Samsung SGH-E340 User manual

GSMTELEPHONE
SGH-E340
GSMTELEPHONECONTENTS
1.Specification
2.Circuit Description
3. ExplodedViews and PartsList
4. ElectricalPartsList
5.BlockDiagrams
6.PCB Diagrams
7. FlowChartofTroubleshooting

Samsung ElectronicsCo.,Ltd.MAY.2005
Printedin Korea.
CodeNo.:GH68-07223A
BASIC.
T
hisServiceManual isa propertyofSamsung ElectronicsCo.,Ltd.
A
nyunauthorized use ofManualcan bepunished underapplicable
I
nternationaland/ordomesticlaw.
ⓒ

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1. Specification
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1-1
PCS1900
1850~1910
1930~1990
512~810
80MHz
270.833kbps
3.692us
576.9us
4.615ms
0.3GMSK
30dBm~0dBm
0pcl~15pcl
-100dBm
8
-
1-1.GSMGeneralSpecification
GSM900
Phase 1 EGSM900 Phase 2 DCS1800 Phase 1
Freq.Band[MHz]
Uplink/Downlink890~915 935~960 880~915 925~960 1710~1785 1805~1880
ARFCN range 1~124 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz45MHz95MHz
Mod.Bitrate
/BitPeriod 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlotPeriod
/FramePeriod 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK
MS Power33dBm~5dBm33dBm~5dBm30dBm~0dBm
PowerClass 5pcl~19pcl5pcl~19pcl0pcl~15pcl
Sensitivity-102dBm-102dBm-100dBm
TDMAMux8 8 8
Cell Radius35Km35Km2Km

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Specification
1-2
TX Power
control levelPCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2.GSMTXpowerclass
TX Power
control levelDCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control levelGSM900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm

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2. Circuit Description
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2-1
2-1.SGH-E340 RFCircuitDescription
2-1-1.RX PART
—FRONTEND MODULE(ANTENNA SWITCHMODULE +RXSAWFILTER) (MODULE1)
→Switching Tx,Rx pathforGSM900,DCS1800 and PCS1900 by logic controlling.
—FRONTEND MODULEControlLosic(MODULE1)→Truth Table
VC1VC2VC3
TxMode(GSM900)HL L
TxMode(DCS1800/1900)LH H(L)
RxMode(GSM900)L L L
RxMode(DCS1800)L L L
RxMode(PCS1900)L L H
—VC-TCXO(U102)
Thismodulegeneratesthe26MHzreference clockto drivethelogic and RF.
It isturnedonwhenthesupply voltage +VCC_SYN isapplied.
Afterbuffering areference clock of26MHzis suppliedtotheotherpartsofthesystem
through thetransceiverpinOUT.
—TRANSCEIVER(U100)
ThischipisfullyintegratedGSMGPRStri-band transceiverwithVCO,loop filtersand mostofthe
passive component init.
And alsofullyintegratedfractionalNRFsynthesizerwithAFCcontrolpossibility,RFVCO withintegratedsupply
regulator.Semi integratedreference oscillatorwithintegratedsupplyregulator.
RFReceiver front-end amplifiestheE-GSM900,DCS1800 and PCS1900 aerialsignal,convert the chosenchannel
downtoalowIFof100kHz.
InIFsection,furtheramplifiesthewantedchanneloutput level tothedesired value and rejectsDC.
2-1-2.TX PART
Thetransmitterisfully differentialusing adirectup conversion architecture.Itconsistsofasignalsideband
powerup mixer.Gainiscontrolled by 6 dBvia3-wireserialbusprograming.ThefullyintegratedVCOand power
mixerachieveLOsuppression,quadraturephase error,quadrature amplitudebalance and lownoisefloorspecification.
Outputmatching/balun componentsdrive a standard 50 ohms single endedload.

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CircuitDescription
2-2
2-2.Baseband Circuitdescription ofSGH-E340
2-2-1.PCF50603 (U403)
—Power Management
Eight low-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimal
systemperformance and long batterylife.Aprogrammableboostconverterprovides supportfor1.8V,3.0VSIMs,
whileaself-resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,
suchasRTCmodule and High VoltageChargepump,Clock generator,aidinreducing both boardarea and system
complexity.
I2C BUSserial interface providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor
full controlofthePCF50603 and enables systemdesignerstomaximize bothstandby and talktimes.
Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and atemperaturesensor,supportreliable
systemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring start-up orinthe eventofa
fault condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedietemperature).
—BacklightBrightness Modulator
TheBacklightBrightness Modulator (BBM)containsaprogrammablePulse-widthmodulator (PWM)and FET to
modulatetheintensity ofaseriesofLED?sortocontrolaDC/DCconverterthatdrivesLCDbacklight.
Thisphone(SGH-E340)usePWMcontrol tocontrast thebacklightbrightness.
—ClockGenerator
TheClockGenerator (CG)generatesall clocksforinternaland externalusage.The32.768 kHz crystaloscillator
providesanaccuratelowclockfrequencyforthePCF50603 and othercircuitry.
2-2-2.LCD Connector
LCDisconsisted ofmainLCD(color6.5KTFT LCD).
ChipselectsignalsintheU304,LCD_CS,canenableLCD.BACKLIGHTsignalenableswhiteLEDofmainLCD.
Thesesignal isfromU403.
16-bit datalines(LD(0)~LD(15)) transfersdata and commandstoLCD.Data and commandsuse"RS"signal.If this
signal ishigh,InputstoLCDare commands.If it islow,InputstoLCDaredata.Thesignalwhichinformsthe
inputoroutputstatetoLCD,isrequired.But this systemisnotnecessarythis signal.So"L_WR"signal isusedto
writedataorcommandstoLCD.PowersignalsforLCDare"VDD_IO_HIGH".

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CircuitDescription
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2-3
2-2-3.Key
Thisisconsisted ofkeyinterface pinsKEY_ROW(0:4)and KEY_COL(0:4)inPCF5212EL1.Thesesignalscompose
thematrix.Result ofmatrixinformsthekeystatusto keyinterface inthePCF5212EL1.Poweron/off keyis
seperatedfromthematrix.So poweron/off signal isconnectedwithPCF50603 toenablePCF50603.KeyLEDis
consisted ofsixteen blueLEDs.
keyLEDusethe3.3VLDO(U604) forasupply voltage.KEY_LED_ON signalenables sixteen blueLED.
"FLIP"informsthestatusofslide(open orclosed)tothePCF5212EL1.Thisusesthehall effectIC,
SH248CSP(U602).AmagnetunderLCDenablesSH248CSP.
2-2-4.EMIESDFilter(U501)
This systemusestheEMIESDfilter,U501 to protectnoisefromIFCONNECTORpart.
2-2-5. IFconnetor(CN302)
It is18-pinconnector.Theyaredesignedto useVBAT,V_EXT_CHARGE,USB_D+,+VBUS,USB_D-,TXD1,
RXD1,AUX_ON,EXT1,EXT2and GND.Theyconnectedto powersupplyIC,microprocessorand signalprocessor
IC.
2-2-6.BatteryCharge Management IC(U505)
Acomplete constant-current/constant-voltagelinearcharger forsingle cell lithium-ion batteriesisused.
If TAconnectedto phone,"V_EXT_CHARGE"enable charger ICand supplycurrent to battery.
Whenfault condition caused,"CHG_ON"signal levelchangelowto high and charger ICstop charging process.
2-2-7.Audio
HFR_Pand HFR_NfromPCF5212EL1are connectedtothemainspeakervia analog switches.MIC_Pand MIC_N
are connectedtothemainMICaswell.EAR1isthesource ofExternalSpeaker.YMU762 isasynthesizerLSI for
mobilephones.ThisLSIhasabuilt-inspeakeramplifier foroutputting soundsthatareused by mobilephonesin
addition to gamesoundsand ringing melodiesthatarereplayed by asynthesizer.
Thesynthesizersection adopts“stereophonichybridsynthesizersystem”thataregivenadvantagesofbothFM
synthesizersand WaveTablesynthesizerstoallowsimultaneousgeneration ofup to32FMvoicesand 32 Wave
Tablevoices.
Itprovides simultaneousgeneration ofup to40tonesby stereophonichybridsynthesizer.
YMU762 hasbuilt aspeakeramplifierofwhichmaximumout is580 mWatSPVDD=3.6Vinthisdevice.
ThereisStereophonic analog outputforHeadphone.
2-2-8.Memory(U301)
This systemusesSamsung'smemory,KAP17SG00A.TheKAP17SG00AisaMulti ChipPackageMemorywhich
combines256Mbit SynchronousBurstMulti Bank NORFlashMemoryand two 512Mbit OneNAND Flashand
128Mbit SynchronousBurstUtRAM.
Ithas16 bit dataline,HD[1~16]whichisconnectedtoPCF5212EL1and MV3018SAQ,also has24 bit address
lines,
HA[1~24].There are3chipselectsignals,CS0n_FLASH,CS4n_NAND,and CS1n_RAM.

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CircuitDescription
2-4
IntheWrting process,WEnisfallentolowand it enableswriting process to operate.During reading process,
OEnisfallentolowand it enablesreading process to operate.EachchipselectsignalsinthePCF5212EL1choose
differentmemories.
2-2-9.PCF5212EL1(U200)
ThePCF5212EL1ismainlycomposed ofembededDSP and ARMcore.TheDSP subsystemincludestheSaturn
DSP corewithembeddedRAMand ROM,and asetofperipherals.Ithas24kx16 bitsPRAM,104k*16 bits,
32k*16 XYRAMand 63k*16 XYROMintheDSP.
TheARM946E-SconsistsofanARM9E-Sprocessorcore,8 kbyteinstruction cache and 8 kbytedata cache,
tghtly-coupledITCM(Instruction TightlyCoupledMemory)and DTCM(DataTightlyCoupledMemory)memories,a
memory protection unit,and anAMBA(AdvancedMicrocontrollerBusArchitecture)AHB(Advanced
High-performance Bus)businterface withawritebuffer.
HD(0:15),datalinesand HA(0:23),address linesare connectedtoKAP17SG00A(memory),MV3018B(imagedsp)
and YMU762 (melody IC).Ithas64 kbyteSC RAM(0.5Mbit)and 32 kbyteSCprogramROMforbootstrap
loaderintheARMcore.
HD(0:15),datalinesand HA(0:23),address linesare connectedtomemoryand YMU762 tocommunicate.
MV3018B(CameraDSP Chip)controlsthe communication betweenARMcore and DSP core.
OEn,WEncontrol the access ofmemory.KROW,and KCOLrecognize thekeystring inputstatus.
Ithas J-TAG controlpins(TDI/TDO/TCK) forARMand DSP core.J-SEL signalcontrolsdifferentaccess toARM
and DSP core.
ADC(Analog toDigitalConvertor) receivesthe condition oftemperature,batterytype and battery voltage.
2-2-10.TCO-5871U(26MHz)(U102)
This systemusesthe26MHzTCXO,TCO-5871U,Toyocom.AFCcontrolsignalformPCF5212EL1controls
frequencyfrom26MHzx-tal.Itgeneratesthe clockfrequency.ThisclockisconnectedtoPCF5212EL1,YMU762
and HD155166.
2-2-11.CameraDSP(MV3018SAQ)(U304)
MV3018SAQ providesrich videofunctionsup to 30-framedisplaywithminimizedtasksinthehandsetmain
processor
aswell ashardwarebasedreal-timeJPEGcompression and decompression.MV3018SAQ directlytransmitsand
previewstheRGBdatatotheLCDgraphicmemory by processing thesensoroutputdata according tothe
handset'scommand.ItcansavetherawRGBdataup toVGA resoultion intoitsimagebufferand allowsthe
hostprocessorto downloadwithscalablesizedcompressed data.
Itutilizes16 bit databusforcommunication withthemain processor,including businterface types.

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3. ExplodedViewand Parts List
3-1
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3-1.Exploded View
QFR01
QMO01
QSP01
QKP01
QRE01
QMP01
QVK01
QAN02
QME01
QIF01
QMI01
QCR06
QMW02
QFU01
QLC01
QCA01
QCR05
QFR02
QFL01
QSC01
QCR04
QMW01
QRF01
QVO01
QSC14
QRF03
QBA01
QMI03

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Explodedviewand PartList
3-2
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3-2.PartsList
LocationNO.DescriptionSEC CODE
QRF03 COVEREARJACKGH72-19702A
QFR01 FRONTGH75-06795A
QMI03 MICHOLDERGH73-04563A
QVO01 VOLUMEKEYGH72-19705A
QSC14 TAPEFRONTHOLEGH74-14197A
QKP01 MEC-KEYPADGH75-06860A
QME01 UNITMETALDOMEGH59-02045A
QMI01 MICROPHONEASSYGH30-00199A
QMP01 PBAMAINGH92-02049A
QVK01 UNITVOLUMEKEYGH59-02067A
QAN02 INTENNAGH42-00557A
QRE01 MEC-REARCOVERGH75-06861A
QIF01 COVERIFCONNECTORGH72-19704A
QCR06 SCREW-MACHINE6001-001155
QRF01 RFCOVERGH74-14863A
QBA01 BATTERYGH43-01677A
QMW02 WINDOWSUBGH72-19678A
QFU01 UPPERFOLDERGH75-06800A
QLC01 LCDGH07-00680A
QMO01 MOTORDCGH31-00154D
QSP01 SPEAKER3001-001759
QCA01 UNITCAMERAGH59-02098A
QCR05 SCREW-MACHINE6001-001478
QFR02 OILDAMPERGH75-06799A
QFL01 FOLDERLOWERGH75-06794A
QCR04 SCREW-MACHINE6001-001479
QSC01 SCREWCAPGH73-04750A
QMW01 MEC-WINDOWMAINGH75-06801A

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Explodedviewand PartList
3-3
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DescriptionSEC CODE
BAGPE;LDPE,T0.05,W80,L180,TRP,-,-6902-000634
ADAPTOR-TAD;TAD137ESE,SGH-P100,-,110 GH44-00482A
UNIT-EARPHONE;SGH-X910,AEP277SSE,-,EGH59-01392A
LABEL(P)-WATERSOAK;SCH-X110,NORGE,1GH68-02026A
LABEL(R)-MAIN(EU);SGH-E340,XET,POLYEGH68-06970A
MANUAL-USE;SGH-E340,XET,ITALIAN,ITAYGH68-07076A
CUSHION-CASE(1-2);SGH-X640,PULP,T0.8GH69-02723A
BOX(P)-UNIT(EU);SGH-E340,SC300+S120+GH69-02779A
MPR-BOHOVINYLIF;SGH-E720,#950,85X1GH74-13606A
MPR-PORONMOTOR;SGH-E340,SRS,P4.9XT0 GH74-14191A
MPR-TAPELCDMODULE;SGH-E340,PSR,5X3GH74-14198A
MPR-BOHOVINYLREAR;SGH-E340,SP-600,GH74-14717A
MEC-HANDSTRAP;SGH-E620,SEC,-,-,ANTIGH75-03207U

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Explodedviewand PartList
3-4
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3-3.TestJig(GH80-03306A)
3-3-2.RF TestCable
(GH39-00283A)3-3-3.TestCable (GH39-00337A)
3-3-5.PowerSupplyCable3-3-6.DATACABLE
(GH39-00331A]3-3-7.TA
(GH44-00482A)
3-3-1.USB JIG Cable
3-3-4.Serial Cable
(CSA LL64151-A)

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4. ElectricalParts List
4-1
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SEC CODE Description Design LOC
0403-001387 DIODE-ZENERZD500
0403-001427 DIODE-ZENERZD501
0406-001104 DIODE-TVSZD601 ZD701
0406-001188 DIODE-TVSU501
0406-001201 DIODE-TVSV705 V706 V707
ㅤDIODE-TVSZD602 ZD603 ZD604
ㅤDIODE-TVSZD605
0504-001151 TR-DIGITALU201 U202 U203
ㅤTR-DIGITALU504
0505-001423 FET-SILICONU305
0601-001785 LEDㅤLED601 LED602
ㅤLEDㅤLED603 LED604
ㅤLEDㅤLED605 LED606
ㅤLEDㅤLED607 LED608
ㅤLEDㅤLED609 LED610
ㅤLEDㅤLED611 LED612
ㅤLEDㅤLED613 LED614
ㅤLEDㅤLED615 LED616
ㅤLEDㅤLED617
0801-002237 ICU302 U709
0801-002294 ICU404
1001-001231 ICU601 U603 U607
1001-001306 ICU608
1001-001331 ICU609 U610
1009-001018 ICU602
1108-000018 ICU710
1201-002223 ICU702
1202-001068 ICU605
1203-003208 ICU701
1203-003545 ICU402
1203-003568 ICU403
1203-003737 ICU401 U604
1203-003742 ICU505
1204-002161 ICU303
1205-002647 ICU200
1205-002709 ICU100
1404-001221 THERMISTORV500
1405-001082 VARISTORV701 V702 V708
ㅤVARISTORV709 V710 V711
1405-001082 VARISTORV400 V712
2007-000137 R-CHIPR512
2007-000138 R-CHIPR113
2007-000140 R-CHIPR404
2007-000141 R-CHIPR601 R604
2007-000143 R-CHIPR102 R103 R107
ㅤR-CHIPR108 R211 R305
ㅤR-CHIPR313 R314
2007-000148 R-CHIPR141 R202 R311
ㅤR-CHIPR406 R409 R503
ㅤR-CHIPR603

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ElectricalPartsList
4-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Description Design LOC
2007-000152 R-CHIPR519
2007-000153 R-CHIPR306
2007-000155 R-CHIPR632
2007-000162 R-CHIPR207 R208 R209
ㅤR-CHIPR210 R216 R220
ㅤR-CHIPR221 R310 R317
ㅤR-CHIPR318 R403 R408
ㅤR-CHIPR501 R511 R602
ㅤR-CHIPR607 R626
2007-000162 R-CHIPR518
2007-000170 R-CHIPR116 R117 R119
ㅤR-CHIPR139 R506 R507
2007-000171 R-CHIPR218
2007-000171 R-CHIPR110 R111 R123
ㅤR-CHIPR135 R143 R144
ㅤR-CHIPR146 R200 R201
ㅤR-CHIPR203 R222 R309
ㅤR-CHIPR315 R322 R323
ㅤR-CHIPR324 R328 R333
ㅤR-CHIPR402 R407 R630
ㅤR-CHIPR631
2007-000172 R-CHIPR101 R106
2007-000242 R-CHIPR205 R206
2007-000758 R-CHIPR500 R502
2007-000831 R-CHIPR606
2007-001303 R-CHIPR302
2007-001325 R-CHIPR304
2007-001339 R-CHIPR627
2007-002970 R-CHIPR609 R610 R611
ㅤR-CHIPR612 R613 R614
ㅤR-CHIPR615 R616 R617
ㅤR-CHIPR618 R619 R620
ㅤR-CHIPR622 R623 R624
ㅤR-CHIPR633
2007-002970 R-CHIPR621
2007-007013 R-CHIPR307
2007-007014 R-CHIPR301 R303
2007-007100 R-CHIPR401
2007-007107 R-CHIPR504
2007-007334 R-CHIPR510
2007-007480 R-CHIPR625
2007-007489 R-CHIPR515
2007-007573 R-CHIPR509 R608
2007-008275 R-CHIPR516
2203-000233 C-CERAMIC C146 C169 C425
2203-000254 C-CERAMIC C125 C128 C133
ㅤC-CERAMIC C138 C158 C168
ㅤC-CERAMIC C201 C300 C616
ㅤC-CERAMIC C617
C-CERAMIC

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ElectricalPartsList
4-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Description Design LOC
2203-000278 C-CERAMIC C163 C164 C602
ㅤC-CERAMIC C611 C615 C715
2203-000311 C-CERAMIC C504
2203-000386 C-CERAMIC C406 C407
2203-000438 C-CERAMICESD2ESD3
2203-000438 C-CERAMIC C135 C137 C159
ㅤC-CERAMIC C167 C303 C307
ㅤC-CERAMIC C624 C625 ESD1
2203-000466 C-CERAMIC C165
2203-000550 C-CERAMIC C330
2203-000585 C-CERAMIC C155
2203-000643 C-CERAMIC C124 C127 C129
ㅤC-CERAMIC C132
2203-000654 C-CERAMIC C153
2203-000679 C-CERAMIC C304 C317
2203-000812 C-CERAMIC C101 C121 C204
ㅤC-CERAMIC C213 C220 C221
ㅤC-CERAMIC C222 C223 C334
ㅤC-CERAMIC C335 C410 C632
ㅤC-CERAMIC C633 C634
2203-000995 C-CERAMIC C166 C605 C614
ㅤC-CERAMIC C705 C706 C708
ㅤC-CERAMIC C709
2203-001153 C-CERAMIC C426
2203-001178 C-CERAMIC C716
2203-001221 C-CERAMIC C313
2203-001259 C-CERAMIC C115 C144
2203-002443 C-CERAMIC C608
2203-002668 C-CERAMIC C111 C141 C142
2203-005050 C-CERAMIC C606
2203-005052 C-CERAMIC C626 C627
2203-005054 C-CERAMIC C601 C610
2203-005065 C-CERAMIC C331
2203-005288 C-CERAMIC C112 C143 C154
2203-005481 C-CERAMIC C314
2203-005482 C-CERAMIC C134 C202 C203
ㅤC-CERAMIC C205 C206 C207
ㅤC-CERAMIC C208 C209 C210
ㅤC-CERAMIC C211 C212 C214
ㅤC-CERAMIC C216 C301 C302
ㅤC-CERAMIC C305 C306 C308
ㅤC-CERAMIC C310 C311 C312
ㅤC-CERAMIC C316 C318 C404
ㅤC-CERAMIC C418 C500 C501
ㅤC-CERAMIC C502 C609 C630
ㅤC-CERAMIC C701 C703
2203-005496 C-CERAMIC C151
2203-006090 C-CERAMIC C403
2203-006093 C-CERAMIC C319 C322 C323
ㅤC-CERAMIC C420 C505 C702

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ElectricalPartsList
4-4
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SEC CODE Description Design LOC
2203-006208 C-CERAMIC C200 C402 C411
ㅤC-CERAMIC C413 C417 C421
2203-006257 C-CERAMIC C405 C412 C414
ㅤC-CERAMIC C415 C423 C424
2203-006562 C-CERAMIC C400 C401 C603
ㅤC-CERAMIC C607 C613
2404-001225 C-TAC700
2404-001268 C-TAC503
2404-001281 C-TAC422 C600 U704
2404-001348 C-TAC122
2404-001374 C-TAC123 C157 C409
2404-001394 C-TAC150 C309
2703-001938 INDUCTOR-SMDL121
2703-002201 INDUCTOR-SMDL125
2703-002267 INDUCTOR-SMDL124
2703-002346 INDUCTOR-SMDL401
2703-002365 INDUCTOR-SMDL101 L102 L103
ㅤINDUCTOR-SMDL104
2703-002596 INDUCTOR-SMDL112
2801-004373 CRYSTAL-UNITOSC400
2809-001294 OSCILLATOR-VCTCXOU102
2901-001286 FILTER-EMISMDF701 F702 F703
ㅤFILTER-EMISMDF704 F705 F706
ㅤFILTER-EMISMDF707 F708 F709
2901-001315 FILTER-EMISMDU502
2911-000007 DUPLEXER-SAWMODULE1
3301-001120 BEAD-SMDL400
3301-001534 BEAD-SMDL600
3705-001358 CONNECTOR-COAXIALCN101
3709-001355 CONNECTOR-CARDEDGESIM400
3710-002115 CONNECTOR-SOCKETCN302
3711-005212 CONNECTOR-HEADER CN703
3722-002181 JACK-EARPHONECN600
4302-001180 BATTERYBAT401
4709-001371 ICU306
GH13-00029AICU304
4202-001049 ANTENNA ANT3
GH30-00199AMICMIC600

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5. BlockDiagrams
5-1
5-1.RFSolution Block Diagram

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BlockDiagrams
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5-2
5-2.BaseBand Solution Block Diagram
PCF5212EL1
VIBRATOR
MELODY IC
(40POLY)
SYSTEM CLOCK
(26MHz)
MV3018SQ
512M OneNAND
MEMORY
KEY_BOARD
LCD
BB INTERFACE
Serial Data
Interface
I/O
Interface
A/D
Interface
AFC
PAMP
RF INTERFACE
PMU
Li-Ion Battery
(Standard)
Charging Circuit RTC_CLOCK
(32.768KHz) SIM CARD
Battery
Type
Battery
Voltage
Battery
Temperature
+VDD_RX_TX
+VCC_SYN
+VDD_IMGE
+AVDD
+AVDD_HFA
+VDD_IO_HIGH
+VDD_IO_LOW
VDD_SLEEP
+VDD_IO_LOW
MIC_BIAS
RSTON
IT_PMU
SIMIO
MIC
RECEIVER
SPEAKER
Ext.
SPEAKER

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6. PCB Diagrams
6-1
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6-1.PCBTop Diagram

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PCB Diagrams
6-2
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6-2.PCB BottomDiagram