Samsung GT-M3710 User manual

GSM TELEPHONE
GT-M3710
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts list
6. MAIN Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
Instructions
GSM TELEPHONE CONTENTS

SAMSUNG Proprietary-Contents may change without notice
1. Safety Precautions
1-1
This Document can not be used without Samsung's authorization
1-1. Repair Precaution
●Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
●Be careful to use akind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
●Surely use astandard screwdriver when you disassemble this product,
otherwise screw will be worn away.
●Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
●Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
●Take specially care of soldering, because Land of PCB is small and weak in heat.
●Surely tune on/off while using AC power plug, because arepair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
●Don't use as you pleases after change other material than replacement registered on SEC
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

SAMSUNG Proprietary-Contents may change without notice
Safety Precautions
1-2
This Document can not be used without Samsung's authorization
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
●Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
●Use earthed soldering steel when you connect or disconnect ESD.
●Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by
static electricity.
●Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
●You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

2. Specification
2-1
2-1. GSM General Specification
GSM900
Phase 1
GSM850
Phase 1
DCS1800
Phase 1 PCS1900
Freq.
Band[MHz]
Uplink/Downlink
880~915
925~960
824.2~848.8
869.2~893.8
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 0~124 &
975~1023 128~251 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~15
pcl 0pcl ~15 pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMAMux8888
Cell Radius 35Km 35Km 2Km -

Speclflcation
2-2
TX Power
control level
GSM850
GSM900
533±3
dBm
631±3
dBm
729±3
dBm
827±3
dBm
925±3
dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1900
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class

SAMSUNG Proprietary-Contents may change without notice
3. Product Function
3-1
This Document can not be used without Samsung's authorization
Main Function
-Quad Band(850/900/1800/1900)
-MicroUSB TA
-105.9ｘ56.5 ｘ12 mm
-2Mega Pixel Camera
-USB v2.0 High-speed, Bluetooth v2.1
-WAP 2.0 Browser
-MP3/AAC/AAC+/EAAC+/WMA
-MicroSD Card Support
-FM Radio w/RDS
-SMS/MMS/EMS (OMA v1.2)

SAMSUNG Proprietary-Contents may change without notice
4. Array course control
4-1
This Document can not be used without Samsung's authorization
4-1. Software Adjustments
Test Jig (GH99-36900A)
RF Test Cable (GH39-00985A) Adapter (GH99-38251A)
Test Cable (GH39-01290A)

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-2
This Document can not be used without Samsung's authorization
4-2. Software Downloading
4-2-1. Pre-requsite for Downloading
ㆍDownloader Program (Downloader V5.62)
ㆍGT-M3710 Mobile Phone
ㆍData Cable
ㆍBinary files
4-2-1. S/W Downloader Program
■1. Load the binary download program by executing the "Downloader V5.62"

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-3
This Document can not be used without Samsung's authorization
2. Select the "BRCM2133".as Control.

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-4
This Document can not be used without Samsung's authorization
3. Select the Full Download.

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-5
This Document can not be used without Samsung's authorization
4. Load the file of Boot, Amss, Apps, Rsrc 1. Rsrc2, Factory FS from the folder that
you saved the binary files.

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-6
This Document can not be used without Samsung's authorization
5. Click the Port Search button when the download cable is connected to PC.
cf. You have to set the phone as adownload mode by pressing Volume down +
Camera +End key simultaneously before connecting to PC .

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-7
This Document can not be used without Samsung's authorization
6. Then the down loader can search the port.

SAMSUNG Proprietary-Contents may change without notice
Array course control
4-8
This Document can not be used without Samsung's authorization
7. Click the Download button when the Port searched.
It will start to download.
8. When downloading is finished successfully, there is a"
All files complete"message.

SAMSUNG Proprietary-Contents may change without notice
5. Exploded View and Parts List
5-1
This Document can not be used without Samsung's authorization
5-1. Cellular phone Exploded View
QFR01
QLC01
QAR01
QMI04
QVK01
QCR72
QBR05
QCA01
QMO01
QCR101
QBA01
QBC00
QME03
QRE01
QLB01
QKP01
QSP01
QCR101
QMP01
QCA02
QMI04
QVO01 QCK01
QIF01

SAMSUNG Proprietary-Contents may change without notice
Exploded View and Parts List
5-2
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
QAR01 AUDIO-RECEIVER 3009-001414
QCR101 SCREW-MACHINE 6001-002005
QCR72 SCREW-MACHINE 6001-002051
QMO01 MOTOR DC-SCHC250 GH31-00323A
QBA01 INNER BATTERY PACK-AB463651BU,960MAH GH43-03216A
QVK01 KEY FPCB-GT-S3650 VOL FPCB GH59-07881A
QCA02 KEY FPCB-GT-S3650 CAM FPCB GH59-07882A
QME03 TOUCH/PANEL-GT_M3710(BLK) GH59-08937A
QSP01 MODULE-SPK+INT MODULE(GT-M3710) GH59-09093A
QBC00 PMO COVER-BATT GH72-56715B
QBR05 PMO BRACKET-CAMERA GH72-57619A
QMI04 RMO RUBBER-MIC GH73-13533A
QMP01 A/S ASSY-PBA MAIN,GT-M3710,SER,RUSS(SVC GH82-04519A
QLC01 ASSY LCD-2.8"QVGA GT-S3650 SMD ASSY GH96-04223A
QCA01 ASSY CAMERA-MODULE,GT-M3710(2M) GH96-04289A
QLB01 ASSY BRACKET-LCD GH98-15144A
QKP01 ASSY KEYPAD-(CIS/BLACK) GH98-15832B
QFR01 ASSY CASE-FRONT GH98-16121B
QMI04 RMO RUBBER-MIC GH73-13533A
QRE01 ASSY CASE-REAR GH98-16119B
QIF01 PMO COVER-IF GH72-56714B
QCK01 ASSY KEY-CAM/HOLD GH98-15817B
QVO01 ASSY KEY-VOL GH98-15818B
5-2. Cellular phone Parts list

SAMSUNG Proprietary-Contents may change without notice
6. MAIN Electrical Parts List
6-1
This Document can not be used without Samsung's authorization
SEC CODE Design LOC DESCRIPTION
0403-001688 ZD300,ZD403 DIODE
0404-001504 ZD100,ZD101,ZD102 DIODE
0404-001504 ZD103 DIODE
0406-001241 ZD409,ZD411 DIODE
0406-001293 ZD503,ZD504,ZD505 DIODE
0406-001329 ZD407 DIODE
0801-003026 U310 IC
0801-003130 U202 IC
1001-001447 U301,U404 IC
1001-001581 U102 IC
1001-001598 U402 IC
1001-001607 U103 IC
1108-000296 UME200 MEMORY
1201-002675 U311 IC
1201-002933 PAM100 IC
1203-006077 U500 IC
1203-006176 U304 IC
1205-003656 UCP200 IC
1205-003839 U106 IC
1205-003868 U101 IC
1404-001221 VR200 THERMISTOR
2007-000137 R501 R-CHIP
2007-000138 R109,R219,R303,R318 R-CHIP
2007-000138 R414 R-CHIP
2007-000140 R406 R-CHIP
2007-000143 R200,R203,R204,R216 R-CHIP
2007-000143 R217,R417,R421,R422 R-CHIP
2007-000144 R207,R208,R209,R210 R-CHIP
2007-000144 R308 R-CHIP
2007-000148 R105,R311 R-CHIP
2007-000152 R504 R-CHIP
2007-000156 R300,R403 R-CHIP
2007-000157 R306,R307,R309,R310 R-CHIP
2007-000162 R102,R103,R110,R112 R-CHIP
2007-000162 R113,R114,R115,R215 R-CHIP
2007-000162 R400,R408 R-CHIP

SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-2
This Document can not be used without Samsung's authorization
SEC CODE Design LOC DESCRIPTION
2007-000165 R305 R-CHIP
2007-001291 R404,R407 R-CHIP
2007-001333 R413 R-CHIP
2007-002796 R500 R-CHIP
2007-003010 R418 R-CHIP
2007-003014 R206 R-CHIP
2007-003015 R401,R402 R-CHIP
2007-003018 R106,R107 R-CHIP
2007-007014 R312,R313 R-CHIP
2007-007132 R104,R116 R-CHIP
2007-007312 R214 R-CHIP
2007-007315 R218 R-CHIP
2007-007981 R201,R202 R-CHIP
2007-008401 R205 R-CHIP
2203-000233 C232,C343 C-CERAMIC,CHIP
2203-000254 C103,C131,C144,C221 C-CERAMIC,CHIP
2203-000254 C231,C352 C-CERAMIC,CHIP
2203-000278 C116,C125,C126,C130 C-CERAMIC,CHIP
2203-000278 C134,C136,C137,C143 C-CERAMIC,CHIP
2203-000311 C409,C420 C-CERAMIC,CHIP
2203-000359 ZD400,ZD410 C-CERAMIC,CHIP
2203-000386 C305,C306,C308,C357 C-CERAMIC,CHIP
2203-000386 C501,ZD401,ZD402 C-CERAMIC,CHIP
2203-000425 C218 C-CERAMIC,CHIP
2203-000438 C234 C-CERAMIC,CHIP
2203-000550 C302,C304 C-CERAMIC,CHIP
2203-000679 C229,C423 C-CERAMIC,CHIP
2203-000696 C147 C-CERAMIC,CHIP
2203-000812 C118,C119,C355,C400 C-CERAMIC,CHIP
2203-000812 L107,L111 C-CERAMIC,CHIP
2203-000854 C226,C233 C-CERAMIC,CHIP
2203-000995 C204,C215,C230,C401 C-CERAMIC,CHIP
2203-000995 C402 C-CERAMIC,CHIP
2203-001101 C222 C-CERAMIC,CHIP
2203-001153 C122,C503 C-CERAMIC,CHIP
2203-001383 C113 C-CERAMIC,CHIP

SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-3
This Document can not be used without Samsung's authorization
SEC CODE Design LOC DESCRIPTION
2203-002709 C322 C-CERAMIC,CHIP
2203-003054 C405,C406 C-CERAMIC,CHIP
2203-005056 C123 C-CERAMIC,CHIP
2203-005057 C429 C-CERAMIC,CHIP
2203-005234 C117 C-CERAMIC,CHIP
2203-005288 C152 C-CERAMIC,CHIP
2203-005450 C145 C-CERAMIC,CHIP
2203-005968 C353,C354 C-CERAMIC,CHIP
2203-006048 C104,C105,C106,C121 C-CERAMIC,CHIP
2203-006048 C132,C133,C140,C200 C-CERAMIC,CHIP
2203-006048 C207,C209,C210,C211 C-CERAMIC,CHIP
2203-006048 C212,C216,C217,C300 C-CERAMIC,CHIP
2203-006048 C319,C321,C358,C407 C-CERAMIC,CHIP
2203-006048 C408,C418,C421,C424 C-CERAMIC,CHIP
2203-006048 C500,C505 C-CERAMIC,CHIP
2203-006190 C109,C110 C-CERAMIC,CHIP
2203-006208 C237 C-CERAMIC,CHIP
2203-006260 C124,C235,C236,C310 C-CERAMIC,CHIP
2203-006260 C311 C-CERAMIC,CHIP
2203-006348 C349 C-CERAMIC,CHIP
2203-006375 C504,C506 C-CERAMIC,CHIP
2203-006399 C127,C150,C206,C208 C-CERAMIC,CHIP
2203-006399 C225,C227,C303,C320 C-CERAMIC,CHIP
2203-006399 C325,C328,C329,C330 C-CERAMIC,CHIP
2203-006399 C331,C332,C336,C337 C-CERAMIC,CHIP
2203-006399 C340,C341,C342,C345 C-CERAMIC,CHIP
2203-006399 C356,C513,C515,C521 C-CERAMIC,CHIP
2203-006399 C522 C-CERAMIC,CHIP
2203-006562 C141,C142,C301,C323 C-CERAMIC,CHIP
2203-006562 C333,C509,C514 C-CERAMIC,CHIP
2203-006681 C213,C214,C224,C228 C-CERAMIC,CHIP
2203-006681 C422 C-CERAMIC,CHIP
2203-006824 C101 C-CERAMIC,CHIP
2203-006825 C335 C-CERAMIC,CHIP
2203-006838 C100 C-CERAMIC,CHIP
2203-006841 C201,C318 C-CERAMIC,CHIP

SAMSUNG Proprietary-Contents may change without notice
Main Electrical Parts List
6-4
This Document can not be used without Samsung's authorization
SEC CODE Design LOC DESCRIPTION
2203-006872 C128,C129,C149,C202 C-CERAMIC,CHIP
2203-006872 C203,C205,C219,C220 C-CERAMIC,CHIP
2203-006872 C223,C326,C327,C334 C-CERAMIC,CHIP
2203-006872 C346,C347,C348,C428 C-CERAMIC,CHIP
2203-006890 C313,C314 C-CERAMIC,CHIP
2203-007270 C120,C344 C-CERAMIC,CHIP
2203-007317 C102,C107,C108,C114 C-CERAMIC,CHIP
2203-007317 C115 C-CERAMIC,CHIP
2404-001377 TA500 C-TA,CHIP
2404-001430 TA305 C-TA,CHIP
2409-001172 BAT304 CAPACITOR
2703-001178 L112,L113,L117 INDUCTOR-SMD
2703-001726 L120,L121,L201 INDUCTOR-SMD
2703-001729 C151 INDUCTOR-SMD
2703-001734 L115,L116 INDUCTOR-SMD
2703-002202 C112 INDUCTOR-SMD
2703-002203 L104,L105 INDUCTOR-SMD
2703-002207 C111 INDUCTOR-SMD
2703-002208 L102,L103,L106,L109 INDUCTOR-SMD
2703-002208 L114 INDUCTOR-SMD
2703-002231 L405 INDUCTOR-SMD
2703-002268 L119 INDUCTOR-SMD
2703-002281 L118,L122 INDUCTOR-SMD
2703-002313 L400,L401 INDUCTOR-SMD
2703-002365 C139,L108,L110 INDUCTOR-SMD
2703-003260 L300,L301 INDUCTOR-SMD
2703-003476 L406,L407,L408 INDUCTOR-SMD
2703-003698 L127 INDUCTOR-SMD
2801-004373 OSC300 CRYSTAL-UNIT
2801-004815 OSC100,OSC200 CRYSTAL-UNIT
2901-001435 F500,F501,F502 FILTER-EMI
2904-001935 F101 FILTER-SAW
2904-001936 F100 FILTER-SAW
2909-001299 F102 FILTER-DUPLEXER
3003-001138 MIC400,MIC401 MIC-CONDENSOR
3301-001438 L126 CORE-FERRITE