Renesas ZSSC3170 User manual

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
1
March 30, 2016
Restrictions:
IDT’s ZSSC3170 SSC Modular Evaluation Kit (SSC Evaluation Kit) hardware and software are designed for
evaluation of the ZSSC3170, laboratory setup, and module development only. The ZSSC3170 SSC Modular
Evaluation Kit hardware and software must not be used for module production and production test setups.
IDT shall not be liable for any damages arising out of defects resulting from (i) delivered hard and software (ii)
non-observance of instructions contained in this manual, or (iii) misuse, abuse, use under abnormal conditions
or alteration by anyone other than IDT. To the extent permitted by law, IDT hereby expressly disclaims and
User expressly waives any and all warranties, whether express, implied, or statutory, including, without
limitation, implied warranties of merchantability and of fitness for a particular purpose, statutory warranty of
non-infringement and any other warranty that may arise by reason of usage of trade, custom, or course of
dealing.
Contents
1Kit Contents...................................................................................................................................................4
2ZSSC3170 Evaluation Board ........................................................................................................................5
2.1. Overview.................................................................................................................................................5
2.2. Schematic...............................................................................................................................................6
2.3. Connections to the ZSSC3170...............................................................................................................8
2.4. Reset Switch...........................................................................................................................................8
3Pinout and Package......................................................................................................................................9
4ZSSC3170 Software....................................................................................................................................10
4.1. Overview...............................................................................................................................................10
4.2. USB Driver Installation .........................................................................................................................10
4.3. User Files..............................................................................................................................................11
4.4. General Setup of the Software.............................................................................................................11
4.4.1. Interface Selection .........................................................................................................................12
4.4.2. ZSSC3170 Configuration...............................................................................................................13
4.4.3. Analog Front End (AFE) Adjustment..............................................................................................14
4.4.4. Temperature Sensor Selection......................................................................................................14
4.4.5. ADC Settings..................................................................................................................................14
4.4.6. Application Settings .......................................................................................................................15
4.5. Operation Section.................................................................................................................................15
4.5.1. Normal Operation Mode (NOM).....................................................................................................16
4.5.2. Command Mode (CM) ...................................................................................................................16
4.5.3. Power IC OFF................................................................................................................................16
4.5.4. Data Read-Out...............................................................................................................................16
4.5.5. Enable Error Check........................................................................................................................17

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
2
March 30, 2016
4.5.6. Average Count and Statistics.........................................................................................................17
4.6. Output Configuration ............................................................................................................................17
4.6.1. I²C™ Interface................................................................................................................................17
4.6.2. PWM Interface ...............................................................................................................................17
4.6.3. LIN Interface...................................................................................................................................18
4.7. Calibration Window...............................................................................................................................19
4.8. RAM-Register Dialog Window..............................................................................................................20
4.9. Calibration-Register (RAM) Dialog.......................................................................................................21
4.10. Get Raw Values Dialog ........................................................................................................................21
4.11. Send Command....................................................................................................................................22
5Calibration Example....................................................................................................................................23
5.1. Hardware Setup....................................................................................................................................23
5.2. Software Startup...................................................................................................................................24
5.3. Calibration Data Acquisition .................................................................................................................25
5.4. Calculation of the Coefficients and Limits ............................................................................................25
6Ordering Information ...................................................................................................................................26
7Related Documents.....................................................................................................................................27
8Glossary ......................................................................................................................................................27
9Document Revision History.........................................................................................................................28
List of Figures
Figure 1.1 ZSSC3170 SSC Evaluation Kit........................................................................................................4
Figure 2.1 ZSSC3170 SSC Evaluation Board – Overview...............................................................................5
Figure 2.2 SSC Evaluation Board Schematic...................................................................................................7
Figure 3.1 Pin Configurations for Different Packaging Options........................................................................9
Figure 4.1 Main Window of the Evaluation Software......................................................................................12
Figure 4.2 Interface Selection Section............................................................................................................12
Figure 4.3 Additional I²CTM and LIN Interface Settings in the “Send Command” Menu..................................13
Figure 4.4 DUT Configuration Section............................................................................................................13
Figure 4.5 Bridge Sensor Adaptation and Mode.............................................................................................14
Figure 4.6 Temperature Sensor......................................................................................................................14
Figure 4.7 ADC Adjust ....................................................................................................................................14
Figure 4.8 Application and Settings ................................................................................................................15
Figure 4.9 Normal Operation Section .............................................................................................................15
Figure 4.10 Measure Output Window ...............................................................................................................16
Figure 4.11 PWM Config...................................................................................................................................17
Figure 4.12 LIN Config......................................................................................................................................18
Figure 4.13 “Sensor – Calibration” Dialog.........................................................................................................19
Figure 4.14 Displaying RAM-EEP Register Contents.......................................................................................20
Figure 4.15 “Calibration-Register (RAM)” Dialog..............................................................................................21
Figure 4.16 “Get Raw Values” Dialog ...............................................................................................................21

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
3
March 30, 2016
Figure 4.17 “Send-Command” Dialog...............................................................................................................22
Figure 5.1 Hardware Setup for Calibration Example ......................................................................................23
Figure 5.2 Select Interface..............................................................................................................................24
Figure 5.3 Select Span and Sensor Mode......................................................................................................24
Figure 5.4 Displaying the Result of the Coefficient Calculation......................................................................26

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
4
March 30, 2016
1 Kit Contents
The ZSSC3170 Evaluation Kit consists of the following parts:
•SSC Communication Board (SSC CB) V3.3 (including USB cable) *
•ZSSC3170 SSC Evaluation Board (SSC EB) V2.0
•SSC Sensor Replacement Board (SRB) V2.0
•5 samples of the ZSSC3170DAT2 (SSOP20 5.3mm)
•SSC Evaluation Kit start up information
Note: The ZSSC3170 Evaluation Software is downloaded from www.IDT.com/ZSSC3170KIT as described in
section 4.1.
Figure 1.1 ZSSC3170 SSC Evaluation Kit
The SSC Evaluation Kit provides the hardware needed for communication and calibration of the ZSSC3170
sensor signal conditioning (SSC) IC. A PC can communicate with the ZSSC3170 SSC Evaluation Board via the
SSC Communication Board (CB) through a USB connection. The software should function on any Windows®
2000/XP/Vista/Windows® 7/Windows® 8 system after the installation of a USB driver.
The Sensor Replacement Board (SRB) provides a replacement for an actual sensor and can be used for the first
step of calibration or a dry-run calibration as described in section 4. On the SRB, the sensor replacement signal is
controlled by a potentiometer (see Figure 1.1).
*For detailed information about the SSC Communication Board, please refer to the SSC Communication Board Datasheet.
Potentiometer for
Bridge Simulation
Pin 1 on ZSSC3170
SSC Communication
Board (SSC CB)
ZSSC3170 SSC
Evaluation Board (SSC EB)
SSC Sensor Replacement
Board (SRB)
USB
Connector
Reset

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
5
March 30, 2016
2 ZSSC3170 Evaluation Board
2.1. Overview
Figure 2.1 ZSSC3170 SSC Evaluation Board – Overview
The main purpose of the SSC Evaluation Kit is to perform communication between the user’s PC and the
ZSSC3170 (referred to as the DUT). The PC sends commands and data via the USB port on the CB (virtual COM
port). The microcontroller on the CB interprets these commands and relays them to the DUT in the I2C™†or LIN
communication mode (via connector K1; see Figure 2.1). The microcontroller also forwards any data bytes from
the DUT back to the PC via the USB connection. These bytes can be bridge and temperature readings to be
displayed by the ZSSC3170 SSC Evaluation Kit software or raw ADC readings used during calibration or
EEPROM content bytes.
The SSC CB microcontroller controls the power signals required for entering the Command Mode, and it is able to
read the PWM output signal of ZSSC3170 and send this value back to PC. Because the ZSSC3170 provides a
high and low side switch PWM signal, an inverted LIN communication protocol is also required. This is generated
automatically by the SSC EB and controlled via the SSC CB.
†I2C™ is a trademark of NXP.

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
6
March 30, 2016
2.2. Schematic
Figure 2.2 shows the schematic of the ZSSC3170 SSC Evaluation Board (SSC EB). The SSC EB is powered by a
12V supply controlled by the microcontroller on the SSC CB. The green LED displays the status of this supply
(maximum current that can be provided is 40mA).
There is a reverse polarity protection diode connected to a series resistor and then directly to the power supply of
the ZSSC3170 (VB as shown in Figure 2.1). If the PWM interface is used, a 5V supply is required. Both power
supplies are controlled by the microcontroller of the SSC CB. Jumper K11 can be used to remove the power
supply for the ZSSC3170 manually or for a simple measurement of the supply current.
The PWM output of ZSSC3170 is connected to screw terminal KL5 and the SSC CB.
Transistor T1 serves as level shifter between ZSSC3170 and microcontroller’s power domain, so a direct
processing of this analog signal by the µC is also possible.
Jumper K17 (“select Comm-IF”) selects the communication path for LIN communication. Select LIN, LOUT, or
HOUT. If the LIN interface is used, jumpers K12 (“LIN-GND”) and K16 (“LIN-VB” ) must be shorted because only
a 10Ωseries resistor is required for VB with LIN communication and the VSS pin of the ZSSC3170 must be
connected directly to GND‡. For the PWM interface, the K12 and K16 jumpers are not needed and the K14
jumper selects the PWM mode, either HSS or LSS.
If PWM and the high-side switch are enabled, LIN communication requires inverted LIN signal levels. This
transformation is done by IC2 if the K17 jumper (“select Comm-IF”) is set to HOUT. The control signal for the
communication direction of IC2 is provided by the SSC CB’s µC via signal D4 on the K1 connector. If D4 is set to
high, the communication from the master (µC) to the ZSSC3170 is enabled. If D4 is set to low, the ZSSC3170 can
send its response to the SSC CB.
The SSC EB is connected to the SSC CB via the 50-pin K1 female connector. On-board there are several strips
for simple access to all IC signals. The SSC EB board type is hard-coded by three resistors on K1 connector pins
D7 (low), D6 (high), and D5 (high).
The SRB can be connected to the SSC EB’s 50-pin male K4 connector. Alternatively, an external bridge sensor
element and an external temperature sensor can be connected using the on-board screw terminal KL3/KL4.
‡For details about ZSSC3170 application examples, refer to the ZSSC3170 Data Sheet.

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
7
March 30, 2016
Figure 2.2 SSC Evaluation Board Schematic
KS5V
KS12V
KS12V
GND
KS12V
IC2
/2OE
E6 O6
E5 O5
E4 O4
O3E3 O2E2 O1E1
/1OE
IC2
HEF40098BTD
100N
C5
T3
BC857C
T2
BC847C
100K
R15
100K
R14
10K
R13
10K
R12
10K
R11
LIN-IF
K17
K16
LIN-VB
KL4
KS12V
K14
K12
LIN-GND
K11
VSupply
GND
GND
GND
GND
KS5V
GND
GND
10
R10
18
R9
KS12V
KS12V
KS5V
5P
5P
10KR8 10KR7 10KR6
VB
VB
SM4001
D2
Power D1
gn
3.3K
R5
10K
R4
10K
R3
100K
R2
100K
R1 T1
BC847C
68P
C4
2,2N
C3
220N
C2
100N
C1
K4x8
K6
K4x9
K5
VTN2
VBR_T
VTN1
VBP
VBR_B
VBN
LOUT
LINVSS
VSSE
VB
HOUT
VDD
SCL
SDA
VSSA
VDDA
ZSSC3170
IC1
KL5
KL3
SL 2X25W 2,54
K4
BL 2X25W 2,54_a
K1
GND
GND
GND
GND
GND
VBDut
D4
LIN_µC
LIN_µC
OWI
OWI
VINP
VINP
VINP
VINN
VINN
VINN
LIN
LIN
LOUT
LOUT
VDDA
VDDA
VSSA
VSSA
HOUT
HOUT
VSS
VDD
VDDB
VDDB
VDDB
KS12V
VTN2
VTN2
VSSB
VSSB
VSSB
VTN1
VTN1
D7
D6
D5
KS5V
KS5V
SCL
SCL
SCL
SDA
SDA
SDA
5P
5P
GND
PWM
Comm - IF
select
HSS - LSS
LIN&PWM-OUT

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
8
March 30, 2016
Table 2.1 gives an overview of the settings for jumpers on the board needed to enable the PWM-HSS, PWM-LSS,
or LIN output modes. The jumper settings have no effect in I2C™ mode.
Table 2.1 Jumper Setup for ZSSC3170 Functionality Options
Mode of the ZSSC3170
Jumper Setting
K12
LIN-GND K14 HSS-LSS K16 LIN-VB K17 Select Comm-IF
PWM – HSS Open HSS Open HOUT
PWM – LSS Open LSS Open LOUT
LIN Shorted Open Shorted LIN
Important: When acquiring measurement or calibration data, disconnect all measurement devices from the
sensor input test pins in order to minimize noise during the measurements.
2.3. Connections to the ZSSC3170
The SSC EB has an SSOP-20 socket for inserting the SSOP-20 ZSSC3170 under test.
NOTE: Only one ZSSC3170 connection option can be used at a time (e.g., either through the SSC CB or via
individual connections).
2.4. Reset Switch
Use the push button on the SSC CB to reset communications if needed.

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
9
March 30, 2016
3 Pinout and Package
Note: The ZSSC3170 is only available for purchase as die. The SSOP20 package is only available for evaluation
purposes as samples in the Evaluation Kit. An SSOP20 Green Package (5.3mm body, 0.65mm lead pitch) is the
standard delivery form for samples.
Table 3.1 Pin Definition of ZSSC3170
Die Pin SSOP20 Pin Name Description Remarks
1
2
VDDA
Positive Analog Supply Voltage
Power supply
2
3
VSSA
Negative Analog Supply Voltage
Ground
3
4
SDA
I²C™ Clock
Analog I/O, internal pull-up
4
5
SCL
I²C™ Data I/O
Analog input, internal pull-up
5
6
VDD
Positive Digital Supply Voltage
Power supply
6
7
HOUT
PWM High-Side Switch
High voltage I/O
7
8
VB
Positive External Supply Voltage
High voltage I/O
8
9
VSSE
External Ground (PWM Modes)
High voltage I/O
9
10
VSS
Ground (LIN Mode)
Ground
10
11
LIN
LIN
LIN high voltage I/O
11
12
LOUT
PWM Low-Side Switch
High voltage I/O
12
14
VBN
Negative Input Sensor Bridge
Analog input
13 / 14
15
VBR_B
Negative (Bottom) Bridge Supply Voltage
Analog I/O
15
16
VBP
Positive Input Sensor Bridge
Analog input
16
17
VTN1
Temperature Sensor 1
Analog I/O
17 / 18
18
VBR_T
Positive (Top) Bridge Supply Voltage
Analog I/O
19
19
VTN2
Temperature Sensor 2
Analog I/O
The two-fold implementation of the bridge supply bond pads enables direct bonding from the ZSSC3170 pads to
supply pads on the sensor die.
Figure 3.1 Pin Configurations for Different Packaging Options
For exact bond pad positions, refer to
ZSSC3170 Technical Note— Pad Coordi-
nates, Die Dimensions, and Package
Dimensions (available on request).
The backside of the die is electrically
connected to the potential VSS and VSSA
within the package.
Drawing not true to scale.
ZSSC3170
VDDA
VSSA
SDA
SCL
VDD
HOUT
VB
VTN2
VBR_T
VTN1
VBP
VBR_B
VBN
VSSE
VSS
LOUT
LIN
1
2
3
4
5
6
7
8
9
10
19
18
17
16
15
14
13
12
11
VBR_T
VBR_B
DIE
ZSSC3170
2
1
3
4
6
5
7
8
19
20
15
16
14
13
n.c.
VDDA
VSSA
SDA
SCL
VDD
HOUT
VB
n.c.
VTN2
VBR_T
VTN1
VBP
VBR_B
VBN
n.c.
10
9
11
12
VSSE
VSS
LOUT
LIN
17
18
SSOP20

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
10
March 30, 2016
4 ZSSC3170 Software
4.1. Overview
The ZSSC3170 SSC Modular Evaluation Kit does not include the software, which must be downloaded from
www.IDT.com/ZSSC3170KIT to ensure receiving the latest release. To download the software, navigate to the
software link on the ZSSC3170 product page as follows:
•Click on the link titled “ZSSC3170 Evaluation Software Rev. X” (where X is the current revision) and follow
the dialog instructions as needed to download the zip file for the software.
•Open the zip file and extract the ZSSC3170_SW_Rev.X.exe file.
•To install the ZSSC3170 SSC Evaluation Kit software on the user’s PC hard drive, double-click on the
downloaded ZSSC3170_SW_Rev.X.exe file. Respond to the dialog box to select the installation directory,
and the software will complete the installation, which results in a program shortcut on the desktop of the
PC.
The default software installation folder is ..:\\program files\ZMDI\ZSSC3170. IDT can provide the user with
algorithms and assistance in developing their full production calibration software.
The software logs various data and commands into log files as described in section 4.3.
The software contains six menus that are intended for the following functions:
•Main Window: IC setup, configuration, and communication via check boxes, entry fields, and
pull-down menus
•RAM/EEPROM Dialog: Direct access to RAM/EEPROM registers (consecutively numbered)
•Calibration Register Dialog: Direct access to RAM/EEPROM registers (sorted by category)
•Calibration Dialog: Acquisition of raw values from sensor and calculation of coefficients
•Get Raw Values Dialog: Special Dx commands for the ZSSC3170§
•Send Command Dialog: Low-level write/read communication with the SSC CB**
4.2. USB Driver Installation
The USB driver installation is only required if the CB revision is earlier than Rev.3.3. For more information refer to
the SSC CB Application Note - USB Driver Installation, which is provided at www.IDT.com/ZSSC3170KIT.
§For details of the Dx commands, refer to the ZSSC3170 Functional Description.
** For details about SSC CB command structure, refer to the SSC Communication Board Data Sheet and SSC Command Syntax.

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
11
March 30, 2016
4.3. User Files
User files are saved in [My Documents]\ZMDI\ZSSC3170 and consist of log files and EEPROM files.
•ZSSC3170_COMx.log
A communication log file created when connection with the SSC CB and the ZSSC3170 is established
(via LIN or I2C™ interface). This file is a log of the communication to the ZSSC3170 during the software
session and can be saved after closing the software by renaming the file. Otherwise, it is overwritten the
next time the software is opened.
•save_[date]_[time].3170
A log file containing IC settings and acquired RAW data. This file can be used to load/save EEPROM
contents.
•save_[date]_[time].3170.txt
A log file in text format containing IC settings and acquired RAW data. This file can be used to view the
EEPROM contents.
4.4. General Setup of the Software
Because of the large number of different functionalities of the ZSSC3170, the user interface is divided into
different segments. Within these segments, a number of associated functionalities are implemented. Several
submenus allow access to sub-functionalities. After the ZSSC3170 Software is started, the main window is
displayed (see Figure 4.1).
The main window includes all the settings for configuration of the ZSSC3170 in a clear structure that hides the
corresponding HEX commands behind buttons and pull-down menus. For a detailed description of the
commands, refer to the ZSSC3170 Functional Description. An information box that explains functionality appears
when the cursor is placed over most buttons, drop-down menus, and check boxes.

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
12
March 30, 2016
Figure 4.1 Main Window of the Evaluation Software
4.4.1. Interface Selection
The ZSSC3170 supports two interfaces for communication:
LIN and I²C™ (see Figure 4.2). After starting the software,
select the interface for the application in the “Interface
Selection” section.
Adjacent to the drop down menu for the interface is a menu
for selecting the I²C™ addresses to be used.
If the I²C™ interface is selected, additional settings for the I²C™ interface are enabled in the “Send Command”
menu. The “Send Command” menu can be accessed with the button (see section 4.11 for details).
Figure 4.2 Interface Selection Section

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
13
March 30, 2016
Figure 4.3 Additional I²CTM and LIN Interface Settings in the “Send Command” Menu
4.4.2. ZSSC3170 Configuration
The “DUT Configuration” section includes the following buttons:
•ReadRAM : Reads the complete RAM contents and updates
only the “RAM_Register” menu.
•RdRAM&Set : Reads the complete RAM contents and updates all
of the ZSSC3170 software.
•Write RAM : Copies the current software settings into the RAM
of the ZSSC3170.
•RAM-->EEP : Copies the RAM contents into EEPROM. The free-user-memory registers (1CHEX, 1DHEX, and
1EHEX) will also be copied using the contents of the IDT software registers††.
•EEP-->RAM : Copies the EEPROM contents into RAM using the C0HEX command.
•Write&Cycle : Copies the current software settings into the RAM of the ZSSC3170 and starts the
measurement cycle using the current RAM settings (command: 02HEX‡‡).
The “RAM/EEP updated” virtual LED (see Figure 4.4) displays the software configuration status compared with
the attached ZSSC3170’s register content. If the content is identical, the LED is green (on).
†† The contents of the “RAM-Register” dialog will be used for free-user-memory registers.
‡‡ For details about ZSSC3170 commands, refer to the ZSSC3170 Functional Description.
Figure 4.4 DUT Configuration Section

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
14
March 30, 2016
4.4.3. Analog Front End (AFE) Adjustment
The ZSSC3170 has different options for adapting the analog
front end (AFE) to the specific sensing element. The “Bridge
Sensor Adaptation” and “Bridge Mode” sections (shown in
Figure 4.5) influence the programmable gain amplifier (PGA)
and extended zero compensation.
Refer to the ZSSC3170 Data Sheet for details about PGA
and XZC settings.
The polarity of the sensor signal can be selected by the radio button and can be changed if the PCB layout
requires swapped input pins.
4.4.4. Temperature Sensor Selection
The next stage in the AFE is the multiplexer that selects the input signal for
measuring temperature (Figure 4.6). The ZSSC3170 can use two different
temperature channels: one for the temperature that is used for the
ZSSC3170’s internal calibration calculation and one that is used as an
optional additional output signal during Normal Operating Mode (NOM). If
only one temperature sensor is used and a temperature readout during
NOM is required, then “CalibrTS CT” and “MediumTS MT” must be set to
the same settings (note: “medium” means ambient).
4.4.5. ADC Settings
The last stage of the AFE is the analog to digital converter (ADC). The
signal path within the AFE is fully differential, so it is necessary to provide
an input signal within the common mode range. Otherwise the ADC will
provide a signal that is equal to 0000HEX (underflow) or 2ADC_Resolution
(overflow) in the “Sensor – Calibration” menu during calibration.
Refer to the ZSSC3170 Data Sheet for details about ADC settings.
If the analog input voltage does not fit the ADC range and an underflow or
overflow occurs, the “Range Shift” option can be used for fine-tuning. A
lower “Span” setting in the “Sensor Adaptation” section can also be useful
for fitting the ADC range.
Figure 4.5 Bridge Sensor Adaptation and Mode
Figure 4.6 Temperature Sensor
Figure 4.7 ADC Adjust

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
15
March 30, 2016
4.4.6. Application Settings
The internal microcontroller of the ZSSC3170 can detect various errors and
perform different types of measurement cycles. It controls multiple
protection options that can be configured by the ZSSC3170 Software.
Figure 4.8 illustrates all the application options for the ZSSC3170, which
can be enabled/disabled via the checkboxes. The example in Figure 4.8
shows the ZSSC3170 settings with no options enabled. For more details
about the related options, refer to the ZSSC3170 Functional Description.
•CHKBCC : Enables the Broken Chip Check.
•CHKSSC : Enables the Sensor Short Check.
•CHKSCCH : Enables the Sensor Connection Check (the ZSSC3170’s
CHKSCCHIC setting) high-capacity mode.
•CHKSCC : Enables Sensor Connection Check.
•CHKSAC : Enables Sensor Aging Check.
•EEPLOCK : Enables EEPROM lock for LIN communication. If enabled, the EEPROM cannot be changed
via the LIN interface and must be reset via the I²C™ interface.
•CHKROM : Enables ROM check after power-on. If enabled, the start-up time will be increased by
approximately 10ms.
•CHKOOR: Enables the ROM check after power on. If enabled, the start-up time will be increased by
approximately 10ms. If a ROM error occurs, the ZSSC3170 will change to the Diagnostic Mode.
•DMRES : If enabled, the ZSSC3170 is reset if the ZSSC3170 enters the Steady Diagnostic Mode.
•BBOOST : Enables the bias boost option for the AFE.
4.5. Operation Section
The “Commands” and “Read Out Data” sections control the collection of data and configuration of the ZSSC3170.
Figure 4.9 Normal Operation Section
Figure 4.8 Application and Settings

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
16
March 30, 2016
4.5.1. Normal Operation Mode (NOM)
In the “Commands” section, use the Cyc_EEP or Cyc_RAM button to exit Command Mode (CM) and start NOM
using either EEPROM or RAM registers settings respectively. The ZSSC3170 can now continually perform a
measurement cycle. The status of the virtual LED “NOM running” (see Figure 4.9) is updated accordingly.
4.5.2. Command Mode (CM)
In the “Commands” section, use the CMD ON button to start the Command Mode of the ZSSC3170 by sending
the Start_CM command (0x7274) to the ZSSC3170. The status of the virtual LED “CMD ON” (see Figure 4.9)
indicates when the ZSSC3170 is in the Command Mode by turning green.
4.5.3. Power IC OFF
The Power OFF button in the “Commands” section (see Figure 4.9) can be used to power off the ZSSC3170. All
communication interfaces are disabled, so no further communication is possible until the CMD ON button is sent
or an interface is selected.
4.5.4. Data Read-Out
The Read and ReadLoop buttons in the “Read Out Data” section (see Figure 4.9) start a read-out of sensor data.
When a loop measurement is started, the button text will change to “Stop.” Clicking again on the button stops the
loop. A separate measurement output window as shown in Figure 4.10 can be opened by clicking over the
measurement results under “OUT BR” or when selected from the menu via “Tools -> Measure Output.” The
temperature results in degrees Celsius are valid only if the temperature limits and targets are the same as during
calibration.
Figure 4.10 Measure Output Window

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
17
March 30, 2016
4.5.5. Enable Error Check
The “Enable Error Check” checkbox in the “Read Out Data” section (see Figure 4.9) turns on the error checks
selected in the “Application & Settings” section (see section 4.4.6). An error message will be displayed if any of
the errors selected occur.
4.5.6. Average Count and Statistics
The “Avg Cnt” checkbox in the “Read Out Data” section (see Figure 4.9) starts the averaging and statistics
calculations. It is only enabled if the measurement is in a loop mode (see section 4.5.4). The resulting data is
displayed in the adjacent fields after the specified cycles in the field are passed.
4.6. Output Configuration
The ZSSC3170 provides three different output interfaces:
•LIN interface
•PWM interface
•I²C™ interface
4.6.1. I²C™ Interface
If the I²C interface is used (see section 4.4.1), the output signal format is fixed and cannot be changed§§.
4.6.2. PWM Interface
The PWM interface can be used to generate an analog output signal using a low-pass filter. The settings for the
PWM interface are illustrated in Figure 4.11.
•enable PWM : Enables the PWM interface. Either the LIN or PWM
interface can be selected. Using both interfaces
simultaneously during NOM is not available.
•PWM Mode : Selects between the two modes for the PWM interface
that the ZSSC3170 supports. If checked, the high-side
switch mode (HSS) is enabled, including an internal pull-
down resistor. If not checked, the low-side switch mode
(LSS) is enabled, including an internal pull-up resistor.
•PWM Slope : The slope of the PWM signal is controlled by monitoring
either the voltage or the current at the PWM output. If
checked, voltage control is activated. If not checked,
current control is activated.
•PWM Slew Rate : Selects the rise or fall rate of PWM slope. Use a slower value to achieve a more robust
system for EMC. Typically, the slew rate is +/-2V per µs for the voltage range of 0.5V to 4V.
§§ For details about ZSSC3170’s I²C™ interface, refer to the ZSSC3170 Functional Description.
Figure 4.11 PWM Config

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
18
March 30, 2016
4.6.3. LIN Interface
The LIN interface has various options for the digital output configuration as shown in Figure 4.12. For a more
detailed description of the LIN configuration, refer to the ZSSC3170 Functional Description.
•LIN SleeP Mode : If checked, the ZSSC3170 is able to go to
Sleep Mode after receiving a “Go-To-Sleep”
command. The ZSSC3170 will not respond
to any other LIN command until the device
receives a wake up signal***. The “Sleep”
button sends a go-to-sleep command to the
ZSSC3170.
Note: LIN Sleep Mode must be disabled for
proper PWM operation.
•LIN SaVE ConFiGuration Service : The Save-Configuration service
is used to initiate the slave node to save its
configuration into EEPROM. This service is
only available if this checkbox is checked.
Otherwise, this request will cause a Save-
Configuration Negative response as
described in the ZSSC3170 Functional Description.
•LIN ConFiGuration FRame : This option selects the data format during read out in Normal Operation Mode.
Data Byte 0 Data Byte 3
00 12-Bit Bridge Sensor 12-Bit Temperature 4-Bit Status 4-Bit Variant ID
01 12-Bit Bridge Sensor 10-Bit Temperature 2-Bit Status 8-Bit Variant ID
10 12-Bit Bridge Sensor 8-Bit Temperature 4-Bit Status 8-Bit Variant ID
11 11-Bit Bridge Sensor 9-Bit Temperature 4-Bit Status 8-Bit Variant ID
•LIN ConFiGuration STATus bits : In addition to sensor signal and temperature data included in the digital read
out, the ZSSC3170 also provides various information with the remaining 4 status bits
during NOM. There are different settings available, which can be selected by this pull-
down menu as shown in the table below:
*** For details about ZSSC3170’s LIN interface functionality, refer to the ZSSC3170 Functional Description.
Figure 4.12 LIN Config
LSB LSB + 1 LSB + 2 LSB + 3
00 Bridge Sensor Error Temperature Error Values Refreshed Response Error
01 Bridge Sensor Signal
Out of Limits Temperature Out of Limits Bridge Sensor or Temperature Invalid Response Error
10 Bridge Sensor Error Response Error Checksum Error Bit Error
11 Bridge Sensor Error Temperature Error Checksum Error Bit Error

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
19
March 30, 2016
•LIN SaMPLe Mode : Selects the sample count per bit for signal detection (3 or 5 samples per bit).
•LIN Low Pass : LIN transceivers normally have filters to remove short spikes on the bus. The number of
samples can be selected from the drop-down menu.
•LIN MODE : The ZSSC3170 supports three different LIN modes: LIN 1.3, LIN 2.0 and LIN 2.1. Select
the mode that the LIN master in the final application uses.
4.7. Calibration Window
The “Sensor – Calibration” dialog is accessed by clicking on the icon or select “Calibration” on the top menu
and then “Calibration” from the drop-down menu. It is used to perform a calibration of the ZSSC3170 with either
the SRB or the user’s sensor module. Section 5 gives an example calibration using the commands on this screen.
Figure 4.13 “Sensor – Calibration” Dialog

ZSSC3170 Evaluation Kit Description
© 2016 Integrated Device Technology, Inc.
20
March 30, 2016
4.8. RAM-Register Dialog Window
The “RAM-Register” dialog window is accessed by clicking the button.
This dialog window is used to read and write register contents in the
ZSSC3170 memories and has the same functionality as the “DUT
Configuration” section in the main window.
There is also a WriteEEP button to store all register contents into the
EEPROM of the ZSSC3170. Register indexing corresponds to the
ZSSC3170 memory addresses.
The configuration of the ZSSC3170 is stored in 32 EEPROM 16-bit words.
•Calibration coefficients for conditioning the bridge sensor signal
via conditioning calculations and output limits are stored in
8 registers: 0HEX to 7HEX.
•Calibration coefficients for conditioning the temperature signal are
stored in 3 registers: 8HEX to AHEX.
•LIN settings include registers BHEX to DHEX data for limits and
registers 14HEX to 1AHEX for frame configuration.
•Sensor Aging Check limits are stored in register EHEX.
•There are five words for setting the configuration of the ZSSC3170
for the application: registers FHEX to 13HEX (indicated by a yellow
background).
•Register 1BHEX is used for storing the EEPROM signature, which is
used in NOM to check the validity of the EEPROM contents after
power-on.
•Four additional 16-bit registers are available for optional user data: registers 1CHEX to 1FHEX.
For more information regarding the registers, refer to the ZSSC3170 Functional Description.
Note: If current settings differ from the memory contents, registers that do not correspond to memory will have a
red background after the “Read” operation.
Figure 4.14 Displaying RAM-EEP
Register Contents