Samsung STH-A225 User manual

SERVICE
TDMA MOBILE
TELEPHONE
STH-A225
2
C
ABC
4
GHI
13
DEF
5
JKL
6
MNO
7
PQRS
8
TUV
0
9
WXYZ
Manual
TDMA MOBILE TELEPHONE CONTENTS
1. Trouble Shooting
2. Electrical Parts List
3. Exploded Views and Parts List
4. Block Diagrams
5. PCB Diagrams
6. Circuit Description &
Circuit Diagrams

©Samsung Electronics Co.,Ltd. December. 2001
Pinted in Korea.
Code No.: GH68-01930A
BASIC.
ELECTRONICS

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1-1
1. STH-A225 Trouble Shooting
1. Baseband Section
1-1. Program No Running
N
Need to check
Q204, U311
N
Replace dome S/W
N
Need to check
Q204, U311
N
Need to replace
Memory(U206)
N
Need to check neighbor part
Need to check OSC302,
U202 & neighbor part
Press END Key
Y
Y
Y
Y
Y
Y
ON_SW=H
VBAT>3.2V
VCTCXO_IN=14.4 MHz
32K_XIN=32.768 kHZ
Memory (U206)
control signal OK?
VCC=3.0V
V_VCTCXO=3.0V
RST=3.0V
IVCC=2.2V
BOOT=H
Program Running
VCC, ADD(0:21), DATA(0:15),
FLASH_CS, SRAM_CS, UBE,
MEMOEB, MEMWEB

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1-2
STH-A225 Trouble Shooting
1-2. Abnormal LCD display ,EL Baob Light, Vibrator & Speaker Operation
Y
LCD module
Good
N
Replace LCD module
Y
Speaker Output OK?
N
Need to check
CN101 & neighbor part
N
Need to check
CN101
START
Y
Y
LCD Control
Signal OK?
Y
Y
EL_EN=H
N
Y
EL Back light
OK?
VCC, ADD(2), DATA(0:7),
DISPLAY_CS, RST
LCD Display Running
Send Command EL
enable(Test mode:176)
N
Need to check
CN101
Y
Y
VIBRATOR=H
N
Replace LCD module
Y
Vibrator Run
OK?
LCD Display Running
EL Back lingt Running
Send Command Vibrator
enable(Test mode:180)
N
Need to check CN101
& neighbor part
Y
SPK+,SPK-
Signal OK?
LCD EL Vibrator OK Send Command
Main Audio Receiver Path ON
(Test mode:031, 131, 134, 185)
Need to check U106 out pin5
2.8 V al control pin3 ‘H’

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1-3
STH-A225 Trouble Shooting
1-3. Abnormal Key, Mic, LED’S operation
N
Need to check CN102-1
& neighbor part
N
Need to check CN102-1,
Q102 & neighbor part
Press Keys
Y
Y
Key Dispaly
OK?
Y
Key Display Good
Send Command Main Audio Path ON
(Test mode:031, 131, 136, 187)
Talking Voice at MIC+
N
Need to check
CN102-1 & neighbor part
Y
Y
Y
LED Operation
OK?
Key Display Good
Mic Path Good
Send Command ALT_LED_ON
Send Command SVC_LED_ON
Send Command LED_ON
(Test mode:178)
Audio signal output
at Speaker?
GOOD

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1-4
STH-A225 Trouble Shooting
1-4. Abnormal Buzzer Operation
START
Y
N
Need to check
U104 & AU101
Y
Y
Ringer Signal
OK?
Send Command Ringer Path ON
(Test mode:183)
N
Replace AU101
Y
Buzzer Sound Output
OK?
Buzzer Operation
Good

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1-5
STH-A225 Trouble Shooting
1-5. Abnormal external Ear_Mic Jack operation
START
Y
N
Need to check Q103,
U102 & neighbor parts
Y
Y
HS_SENSE=H
Hock Up Ear_Mic Phone in the Jack(U313)
Send Command MIC_BIAS_EN enable Send
Command AMP_EN enable
Audio set Path=HS
(Test mode:187, 185, 032)
N
Need to check Q103,
U102 & neighbor parts
Y
Y
SEND_END=H
Press Button on the Ear-Jack
Ear_Mic phone
Operation Good

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1-6
STH-A225 Trouble Shooting
2. RF Section
2-1. Call processing and Online Test
N
DONE
START
Y
Y
Normal SVC?
Check RX path
N
Y
Set up Call OK?
Check TX path
N
Y
Measure SINAD/BER
Good?
Check RX path
N
Y
Measure
Tx Power Good?
Check TX path

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1-7
STH-A225 Trouble Shooting
2-2. Receiver Section (Offline test)
1
Y
Y
N
Need to check
U209, U208, U207
Y
N
Need to check
F306
U301_8=-54dBm
N
Need to check
F304 & neighbor parts
Y
RF_BAND=L, RX_BAT=H
PLL_ON=H, PON_LC=H
VCTCXO_PC=H, IF_ON=H
PON_VRF3=H
set up 8920B basestation for RX test
Set Base station RX Lev=-50 dBm
Send Command RX path ON
Send Command channel selecton
(Test mode:031)
START
N
Y
V_LNA_CELL=H
U208_1=H
U207_1=H
Need to check
U301 & neighbor parts
F304 input=-34dBm
2
U304_45=-35dBm

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1-8
STH-A225 Trouble Shooting
2
N
N
AMPSTDMA
N
Replace U304
Replace
F302
Need to check OSC301,
neighbor parts & U304_1,2,3
Need to check
U207 & neighbor parts
N
Y
Y
Y
Y
YRF loal check
U304_48 Lev=-5dBm
Freq=adjusted freq?
1
U304_41 Lev=-19dBm
Freq=130.05MHz
U304_34 Lev=-26dBm
Freq=130.05MHz
NNeed to check
U304, L303, C308, L301, C307
U304_37 Lev=4dBm
Freq=450kHz
Y
NReplace F301 or
Need to check R302, R304, C301
U304_25 Lev=-2dBm
Freq=450kHz
MODE
U304_40, 42=3.0V
43

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1-9
STH-A225 Trouble Shooting
N
Replace U304
Case TDMA mode:
setup basestation for RX test
Amplitude:-50dBm
3
U304_9, 19, 11, 12
measure I/Q
Quarature wave N
Need to check U304 &
Quad LC Tank circuit
(L310, C328, C330,
C329, R320)
PON_LD=H
Case AMPS mode:
setup basestation for RX test
Audio Freq gen : 1004Hz
FM deviation : 2.9kHz
4
Y Y
Y
U304_16 DEMOD
(sinusoidal wave)
Vp-p=350mV
Freq=1004Hz
N
Need to check U304 &
R327, R323, C353, C107
U101_52 DEMOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
N
Replace U203
Y
U101_40 BBCLK=
6.2208MHz or 4.96NHz or
5.12MHz
N
Replace U203
Y
U101_32RX_CLK=
BBCLK/2 or
BBCLK/8
N
Replace U203
Y
U101_31 RX_SYNC=
BBCLK/32 or
BBCLK/128
N
Replace U203
Y
U101_31 RX_DATA=
serial data
DONE

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1-10
STH-A225 Trouble Shooting
2-3.Transmitter Section (Offline test)
N
Replace U203
N
Replace U203
N
Replace U203
N
Replace U203
Y
Y
Y
U101_40 BBCLK=
6.2208MHz or 4.096MHz
or5.12MHz
Y
U101_34 TX_CLK=
BBCLK/32 or BBCLK/8
Y
U101_33 TX_SYNC=
BBCLK/512 or BBCLK/128
Y
U101_33 TX_DATA=
serial data
RF_BAND=L, TX_BAT=H
PLL_ON=H, VCYCXO_PC=H
IF_ON=H, PON_TX=H
PON_VRF3=H
setup 8920B as basestaion for
TX test audio signal?
Send command TX path ON
Send Command channel selection
(Test mode:136, 131)
START
AMPSTDMA
21
MODE

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1-11
STH-A225 Trouble Shooting
1
3
Replace U101
Y
Y
Need to check
V_RF2=3.0V or
Replace U304
2
Y
U304_59(RF OUT)
Fc=Local_freq + 175.05
U101_61, 60, 58, 57
TX I/Q Quarature signal
AC Lev Vp_p=0.4V
DC bias Lev=1.5V
U101_63 MOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
OSC303_1
(FM modulation out)
Freq=175.05MHz
Audio Freq=1004Hz
Need to check
OSC303,
V_IF_VCO=3.0V
NY
N
N
Y
Need to check
U304_66 or
Replace U304
U304_59(RF OUT)
measure Level
Send command PA_CNT
(Test mode:132)
Level is adjustable?
N
Y
Replace F310
U304_59(RF OUT)
Fc=Local_freq + 175.05 N
Y

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1-12
STH-A225 Trouble Shooting
3
Y
Need to check
V_DRV_CELL=3.0V,
neighbor part or
Replace U307
U307 Gain
around 27dB N
Y
Replace F309
F309 Insertion loss
around 3dB N
Y
Need to check
V_PA_BAIS_CELL(U305_5,6,7)=3.0V
VBATT(U305_14,15,16)=3.2~1V
or Replace U305
U305 Gain
around 30dB N
Y
Need to check
F313 & neighbor parts
F306_1 around same power
with U305 output N
Y
Need to check
F313 & neighbor parts
F306 insertion loss
under 3dB N
DONE

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2-1
2. STH-A225 MAIN Electrical Parts List
0 STH-A225G/TCE
1 GH07-00092A LCD-STHA225 MOTOR, SPK UG-18B75-FGHTX-A, STH-A225, -, 34.6 x
1 GH43-00360A BATTERY-STHA205 LP473465B, STH-A205, LI-ION , 900 mAh, -, 4.2 V, -
1 GH44-00145G CHARGER-SCHN105 TC TCH020ABN, SCH-N105, AC/DC, -, -, -, -,
1 GH59-00174A UNIT-KEY PAD ASS’Y STH-A205, HUW9518-010010, -, KEY PAD ASS’Y, -,
1 GH92-00829A PBA MAIN-STHA225 STH-A225, -, BRAZ, MAIN PBA, -, -, -, -, -
2 3002-001062 AU101 BUZZER-MAGNETIC 88dB, 3.6 V, 90 mA, 2.731KHz, TP
2 2203-005061 C101 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C102 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000254 C103 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-005061 C104 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C105 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C106 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C107 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C108 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C109 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C110 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C111 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C112 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C114 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C115 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C116 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000628 C117 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C118 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-001153 C119 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C120 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C121 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C122 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C123 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C124 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C125 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C126 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C127 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000278 C128 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
Level SEC CODE Design LOC DESCRIPTIONS

SAMSUNG Proprietary-Contents may change without notice
2-2
STH-A225 Electrical Parts List
2 2203-001153 C130 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C131 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C132 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C133 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C134 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C135 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C136 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2404-001105 C141 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-005061 C142 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C143 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000278 C144 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-005061 C145 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005065 C148 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2404-001088 C149 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001105 C150 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2404-001105 C151 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-000278 C152 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000330 C153 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000278 C154 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000330 C155 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000679 C156 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C160 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C161 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005065 C162 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-005061 C163 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2404-001151 C164 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2 2203-005061 C165 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-001153 C166 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C167 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C168 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C169 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-001153 C170 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C172 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C173 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
Level SEC CODE Design LOC DESCRIPTIONS

SAMSUNG Proprietary-Contents may change without notice
2-3
STH-A225 Electrical Parts List
2 2203-005061 C174 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000278 C175 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-005065 C176 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-000278 C177 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000233 C178 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C179 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000679 C180 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005065 C181 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-000233 C201 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C202 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000386 C203 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000386 C204 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C205 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C206 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C207 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C208 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C209 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005065 C210 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-005061 C211 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C218 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C219 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2404-001088 C220 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001105 C221 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2404-001105 C222 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-005065 C223 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-005065 C224 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-000940 C225 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
2 2404-001105 C226 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2404-001088 C227 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001088 C228 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001105 C229 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-005061 C230 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000438 C231 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-005061 C232 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level SEC CODE Design LOC DESCRIPTIONS

SAMSUNG Proprietary-Contents may change without notice
2-4
STH-A225 Electrical Parts List
2 2203-005061 C233 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2404-001088 C234 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001151 C235 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2 2404-001088 C236 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001088 C237 C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2 2404-001151 C239 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2 2203-005061 C240 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000628 C241 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000254 C242 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2404-001151 C243 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2 2203-005061 C301 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C302 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C303 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000438 C304 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-001259 C305 C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000438 C306 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-001153 C307 C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000278 C308 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000278 C309 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-005061 C310 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C311 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000438 C313 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000278 C314 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-005061 C315 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005053 C316 C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP, 1005
2 2203-000233 C318 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C321 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005393 C322 C-CERAMIC, CHIP 0.005 nF, 0.1 pF, 50 V, NP0, TP, 1005
2 2203-000438 C323 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000489 C324 C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000386 C325 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C326 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C327 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000278 C328 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
Level SEC CODE Design LOC DESCRIPTIONS

SAMSUNG Proprietary-Contents may change without notice
2-5
STH-A225 Electrical Parts List
2 2203-000783 C329 C-CERAMIC, CHIP 0.33 nF, 5 %, 50 V, NP0, TP, 1608
2 2203-000233 C330 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C331 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C332 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005281 C333 C-CERAMIC, CHIP 0.0015 nF, 0.1 pF, 50 V, NP0, TP, 1005
2 2203-005061 C336 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C337 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000254 C338 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-000233 C340 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C342 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C343 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C344 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005054 C345 C-CERAMIC, CHIP 0.0047 nF, 0.25 pF, 50 V, NP0, TP, 1005
2 2203-000530 C346 C-CERAMIC, CHIP 2.7 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-005061 C348 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000386 C350 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C352 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000489 C353 C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000386 C354 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C355 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005494 C356 C-CERAMIC, CHIP 220 nF, 10 %, 10 V, X7R, TP, 1608, -
2 2203-005061 C357 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005061 C358 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2404-001105 C360 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-000278 C362 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-001072 C363 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2 2404-001105 C364 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-000233 C365 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C366 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005065 C367 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2 2203-000233 C368 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000254 C369 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-005061 C370 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000425 C373 C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP, 1005
Level SEC CODE Design LOC DESCRIPTIONS

SAMSUNG Proprietary-Contents may change without notice
2-6
STH-A225 Electrical Parts List
2 2203-000278 C374 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000940 C375 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-005480 C376 C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, -
2 2203-000138 C377 C-CERAMIC, CHIP 1.5 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000254 C378 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-005061 C379 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2404-001105 C380 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2 2203-000254 C381 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-000440 C382 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1608, -
2 2203-000254 C383 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-000254 C384 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2 2203-005050 C387 C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2 2203-005061 C388 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-005552 C390 C-CERAMIC, CHIP 0.0022 nF, 0.1 pF, 50 V, NP0, TP, 1005
2 2203-000233 C393 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C394 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C395 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000628 C396 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000278 C397 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-000628 C398 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000233 C399 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000438 C400 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-005393 C401 C-CERAMIC, CHIP 0.005 nF, 0.1 pF, 50 V, NP0, TP, 1005
2 2203-000330 C402 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000438 C403 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000233 C404 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-005061 C405 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-001259 C407 C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
2 2203-005053 C408 C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP, 1005
2 2203-005061 C409 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2 2203-000233 C410 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2 2203-000438 C411 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000438 C412 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2 2203-000438 C413 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
Level SEC CODE Design LOC DESCRIPTIONS