Rorke Data Galaxy A16F-G2422 User manual

Galaxy Raid
Model A16F-G2422
FC-4G to SATA-II RAID Subsystem
Installation and Hardware
Reference Manual
Version 070106
Version 1.0 (08, 2005)

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Contact Information
Americas
Rorke Data Inc
9700 West 76th St
Eden Prairie, MN 55344
USA
Tel: [phone]
Fax: [phone]
[email protected]
[e-mail]
http://www.rorke.com

Galaxy Raid Installation and Hardware Reference Manual
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Copyright 2005
This Edition First Published 2005
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to notify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC®is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.

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Warnings and Certifications
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
WARNING:
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly approved by
the party responsible for compliance could void your authority to operate the
equipment.
This device is in conformity with the EMC.

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CB
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus. This
standard covers only safety aspects of the above apparatus; it does not cover
other matters, such as style or performance.
ITE BSMI Class A, CNS 13438 (for Taiwan)
This device is in conformit
y
with the CB safet
y
specifications.

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Table of Contents
CHAPTER 1 INTRODUCTION
1.1. PRODUCT OVERVIEW.................................................................................................. 1-1
1.1.1 Product Introduction.......................................................................................... 1-1
1.1.2 Enclosure Chassis.............................................................................................. 1-2
1.1.2.1 Chassis Overview..............................................................................................................1-2
1.1.2.2 Physical Dimensions.........................................................................................................1-3
1.1.2.3 Front Panel Overview .......................................................................................................1-3
1.1.2.4 Hard Drive Numbering .....................................................................................................1-4
1.1.2.5 Rear Panel Overview.........................................................................................................1-4
1.1.2.6 Back-plane Board..............................................................................................................1-5
1.2. GALAXY COMPONENTS............................................................................................ 1-5
1.2.1 LCD Panel.......................................................................................................... 1-5
1.2.2 Drive Trays......................................................................................................... 1-6
1.2.3 RAID Controller Modules.................................................................................. 1-6
1.2.4 Controller Module Interfaces ............................................................................ 1-7
1.2.5 DIMM Modules.................................................................................................. 1-9
1.2.6 BBU .................................................................................................................... 1-9
1.2.7 PSUs................................................................................................................. 1-10
1.2.8 Cooling Modules.............................................................................................. 1-11
1.3. GALAXY MONITORING........................................................................................... 1-12
1.3.1 I2C bus ............................................................................................................. 1-12
1.3.2 LED Indicators................................................................................................. 1-12
1.3.3 Firmware (FW) and RAIDWatch GUI ............................................................ 1-13
1.3.4 Audible Alarms................................................................................................. 1-13
1.4. HOT-SWAPPABLE COMPONENTS............................................................................... 1-13
1.4.1 Hot-swap Capabilities...................................................................................... 1-13
1.4.2 Components...................................................................................................... 1-13
1.4.3 Normalized Airflow.......................................................................................... 1-14
CHAPTER 2 HARDWARE INSTALLATION
2.1. INSTALLATION OVERVIEW ................................................................................ 2-1
2.2. INSTALLATION PRE-REQUISITES...................................................................... 2-1
2.3. SAFETY PRECAUTIONS:....................................................................................... 2-2
2.3.1 Precautions and Instructions............................................................................. 2-2
2.3.2 Static-free Installation........................................................................................ 2-3
2.4. GENERAL INSTALLATION PROCEDURE.......................................................... 2-3
2.4.1 Installation Procedure Flowchart ..................................................................... 2-4
2.5. UNPACKING THE SUBSYSTEM........................................................................... 2-5
2.6. INSTALLATION OVERVIEW ................................................................................ 2-5
2.6.1 Pre-installed Components.................................................................................. 2-5
2.6.2 Uninstalled Components.................................................................................... 2-5
2.7. INSTALLING THE OPTIONAL BBU..................................................................... 2-6
2.7.1 BBU Installation Overview................................................................................ 2-6
2.7.2 BBU Warnings and Precautions........................................................................ 2-6

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2.7.3 Installation Procedure ....................................................................................... 2-7
2.8. HARD DRIVE INSTALLATION............................................................................. 2-9
2.8.1 Hard Drive Installation Prerequisites............................................................... 2-9
2.8.2 SATA Drive Installation..................................................................................... 2-9
2.9. DRIVE TRAY INSTALLATION............................................................................ 2-10
2.10. RACK/CABINET INSTALLATION...................................................................... 2-12
CHAPTER 3 SUBSYSTEM MONITORING
3.1. SUBSYSTEM MONITORING OVERVIEW........................................................................ 3-1
3.2. STATUS-INDICATING LEDS......................................................................................... 3-2
3.2.1 Brief Overview of the LEDs............................................................................... 3-2
3.2.2 LCD Panel.......................................................................................................... 3-3
3.2.3 Drive Tray LEDs................................................................................................ 3-4
3.2.4 Controller Module LEDs ................................................................................... 3-5
3.2.5 LAN Port LEDs .................................................................................................. 3-6
3.2.6 BBU LED............................................................................................................ 3-7
3.2.7 PSU LEDs .......................................................................................................... 3-8
3.2.8 Cooling Module LEDs ....................................................................................... 3-9
3.3. AUDIBLE ALARM ...................................................................................................... 3-10
3.3.1 Default Threshold Values ................................................................................ 3-10
3.3.2 Failed Devices.................................................................................................. 3-11
3.4. I2C MONITORING...................................................................................................... 3-11
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION
4.1 FC HOST CONNECTION PREREQUISITES ......................................................... 4-1
4.1.1 Choosing the Fibre Cables................................................................................ 4-1
4.1.2 FC Lasers........................................................................................................... 4-2
4.1.3 FC Speed Auto-detection ................................................................................... 4-2
4.1.4 SFP Transceivers............................................................................................... 4-2
4.2 TOPOLOGY AND CONFIGURATION CONSIDERATIONS............................... 4-3
4.2.1 Basic Configuration Rules................................................................................. 4-3
4.2.2 Fibre Channel Topologies ................................................................................. 4-3
4.2.3 Host-side Topologies.......................................................................................... 4-4
4.2.4 Unique Identifier................................................................................................ 4-4
4.2.5 ID/LUN Mapping............................................................................................... 4-4
4.3 SAMPLE TOPOLOGIES .......................................................................................... 4-5
4.3.1 Sample Topology – Clustered Hosts.................................................................. 4-5
4.3.2 Sample Topology – Direct-Attached.................................................................. 4-6
4.4 POWER ON ............................................................................................................... 4-6
4.4.1 Check List........................................................................................................... 4-7
4.4.2 Power On Procedure ......................................................................................... 4-7
4.4.3 Power On Status Check...................................................................................... 4-8
4.4.4 LCD Screen ........................................................................................................ 4-9
4.5 POWER OFF PROCEDURE................................................................................... 4-10
CHAPTER 5 SUBSYSTEM MAINTENANCE
5.1. OVERVIEW............................................................................................................... 5-1
5.1.1 Maintenance....................................................................................................... 5-1

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5.1.2 General Notes on Component Replacement...................................................... 5-1
5.2. REPLACING CONTROLLER MODULE COMPONENTS ................................... 5-2
5.2.1 Overview............................................................................................................. 5-2
5.2.2 Notes on Controller Module Maintenance........................................................ 5-3
5.2.3 Removing the Controller Module ...................................................................... 5-3
5.2.4 Replacing the Controller Module...................................................................... 5-4
5.3. DIMM MODULE REPLACEMENT........................................................................ 5-6
5.3.1 DIMM Module Considerations.......................................................................... 5-6
5.3.2 DIMM Module Replacement Procedure............................................................ 5-6
5.4. REPLACING AFAULTY BBU................................................................................ 5-7
5.5. REPLACING AFAULTY PSU MODULE .............................................................. 5-9
5.5.1 PSU Module Overview....................................................................................... 5-9
5.5.2 Replacing the PSU Module.............................................................................. 5-10
5.6. COOLING MODULE MAINTENANCE ............................................................... 5-13
5.6.1 Cooling Module Overview............................................................................... 5-13
5.6.2 Replacing a Cooling Module........................................................................... 5-13
5.7. REPLACING AFAILED HARD DRIVE............................................................... 5-14
5.7.1 Hard Drive Maintenance Overview................................................................. 5-14
5.7.2 Replacing a Hard Drive................................................................................... 5-15
APPENDIX A UNINTERRUPTIBLE POWER SUPPLY
A.1. UNINTERRUPTIBLE POWER SUPPLY OVERVIEW .......................................................A-1
A.2. COMPATIBLE UPS SUPPLIES.....................................................................................A-1
A.3. SERIAL COMMUNICATION CABLES...........................................................................A-1
A.4. CONNECTING THE UPS TO THE SUBSYSTEM.............................................................A-2
A.4.1 Connect the PSU Module Power Cords..........................................................A-2
A.4.2 Set the Baud Rate.............................................................................................A-2
A.4.3 Connect COM2.................................................................................................A-2
A.5. POWER ON................................................................................................................A-3
A.6. UPS STATUS MONITORING.......................................................................................A-3
A.6.1 Normal Operational Status..............................................................................A-3
A.6.2 UPS Messages..................................................................................................A-3
A.6.3 UPS Message Summary...................................................................................A-4
APPENDIX B SPECIFICATIONS
B.1. TECHNICAL SPECIFICATIONS ....................................................................................B-1
B.2. CONTROLLER SPECIFICATIONS .................................................................................B-3
B.2.1 Configuration...................................................................................................B-3
B.2.2 Architecture......................................................................................................B-3
B.3. DRIVE TRAY SPECIFICATIONS...................................................................................B-4
B.4. POWER SUPPLY SPECIFICATIONS..............................................................................B-4
B.5. COOLING MODULE SPECIFICATIONS.........................................................................B-5
B.6. RAID MANAGEMENT ...............................................................................................B-5
B.7. FAULT TOLERANCE MANAGEMENT..........................................................................B-6
APPENDIX C SPARE PARTS AND ACCESSORIES
C.1. SPARE PARTS ............................................................................................................C-1
C.2. ACCESSORIES ............................................................................................................C-2

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APPENDIX D PIN OUTS
D.1. SFP CONNECTOR PIN OUTS......................................................................................D-1
D.2. COM1 CABLE:DB9 AUDIO JACK PIN OUTS............................................................D-3
D.3. COM2 CABLE:DB9 AUDIO JACK PIN OUTS............................................................D-3
D.4. IFT-9011 NULL MODEM...........................................................................................D-4
D.5. ETHERNET PORT PIN OUTS.......................................................................................D-5
D.6. MAIN POWER ............................................................................................................D-5
Safety Precautions
Precautions and Instructions
•Prior to powering on the subsystem, ensure that the correct power range is being
used.
•The GALAXY subsystem comes with sixteen (16) drive bays. Leaving any of
these drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.
•If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
•Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and rear.
•Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
•To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
•Be sure that the rack cabinet into which the subsystem chassis will be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
•Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
•If it is necessary to transport the subsystem, repackage all disk drives separately.
•Dual redundant controller models come with two controller modules that must
be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single controller modules cannot be upgraded, this
metal sheet should NEVER be removed.

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ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.
About This Manual
This manual:
•Introduces the GALAXY RAID subsystem series.
•Describes all the active components in the subsystem.
•Provides recommendations and details about the hardware installation
process.
•Briefly describes how to monitor the subsystem.
•Describes how to maintain the subsystem.
This manual does not:
•Describe components that are not user-serviceable.
•Describe the configuration options of firmware, using terminal
emulation programs, or the RAIDWatch GUI software that came with
your subsystem.
•Give a detailed description of the RAID controllers embedded within
the subsystem.
Revision History
♦Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.