Samsung SGH-C210 User manual

GSMTELEPHONE
SGH-C210
GSMTELEPHONECONTENTS
1.Specification
2.Circuit Description
3. ExplodedViews and PartsList
4. ElectricalPartsList
5.BlockDiagrams
6.PCB Diagrams
7. FlowChartofTroubleshooting

SAMSUNG Proprietary-Contents may change without notice
1. Specification
1-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
EGSM900
Phase2DCS1800 Phase1PCS1900 Phase1
Freq.Band[MHz]
Uplink/Downlink 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1960
ARFCNrange0~124 &975~1023 512~885 512~810
Tx/Rxspacing 45MHz95MHz80MHz
Mod.Bit rate/
Bit Period 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlot
Period/FramePeriod 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~5dBm30dBm~0dBm30dBm~0dBm
PowerClass 5pcl~19pcl0pcl~15pcl0pcl~15pcl
Sensitivity-102dBm-100dBm-100dBm
TDMAMux 8 8 8
Cell Radius35Km2Km2Km
Operating
Temperature-20°C~+50°C
1-1.GSMGeneralSpecification

SAMSUNG Proprietary-Contents may change without notice
2. Circuit Description
2-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-1.SGH-C210 RFCircuitDescription
2-1-1.RX PART
—ASM(F101)→SwitchingTx,RxpathforGSM900,DCS1800 and PCS1900 bylogic controlling.
—ASMControlLogicTruthTable
VC1VC2VC3
EGSMTX H L L
DCS/PCSTXLHL
PCS_RXL L H
—SawFILTER
ToconvertElectromagneticFieldWavetoAcousticWave and then pass thespecificfrequency band.
-GSMFILTER(F100)→For filtering thefrequency band between 925 and 960 MHz.
-DCS FILTER(F100)→For filtering thefrequency band between 1805 and 1880 MHz
-PCS FILTER(F102)→For filtering thefrequency band between 1930 and 1990 MHz.
—Crystal(X101)
To generatethe26MHzreference clockto drivethelogic and RF.
Afteradditionalprocess,thereference clockappliestotheU801 RxIQdemodulatorand TxIQmodulator.
Theoscillator forRXIQdemodulatorand Txmodulatorare controlled by serialdatatoselectchanneland usefast lock
modeforGPRShigh class operation.
—Si4210 (U102)
Thereceivesection integratesfourdifferential-input lownoise amplifiersLNAs supporting theGSM850,EGSM900,
DCS1800 and PCS1900 bands.TheLNA inputsarematchedtothe150 ohmbalanced-outputSAWfiltersthrough externa
LCmatching network.
AquadratureImage-rejectmixerdownconvertstheRFsignal toa200 KHzintermediatefrequency(IF).Themixeroutput is
amplifiedwithananalog programmablegainamplifier(PGA)that iscontrolledwiththeAGAIN.ThequadratureIF? ?
isdigitizedwith high resolution analog-to-digitalconverts(ADC).
TheADCoutput isdownconvertedto baseband withadigitalquadratureLOsignal.Digitaldecimation and FIRfilters
performdigitalfiltering and removeADCquantization noise,blockersand reference interferers.
After filtering,thedigitaloutput is scaledwithadigitalPGA,whichiscontrolledwiththeDGAIN.DACsdrive a
differentialIand Qanalog signalontotheBIP,BIN,BQPand BQN pinstointerface tostandardanalog-inputbaseband
ICs.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
2-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-1-2.TX PART
Baseband IQsignalfedinto offsetPLL,thisfunction isincludedinsideofU801 chip.Thetransmit section ofU801
consistofanI/Qbaseband upconverter,an offsetphase-lockedloop (OPLL)and two 50 ohmoutputbuffersthatcan drive
anexternalPowerAmplifier(PA).Si4210 chip generatesmodulatorsignalwhich powerlevel isabout1.5dBmand fedinto
PowerAmplifier(U900).ThePAoutputpowerand power ramping arewell controlledbyAutoPowerControlcircuit.
WeuseoffsetPLL below.
Modulation Spectrum
200kHzoffset
30 kHzbandwidth
GSM-35dBc
DCS-35dBc
PCS-35dBc
400kHzoffset
30 kHzbandwidth
GSM-66dBc
DCS-65dBc
PCS-66dBc
600kHz~1.8MHzoffset
30 kHzbandwidth
GSM-75dBc
DCS-68dBc
PCS-75dBc
2-2.Baseband Circuitdescription ofSGH-C210
2-2-1.CSP2200B1
—Power Management
Sevenlow-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimal
systemperformance and long batterylife.AprogrammableLDO provides supportfor1.8V,3.0VSIMs,while a self-
resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,suchastwoLED
driversand twocall-alertdrivers,aidinreducing both boardarea and systemcomplexity.Afour-wireserial interface
unit(SIU)providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor full controlofthe
CSP2200B1and enables systemdesignerstomaximize bothstandby and talktimes.Error reporting isprovided via an
interruptsignaland statusregister.Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and a
thermalmonitor,supportreliablesystemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring
start-up orinthe eventofafault condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedie
temperature).
—BatteryChargeManagement
Abatterychargemanagementblock,incorporating aninternalPMOSswitch,and an 8-bit ADC,providesfast,efficient
charging ofsingle-cell Li-Ion battery.Usedinconjunction witha current-limited voltagesource,thisblocksafely
conditionsnear-deadcellsand providestheoption ofhaving fast-charge and top-off controlledinternally orby thesystem's
microprocessor.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
2-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
—BacklightLED Driver
ThebacklightLEDdriverisalow-side,programmable currentsource designedtocontrol thebrightness ofthekeyboard
illumination.LED1_DRViscontrolled viaLED1_[0:2]and can beprogrammedtosink from15mAto 60mAin 7.5mA
steps.LED2_DRViscontrolled viaLED2_[0:2]and can beprogrammedtosink from5mAto 40mAin 5mAsteps.
BothLEDdriversare capableofsinking theirmaximumoutputcurrentataworst-casemaximumoutputvoltageof0.6V.
Forefficientuse,theLEDsisconnected betweenthebatteryand theLED_DRVoutput.
—VibratorMotorDriver
Thevibratormotordriverisaindependentvoltageregulatorto driveasmall dcmotorthatsilentlyalertstheuserofan
incoming call.Thedriverisa3.3Vconstantsource whilesinking up to 140mAand controlledbyenablesignalofmain
chip.Forefficientuse and safety,thevibratormotorshould be connected betweentheregulatoroutputand theground.
2-2-2.Connector
—JTAGConnector
TridenthastwoJTAG portswhichareforARMcore and DSP core(DSP16000).Sothis systemhastwo portconnector
fortheseports.Pins'initialsforARMcore are'CP_' and pins'initialsforDSP core are'DSP_'.
CP_TDIand DSP_TDIsignalareusedforinputofdata.CP_TDO and DSP_TDO signalsareusedfortheoutputofthe
data.CP_TCKand DSP_TCKsignalsareusedforclock becauseJTAG communication isasynchronous.CP_TMSand
DSP_TMSsignalsaretestmodesignals.Thedifference betweentheseistheRESET_INTsignalwhichisforARMcore
RESET.
—Keypadconnector
Thisisconsisted ofkeyinterface pinsinthetrident,KEY_ROW[0~4]and KEY_COL[0~4].Thesesignalscomposethe
matrix.Result ofmatrixinformsthekeystatusto keyinterface inthetrident.Somepinsare connectedto varistor for
ESDprotection.And poweron/off keyis seperatedfromthematrix.
So poweron/off signal isconnectedwithCSP2200 toenableCSP2200.
NinekeyLEDusethe +VBATT supply voltage.These are connectedtoBACKLIGHTsignal intheCSP2200.
This signalenablesLEDswithcurrentcontrol.
—EMIFiltering
This systemusestheEMIFiltertoreduce noisefromLCDpart.Some controlsignalsare connectedtoLCD withoutEMI
filtering.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
2-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-2-3. IFconnetor
It is24-pinconnector,and separatedintotwo parts.Oneisapowersupply partformainsystem.And theotheris
designedto useSDS,DEBUG,DLC-DETECT,JIG_ON,VEXT,VTEST,VF,and GND.Theyconnectedto powersupply
IC,microprocessorand signalprocessor IC.
2-2-4.Audio
AOUTAP,AOUTAN fromCSP2200 isconnectedtothespeakervia analog switch.AOUTBPand AOUTBNare connected
tothe ear-micspeakervia ear-jack.MICINand MICOUTare connectedtothemainMIC.And AUXINand AUXOUT
are connectedtotheEar-mic.
YMU762MA3isaLSI forportabletelephonethat iscapableofplaying high qualitymusicby utilizing FMsynthesizer
and ADPCMdecorderthatareincludedinthisdevice.
Asasynthesis,YMU762MA3isequipped 16 voiceswith different tones.Since thedevice iscapableofsimultaneously
generating up tosynchronouswiththeplay oftheFMsynthesizer,various sampled voicescan beusedas sound effects.
Since theplay dataofYMU762MA3areinterpretedatanytimethrough FIFO,thelength ofthedata(playing period)isnot
limited,sothedevice canflexiblysupportapplication suchasincoming call melody musicdistribution service.The
hardwaresequencerbuilt inthisdevice allowsplaying ofthe complexmusicwithoutgiving excessiveloadtotheCPUof
theportabletelephones.Moreover,theregistersoftheFMsynthesizercan beoperated directlyfor real timesound
generation,allowing,forexample,utilization ofvarious sound effectswhen using thegamesoftwareinstalledinthe
portabletelephone.
YMU762 includesaspeakeramplifierwith high rippleremovalratewhosemaximumoutput is550mW(SPVDD=3.6V).
Thedevice isalsoequippedwithconventionalfunction including avibartorand a circuit forcontrolling LEDs synchornous
withmusic.
Fortheheadphone,it isprovidedwithastereophonicoutput terminal.
Forthepurposeofenabling YMU762MA3to demonstrateitsfull capabilities,Yamahapurposeto use"SMAF:Synthetic
musicMobileApplication Format"asadatadistribution format that iscompatiblewithmultimedia.
Since theSMAFtakesastructurethatsetsimportance on thesynchronization betweensound and images,variouscontents
can bewrittenintoit including incoming call melody withwordsthatcan beusedfortraining karaoke,and commercial
channel thatcombinestexts,imagesand sounds,and others.ThehardwaresequencerofYMU762MA3 directlyinterprets
and playsblocksrelevant tosynthesis(playing music and reproducing ADPCMwithFMsynthesizer) thatareincludedin
datadistributedinSMAF.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
2-5
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-2-5.Memory
This systemusesSHARP'smemory,LRS18B0.
It isconsisted of256Mbitsflashmemoryand 64MbitsSCRAM.Ithas16 bit dataline,D[0~15]whichisconnectedto
trident,LCDorCSP2200.Ithas23 bit address lines,A[1~23].Theyare alsoconnected.CP_CSROMENsignal,chip
selectsignal inthetrident,enableflashmemories.They usesupply voltages,VCCDand VCC_1.8A.
During wrting process,CP_WENislowand it enableswriting process toflashmemoryand SCRAM.During reading
process,CP_OENislowand it output information whichislocatedat the address fromthetrident intheflashmemory or
SCRAMto datalines.Eachchipselectsignalsinthetridentselectflashmemory orSCRAM.Reading orwriting
procedureisprocessedafterCP_WENorCP_OENisenabled.MemoriesuseFLASH_RESET,whichisbufferedsignalof
RESET fromCSP2200,forESDprotection.A[0]signalenableslowerbyteofSCRAMand UPPER_BYTE signalenables
higherbyteofSCRAM.
2-2-6.Trident
Trident isconsisted ofARMcore and DSP core.Ithas20K*16bitsRAM144K*16bitsROMintheDSP.Ithas
4K*32bitsROMand 2K*32bitsRAMintheARMcore.DSP isconsisted oftimer,onebit input/outputunit(BIO),JTAG,
EMIand HDS(HardwareDevelopmentSystem).ARMcoreisconsisted ofEMI,PIC(ProgrammableInterruptController),
reset/power/clock unit,DMAcontroller,TIC(TestInterface Controller),peripheralbridge,PPI,SSI(SynchronousSerial
Interface),ACCs(Asynchronouscommunicationscontrollers),timer,ADC,RTC(Real-TimeClock)and keyboardinterface.
DSP_AB[0~8],address linesofDSP core and DSP_DB[0~15],datalinesofDSP core are connectedtoCSP2200.A[0~20],
address linesofARMcore and D[0~15],datalinesofARMcore are connectedtomemory,LCDand YMU762.
ICP(InterprocessorCommunication Port)controlsthe communication betweenARMcore and DSP core.
CSROMEN,CSRAMENand CS1NtoCS4NintheARMcore are connectedtoeachmemory.WENand OENcontrol the
process ofmemory.ExternalIRQ(InterruptReQuest)signalsfromeach units,suchas,YMU,Ear-jack,Ear-mic and
CSP1093,needthe compatibleprocess.
SomePPIpinshasmany specialfunctions.CP_KB[0~9] receivethestatusfromkeyFPCB and areusedforthe
communicationsusing datalink cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
And UP_CS/SCLK/SDI,controlsignalsforCSP2200 areoutputtedthrough PPIpins.Ithas signalportfor
charging(CHG_DET),SIM_RESET and FLIP_SNSwithwhichweknowsopen.closedstatusof folder.Ithas JTAG control
pins(TDI/TDO/TCK) forARMcore and DSP core.Itrecieves13MHz clockinCKIpinfromexternalTCXO and receives
32.768KHz clockfromX1RTC.ADC(Analog toDigitalConvertor) partreceivesthestatusoftemperature,batterytype and
battery voltage.And controlsignals(DSP_INT,DSP_IOand DSP_RWN) forDSP core areused.ItenablesmainLCD with
DSP IPpins.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
2-6
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-2-7.CSP2200
CSP2200 isintegratedthetiming and controlfunctionsforGSM2+mobile application withtheADCand DACfunctions,
and powermanagementblock.TheCSP2200 interfacestothetrident,via a 16-bit parallel interface.Itservesasthe
interface thatconnectsaDSP totheRFcircuitryinaGSM2+mobiletelephone.DSP canload 148 bitsofburstdata
intoCSP2200’ sinternalregister,and programCSP2200’ sevent timing and controlregisterwiththe exact timetosend the
burst.Whenthetiming portion ofthe event timing and controlregistermatchestheinternalquarter-bit counterand internal
frame counter,the148 bitsintheinternalregisterareGMSKmodulatedaccording toGSM2+standards.Theresulting
phaseinformation istranslatedintoIand Qdifferentialoutputvoltagesthatcan be connected directlytoanRFmodulator
at theTXOPand TXON pins.TheDSP isnotifiedwhenthetransmission iscompleted.For receiving baseband data,a
DSP can programCSP2200’ sevent timing and controlregisterwiththe exact timetostartreceiving Iand Qsamples
through TXIPand TXINpins.Whenthat timeisreached,the controlportion ofthe event timing and controlregisterwill
start thebaseband receivesection converting Iand Qsamplepairs.Thesamplesarestoredinadouble-bufferedregister
until theregistercontains32 samplepairs.CSP2200 then notifiestheDSP which has sampletimetoreadtheinformation
outbeforethenext32 samplepairsarestored.Thevoice band ADCconverterissuesaninterrupt totheDSP wheneverit
finishesconverting a16-bit PCMword.TheDSP thenreadsthenewinputsample and simultaneouslyloadsthevoice
band outputDACconverterwithanewPCMoutputword.Thevoice band outputcan be connected directlytoaspeaker
viaAOUTAN and AOUTAPpinsand be connectedtoaEar-micspeakerviaAOUTBNand AOUTBPpins.
There are7LDOswhicharepowersourcesofmicroprocessor,LCD,etc.These7LDOsoutputareprogrammable.

SAMSUNG Proprietary-Contents may change without notice
3. ExplodedViewand Parts List
3-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-1.Exploded View
QSP01
QMO01
QCR31
QMI01
QMP01
QAN01
QRE01
QBA01
QKP01
QRF01
QFR01
QME01
QLC01

SAMSUNG Proprietary-Contents may change without notice
Explodedviewand PartList
3-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-2.PartsList
Location
NO.DescriptionSEC CODERemark
QFR01 FRONTCOVERGH75-06802A
QKP01 KEYPADGH75-06998A
QSP01 SPEAKER3001-001760
QMO01 MOTORDCGH31-00163A
QMP01 PBAMAINGH92-02142A
QLC01 LCDGH07-00701A
QME01 UNITMETALDOMEGH59-02090A
QMI01 MICROPHONEASSYGH30-00186A
QAN01 INTENNAGH42-00552A
QRE01 REARCOVERGH75-06804A
QRF01 TAPEPCRFGH74-14175A
QCR31 SCREW6001-001795
QBA01 BATTERYGH43-01817A

SAMSUNG Proprietary-Contents may change without notice
Explodedviewand PartList
3-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
DescriptionSEC CODE
BAGPE;LDPE,T0.05,W80,L180,TRP,-,-6902-000634
ADAPTOR-TAD;TAD137ESE,SGH-P100,-,110 GH44-00482A
LABEL(P)-WATER SOAK;SCH-X110,NORGE,1GH68-02026A
MANUAL-SFC;SGH-S200,SAMSUNG,RUSSIAN,GH68-04336A
LABEL(R)-MAIN(SER);SGH-C210,SER,POLGH68-06983B
MANUAL-USE;SGH-C210,SER,RUSSIAN,ROMAGH68-07137A
CUSHION-CASE(1-2);SGH-C210,PULP,T0.8GH69-02937A
MPR-ESDTAPE;SGH-C200,3M851,7X5,-,-GH74-08853A
MPR-BOHOVINYLM/WIN;SGH-C200,STAELGH74-09824B
MPR-MAINWINDOWBOHO;SGH-C200,ST 555 GH74-11636A

SAMSUNG Proprietary-Contents may change without notice
Explodedviewand PartList
3-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-3.TestJig(GH80-00865A)
3-3-1.RF TestCable
(GH39-00283A)3-3-2.TestCable (GH39-00127A)3-3-3.Serial Cable
3-3-4.PowerSupplyCable3-3-5.DATACABLE
(GH39-00143B)3-3-6.TA
(GH44-00184A)

SAMSUNG Proprietary-Contents may change without notice
4. ElectricalParts List
4-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC Code Design LOC Description
0403-001387 ZD700 DIODE-ZENER
0403-001427 ZD703 DIODE-ZENER
0406-001083 ZD701,ZD702 DIODE-TVS
0406-001190 ZD401 DIODE-TVS
0406-001194 ZD601 DIODE-TVS
0406-001201 ZD501,ZD502 DIODE-TVS
0407-001002 D501 DIODE-ARRAY
0501-000225 Q400 TR-SMALL SIGNAL
0504-000168 Q300 TR-DIGITAL
0601-002020 LED601,LED602,LED603 LED
0601-002020 LED604,LED605,LED606 LED
0601-002020 LED607,LED608,LED609 LED
0601-002020 LED610 LED
0801-000796 U701 IC
1001-001294 U502 IC
1108-000010 U601 IC
1201-002260 U101 IC
1203-002782 U505 IC
1203-003109 U301 IC
1203-003304 U300 IC
1203-003674 U705 IC
1204-002161 U501 IC
1205-002683 U102 IC
1404-001221 TH200 THERMISTOR
1405-001082 V405,V410,V411,V601 VARISTOR
1405-001082 V602,V603,V604,V605 VARISTOR
1405-001082 V606,V607,V608,V609 VARISTOR
1405-001082 V610,V611,V613,V702 VARISTOR
1405-001082 V703,V704,V705,V706 VARISTOR
1405-001093 V701 VARISTOR
1405-001108 V501,V502,V503,V504 VARISTOR
1405-001108 V612 VARISTOR
2007-000140 R207,R417,R420,R704 R-CHIP
2007-000140 R712,R713,R714,R715 R-CHIP
2007-000140 R716,R717,R718,R719 R-CHIP
2007-000140 R720,R721,R724,R726 R-CHIP
2007-000140 R727 R-CHIP
2007-000142 R406 R-CHIP
2007-000145 R422 R-CHIP

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC Code Design LOC Description
2007-000146 R502 R-CHIP
2007-000148 R112,R402 R-CHIP
2007-000153 R722 R-CHIP
2007-000157 R201,R204,R223,R309 R-CHIP
2007-000162 R208,R211,R501,R725 R-CHIP
2007-000167 R306 R-CHIP
2007-000171 C131,R101,R104,R105 R-CHIP
2007-000171 R107,R213,R214,R216 R-CHIP
2007-000171 R217,R219,R220,R301 R-CHIP
2007-000171 R305,R408,R409,R414 R-CHIP
2007-000171 R418,R419,R500,R612 R-CHIP
2007-000171 R700,R701,R702,R703 R-CHIP
2007-000171 R723 R-CHIP
2007-000172 R222,R304,R611 R-CHIP
2007-000173 R412,R415 R-CHIP
2007-000174 R601,R602,R603,R604 R-CHIP
2007-000174 R605,R606,R607,R608 R-CHIP
2007-000174 R609,R610 R-CHIP
2007-000566 R707,R708,R709,R710 R-CHIP
2007-000566 R711 R-CHIP
2007-001298 R103 R-CHIP
2007-001308 R113 R-CHIP
2007-001313 R102 R-CHIP
2007-001317 R407 R-CHIP
2007-001319 R303,R504 R-CHIP
2007-001320 R405,R411 R-CHIP
2007-001325 R506 R-CHIP
2007-001333 R421 R-CHIP
2007-002797 R108 R-CHIP
2007-003001 R705 R-CHIP
2007-003112 R503,R505 R-CHIP
2007-007134 R410,R416 R-CHIP
2007-007142 R206,R310,R401,R403 R-CHIP
2007-007142 R413 R-CHIP
2007-007308 R210,R212 R-CHIP
2007-007480 R205 R-CHIP
2007-007489 R400,R404 R-CHIP
2007-007538 R218 R-CHIP
2007-008263 R311 R-CHIP

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC Code Design LOC Description
2203-000233 C118,C310,C325,C411 C-CERAMIC,CHIP
2203-000233 C601,C603,C701 C-CERAMIC,CHIP
2203-000254 C134,C201,C202,C203 C-CERAMIC,CHIP
2203-000254 C204,C208,C210,C211 C-CERAMIC,CHIP
2203-000254 C212,C213,C215,C301 C-CERAMIC,CHIP
2203-000254 C319,C605 C-CERAMIC,CHIP
2203-000278 C119,C120 C-CERAMIC,CHIP
2203-000330 C220,C221 C-CERAMIC,CHIP
2203-000386 C127 C-CERAMIC,CHIP
2203-000425 C406 C-CERAMIC,CHIP
2203-000438 C104,C115,C132,C514 C-CERAMIC,CHIP
2203-000438 C700 C-CERAMIC,CHIP
2203-000530 C113 C-CERAMIC,CHIP
2203-000585 C510 C-CERAMIC,CHIP
2203-000628 C405 C-CERAMIC,CHIP
2203-000679 C207,C419 C-CERAMIC,CHIP
2203-000696 C124,C142 C-CERAMIC,CHIP
2203-000812 C305,C306,C307,C401 C-CERAMIC,CHIP
2203-000812 C402,C409,C416 C-CERAMIC,CHIP
2203-000854 C117,C706 C-CERAMIC,CHIP
2203-000995 C105,C116,C404 C-CERAMIC,CHIP
2203-001017 C141 C-CERAMIC,CHIP
2203-001072 C302,C417,C418 C-CERAMIC,CHIP
2203-001405 C209 C-CERAMIC,CHIP
2203-001412 C129 C-CERAMIC,CHIP
2203-001432 C114 C-CERAMIC,CHIP
2203-001598 C309,C318 C-CERAMIC,CHIP
2203-002668 C107,C111 C-CERAMIC,CHIP
2203-002677 C138,C140 C-CERAMIC,CHIP
2203-002687 C504 C-CERAMIC,CHIP
2203-005061 C206,C308,C320,C501 C-CERAMIC,CHIP
2203-005061 C506,C509,C511,C515 C-CERAMIC,CHIP
2203-005061 C602,C604 C-CERAMIC,CHIP
2203-005065 C321,C500 C-CERAMIC,CHIP
2203-005234 C121,C122 C-CERAMIC,CHIP
2203-005393 C103 C-CERAMIC,CHIP
2203-005450 C139 C-CERAMIC,CHIP
2203-005482 C137,C143,C144,C303 C-CERAMIC,CHIP
2203-005496 C205,C214,C403,C407 C-CERAMIC,CHIP

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC Code Design LOC Description
2203-005496 C413,C507 C-CERAMIC,CHIP
2203-006053 C312,C313,C314,C315 C-CERAMIC,CHIP
2203-006053 C316 C-CERAMIC,CHIP
2203-006090 C110 C-CERAMIC,CHIP
2203-006093 C304,C503 C-CERAMIC,CHIP
2203-006190 C513 C-CERAMIC,CHIP
2203-006208 C512 C-CERAMIC,CHIP
2203-006257 C327 C-CERAMIC,CHIP
2203-006348 C703 C-CERAMIC,CHIP
2203-006438 C218 C-CERAMIC,CHIP
2203-006562 C704 C-CERAMIC,CHIP
2404-001105 C412,C414,C502 C-TA,CHIP
2404-001134 C109 C-TA,CHIP
2404-001240 C311 C-TA,CHIP
2404-001268 C324,C326,C505,C705 C-TA,CHIP
2404-001305 C410 C-TA,CHIP
2503-001041 C708,C709 C-NETWORK
2503-001053 C710,C711,C712,C713 C-NETWORK
2503-001053 C714 C-NETWORK
2703-002170 L108 INDUCTOR-SMD
2703-002198 L102 INDUCTOR-SMD
2703-002199 L106 INDUCTOR-SMD
2703-002202 L401,L402 INDUCTOR-SMD
2703-002203 L109 INDUCTOR-SMD
2703-002205 L103,L112 INDUCTOR-SMD
2703-002269 L113 INDUCTOR-SMD
2703-002339 L701 INDUCTOR-SMD
2703-002367 L101 INDUCTOR-SMD
2703-002544 L105,L111 INDUCTOR-SMD
2703-002558 L107 INDUCTOR-SMD
2801-003856 X201 CRYSTAL-UNIT
2801-004426 X101 CRYSTAL-UNIT
2904-001480 F102 FILTER-SAW
2904-001523 F100 FILTER-SAW
3301-001659 L702 CORE-FERRITE BEAD
3705-001347 CN100 CONNECTOR-COAXIAL
3709-001336 CN300 CONNECTOR-CARD EDGE
3710-001611 CN701 CONNECTOR-SOCKET
3711-005829 CN702 CONNECTOR-HEADER

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-5
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC Code Design LOC Description
3722-002067 CN401 JACK-PHONE
4302-001130 U303 BATTERY
NEW-IC001 F101 COMP-SMD

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
5. BlockDiagrams
5-1
5-1.RFSolution Block Diagram

SAMSUNG Proprietary-Contents may change without notice
BlockDiagrams
ThisDocumentcan notbe used withoutSamsung'sauthorization
5-2
5-2.BaseBand Solution Block Diagram

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
6. PCB Diagrams
6-1
6-1.MainPCBTop Diagram