #2
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J2 J5
J4
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J11
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GND
VOUT
GND
ISL81801DEMO1Z #1
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J4
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GND
VOUT
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Load
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ISL81801DEMO1Z 1. Functional Description
R16UH0005EU0100 Rev.1.00 Page 4 of 18
Oct.16.20
1.4 Bidirectional Operation
See Figure 5 for proper setup. Float the FBI pin (J7) and set the mode to PWM before powering on the board. The
rated voltage of the super capacitor must be higher than 48V.
1. Adjust the input voltage higher than 36V. Switch on the input power source.
2. Switch off the input power source after the super capacitor is fully charged.
1.5 Quick Test Guide
1. Jumper J8provides the option to select PWM or DEM. Jumper J9provides the option to select Constant current
limit or HICCUP. See Table 3 for the operating options. Ensure that the circuit is correctly connected to the
supply and electronic loads prior to applying any power. See Figure 7 for proper setup.
2. Turn on the power supply.
3. Adjust input voltage VIN within the specified range and observe the output voltage. The output voltage variation
should be within 3%.
4. Adjust the load current within the specified range and observe the output voltage. The output voltage variation
should be within 3%.
5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, see
Figure 6 for proper test setup.
Figure 4. Current Sharing Among Three Units
Figure 5. Proper Set-Up for Bidirectional Operation
Table 2. Set Phase Shift for Interleaving
CLK Lag
RT by (°) 90 60 180 120
J7FBI VC5 (1) VC5 (1) GND
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ISL81801DEMO1Z 1. Functional Description
R16UH0005EU0100 Rev.1.00 Page 5 of 18
Oct.16.20
Table 3. Operating Options
Jumper Position Function
3 EN-GND Disable output
EN Floating Enable output
6I
IN Floating Enable input current limit
IIN-VCC5 Disable input current limit
7 FBI-GND Disable VIN limit
FBI Floating Enable VIN limit
8Pin1-2 PWM
Pin 2-3 DEM
9 Pin 1-2 Constant current limit
Pin 2-3 HICCUP
Figure 6. Proper Probe Set-Up to Measure Output Ripple and Phase Node Ringing
Figure 7. Proper Test Setup
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ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 6 of 18
Oct.16.20
2. PCB Layout Guidelines
Careful attention to layout requirements is necessary for successful implementation of an ISL81801 based DC/DC
converter. The ISL81801 switches at a high frequency; therefore the switching times are short. At these switching
frequencies, even the shortest trace has significant impedance. The peak gate drive current also rises
significantly in an extremely short time. Transition speed of the current from one device to another causes voltage
spikes across the interconnecting impedances and parasitic circuit elements. These voltage spikes can degrade
efficiency, generate EMI, and increase device voltage stress and ringing. Careful component selection and proper
PC board layout minimizes the magnitude of these voltage spikes.
Three sets of components are critical when using the ISL81801 DC/DC converter:
• Controller
• Switching power components
• Small signal components
The switching power components are the most critical to the layout because they switch a large amount of energy,
which tends to generate a large amount of noise. The critical small signal components are those connected to
sensitive nodes or those supplying critical bias currents. A multilayer printed circuit board is recommended.
Complete the following steps to optimize the PCB layout.
1. Place the input capacitors, buck FETs, inductor, boost FETs, and output capacitor first. Isolate these power
components on dedicated areas of the board with their ground terminals adjacent to one another. Place the
input and output high frequency decoupling ceramic capacitors close to the MOSFETs.
2. If signal components and the IC are placed separately from the power train, Renesas recommends using full
ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise,
use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND
together close to the IC. DO NOT connect them together anywhere else.
3. Important: Keep the loop formed by the input capacitor, the buck top FET, and the buck bottom FET as small
as possible. Also, keep the loop formed by the output capacitor, the boost top FET, and the boost bottom FET
as small as possible.
4. Ensure the current paths from the input capacitor to the buck FETs, the power inductor, the boost FETs, and
the output capacitor are as short as possible with maximum allowable trace widths.
5. Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be
short and wide. Place the IC over a quiet ground area. Avoid switching ground loop currents in this area.
6. Place the VDD bypass capacitor close to the VDD pin of the IC and connect its ground end to the PGND pin.
Connect the PGND pin to the ground plane by a via.
Note: Do not connect the PGND pin directly to the SGND EPAD.
7. Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.
8. Place the output capacitors as close to the load as possible. Use short, wide copper regions to connect output
capacitors to the load to avoid inductance and resistance.
9. Use copper filled polygons or wide, short traces to connect the junction of the buck or boost upper FET, buck
or boost lower FET, and output inductor. Keep the buck and boost PHASE nodes connection to the IC short.
Important: DO NOT unnecessarily oversize the copper islands for the PHASE nodes. Because the phase
nodes are subjected to high dv/dt voltages, the stray capacitor formed between these islands and the
surrounding circuitry tend to couple switching noise.
10. Route all high speed switching nodes away from the control circuitry.
11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. Connect all
small signal grounding paths including feedback resistors, current monitoring resistors and capacitors,
soft-starting capacitors, loop compensation capacitors and resistors, and EN pull-down resistors to this SGND
plane.

ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 7 of 18
Oct.16.20
12. Use a pair of traces with minimum loop for the input or output current sensing connection.
13. Ensure the feedback connection to the output capacitor is short and direct.
2.1 ISL81801DEMO1Z Demonstration Board
Figure 8. ISL81801DEMO1Z Demonstration Board (Top)
Figure 9. ISL81801DEMO1Z Demonstration Board (Bottom)

ISL81801DEMO1Z 2. PCB Layout Guidelines R16UH0005EU0100 Rev.1.00 Page 8 of 18 Oct.16.20
2.2 ISL81801DEMO1Z Circuit Schematic
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ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 9 of 18
Oct.16.20
2.3 Bill of Materials
Qty Reference Designator Description Manufacturer Manufacturer Part
2 C31, C32 CAP, SMD, 0805, 10µF, 16V, 10%, X7S Murata GRM21BC71C106KE11L
16 C1, C5, C6, C8-C10,
C19-C24, C52-C55
CAP, SMD, 1210, 10µF, 100V, 10%, X7S Murata GRM32EC72A106KE05L
1 C60 CAP, SMD, 0603, 100pF, 50V, 10%, X7R Kemet C0603C101K5RACTU
3 C11, C15, C43 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R AVX 06035C102KAT2A
2 C50, C57 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R AVX 06035C102KAT2A
5 C12, C13, C41, C42,
C101
CAP, SMD, 0603, 0.01µF, 100V, 10%, X7R Kemet C0603C103K1RECAUTO
1 C33 CAP, SMD, 0603, 0.01µF, 50V, 10%, X7R AVX 06035C103KAT2A
2 C16, C46 CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R Venkel C0603X7R101-104KNE
3 C56, C58, C61 CAP, SMD, 0603, 0.1µF, 50V, 10%, X7R AVX 06035C104KAT2A
1 C40 CAP, SMD, 0603, 220pF, 50V, 10%, X7R Murata GRM188R71H221KA01D
1 C39 CAP, SMD, 0603, 0.022µF, 25V, 10%, X7R Murata GRM188R71E223KA01J
1 C36 CAP, SMD, 0603, 33000pF, 25V, 10%, X7R Panasonic ECJ-1VB1E333K
2 C59, C72 CAP, SMD, 0603, 470pF, 100V, 10%, X7R Vishay VJ0603Y471KXBA
2 C14, C45 CAP, SMD, 0603, .047µF, 25V, 10%, X7R Murata GRM188R71E473KA01D
2 C30, C37 CAP, SMD, 0603, 0.47µF, 25V, 10%, X7R Murata GRM188R71E474KA12D
1 C34 CAP, SMD, 0603, 820pF, 50V, 10%, X7R Kemet C0603C821K5RACTU
0 C17, C28, C35, C38,
C44, C48, C49
CAP, SMD, 0603, DNP-PLACE HOLDER
1 L1 COIL-PWR INDUCTOR, 15µH, 14A, 9mΩ,
SMD, 18.3, x9.1, WW
Wurth Elektronik 74439370150
8 C3, C4, C26, C27, C65,
C66, C67, C68
CAP, RADIAL, 12.5x26.5, 220µF, 100V, 20%,
ALUM.ELEC., 5mm
United Chemi-con
Panasonic
EKZN101ELL221MK25S
EEUFS2A221
6 TP16, TP18, TP20,
TP22, TP29, TP30
CONN-COMPACT TEST PT, VERTICAL,
WHT
Keystone 5007
1 J10 CONN-HEADER, TH, 2x40, R/A,
2.54mmPITCH, 11x5mm
Wurth Elektronik 61308021021
(or two 40 pin)
2 J3, J6 CONN-HEADER, 1x2, BRKAWY 1x36,
2.54mm
Berg/FCI 68000-236HLF
3 J7, J8, J9 CONN-HEADER, 1x3, BREAKAWY 1x36,
2.54mm
Berg/FCI 68000-236HLF
1 D3 DIODE-SCHOTTKY, AEC-Q101, SMD, 2P,
SOD-123, 30V, 200mA
Nexperia USA, Inc BAT54GWJ
2 D5, D0 DIODE-ZENER, SMD, SOD-323, 4.7V, 6%,
200mW
Micro Commercial
Components
BZT52C4V7S-TP
2 D1, D2 DIODE-SCHOTTKY, AEC-Q101, SMD,
SOD-123FA, 100V, 1A
ON Semiconductor S110FA
2 U2, U3 IC-DUAL OP AMP, RRIO, 8P, MSOP Renesas
Electronics America
ISL28213FUZ
1 U1 IC-80V 4-SWITCH PWM CONTROLLER, 32P,
TQFN, 5x5
Renesas
Electronics America
ISL81801FRTZ
8 Q1, Q2, Q3, Q4, Q5, Q6,
Q7, Q8
TRANSISTOR-MOS, N-CHANNEL, SMD, 8P,
PPK SO-8, 100V, 80A, ROHS
Infineon Technology BSC070N10NS5ATMA1
4 R8, R10, R35, R37 RES, SMD, 0603, 1Ω, 1/10W, 1%, TF Panasonic ERJ-3RQF1R0V
1 R4 RES, SMD, 0603, 10Ω, 1/10W, 1%, TF KOA RK73H1JT10R0F

ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 10 of 18
Oct.16.20
3 R46, R84, R85 RES, SMD, 0603, 20Ω, 1/10W, 1%, TF Panasonic ERJ-3EKF20R0V
11 R11, R15, R16, R19,
R20, R22-R24, R27-R29
RES, SMD, 0603, 2.2Ω, 1/10W, 1%, TF Panasonic ERJ-3RQF2R2V
1 R54 RES, SMD, 0603, 100Ω, 1/10W, 1%, TF Venkel CR0603-10W-1000FT
2 R110, R166 RES, SMD, 0603, 1k, 1/10W, 1%, TF Panasonic ERJ-3EKF1001V
4 R36, R67, R69, R70 RES, SMD, 0603, 10k, 1/10W, 1%, TF Venkel CR0603-10W-1002FT
3 R33, R73, R75 RES, SMD, 0603, 100k, 1/10W, 1%, TF Venkel CR0603-10W-1003FT
3 R68, R71, R72 RES, SMD, 0603, 1M, 1/10W, 1%, TF Panasonic ERJ-3EKF1004V
2 R40, R42 RES, SMD, 0603, 15k, 1/10W, 1%, TF Panasonic ERJ-3EKF1502V
1 R25 RES, SMD, 0603, 196k, 1/10W, 1%, TF Panasonic ERJ-3EKF1963V
1 R76 RES, SMD, 0603, 20k, 1/10W, 1%, TF Venkel CR0603-10W-2002FT
1 R26 RES, SMD, 0603, 2.7k, 1/10W, 1%, TF Venkel CR0603-10W-2701FT
1 R112 RES, SMD, 0603, 3.48k, 1/10W, 1%, TF Panasonic ERJ-3EKF3481V
1 R167 RES, SMD, 0603, 3.9k, 1/10W, 1%, TF Panasonic ERJ-3EKF3901V
2 R12, R18 RES, SMD, 0603, 40.2k, 1/10W, 1%, TF Yageo RC0603FR-0740K2L
1 R86 RES, SMD, 0603, 4.3M, 1/10W, 1%, TF Stackpole RMCF0603FT4M30
1 R7 RES, SMD, 0603, 43.2k, 1/10W, 1%, TF Yageo RC0603FR-0743K2L
1 R39 RES, SMD, 0603, 48.7k, 1/10W, 1%, TF Panasonic ERJ-3EKF4872V
2 R5, R38 RES, SMD, 0603, 5.1k, 1/10W, 1%, TF Venkel CR0603-10W-5101FT
5 R41, R43, R60, R61,
R165
RES, SMD, 0603, 51k, 1/10W, 1%, TF Yageo RC0603FR-0751KL
1 R74 RES, SMD, 0603, 523k, 1/10W, 1%, TF Yageo RC0603FR-07523KL
1 R3 RES, SMD, 0603, 62k, 1/10W, 1%, TF Yageo RC0603FR-0762KL
1 R62 RES, SMD, 0603, 4.7k, 1/10W, 1%, TF Yageo RC0603FR-074K7L
1 R44 RES, SMD, 0603, 8.45k, 1/10W, 1%, TF Yageo RC0603FR-078K45L
0 R14, R30, R31, R32,
R49, R50, R55, R87, R88
R103, R104, R105,
R106, R107
RES, SMD, 0603, DNP-PLACE HOLDER
1 R2 RES, SMD, 1206, 1M, 1/4W, 1%, TF Venkel CR1206-4W-1004FT
1 R111 RES, SMD, 1206, 154k, 1/4W, 1%, TF Yageo RC1206FR-07154KL
2 R45, R77 RES, SMD, 1206, 499k, 1/4W, 1%, TF Venkel CR1206-4W-4993FT
0 R51, R52 RES, SMD, 1206, DNP, DNP, DNP, TF
4 R1, R6, R57, R59 RES-AEC-Q200, SMD, 2512, 0.003Ω, 1W,
1%, CURR.SENSE, MF
Vishay/Dale WSL25123L000FEA
4 J1, J2, J4, J5 HDWARE, TERMINAL, M4 METRIC SCREW,
TH, 4P, SNAP-FIT
Keystone 7795
1 J11 CONN-SOCKET HEADER, TH, 2x40, R/A,
2.54mmPITCH, 12.6x5mm
Wurth Elektronik 61308024312
(or 2 x 613040243121)
0 D6, D7, D8, TP3
TP4-TP6, TP8-TP10,
TP11-TP15, TP17, TP19,
TP21, TP23-TP28
DO NOT POPULATE OR PURCHASE
Qty Reference Designator Description Manufacturer Manufacturer Part

ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 11 of 18
Oct.16.20
2.4 Board Layout
Figure 11. Assembly Top
Figure 12. Top Layer

ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 12 of 18
Oct.16.20
Figure 13. Layers 2 and 3 (Solid Ground), Identical
Figure 14. Bottom Layer

ISL81801DEMO1Z 2. PCB Layout Guidelines
R16UH0005EU0100 Rev.1.00 Page 13 of 18
Oct.16.20
Figure 15. Assembly Bottom

ISL81801DEMO1Z 3. Typical Performance Curves
R16UH0005EU0100 Rev.1.00 Page 14 of 18
Oct.16.20
3. Typical Performance Curves
VIN = 48V, R62 = 4.7k, unless otherwise noted.
Figure 16. Efficiency, CCM Figure 17. Efficiency, DEM
Figure 18. DEM vs CCM at Light Load, VIN = 36V Figure 19. DEM vs CCM at Light Load, VIN = 48V
Figure 20. DEM vs CCM at Light Load, VIN = 60V
80
82
84
86
88
90
92
94
96
98
100
0 20406080
100
Efficiency (%)
Load (%)
36Vi -CCM
48Vi -CCM
80Vi -CCM
72
77
82
87
92
97
0 20406080
100
Efficiency (%)
Load (%)
36Vi -DEM
48Vi -DEM
80Vi -DEM
72
77
82
87
92
97
0 5 10 15 20
Efficiency (%)
Load (%)
36Vi -CCM
36Vi -DEM
72
77
82
87
92
97
0 5 10 15 20
Efficiency (%)
Load (%)
48Vi -CCM
48Vi -DEM
72
77
82
87
92
97
0 5 10 15 20
Efficiency (%)
Load (%)
60Vi -CCM
60Vi -DEM

ISL81801DEMO1Z 3. Typical Performance Curves
R16UH0005EU0100 Rev.1.00 Page 15 of 18
Oct.16.20
Figure 21. Input Port CV/CC Regulation (R62 = 8.45k) Figure 22. Output Port CV/CC Regulation (48V, 11A)
Figure 23. Load Regulation, CCM Figure 24. Load Regulation, DEM
Figure 25. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 36V, IOUT = 5A
Figure 26. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 48V, IOUT = 5A
VIN = 48V, R62 = 4.7k, unless otherwise noted. (Continued)
0
5
10
15
20
25
30
35
40
45
50
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VIN (V)
IIN (A)
0
5
10
15
20
25
30
35
40
45
50
-11357911
13
V
OUT
(V)
I
OUT
(A)
48.0
48.1
48.2
48.3
48.4
48.5
0 20406080
100
VOUT (V)
Load (%)
36Vi -CCM
48Vi -CCM
60Vi -CCM
48.0
48.1
48.2
48.3
48.4
48.5
0 20406080
100
V
OUT
(V)
Load (%)
36Vi -DEM
48Vi -DEM
60Vi -DEM
10µs/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 200mV/Div
IL10A/Div
10µs/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 200mV/Div
IL10A/Div

ISL81801DEMO1Z 3. Typical Performance Curves
R16UH0005EU0100 Rev.1.00 Page 16 of 18
Oct.16.20
Figure 27. Phase 1, Phase 2, VOUT and Inductor Current,
VIN = 80V, IOUT = 5A
Figure 28. Load Transient, VIN = 36V, IOUT = 0A to 5A
2.5A/µs, CCM
Figure 29. Load Transient, VIN = 48V, IOUT = 0A to 5A
2.5A/µs, CCM
Figure 30. Load Transient, VIN = 80V, IOUT = 0A to 5A
2.5A/µs, CCM
Figure 31. Start-Up Waveform, VIN = 36V, IOUT = 5A, CCM Figure 32. Start-Up Waveform, VIN = 48V, IOUT = 5A, CCM
VIN = 48V, R62 = 4.7k, unless otherwise noted. (Continued)
10µs/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 200mV/Div
IL10A/Div
VOUT 500mV/Div
IOUT 2A/Div
2ms/Div
VOUT 500mV/Div
IOUT 2A/Div
2ms/Div
VOUT 500mV/Div
IL2A/Div
2ms/Div
4ms/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 50V/Div
IL20A/Div
4ms/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 50V/Div
IL20A/Div

ISL81801DEMO1Z 3. Typical Performance Curves
R16UH0005EU0100 Rev.1.00 Page 17 of 18
Oct.16.20
Figure 33. Start-Up Waveform, VIN = 80V, IOUT = 5A, CCM Figure 34. Short-Circuit Waveform
Figure 35. Bidirectional Operation, VIN = 48V,
Vin_limit = 36V, IIN = 1A
Figure 36. Line Transient, VIN = 36V to 80V, 1V/ms,
IOUT =0A
Figure 37. Line Transient, VIN = 80V to 36V, 1V/ms, IOUT =0A
VIN = 48V, R62 = 4.7k, unless otherwise noted. (Continued)
4ms/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 50V/Div
IL20A/Div
100ms/Div
Phase 1 50V/Div
Phase 2 50V/Div
VOUT 50V/Div
IL20A/Div
4ms/Div
VIN 20V/Div
VOUT 20V/Div
IL10A/Div
10ms/Div
VIN 20V/Div
VOUT 1V/Div
IL10A/Div
20ms/Div
VIN 20V/Div
VOUT 1V/Div
IL10A/Div

ISL81801DEMO1Z 4. Revision History
R16UH0005EU0100 Rev.1.00 Page 18 of 18
Oct.16.20
4. Revision History
Rev. Date Description
1.00 Oct.16.20 Initial release

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