Rorke Data A16F-R2431 Galaxy Raid User manual

Galaxy Raid
Model A16F-R2431
Dual Redundant Controller
4Gb FC to SATA-II RAID Subsystem
Installation and Hardware
Reference Manual
Version 0107
Version 1.0 (08, 2005)

Galaxy A16F-R2431 Installation and Hardware Reference Manual
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Contact Information
Americas
Rorke Data Inc
7626 Golden Triangle Drive
Eden Prairie, MN 55344
USA
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://www.rorke.com

Galaxy A16F-R2431 Installation and Hardware Reference Manual
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Copyright 2006
This Edition First Published 2006
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to notify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC®is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.

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Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and service personnel who have
been instructed of and fully understand the possible hazardous conditions and the
consequences of accessing non-field-serviceable units. For example, accessing the backplane
may cause electric shock.
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
WARNING:
Use only shielded cables to connect I/O devices to this equipment.

Galaxy A16F-R2431 Installation and Hardware Reference Manual
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You are cautioned that changes or modifications not expressly approved by
the party responsible for compliance could void your authority to operate the
equipment.
CB
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus.
This standard covers only safety aspects of the above apparatus; it
does not cover other matters, such as style or performance.
CCC for Power Supplies’ compatibility to China Compulsory Certification.
This device is in conformity with UL standards for safety.
ITE BSMI Class A, CNS 13438 (for Taiwan)
This device is in conformity with UL standards for safety.
RoHS 2002/96/EC compliant
WEEE Disposal of Old Electrical and Electronic Equipment
This device is in conformity with the EMC.
This device is in conformit
y
with the CB safet
y
specifications.

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Table of Contents
CONTACT INFORMATION .......................................................................................................II
COPYRIGHT 2006....................................................................................................................II
Disclaimer..........................................................................................................................III
Trademarks........................................................................................................................ III
WARNINGS AND CERTIFICATIONS .........................................................................................V
TABLE OF CONTENTS ............................................................................................................VI
REVISION HISTORY ...............................................................................................................XI
WHO SHOULD READ THIS MANUAL? .....................................................................................XI
RELATED DOCUMENTATION .................................................................................................XI
CONVENTIONS ......................................................................................................................XII
SOFTWARE AND FIRMWARE UPDATES............................................................................... XIII
CHAPTER 1 INTRODUCTION
1.1 PRODUCT OVERVIEW ..............................................................................................1-1
1.1.1 Product Introduction........................................................................................1-1
1.2 CHASSIS OVERVIEW ................................................................................................1-2
1.2.1 Front Panel Overview ......................................................................................1-2
1.2.2 Rear Panel Overview........................................................................................1-3
1.2.3 Integrated Backplane........................................................................................1-4
1.2.4 Physical Dimensions ........................................................................................1-4
1.3 MAJOR SUBSYSTEM COMPONENTS.........................................................................1-4
1.3.1 LCD Keypad Panel...........................................................................................1-5
1.3.2 Drive Tray ........................................................................................................1-5
1.3.3 MUX Kit ...........................................................................................................1-6
1.3.4 The RAID Controller Module...........................................................................1-7
1.3.5 Controller Module Interfaces...........................................................................1-8
1.3.5.1 DIMM Module.......................................................................................................1-10
1.3.6 BBU................................................................................................................1-11
1.3.7 PSUs...............................................................................................................1-12
1.3.8 Cooling Modules ............................................................................................1-13
1.4 SUBSYSTEM MONITORING.....................................................................................1-14
1.4.1 I2C bus............................................................................................................1-14
1.4.2 LED Indicators...............................................................................................1-14
1.4.3 Firmware (FW) and RAIDWatch GUI ...........................................................1-15
1.4.4 Audible Alarms...............................................................................................1-15
1.5 HOT-SWAPPABLE COMPONENTS...........................................................................1-15
1.5.1 Hot-swap Capabilities....................................................................................1-16
1.5.2 Components....................................................................................................1-16
CHAPTER 2 HARDWARE INSTALLATION
2.1 INTRODUCTION........................................................................................................2-1
2.2 INSTALLATION PREREQUISITES..............................................................................2-1
2.3 SAFETY PRECAUTIONS ............................................................................................2-2
2.3.1 Precautions and Instructions............................................................................2-2
2.3.2 Static-free Installation......................................................................................2-4
2.3.3 Preparation ......................................................................................................2-4
2.4 GENERAL INSTALLATION PROCEDURE...................................................................2-5
2.4.1 Installation Procedure Flowchart ....................................................................2-6
2.5 UNPACKING THE SUBSYSTEM..................................................................................2-6
2.5.1 Preinstalled Components..................................................................................2-7
2.5.2 Components to be Installed..............................................................................2-7

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2.6 HARD DRIVE INSTALLATION...................................................................................2-7
2.6.1 Hard Drive Installation Prerequisites..............................................................2-7
2.6.2 Drive Installation..............................................................................................2-8
2.7 DRIVE TRAY INSTALLATION ...................................................................................2-9
2.8 BBU INSTALLATION ..............................................................................................2-11
BBU Warnings and Precautions ....................................................................................2-12
2.9 RACKMOUNTING....................................................................................................2-13
CHAPTER 3 SUBSYSTEM CONNECTION
3.1 FC HOST CONNECTION PREREQUISITES................................................................3-1
3.1.1 Choosing the Fibre Cables......................................................................................3-1
3.1.2 FC Lasers................................................................................................................3-2
3.1.3 SFP Transceivers ....................................................................................................3-3
3.1.4 FC Port Dust Plugs.................................................................................................3-3
3.2 TOPOLOGY AND CONFIGURATION CONSIDERATIONS............................................3-3
3.2.1 Basic Configuration Rules.......................................................................................3-3
3.2.2 Fibre Channel Topologies.......................................................................................3-5
3.2.3 Host-side Topologies...............................................................................................3-5
3.2.4 Drive-side Connection.............................................................................................3-5
3.2.5 Internal Connections...............................................................................................3-5
3.2.6 Unique Identifier .....................................................................................................3-6
3.2.7 ID/LUN Mapping ....................................................................................................3-6
3.3 DIP SWITCH.............................................................................................................3-6
DIP Switch Mode Setting......................................................................................................3-8
3.4 SAMPLE TOPOLOGIES..............................................................................................3-8
3.4.1 Multiple RAID, Fault-tolerant Connection..............................................................3-8
3.4.2 Switched, Fault-Tolerant Connection....................................................................3-11
3.4.3 DAS, Fault-Tolerant Connection w/ Onboard Hub...............................................3-13
CHAPTER 4 SYSTEM OPERATION AND MONITORING
4.1 POWER ON...............................................................................................................4-1
4.1.1 Check List.........................................................................................................4-1
4.1.2 Power On Procedure........................................................................................4-2
4.1.3 Power On Status Check....................................................................................4-3
4.1.4 LCD Screen ......................................................................................................4-4
4.2 POWER OFF PROCEDURE ........................................................................................4-5
4.3 SYSTEM MONITORING OVERVIEW .........................................................................4-5
4.4 STATUS-INDICATING LEDS.....................................................................................4-7
4.4.1 LED Overview..................................................................................................4-7
4.4.2 LCD Keypad Panel...........................................................................................4-7
4.4.3 Drive Tray LEDs ..............................................................................................4-8
4.4.4 Controller Module LEDs..................................................................................4-9
4.4.4.1 Controller Status LEDs ..........................................................................................4-10
4.4.4.2 Fibre Port LEDs .....................................................................................................4-11
4.4.4.3 Restore Default LED..............................................................................................4-11
4.4.4.4 LAN Port LEDs......................................................................................................4-11
4.4.5 BBU LED........................................................................................................4-12
4.4.6 PSU LEDs.......................................................................................................4-12
4.4.7 Cooling Module LEDs....................................................................................4-13
4.5 AUDIBLE ALARM ...................................................................................................4-14
4.5.1 Failed Devices................................................................................................4-14
4.6 I2CMONITORING...................................................................................................4-14
CHAPTER 5 SYSTEM MAINTENANCE

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5.1 OVERVIEW ...............................................................................................................5-1
5.1.1 About Subsystem Maintenance.........................................................................5-1
5.1.2 General Notes on Component Replacement.....................................................5-2
5.2 REPLACING A CONTROLLER MODULE ...................................................................5-3
5.2.1 Considerations..................................................................................................5-3
5.2.2 Removing the Controller Module .....................................................................5-4
5.2.3 Replacing the Controller Module.....................................................................5-5
5.3 DIMMMODULE REPLACEMENT............................................................................5-7
5.3.1 DIMM Module Considerations.........................................................................5-7
5.3.2 DIMM Module Upgrade/Replacement Procedure............................................5-8
5.4 REPLACING A FAULTY BBU....................................................................................5-9
5.5 REPLACING A FAULTY PSU ..................................................................................5-12
5.5.1 PSU Overview ................................................................................................5-12
5.5.2 Replacing the PSU..........................................................................................5-13
5.6 COOLING MODULE MAINTENANCE ......................................................................5-16
5.6.1 Notes on Cooling Module Maintenance.........................................................5-16
5.6.2 Replacing a Cooling Module..........................................................................5-17
5.7 REPLACING A FAILED HARD DRIVE .....................................................................5-19
5.7.1 Hard Drive Maintenance Overview................................................................5-19
5.7.2 Replacing a Hard Drive .................................................................................5-19
5.8 REPLACING A MUX KIT........................................................................................5-21
APPENDIX A SPECIFICATIONS
A.1 TECHNICAL SPECIFICATIONS.................................................................................A-1
Environmental Specifications.......................................................................................... A-1
Power Requirements........................................................................................................ A-1
Certifications................................................................................................................... A-2
Warning Alarms .............................................................................................................. A-2
A.2 FUNCTIONAL SPECIFICATIONS...............................................................................A-2
Configuration Specifications........................................................................................... A-2
Architectural Specifications ............................................................................................ A-2
A.3 DRIVE TRAY SPECIFICATIONS ...............................................................................A-3
A.4 POWER SUPPLY SPECIFICATIONS...........................................................................A-3
A.5 COOLING MODULE SPECIFICATIONS.....................................................................A-4
A.6 RAID MANAGEMENT.............................................................................................A-4
A.7 FAULT TOLERANCE MANAGEMENT.......................................................................A-5
APPENDIX B SPARE PARTS AND ACCESSORIES
B.1 SPARE PARTS ..........................................................................................................B-1
B.2 ACCESSORIES.......................................................................................................... B-2
APPENDIX C PINOUTS
C.1 SFP CONNECTOR PINOUTS ....................................................................................C-1
C.2 COM1 CABLE:DB9 AUDIO JACK Y-CABLE PINOUTS..........................................C-3
C.3 COM2 UPSCABLE:DB9 AND AUDIO JACK PINOUTS..........................................C-4
C.4 IFT-9011 NULL MODEM ........................................................................................C-5
C.5 LAN PORT PINOUTS...............................................................................................C-6
C.6 POWER CONNECTORS.............................................................................................C-6
C.7 CONNECTOR TYPE AND OTHER INFORMATION ....................................................C-6
C.7.1 Connector Type and Supported Connections .................................................. C-6
APPENDIX D UNINTERRUPTIBLE POWER SUPPLY
D.1 UNINTERRUPTIBLE POWER SUPPLY OVERVIEW ...................................................D-1
D.2 COMPATIBLE UPS SUPPLIES..................................................................................D-1

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D.3 SERIAL COMMUNICATION CABLE..........................................................................D-1
D.4 CONNECTING THE UPS TO THE SUBSYSTEM .........................................................D-2
D.4.1 Connect the PSU Module Power Cords ..........................................................D-2
D.4.2 Set the Baud Rate.............................................................................................D-2
D.4.3 Connect COM2................................................................................................D-2
D.5 POWER ON..............................................................................................................D-2
D.6 UPS STATUS MONITORING ....................................................................................D-3
D.6.1 Normal Operational Status..............................................................................D-3
D.6.2 UPS Messages.................................................................................................D-3
D.6.3 UPS Message Summary...................................................................................D-5

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Safety Precautions
Precautions and Instructions
Prior to powering on the subsystem, ensure that the correct power range is being
used.
The Galaxy subsystem comes with sixteen (16) drive bays. Leaving any of these
drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.
If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and rear.
Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
Be sure that the rack cabinet into which the subsystem chassis will be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
If it is necessary to transport the subsystem, repackage all disk drives separately.
Dual redundant controller models come with two controller modules that must
be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single controller modules cannot be upgraded, this
metal sheet should NEVER be removed.
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.