Samsung MultiXpress M537x series User manual

MonoLaserMFP
MultiXpressM537x/M437xseries
SL-M5370LX,SL-M4370LX
(Ver.1.01)
SERVICEMANUAL
MonoLaserMFPContents
1.Precautions
2.ProductSpecicationsandDescription
3.DisassemblyandReassembly
4.Troubleshooting
5.SystemDiagram
6.ReferenceInformation
RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents
Contents
1.Precautions........................................................................................................................................1−1
1.1.Safetywarning..........................................................................................................................1−1
1.2.Cautionforsafety......................................................................................................................1−2
1.2.1.Toxicmaterial...............................................................................................................1−2
1.2.2.Electricshockandresafetyprecautions...........................................................................1−2
1.2.3.Handlingprecautions.....................................................................................................1−4
1.2.4.AssemblyandDisassemblyprecautions.............................................................................1−4
1.2.5.Disregardingthiswarningmaycausebodilyinjury..............................................................1−5
1.3.ESDprecautions........................................................................................................................1−6
1.4.CautionforDataLoss.................................................................................................................1−7
2.ProductSpecicationsandDescription....................................................................................................2−1
2.1.ProductOverview......................................................................................................................2−1
2.2.Specications............................................................................................................................2−2
2.2.1.GeneralSpecication.....................................................................................................2−2
2.2.2.PrintSpecications........................................................................................................2−4
2.2.3.Scanspecication..........................................................................................................2−5
2.2.4.Copyspecication.........................................................................................................2−6
2.2.5.Faxspecication...........................................................................................................2−7
2.2.6.PaperHandlingspecication............................................................................................2−8
2.2.7.SoftwareandSolutionspecication.................................................................................2−10
2.2.8.Supplies.....................................................................................................................2−12
2.2.9.MaintenanceParts.......................................................................................................2−13
2.2.10.Option.......................................................................................................................2−14
2.3.SystemConguration...............................................................................................................2−18
2.4.FeedingSystem.......................................................................................................................2−23
2.4.1.FeedingSystemOverview.............................................................................................2−23
2.4.2.Cassette.....................................................................................................................2−28
2.4.3.Pick-UpUnit..............................................................................................................2−29
2.4.4.RegistrationUnit.........................................................................................................2−30
2.4.5.MPF(Multi-PurposeFeeder)Unit...................................................................................2−31
2.5.ImageCreation........................................................................................................................2−32
2.5.1.Printingprocessoverview.............................................................................................2−32
2.5.2.TonerCartridge...........................................................................................................2−33
2.5.3.ImagingUnit..............................................................................................................2−34
2.5.3.1.DeveloperUnit.............................................................................................2−35
2.5.4.Drumdrive.................................................................................................................2−37
2.6.Fuserunit...............................................................................................................................2−38
2.6.1.Fuserunitoverview.....................................................................................................2−38
iCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents
2.6.2.Fuserunitdrive...........................................................................................................2−39
2.6.3.Fuserunittemperaturecontrol........................................................................................2−40
2.7.LaserScanningUnit(LSU)........................................................................................................2−41
2.7.1.LSUoverview.............................................................................................................2−41
2.7.2.LaserScanningOpticalpath..........................................................................................2−43
2.7.3.Lasersynchronizingdetectors........................................................................................2−44
2.8.DriveSystem..........................................................................................................................2−46
2.8.1.DriveMotors..............................................................................................................2−46
2.8.2.MainDriveUnit..........................................................................................................2−47
2.8.2.1.MainDrive(OPC_Regi._Pick-up_MP_Duplex)..................................................2−48
2.8.2.2.MainDrive(Deve_Agitaitor_TonerSupply).......................................................2−49
2.8.3.Fuser_ExitDrive.........................................................................................................2−50
2.9.ScannerSystem.......................................................................................................................2−51
2.9.1.ScannerSystemoverview.............................................................................................2−51
2.9.2.ScanningSystemComponents.......................................................................................2−52
2.10.DualScanDocumentFeeder(DSDF)...........................................................................................2−53
2.10.1.DSDF(DualScanDocumentFeeder)overview..................................................................2−53
2.10.2.Electricalpartslocation................................................................................................2−54
2.10.3.DSDFDriveSystem....................................................................................................2−56
2.11.HardwareConguration............................................................................................................2−58
2.11.1.Mainboard.................................................................................................................2−61
2.11.2.MSOK......................................................................................................................2−63
2.11.3.FaxJointPBA............................................................................................................2−63
2.11.4.FaxCard(Optional).....................................................................................................2−64
2.11.5.FDI(Optional)............................................................................................................2−64
2.11.6.OPEHubPBA............................................................................................................2−65
2.11.7.SMPSboard...............................................................................................................2−66
2.11.8.FuserDriveBoard(FDB)..............................................................................................2−68
2.11.9.HVPSboard...............................................................................................................2−69
2.11.10.FinisherPBA..............................................................................................................2−71
2.11.11.SCF_HCFboard..........................................................................................................2−72
2.11.12.CRUMJointPBA........................................................................................................2−72
2.11.13.Sub-CassettePBA.......................................................................................................2−73
2.11.14.CRUMPBA..............................................................................................................2−73
2.11.15.EraserPBA................................................................................................................2−74
2.11.16.FuserCRUMPBA.......................................................................................................2−74
3.DisassemblyandReassembly................................................................................................................3−1
3.1.Precautionswhenreplacingparts..................................................................................................3−1
3.1.1.Precautionswhenassemblinganddisassembling.................................................................3−1
3.1.2.PrecautionswhenhandlingPBA.......................................................................................3−1
Copyright©1995-2013SAMSUNG.Allrightsreserved.ii

Contents
3.1.3.ReleasingPlasticLatches................................................................................................3−2
3.2.Maintenance.............................................................................................................................3−3
3.2.1.MachineCleaningformaintenance...................................................................................3−3
3.2.1.1.CleaningtheDSDFwhitebar............................................................................3−3
3.2.2.Replacingthemaintenancepart........................................................................................3−4
3.2.2.1.FuserUnit......................................................................................................3−4
3.2.2.2.TransferRoller...............................................................................................3−5
3.2.2.3.Pick-Up_Reverse_Forwardroller.......................................................................3−6
3.2.2.4.MPpadandMPUnit.......................................................................................3−7
3.2.2.5.DSDFpickuprollerAssy...............................................................................3−11
3.2.2.6.DSDFReverserollerAssy..............................................................................3−12
3.2.2.7.SCFPick-Up_Reverse_Forwardroller...............................................................3−13
3.2.2.8.HCFPick-Up_Reverse_Forwardroller..............................................................3−14
3.3.ReplacingthemainSVCpart.....................................................................................................3−15
3.3.1.LeftCover..................................................................................................................3−15
3.3.2.RearCover.................................................................................................................3−15
3.3.3.FrontCover................................................................................................................3−16
3.3.4.FuserDriveBoard(FDB)..............................................................................................3−17
3.3.5.HVPSboard...............................................................................................................3−18
3.3.6.SMPSboard...............................................................................................................3−19
3.3.7.MainBoard................................................................................................................3−20
3.3.8.HardDiskDrive(HDD)................................................................................................3−21
3.3.9.MainDriveUnit..........................................................................................................3−22
3.3.10.Fuser_ExitDriveUnit..................................................................................................3−23
3.3.11.SideUnit...................................................................................................................3−24
3.3.11.1.DuplexFan..................................................................................................3−26
3.3.11.2.DuplexClutch..............................................................................................3−26
3.3.11.3.CTDsensor..................................................................................................3−27
3.3.12.Scanner.....................................................................................................................3−28
3.3.13.ExitUnit....................................................................................................................3−30
3.3.13.1.ExitSensor1................................................................................................3−31
3.3.13.2.ExitSensor2................................................................................................3−31
3.3.14.LSU(LaserScanningUnit)...........................................................................................3−32
3.3.15.Regi_Feed_Readysensor..............................................................................................3−33
3.3.16.DSDF(DualScanDocumentFeeder)..............................................................................3−34
3.3.16.1.DSDFHinge................................................................................................3−35
3.3.16.2.DSDFCover................................................................................................3−36
3.3.16.3.DSDFboard.................................................................................................3−37
3.3.16.4.DSDFStacker..............................................................................................3−37
3.3.16.5.DSDFCOVER-OPEN...................................................................................3−38
iiiCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents
3.3.16.6.DSDFGUIDE-PICKUPASSY.......................................................................3−39
3.3.16.7.DSDF-EXITUP............................................................................................3−40
3.3.16.8.HOLDER-HARNESS....................................................................................3−40
3.3.16.9.DSDF-CCDM..............................................................................................3−41
3.3.16.10.DSDFDrive.................................................................................................3−42
3.3.17.OPEUnit...................................................................................................................3−43
3.3.18.PlatenUnit.................................................................................................................3−44
3.3.18.1.ScanUpper..................................................................................................3−44
3.3.18.2.ScanMotor..................................................................................................3−45
3.3.18.3.ScanJointBoard...........................................................................................3−45
3.3.18.4.CoverOpenSensor........................................................................................3−46
3.3.18.5.APSSensor..................................................................................................3−46
3.3.19.CardReaderorNFCKitInstallation...............................................................................3−47
4.Troubleshooting..................................................................................................................................4−1
4.1.Controlpanel............................................................................................................................4−1
4.1.1.Displayscreenandusefulbuttons.....................................................................................4−2
4.1.1.1.Menunavigation.............................................................................................4−2
4.1.1.2.HomeScreenOverview....................................................................................4−3
4.1.1.3.Customizingyourhomescreen..........................................................................4−4
4.1.1.4.NoticationBar..............................................................................................4−6
4.2.UnderstandingtheLEDs.............................................................................................................4−7
4.3.UpdatingFirmware....................................................................................................................4−8
4.3.1.UpdatingfromthePrinterControlPanel............................................................................4−8
4.3.2.UpdatingfromtheNetwork............................................................................................4−9
4.4.JAMremoval..........................................................................................................................4−12
4.4.1.Clearingoriginaldocumentjams....................................................................................4−12
4.4.2.Clearingpaperjams.....................................................................................................4−19
4.5.ServiceMode..........................................................................................................................4−37
4.5.1.EnteringtheServiceMode............................................................................................4−37
4.5.2.ServiceModeMenuTree.............................................................................................4−38
4.5.3.Information................................................................................................................4−43
4.5.3.1.General.......................................................................................................4−43
4.5.3.2.SupplyStatus...............................................................................................4−43
4.5.3.3.SoftwareVersion...........................................................................................4−43
4.5.3.4.ServiceHours...............................................................................................4−44
4.5.3.5.FaultLog.....................................................................................................4−44
4.5.3.6.PrintReports................................................................................................4−44
4.5.3.7.ExportReports..............................................................................................4−44
4.5.4.MaintenanceCounts.....................................................................................................4−45
4.5.4.1.FaultCount.................................................................................................4−45
Copyright©1995-2013SAMSUNG.Allrightsreserved.iv

Contents
4.5.4.2.JamCount...................................................................................................4−45
4.5.4.3.PartReplacementCount.................................................................................4−45
4.5.5.Diagnostics................................................................................................................4−47
4.5.5.1.EngineDiagnostics........................................................................................4−47
4.5.5.2.FaxDiagnostics............................................................................................4−51
4.5.5.3.ScannerDiagnostics.......................................................................................4−55
4.5.5.4.Adjustment..................................................................................................4−57
4.5.6.ServiceFunctions........................................................................................................4−64
4.5.6.1.MainMemoryClear......................................................................................4−64
4.5.6.2.HardDiskMaintenance..................................................................................4−64
4.5.6.3.NetworkPort................................................................................................4−65
4.5.6.4.DebugLog...................................................................................................4−65
4.5.6.5.CaptureLog.................................................................................................4−65
4.5.6.6.NetworkPacketCapture.................................................................................4−66
4.5.6.7.SystemRecovery..........................................................................................4−67
4.5.6.8.ClearSystemCache.......................................................................................4−69
4.5.6.9.Hibernation..................................................................................................4−69
4.5.6.10.PaperLowWarningMessage...........................................................................4−69
4.5.6.11.PartReplacementAlert...................................................................................4−69
4.5.6.12.FDI............................................................................................................4−69
4.5.6.13.EIUL(EndofImageUnitLife)........................................................................4−69
4.5.6.14.SFE(SpecialFeatureEnablement)....................................................................4−70
4.5.6.15.DealerID.....................................................................................................4−71
4.5.6.16.EnvelopeRotate............................................................................................4−71
4.6.ErrorCodeandTroubleshooting.................................................................................................4−72
4.6.1.Ax-xxxxtypeerrorcode...............................................................................................4−80
4.6.2.Cx-xxxxtypeerrorcode...............................................................................................4−89
4.6.3.H1-xxxxtype(OptionalCassette)errorcode...................................................................4−102
4.6.4.H2-xxxxtype(Finisher)errorcode...............................................................................4−118
4.6.5.Mx-xxxxtypeerrorcode.............................................................................................4−147
4.6.6.Sx-xxxxtypeerrorcode..............................................................................................4−161
4.6.7.U1-xxxxtype(Fuser)errorcode...................................................................................4−177
4.6.8.U2-xxxxtype(LSU)errorcode....................................................................................4−180
4.6.9.U3-xxxxtype(DSDF)errorcode..................................................................................4−182
4.7.Imagequalityproblem............................................................................................................4−193
5.SystemDiagram..................................................................................................................................5−1
6.ReferenceInformation..........................................................................................................................6−1
6.1.ToolsforTroubleshooting............................................................................................................6−1
6.2.Glossary...................................................................................................................................6−3
vCopyright©1995-2013SAMSUNG.Allrightsreserved.

Contents
6.3.TheSamplePatternfortheTest....................................................................................................6−9
6.4.ModelNameandCode.............................................................................................................6−10
6.5.DocumentRevisionList............................................................................................................6−11
Copyright©1995-2013SAMSUNG.Allrightsreserved.vi

1.Precautions
1.Precautions
Inordertopreventaccidentsanddamagestotheequipmentpleasereadtheprecautionslistedbelowcarefullybefore
servicingtheproductandfollowthemclosely.
1.1.Safetywarning
1)Onlytobeservicedbyafactorytrainedservicetechnician.
Highvoltagesandlasersinsidethisproductaredangerous.Thisproductshouldonlybeservicedbyafactorytrained
servicetechnician.
2)UseonlySamsungreplacementparts.
Therearenouserserviceablepartsinsidetheproduct.Donotmakeanyunauthorizedchangesoradditionstothe
productasthesecouldcausetheproducttomalfunctionsandcreateanelectricshocksorrehazards.
3)LaserSafetyStatement
TheprinteriscertiedintheU.S.toconformtotherequirementsofDHHS21CFR,chapter1SubchapterJfor
ClassI(1)laserproducts,andelsewhereiscertiedasaClassIlaserproductconformingtotherequirementsofIEC
60825-1.ClassIlaserproductsarenotconsideredtobehazardous.Thelasersystemandprinteraredesignedso
thereisneveranyhumanaccesstolaserradiationaboveaClassIlevelduringnormaloperation,usermaintenance
orprescribedservicecondition.
•Wavelength:800nm
•Beamdivergence
-Paraller:11degrees
-Perpendicular:35degrees
•Maximumpowerofenergyoutput:12mW
WARNING
NeveroperateorservicetheproductwiththeprotectivecoverremovedfromLaser/Scannerassembly.Thereected
beam,althoughinvisible,candamageyoureyes.
Whenusingthisproduct,thesebasicsafetyprecautionsshouldalwaysbefollowedtoreduceriskofre,electric
shock,andpersonalinjury.
4)Lithiumbatterynotreplaceablebyuser
1-1Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precautions
1.2.Cautionforsafety
1.2.1.Toxicmaterial
Thisproductcontainstoxicmaterialsthatcouldcauseillnessifingested.
1)Pleasekeepimagingunitandtonercartridgeawayfromchildren.Thetonerpowdercontainedintheimagingunitand
tonercartridgemaybeharmful,andifswallowed,youshouldcontactadoctor.
1.2.2.Electricshockandresafetyprecautions
Failuretofollowthefollowinginstructionscouldcauseelectricshockorpotentiallycauseare.
1)Useonlythecorrectvoltage,failuretodosocoulddamagetheproductandpotentiallycauseareorelectricshock.
2)Useonlythepowercablesuppliedwiththeproduct.Useofanincorrectlyspeciedcablecouldcausethecableto
overheatandpotentiallycauseare.
3)Donotoverloadthepowersocket,thiscouldleadtooverheatingofthecablesinsidethewallandcouldleadtoare.
4)Donotallowwaterorotherliquidstospillintotheproduct,thiscancauseelectricshock.Donotallowpaperclips,pins
orotherforeignobjectstofallintotheproduct,thesecouldcauseashortcircuitleadingtoanelectricshockorrehazard.
5)Nevertouchtheplugsoneitherendofthepowercablewithwethands,thiscancauseelectricshock.Whenservicing
theproduct,removethepowerplugfromthewallsocket.
6)Usecautionwheninsertingorremovingthepowercord.Whenremovingthepowercord,gripitrmlyandpull.The
powercordmustbeinsertedcompletely,otherwiseapoorcontactcouldcauseoverheatingleadingtoare.
7)Takecareofthepowercable.Donotallowittobecometwisted,bentsharplyaroundcornersorpowercablemaybe
damaged.Donotplaceobjectsontopofthepowercable.Ifthepowercableisdamageditcouldoverheatandcausea
re.Exposedcablescouldcauseanelectricshock.Replacethedamagedpowercableimmediately,donotreuseor
repairthedamagedcable.Somechemicalscanattackthecoatingonthepowercable,weakeningthecoverorexposing
cablescausingreandshockrisks.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-2

1.Precautions
8)Ensurethatthepowersocketsandplugsarenotcrackedorbrokeninanyway.Anysuchdefectsshouldberepaired
immediately.Takecarenottocutordamagethepowercableorplugswhenmovingthemachine.
9)Usecautionduringthunderorlightningstorms.Samsungrecommendsthatthismachinebedisconnectedfromthe
powersourcewhensuchweatherconditionsareexpected.Donottouchthemachineorthepowercordifitisstill
connectedtothewallsocketintheseweatherconditions.
10)Avoiddampordustyareas,installtheproductinacleanwellventilatedlocation.Donotpositionthemachineneara
humidierorinfrontofanairconditioner.Moistureanddustbuiltupinsidethemachinecanleadtooverheatingand
causeareorcausepartstorust.
11)Donotpositiontheproductindirectsunlight.Thiswillcausethetemperatureinsidetheproducttorisepossiblyleading
totheproductfailingtoworkproperlyandinextremeconditionscouldleadtoare.
12)Donotinsertanymetalobjectsintothemachinethroughtheventilatorfanorotherpartofthecasing,itcouldmake
contactwithahighvoltageconductorinsidethemachineandcauseanelectricshock.
13)WhenreplacingtheSMPSboard,pleasewait5minutesafterunpluggingthepowercord,thenreplaceit.You
cangetashockbytheelectricdischarge.
1-3Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precautions
1.2.3.Handlingprecautions
Thefollowinginstructionsareforyourownpersonalsafetytoavoidinjuryandsoasnottodamagetheproduct.
1)Ensuretheproductisinstalledonalevelsurface,capableofsupportingitsweight.Failuretodosocouldcause
theproducttotiporfall.
2)Theproductcontainsmanyrollers,gearsandfans.Takegreatcaretoensurethatyoudonotcatchyourngers,hairor
clothinginanyoftheserotatingdevices.
3)Donotplaceanysmallmetalobjects,containersofwater,chemicalsorotherliquidsclosetotheproductwhichifspilled
couldgetintothemachineandcausedamageorashockorrehazard.
4)Donotinstallthemachineinareaswithhighdustormoisturelevels,besideonopenwindoworclosetoahumidieror
heater.Damagecouldbecausedtotheproductinsuchareas.
5)Donotplacecandles,burningcigarettes,etcontheproduct,Thesecouldcauseare.
6)Ensurethatthemachineisinstalledandusedinproperareatomeetthetemperatureandhumidityspecications.
•IfthemachineisstoredatbelowzeroCelsiusforalongtime,donotusethemachineinstantlyaftermovement.It
canmalfunction.Takecareofthemachinestorage.IfthemachineisstoredatbelowzeroCelsiusforalongtime,
keepthemachineatroomtemperatureandinstallit.
1.2.4.AssemblyandDisassemblyprecautions
1)ReplacepartscarefullyandalwaysuseSamsungparts.Takecaretonotetheexactlocationofpartsandalsocable
routingbeforedismantlinganypartofthemachine.Ensureallpartsandcablesarereplacedcorrectly.Pleasecarryout
thefollowingproceduresbeforedismantlingtheproductorreplacinganyparts.
2)Ensurethatpowerisdisconnectedbeforeservicingorreplacinganyelectricalparts.
3)Disconnectinterfacecablesandpowercables.
4)Onlyuseapprovedspareparts.Ensurethatpartnumber,productname,anyvoltage,currentortemperaturerating
arecorrect.
5)Whenremovingorre-ttinganypartsdonotuseexcessiveforce,especiallywhenttingscrewsintoplastic.
6)Takecarenottodropanysmallpartsintothemachine.
7)HandlingoftheOPCDrum
•TheOPCDrumcanbeirreparablydamagedifitexposedtolight.TakecarenottoexposetheOPCDrumeither
todirectsunlightortouorescentorincandescentroomlighting.Exposureforaslittleas5minutescandamage
thesurfaceofthephotoconductivepropertiesandwillresultinprintqualitydegradation.Takeextracarewhen
servicingtheproduct.RemovetheOPCDrumandstoreitinablackbagorotherlightproofcontainer.Take
carewhenworkingwiththeCovers(especiallythetopcover)openaslightisadmittedtotheOPCareaandcan
damagetheOPCDrum.
•TakecarenottoscratchthegreensurfaceofOPCDrumUnit.IfthegreensurfaceoftheDrumCartridgeis
scratchedortouchedtheprintqualitywillbecompromised.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-4

1.Precautions
1.2.5.Disregardingthiswarningmaycausebodilyinjury
1)Becarefulwiththehightemperaturepart.
Thefuserunitworksatahightemperature.Usecautionwhenworkingontheprinter.Waitforthefuserunitto
cooldownbeforedisassembly.
2)Donotputngersorhairintotherotatingparts.
Whenoperatingaprinter,donotputhandorhairintotherotatingparts(Paperfeedingentrance,motor,fan,etc.).
Ifdo,youcangetharm.
3)Whenyoumovetheprinter,usesafeliftingandhandlingtechniques.
Thisprinterisheavy.Usetheliftinghandleslocatedoneachsideofthemachine.Backinjurycouldbecausedif
youdonotliftcarefully.
4)Ensuretheprinterisinstalledsafely.
Ensuretheprinterisinstalledonalevelsurface,capableofsupportingitsweight.Failuretodosocouldcausethe
printertotiporfallpossiblycausingpersonalinjuryordamagingtheprinter.
5)Donotinstalltheprinteronaslopingorunstablesurface.Afterinstallation,doublecheckthattheprinterisstable.
1-5Copyright©1995-2013SAMSUNG.Allrightsreserved.

1.Precautions
1.3.ESDprecautions
Certainsemiconductordevicescanbeeasilydamagedbystaticelectricity.Suchcomponentsarecommonlycalled
“ElectrostaticallySensitive(ES)Devices”orESDs.ExamplesoftypicalESDsare:integratedcircuits,someeldeffect
transistors,andsemiconductor“chip”components.Thetechniquesoutlinedbelowshouldbefollowedtohelpreducethe
incidenceofcomponentdamagecausedbystaticelectricity.
CAUTION
Besurenopowerisappliedtothechassisorcircuit,andobserveallothersafetyprecautions.
1)Immediatelybeforehandlingasemiconductorcomponentorsemiconductor-equippedassembly,drainoffany
electrostaticchargeonyourbodybytouchingaknownearthground.Alternatively,employacommerciallyavailable
wriststrapdevice,whichshouldberemovedforyourpersonalsafetyreasonspriortoapplyingpowertotheunit
undertest.
2)AfterremovinganelectricalassemblyequippedwithESDs,placetheassemblyonaconductivesurface,suchas
aluminumorcopperfoil,orconductivefoam,topreventelectrostaticchargebuildupinthevicinityoftheassembly.
3)UseonlyagroundedtipsolderingirontosolderordesolderESDs.
4)Useonlyan“anti-static”solderremovaldevice.Somesolderremovaldevicesnotclassiedas“anti-static”can
generateelectricalchargessufcienttodamageESDs.
5)DonotuseFreon-propelledchemicals.Whensprayed,thesecangenerateelectricalchargessufcienttodamageESDs.
6)DonotremoveareplacementESDfromitsprotectivepackaginguntilimmediatelybeforeinstallingit.Most
replacementESDsarepackagedwithallleadsshortedtogetherbyconductivefoam,aluminumfoil,oracomparable
conductivematerial.
7)ImmediatelybeforeremovingtheprotectiveshortingmaterialfromtheleadsofareplacementESD,touchtheprotective
materialtothechassisorcircuitassemblyintowhichthedevicewillbeinstalled.
8)MaintaincontinuouselectricalcontactbetweentheESDandtheassemblyintowhichitwillbeinstalled,until
completelypluggedorsolderedintothecircuit.
9)MinimizebodilymotionswhenhandlingunpackagedreplacementESDs.Normalmotions,suchasthebrushingtogether
ofclothingfabricandliftingone’sfootfromacarpetedoor,cangeneratestaticelectricitysufcienttodamageanESD.
Copyright©1995-2013SAMSUNG.Allrightsreserved.1-6

1.Precautions
1.4.CautionforDataLoss
TopreventlossofcustomersdatatheSVCengineerprovidesend-userwithrelevantinformationinadvance.
1-7Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecicationsandDescription
2.ProductSpecicationsandDescription
2.1.ProductOverview
•PrintingSpeed
•M5370series:Upto53ppminA4(55ppminLetter)
•M4370series:Upto43ppminA4(45ppminLetter)
•Processor
•DualCore1GHz
•Memory(Std./Max)
•2GB/2GBDDR3SDRAM
•320GBHDD
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-1

2.ProductSpecicationsandDescription
2.2.Specications
ProductSpecicationsaresubjecttochangewithoutnotice.
2.2.1.GeneralSpecication
ItemSpecication
MainController1GHz(DualCore)
ProcessorOperationalPanel1GHz(QuadCore)
OperationalPanel10.1"ColorTouch-ScreenLCD(960x600)
LED3EA UserInterface
Key/Button1EA(Power)
Standard2GB
MemoryMax.(Option)2GB
StorageStandard320GBHDD
USB(Device)Std(Hi-SpeedUSB2.0)
USB(Host)Std(Hi-SpeedUSB2.0)
USB(EDI)N/A
WiredLANStd(Ethernet10/100/1000BaseTX)
AdditionalWired
LANSupportN/A
WirelessLANOpt(IEEE802.11b/g/n+NFCActiveType)
NFCOpt(IEEE802.11b/g/n+NFCActiveType)
Interface
RJ11ConnectorOpt(Fax)
FromPower-OffLessthan60sec
Warm-upTimeFromSleep•M5370series:Lessthan26sec
•M4370series:Lessthan27sec
ReadyLessthan30W
Normaloperation•M5370series:Lessthan900W
•M4370series:Lessthan800W
Max/PeakLessthan1000W
SleepLessthan1.5W
PowerOffLessthan0.5W
Power
Consumption
TEC•M5370series:Lessthan3.9kWh
•M4370series:Lessthan3.4kWh
Default1min
SleepDelayTimeRange1-120min
Korea220~240V/50/60Hz/4.5A
USA100~127V/60Hz/9A Power
Europe220~240V/50Hz/4.5A
2-2Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecicationsandDescription
ItemSpecication
Printing
•Tray1:Lessthan56dBA
•Tray2~4:Lessthan57dBA
•MP:Lessthan57dBA
•HCF:Lessthan57dBA
Copying
•Tray1:Lessthan58dBA
•Tray2~4:Lessthan59dBA
•MP:Lessthan59dBA
•HCF:Lessthan59dBA
Standby(Fuseroff)37dBA
AcousticNoise
Level(Sound
Power/Pressure)
SleepBackgroundNoiseLevel
Dimension(WxD
xH)
Set(mm)
(withoutany
options)
•630x506x636mm(24.8"x19.9"x25.0")
Weight
Set(Kg)
(withsupplies
/withoutany
options)
•48.97Kg(108lb)
Recommended
MonthlyPrint
V olume
•M5370series:15,000Images
•M4370series:10,000Images
Reliability&
ServiceMaxMonthlyDuty
Cycle
•M5370series:300,000Images
•M4370series:250,000Images
Operating10to32°C(50to90°F)
TemperatureStorage-20to40°C(-4to104°F)
Operating20to80%RH
HumidityStorage10to90%RH
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-3

2.ProductSpecicationsandDescription
2.2.2.PrintSpecications
ItemSpecication
Simplex
•M5370series
•Upto53ppminA4(55ppminLetter)
•M4370series
•Upto43ppminA4(45ppminLetter)
PrintSpeed
Duplex
•M5370series
•Upto48ppminA4(50ppminLetter)
•M4370series
•Upto38ppminA4(40ppminLetter)
FromReady•M5370series:Lessthan7.5sec
•M4370series:Lessthan8.0sec
FPOT
FromSleep@2hrLessthan35sec
OpticalUpto1200x600dpi
ResolutionEnhancedUpto1200x1200dpiEffectiveOutput(1200x600x2bit)
PrinterLanguagesPCL5C/PCL6/PS3/PDFV1.7
PCL93ScalableFonts/1Bitmap
FontPostscript3136ScalableFonts
WindowsXP(32/64bit)/2003Server(32/64bit)/Vista(32/64bit)/2008server(32/64
bit)/7(32/64bit)/2008ServerR2/Win8(32/64bit)/2012(64bit)
Linux
•RedHatEnterpriseLinux5/6
•Fedora11/12/13/14/15/16/17/18/19
•openSUSE11.0/11.1/11.2/11.3/11.4/12.1/12.2/12.3
•Ubuntu10.04/10.10/11.04/11.10/12.04/12.10/13.04
•SUSELinuxEnterpriseDesktop10/11
•Debian5.0/6.0/7.0/7.1
•Mint13/14/15
UNIXSunSolaris9/10/11(x86/SP ARC)/HP-UNIX11.0/11iv1/11iv2/11iv3
(PA-RISC/Itanium)/IBMAIX5.1/5.2/5.3/5.4/6.1/7.1(PowerPC)
ClientOSSupport
MacOSMacOSX10.5-10.9
NetworkProtocol
TCP/IPv4/HTTP/HTTPS/SNMP(v1.2/v3)/LDAP/LDAPS/SMTP/SSL/TLS
/IPSec/DNS/WINS/SLP/Bonjour/SSDP/DDNS/DHCP/BOOTP/IPv6/
NetBIOSoverTCP/IP
DuplexPrintBuilt-in
DirectPrintPDF
PrintFeaturesProofPrint/ECOPrint/AutoContinue/SkipBlankPages/AirPrint/Google
CloudPrint
2-4Copyright©1995-2013SAMSUNG.Allrightsreserved.

2.ProductSpecicationsandDescription
2.2.3.Scanspecication
ItemSpecication
B/W(Lineart,
Halftone)
•Simplex:Upto55ipm(@300dpi)
•Duplex:Upto80ipm(@300dpi)
Gray•Simplex:Upto55ipm(@300dpi)
•Duplex:Upto80ipm(@300dpi)
ScanSpeed
Color•Simplex:Upto55ipm(@300dpi)
•Duplex:Upto80ipm(@300dpi)
ColorModeMono/Gray/Color
CompatibilityTWAIN(OnlyforUSB),WIA(N/A)
ScanmethodWhite-LEDScanLampTypeofCCD
FileFormatsTIFF-S/TIFF-M/JPEG/PDF/CompactPDF/XPS
Optical(ADF)Upto600x600dpi
Optical(Platen)Upto600x600dpi
Enhanced(ADF)Upto4800x4800dpi
Resolution
Enhanced(Platen)Upto4800x4800dpi
ScanDestinationsEmail/FTP/SMB/HDD/USB/Client
MultiDestinationsNo
CommunicationProtocolSMTP/MIME(Base64)/SMB/FTP/W ebDA V
ADFMax.216x356mm(8.5"x14")
ScanSizePlatenMax.216x356mm(8.5"x14")
ScanOriginalTypesText,Text/Photo,Photo
Copyright©1995-2013SAMSUNG.Allrightsreserved.2-5

2.ProductSpecicationsandDescription
2.2.4.Copyspecication
ItemSpecication
SDMC(Single
Document
MultipleCopy)
•M537xseries
•Upto53cpm@A4(Upto55cpminLetter)
•M437xseries
•Upto43cpm@A4(Upto45cpminLetter)
CopySpeed
MDMC(Multiple
Document
MultipleCopy)
•M537xseries
•SimplextoDuplex(1-2):upto48cpminA4
•DuplextoSimplex(2-1):upto53cpminA4
•DuplextoDuplex(2-2):upto48cpminA4
•M437xseries
•SimplextoDuplex(1-2):upto38cpminA4
•DuplextoSimplex(2-1):upto43cpminA4
•DuplextoDuplex(2-2):upto38cpminA4
FromReady@
Platen
•M537xseries:Lessthan4.5sec
•M437xseries:Lessthan5sec
FromReady@
ADF
Lessthan8sec
FromSleep@
Platen,2hr
Lessthan40sec
FCOT
FromColdstart@
PlatenLessthan60sec
ADF(DSDF)•Scan:600x600dpi(Optical)
•Printing:Upto1200x1200dpiEffectiveOutput(1200x600x2bit)
Resolution
Platen•Scan:600x600dpi(Optical)
•Printing:Upto1200x1200dpiEffectiveOutput(1200x600x2bit)
ADF(DSDF)25-200%
Platen25-400%
Reduce/EnlargePresetOriginal(100%)/AutoFit/A4→A5(71%)/LGL→LTR(78%)/LGL→A4
(83%)/A4→LTR(94%)/EXE→LTR(104%)/A5→A4(141%)/25%/
50%/150%/200%/400%/Custom(25-400%)
DarknessControl11Levels
ContrastControl11Levels
MultiCopy1-9999
DuplexCopyBuilt-in
CopyOriginalTypeText/Text/Photo/Photo
CopyFeaturesEraseEdge/MarginShift(AutoCenter/CustomMargin)/BookCenterErase/
FormCopy/WatermarkCopy/PageNumbering/Time&DateStamp/IDStamp/
JobProgram/EraseBackground(Auto/Erase7Levels/Enhance3Levels)/Erase
BacksideImage(10Levels)/Sharpness(11Levels)/NegativeImage(On/Off)/
JobBuild/Mirror
2-6Copyright©1995-2013SAMSUNG.Allrightsreserved.