SIEB & MEYER SD2 Guide

Drive System SD2
Hardware Description
Drive amplifier SD2, power supply unit PS2
P-TD-0000205.7
2016-04-13
SIEB & MEYER W

Copyright
Translation of the original instructions, Copyright © 2016 SIEB & MEYER AG
All rights reserved.
This manual or extracts thereof may only be copied with the explicit authorization of
SIEB & MEYER AG.
Trademarks
All product, font and company names mentioned in this manual may be trademarks or registered
trademarks of their respective companies.
SIEB & MEYER worldwide
For questions regarding our products and technical problems please contact us.
SIEB & MEYER AG
Auf dem Schmaarkamp 21
21339 Lüneburg
Germany
Phone: [phone]
Fax: [phone]
[email protected]
http://www.sieb-meyer.de
SIEB & MEYER Shenzhen Trading Co. Ltd.
Room 306, 3rd Floor, Building A1,
Dongjiaotou Industrial Area, Houhai Dadao,
Shekou, Nanshan District,
Shenzhen City, 518067
China
Phone: [phone]
Fax: [phone]
[email protected]
http://www.sieb-meyer.cn
SIEB & MEYER Asia Co. Ltd.
4 Fl, No. 532, Sec. 1
Min-Sheng N. Road
Kwei-Shan Hsiang
333 Tao-Yuan Hsien
Taiwan
Phone: [phone]
Fax: [phone]
[email protected]
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SIEB & MEYER USA
3975 Port Union Road
Fairfield, OH 45014
USA
Phone: [phone]
Fax: [phone]
[email protected]
http://www.sieb-meyer.com
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2 Drive System SD2 - Hardware Description

About this Manual 1
General Information 2
Safety Instructions 3
Unit Assembly Complying EMC 4
Drive Amplifier SD2 5
Single-axis Drive Amplifiers 6
Double-axis Drive Amplifiers 7
Compact Devices 8
Power Supply Unit PS2 9
Mounting Example with Heat Sink 10
Integrated Water-cooled Heat Sink 11
Connector Pin Assignment 12
Connection Examples 13
System Connection 14
Status Display and Error Messages of SD2 15
Status Display and Error Messages of PS2 16
General Information Regarding the Wiring 17
Electric Performance Dimensioning 18
WChapter Overview
Drive System SD2 - Hardware Description 3

Safety Circuit / Restart Lock 19
Appendix 20
Index 21
Chapter Overview W
4 Drive System SD2 - Hardware Description

1 About this Manual ........................................................... 11
1.1 Illustration of Warnings ............................................................................. 11
1.2 Illustration of General Notices ................................................................... 12
1.3 Abbreviations ............................................................................................ 12
2 General Information ........................................................ 13
3 Safety Instructions ........................................................... 15
3.1 General Information .................................................................................. 15
3.2 Appropriate Use ........................................................................................ 16
3.3 Transport and Storage .............................................................................. 16
3.4 Installation ................................................................................................. 17
3.5 Electrical Connection ................................................................................ 18
3.6 Operation .................................................................................................. 19
3.7 Maintenance ............................................................................................. 20
3.8 Disposal .................................................................................................... 20
3.9 Legal Warranty .......................................................................................... 20
4 Unit Assembly Complying EMC ...................................... 21
4.1 Emission of Line and Field Interferences According to Category C3 ........ 21
5 Drive Amplifier SD2 ......................................................... 23
5.1 Block Diagram ........................................................................................... 23
5.2 Type Plate ................................................................................................. 24
5.3 Device Designation ................................................................................... 25
5.4 Components of the Drive System SD2x ................................................... 26
6 Single-axis Drive Amplifiers ............................................ 27
6.1 Device Variant 0362111xy (max. 80 A) .................................................... 27
6.1.1 Dimensions ........................................................................................................... 28
6.1.2 Technical Data ...................................................................................................... 29
6.1.3 Connectors ............................................................................................................ 30
6.2 Device Variant 0362111MF/0362111NF (max. 200 A) ............................. 31
6.2.1 Dimensions ........................................................................................................... 32
6.2.2 Technical Data ...................................................................................................... 33
6.2.3 Connectors ............................................................................................................ 34
6.3 Device Variant 0362111OF (max. 160 A) with Integrated Water-cooled
Heat Sink .................................................................................................. 35
6.3.1 Dimensions ........................................................................................................... 36
6.3.2 Technical Data ...................................................................................................... 37
6.3.3 Connectors ............................................................................................................ 38
6.4 Device Variant 0362111RF (max. 220 A) with Integrated Water-cooled
Heat Sink .................................................................................................. 39
6.4.1 Dimensions ........................................................................................................... 40
6.4.2 Technical Data ...................................................................................................... 41
6.4.3 Connectors ............................................................................................................ 42
6.5 Device Variant 0362114xy (max. 80 A) with Integrated Heat Sink ........... 43
6.5.1 Dimensions ........................................................................................................... 44
6.5.2 Technical Data ...................................................................................................... 45
6.5.3 Connectors ............................................................................................................ 46
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Drive System SD2 - Hardware Description 5

6.6 Device Variant 0362114MF/0362114NF (max. 200 A) with Integrated
Heat Sink .................................................................................................. 47
6.6.1 Dimensions ........................................................................................................... 48
6.6.2 Technical Data ...................................................................................................... 49
6.6.3 Connectors ............................................................................................................ 50
7 Double-axis Drive Amplifiers ........................................... 51
7.1 Device Variant 0362110xxy (max. 40 A) ................................................... 51
7.1.1 Dimensions ........................................................................................................... 52
7.1.2 Technical Data ...................................................................................................... 53
7.1.3 Connectors ............................................................................................................ 54
7.2 Device Variant 0362112xxy (max. 120 A) ................................................. 55
7.2.1 Dimensions ........................................................................................................... 56
7.2.2 Technical Data ...................................................................................................... 57
7.2.3 Connectors ............................................................................................................ 58
7.3 Device Variant 0362113xxy (max. 40 A) with Integrated Heat Sink ......... 59
7.3.1 Dimensions ........................................................................................................... 61
7.3.2 Technical Data ...................................................................................................... 62
7.3.3 Connectors ............................................................................................................ 63
7.4 Device Variant 0362115xxy (max. 120 A) with Integrated Heat Sink ....... 64
7.4.1 Dimensions ........................................................................................................... 65
7.4.2 Technical Data ...................................................................................................... 66
7.4.3 Connectors ............................................................................................................ 67
8 Compact Devices ............................................................ 69
8.1 Device Variant 0362130xxy (max. 60 A) ................................................... 69
8.1.1 Dimensions ........................................................................................................... 70
8.1.2 Technical Data ...................................................................................................... 71
8.1.3 Connectors ............................................................................................................ 73
8.2 Device Variant 0362131xxy (max. 60 A) with Integrated Heat Sink ......... 74
8.2.1 Dimensions ........................................................................................................... 76
8.2.2 Technical Data ...................................................................................................... 77
8.2.3 Connectors ............................................................................................................ 79
9 Power Supply Unit PS2 ................................................... 81
9.1 Block Diagram ........................................................................................... 82
9.2 Device Variant 0362190y .......................................................................... 83
9.2.1 Dimensions ........................................................................................................... 84
9.2.2 Technical Data ...................................................................................................... 85
9.2.3 Connectors ............................................................................................................ 86
9.3 Device Variant 0362191y with Integrated Heat Sink ................................. 87
9.3.1 Dimensions ........................................................................................................... 88
9.3.2 Technical Data ...................................................................................................... 89
9.3.3 Connectors ............................................................................................................ 90
10 Mounting Example with Heat Sink .................................. 91
10.1 Rear Panel with Liquid Cooling ................................................................. 92
10.2 Extruded Heat Sink Made of Aluminum .................................................... 93
10.3 High-performance Heat Sink ..................................................................... 94
10.4 Mounting Holes for 70 mm Devices .......................................................... 95
10.5 Mounting Holes for 100 mm Devices ........................................................ 96
10.6 Mounting Holes for 130 mm Devices ........................................................ 97
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6 Drive System SD2 - Hardware Description

11 Integrated Water-cooled Heat Sink ................................. 99
12 Connector Pin Assignment ............................................ 101
12.1 ID Switch SD2 ......................................................................................... 101
12.2 ID Switch PS2 ......................................................................................... 101
12.3 X1, X2 – 24V ........................................................................................... 101
12.4 X3 – Bus Inputs (RS485, CAN) ............................................................... 102
12.5 X4 – Bus Outputs (RS485, CAN) ............................................................ 102
12.6 X5 – DIO ................................................................................................. 103
12.6.1 Digital Inputs / Outputs – SERVO / VECTOR (SVC) ........................................... 103
12.6.2 Digital Inputs / Outputs – HSPAM / VF ................................................................ 104
12.7 X6 – Encoder 0 ....................................................................................... 105
12.8 X7 – Encoder 1 / Encoder Emulation ...................................................... 106
12.9 X8 – Resolver .......................................................................................... 106
12.10 X9 – Motor Feedback .............................................................................. 107
12.11 X10 – Safety (STO) ................................................................................. 108
12.12 X11ϑ – Temperature Sensor of the Motor .............................................. 108
12.13 X12 – DIO PS2 ........................................................................................ 109
12.14 X13 – Analog Interface ............................................................................ 109
12.15 X14 – USB .............................................................................................. 110
12.16 X20, X21 – DC Link Connections ............................................................ 110
12.17 X22, X24 – Motor Connection ................................................................. 111
12.18 X23 – Mains Supply PS2 ........................................................................ 112
12.19 X25 – External Ballast Resistor ............................................................... 113
12.20 X26/ X27 – SERVOLINK 4 ...................................................................... 113
12.20.1 Assembly of Optical Fiber Cables ....................................................................... 114
12.21 X28 – Mains Supply of the Compact Devices ......................................... 115
12.22 Motor/DC Link Connection 0362111RF .................................................. 116
13 Connection Examples ................................................... 117
13.1 X1, X2 – 24 V .......................................................................................... 117
13.2 X3, X4 – Bus Connection ........................................................................ 117
13.2.1 RS485 Bus .......................................................................................................... 117
13.2.2 CAN-Bus ............................................................................................................. 118
13.3 X5 DIO – Digital Inputs/Outputs .............................................................. 118
13.3.1 Digital Inputs ....................................................................................................... 118
13.3.2 Digital Outputs ..................................................................................................... 119
13.4 X6, X7 – Incremental Encoder with TTL Signals ..................................... 119
13.5 X7 – Encoder Emulation ......................................................................... 120
13.6 X8 - Resolver .......................................................................................... 121
13.7 X9 – Motor Feedback .............................................................................. 122
13.7.1 Incremental Encoder with Sine Signals (1 Vpp) ................................................... 122
13.7.2 Linear Hall Encoder (1 Vpp) ................................................................................. 123
13.7.3 EnDat 2.1 with Sine Signals (1 Vpp) .................................................................... 124
13.7.4 Hiperface with Sine Signals ................................................................................ 125
13.7.5 SSI Encoder ........................................................................................................ 126
13.7.6 Hall Sensor 12 V ................................................................................................. 126
13.7.7 Hall Sensor 5.3 V ................................................................................................ 127
13.7.8 Field Plate ........................................................................................................... 128
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Drive System SD2 - Hardware Description 7

13.7.9 Incremental Encoder with TTL Signals (5.3 V) .................................................... 129
13.7.10 Incremental Encoder 12 V ................................................................................... 130
13.8 X10 – Safety Circuit (STO) ...................................................................... 130
13.8.1 Wiring with OSSD ............................................................................................... 130
13.8.2 Wiring without OSSD .......................................................................................... 131
13.9 X11 - Temperature Sensor of the Motor ................................................. 131
13.10 X13 – Analog Inputs/Outputs .................................................................. 132
13.10.1 Analog Inputs ...................................................................................................... 132
13.10.2 Analog Outputs ................................................................................................... 133
13.11 X22/X24 – Motor Phases ........................................................................ 133
13.12 X26/X27 – SERVOLINK .......................................................................... 134
14 System Connection ....................................................... 135
15 Status Display and Error Messages of SD2 .................. 137
15.1 List of the Operating States .................................................................... 138
15.2 List of Drive Error Messages ................................................................... 138
15.3 List of Warning Messages ....................................................................... 142
15.4 Message of the Quick Stop Functions .................................................... 143
16 Status Display and Error Messages of PS2 .................. 145
16.1 List of Operating States .......................................................................... 145
16.2 List of the Power Supply Error Messages ............................................... 146
16.3 Hardware Status Signals ERR0/ERR1 ................................................... 146
17 General Information Regarding the Wiring .................... 147
17.1 Mains Connection ................................................................................... 147
17.2 Cable Requirements ............................................................................... 147
17.2.1 Motor Cable ......................................................................................................... 149
17.2.2 Communication Cable ......................................................................................... 150
17.2.3 Cables for the Rotor Position Detection .............................................................. 151
17.2.4 Cables for the External Ballast Resistor .............................................................. 151
18 Electric Performance Dimensioning .............................. 153
18.1 Components ............................................................................................ 153
18.1.1 Output Stage ....................................................................................................... 153
18.1.2 Power Supply ...................................................................................................... 153
18.1.3 Motor ................................................................................................................... 154
18.2 Power Consumption of a Drive ............................................................... 155
19 Safety Circuit / Restart Lock .......................................... 157
19.1 Functional Description of the Restart Lock ............................................. 158
19.2 Wiring Example ....................................................................................... 159
19.3 Requirements and Standards ................................................................. 160
20 Appendix ....................................................................... 163
20.A Specification of Drive Functions .............................................................. 163
20.B Specification of Device Firmware ............................................................ 167
20.C Wiring Examples ..................................................................................... 169
20.D Manufacturers ......................................................................................... 171
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8 Drive System SD2 - Hardware Description

20.D.1 SIEB & MEYER Accessories .............................................................................. 171
20.D.1.1 Connectors of the Series SD2 ............................................................................. 171
20.D.1.2 Line Filters for Frequency Converter/Power Electronics ..................................... 171
20.D.1.3 SERVOLINK 4 Master PCI Plug-in Board 036500001 ........................................ 173
20.D.1.4 USB>RS232/485 Converter 050201 ................................................................... 173
20.D.2 Phoenix Contact .................................................................................................. 173
20.D.2.1 Surge Arrestor FLASHTRAB ............................................................................... 174
20.D.2.2 Shield Connection Clamps .................................................................................. 174
20.D.3 SCHNEEFUSS + ROHDE Mains Chokes ........................................................... 174
20.D.4 TOSHIBA - Fiber Optic Connectors .................................................................... 175
20.D.5 WAGO Innovative Connections .......................................................................... 175
20.D.5.1 Shield Connection Clamps .................................................................................. 175
21 Index ............................................................................. 177
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10 Drive System SD2 - Hardware Description

1 About this Manual
This chapter explains symbols, signal words and abbreviations possibly used in this
manual.
1.1 Illustration of Warnings
Depending on their degree of risk, warnings are classified into different levels. In the
manual, the different levels and types of dangers are represented as follows:
[1] Risk level (signal word/warning color)
Classification of the risk
[2] Safety symbol
Risk of injury
[3] Risk symbol
Graphic representation of the source of risk
Risk levels
Risk Level Description
Indicates an imminently hazardous situation which, if not avoided, will
result in death or serious injury.
Indicates a potentially hazardous situation which, if not avoided, could
result in death or serious injury.
Indicates a potentially hazardous situation which, if not avoided, may result
in minor or moderate injury or property damage.
Indicates a hazardous situation which, if not avoided, may result in property
damage.
Risk symbols
Risk symbol Description
General hazardous situation
Risk of injury due to electric shock
Risk of injury due to hot surfaces
WAbout this Manual
Drive System SD2 - Hardware Description 11
1

Risk symbol Description
Potentially risk of injury when working on machines with open covers/
doors
Risk of injury due to flying objects
Destruction risk of electrostatically sensitive components
Risk of property damage
1.2 Illustration of General Notices
Symbol Description
Hint with additional, further information
Tip with suggestions and useful information
Terms and Definitions
Terms that are specifically explained in the manual are highlighted as underlined and
green words.
All term definitions are to find in the glossary of the manual. In the PDF file a mouse
click on a highlighted term jumps directly to the according definition.
1.3 Abbreviations
HSPAM high-speed pulse amplitude modulation
n.c. not connected
OSSD Output Signal Switching Device
SERVO servo control
STO safety function: Safe Torque Off
SVC sensorless vector control
VF V/f Characteristic Curve
VCC voltage at the common collector
VECTOR vector control
About this Manual W
12 Drive System SD2 - Hardware Description
1

2 General Information
This manual describes the drive systems of the series SD2. These devices allow oper‐
ation of high-dynamic servo motors as well as synchronous and asynchronous high-
frequency spindles.
The devices are equipped with interfaces for different sensor systems allowing to drive
motors with resolvers as well as SinCos, EnDat, Hall, linear Hall, incremental and field
plate sensors. Motor systems without any sensors are also supported, whereas
different customized control methods are available. In addition the devices can drive
rotary and linear motors. Thus, the number of device variants is reduced for the
machine manufacturer.
This manual provides information on:
▶ Safety instructions and application advice
▶ Notes about the electromagnetic compatibility
▶ Description of the device (block diagram, type plate, module designation)
▶ Technical data, dimensions
▶ Connector pin assignment
▶ Wiring examples
▶ Status and error messages
▶ General information regarding the wiring (cables and line cross-sections)
▶ External protection, ballast circuit
Information concerning the initial operation and parameterization of the digital drive
amplifier can be found in the manual of the software
drivemaster2 .
This manual is available in German and English as PDF file, on CD ROM and as
printed version or it can be downloaded from the Internet. The PDF files can be printed
on standard printers.
This manual has the following demands on the trained staff of machine manufacturers:
Transport: only by skilled employees familiar with handling electrostatically
sensitive components.
Installation: only by experts with electromechanical experience
Initial operation: only by experts with experience in the fields of electrical engi‐
neering / drive technology
WGeneral Information
Drive System SD2 - Hardware Description 13
2

General Information W
14 Drive System SD2 - Hardware Description
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3 Safety Instructions
These safety instructions contain important information for your safety. Read
them carefully and keep them for later use.
According to: ▶ Low-Voltage Directive 2014/35/EU
▶ Machinery Directive 2006/42/EC
▶ EMC Directive 2014/30/EU
3.1 General Information
WARNING
Risk of serious injuries and material damage
Generally, the complete installation, the initial operation and the maintenance must
be carried out by trained staff only.
Trained staff, according to this fundamental safety instruction, are persons familiar
with the installation, mounting, initial and permanent operation of the product and
they are qualified appropriately for the work. The standards DIN VDE 0100 and
DIN VDE 0110 as well as the national accident prevention regulations shall be
considered!
WARNING
Risk of burn due to hot surfaces
During operation the units can have hot surfaces according to their protection
system. When using ferrite rings temperatures may exceed 80°C in some cases.
Only use cables suitable for temperatures over 80 °C. This corresponds to the
flammability rating UL 94V-0, RTI 105°C.
Consider the relevant notes in the manual.
DANGER
Material may be damaged and persons be injured seriously:
▶ when covers are removed illegally,
▶ during any improper use,
▶ when either the installation or the operation is incorrect
Consider the relevant notes in the manual.
WARNING
Risk of injuries and material damage due to illegal modifications
Only change the settings of the device after having contacted SIEB & MEYER.
WSafety Instructions
Drive System SD2 - Hardware Description 15
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3.2 Appropriate Use
Terms according to DIN EN 61800
Before initial operation, make sure that the machine will not expose danger (e.g.
runaway moves). The conformity with the safety standards DIN EN 60204-1 and DIN
EN 61800-5-1 must be ensured.
The manufacturer of the system or the machine has to meet the requirements of the
legal values regarding the Electromagnetic Compatibility (EMC). SIEB & MEYER units
can be operated in industrial areas, provided that the attached EMC information has
been taken into consideration.
SIEB & MEYER takes care in its own EMC laboratory over their products to meet the
respective standards, when they are installed properly.
Deviations of the construction and the installation, described in the documentation and
in the manual Unit Assembly Complying EMC require new measurements of the
system or machine by the machine manufacturer to meet the statutory requirements.
The use in industrial areas under consideration of the EMC product standard (PDS)
DIN EN 61800-3 is ensured by appropriate measures.
The use of line filters helps reaching the following:
▶ Resistance to interference / immunity. The electronic system is protected against
high-frequency disturbances, possibly infiltrated via the mains cable.
▶ Protection against radiation. High-frequency disturbances are reduced to legally
authorized measure. This prevents effects of the transients to adjacent compo‐
nents or devices.
Products, not equipped with an integrated AC supply line filter must be operated with a
series connected external line filter. Detailed information can be found in the chapter
"Unit Assembly Complying EMC".
If using the drive systems in residential areas, in business and commercial areas as
well as in small trade, the user has to take additional and larger filter measurements.
All SIEB & MEYER products meet the requirements of Low-Voltage Directive
2014/35/EU. The harmonized standards of DIN EN 50178 and DIN EN 60204-1 in
combination with the standards DIN EN 60947 and DIN EN 61800-5-1 are applied
consequently.
Technical data and the connection specification can be found in the respective product
documents.
3.3 Transport and Storage
Make sure, that the unit is correctly used. The following points must especially be
taken into consideration:
▶ Protection against mechanical damage (transport, handling, etc.)!
▶ Protection against dirt and humidity!
▶ Protection against contact with electronic components (electrostatic discharge)!
▶ No modification of insulating distances!
The following climatic conditions apply to the storage. If required, appropriate meas‐
ures must be taken to ensure these climatic conditions (installation of heating/air condi‐
tioning systems etc.):
▶ The storage area must be clean (dust-free, if possible), dry and well-ventilated.
▶ Storage in the open is not permitted.
Safety Instructions W
16 Drive System SD2 - Hardware Description
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▶ The storage temperature must be in the range of -25 °C to +55 °C (-13 °F to
+131 °F). Shortly it may be +70 °C (+158 °F).
▶ The relative humidity on the storage premises must be in the range of 5 % to 75 %
(no bedewing).
▶ Sudden changes of the temperature or the humidity should be prevented.
The maximum storage period is 2 years. Electrolytic capacitors produce high leakage
currents when a voltage is applied after a long storage period without applied voltage
and must be reformed. For this, the operating voltage is applied via a 1 kΩ series
resistor for one hour. Please contact the SIEB & MEYER service department for
details.
3.4 Installation
NOTICE
Damage of electrostatically sensitive components due to improper handling
Never touch electrostatically sensitive components!
Mechanical installation conditions for the system according to DIN EN 61800-2:
Vibrations must remain within the limit values of the IEC 60721-3-3, class 3M1,
standard for fixed equipment.
Frequency [Hz] Amplitude [mm] Acceleration [m/s²]
2 ≤ f < 9 0,3 Not applicable
9 ≤ f < 200 Not applicable 1
Tab. 1: Vibration limits of the system
Vibrations which exceed these limits, or the use on mobile equipment, are considered
as abnormal mechanical conditions.
Operating conditions:
The following requirements are to be considered for the installation and the operation
of the device. Noncompliance with theses requirements is regarded as abnormal oper‐
ating condition:
▶ The device is conceived according to DIN EN 61800-1 / DIN EN 50178 for the dirt
level 2.
▶ The units can be loaded to their maximum up to a height of 1000 m above MSL
(3281 ft above MSL).
For an operation in areas higher than 1000 m (3281 ft) above MSL the capacity
must be reduced by 15 % per 1000 m (3281 ft).
▶ The device must be protected against harmful gas, oil vapor and salty air at the
place of installation.
▶ The ambient air must not contain aggressive, grinding, electrically conductive or
flammable substances as well as any amount of dust.
▶ The admissible relative humidity is between 5 % and 85 % (no bedewing).
▶ The admissible ambient temperature during operation is +5 °C to +40 °C (+41 °F
to +104 °F). Extreme and sudden changes of the temperature should be
prevented.
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Drive System SD2 - Hardware Description 17
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─ For devices that can be operated at ambient temperatures up to +60 °C
(+140 °F) – see technical data – the output power must be reduced at temper‐
atures above +40 °C. The following applies: -1.5 % per 1 °C. Note:
F=C×9/5+32; C=(F-32)×5/9
In addition, the service life of the device is probably reduced due to increased
wear of the components.
─ Devices with polyester film at the front panel: The polyester films must not be
exposed to direct sunlight for extended periods of time. In conditions of high
humidity (>80 %) the ambient temperature must not exceed +40 °C (+104 °F).
The polyester films must not come in contact with benzyl alcohol or methylene
chloride.
▶ Make sure that the fans installed in the units have sufficient space to take in and
exhaust the cooling air. In addition pay attention to the direction of air flow through
internally installed fans.
3.5 Electrical Connection
DANGER
Risk of serious injuries when working on energized devices
Consider the applicable accident prevention regulations.
DANGER
Risk of serious injuries due to high currents
Incorrect or insufficient connection of the system to ground may cause dangerous
currents.
Carry out all earthing measures as described in the manual.
The electrical installation must be carried out according to the relevant electrical codes
(e.g. appropriate wire gauges, fuse protection and connections of ground conductors
must be considered).
Connecting the device to an IT mains is only possible with isolating transformer.
Recommendations for the installation according to the EMC (e.g. shields, connection to
earth and line installations) can be found in the technical documents of the unit (only
for machine manufacturers). The manufacturer of the system or machine has to meet
the requirements of the legislation regarding the EMC.
➮ All work at and within the units must only be carried out, when the units are turned
off, the mains supply is cut and the DC bus is completely discharged.
➮ Consider that the mains supply must be protected via an overload release with
restricted guidance for each mains phase. The mains line should only be
connected, when the work is completed.
➮ Before turning on the unit the first time, make sure that the connected machine will
not have runaway axes!
➮ After turning off the unit hazardous voltages may still exist for up to 3 minutes in
the power supply (due to capacitors).
➮ Never connect capacitive loads to the output phases of the servo amplifiers and
frequency converters.
Safety Instructions W
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➮ Prevent cable loops. Therefore, the units must only be connected to earth at the
provided PE connection for the mains supply line and the racks only at the
provided earth screw.
DANGER
Connection of the power supply unit
This product may cause touch current in the protective earthing conductor. The
current in the protective earthing conductor can exceed 3.5 mA AC or 10 mA DC.
Pay attention to the local safety regulations for electric equipment with high
leakage currents, in particular the minimum cross-section of the protective earthing
conductor.
Generally, the product can be operated with a residual current device. Nevertheless,
like all clocked units of the power electronics, also SIEB & MEYER products can lead
leakage currents via the earth system. Due to the DC component in the leakage
current the protection of the residual current device could be reduced. Consequently,
there might be no protection against direct touching or for technical equipment of the
installation.
DANGER
Used residual current device/monitor
This product may cause direct current in the protective earthing conductor. If a
residual current device (RCD) or a residual current monitor (RCM) is used for
protection in the event of direct or indirect contact, only a type B (all current sensi‐
tive) RCD/RCM is permitted on the current supply side of this product.
If a type B RCD/RCM is used at the product, all upstream connected RCDs/RCMs
up to the supply transformer must be of type B as well.
Depending on the sensitivity of the residual current device and the installation type,
consider the following points for the operation with residual current device:
➮ Use the shortest connection and motor cables possible.
➮ Do not connect additional consumers to the same residual current device.
➮ Use residual current devices with high response threshold and time-lag response
time. Depending on the required protection class we recommend using short-time
delay or selective residual current device.
3.6 Operation
WARNING
Risk of serious injuries due to moving machine parts
During the operation of an installation with open doors or removed covers, persons
may seriously be injured by moving machine parts.
Keep the doors closed during the operation and do not remove covers.
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Drive System SD2 - Hardware Description 19
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WARNING
Risk of injuries and material damage due to flying parts
Persons may be injured or material be damaged, if screws of the front panels and
housing parts are not fastened.
Before the initial operation of the installation ensure that all screws are tightened.
Systems, into which servo amplifiers and frequency converters are mounted, possibly
must be equipped with additional protective devices according to the valid safety
instructions (e.g. law about technical material, rules for prevention of accidents, etc.).
3.7 Maintenance
The unit must be checked regularly for cleanness and functionality depending on the
ambient pollution. This applies in particular for installed fans.
3.8 Disposal
SIEB & MEYER products fulfill the requirements covered in the Directive 2002/95/EC
on the restriction of the use of hazardous substances in electrical and electronic equip‐
ment (RoHS Directive).
Make sure that the country-specific waste and disposal laws and statutes are consid‐
ered for the disposal of packing material, used batteries and irreparable devices.
3.9 Legal Warranty
SIEB & MEYER products are liable to a legal warranty of at least one year. Any claims
for the products beyond this warranty shall be declared in an additional contractual
agreement between SIEB & MEYER and the customer.
NOTICE
Due diligence of the machine manufacturer
A first programming carried out by SIEB & MEYER does not release the machine
manufacturer from his duty to check the programmed values for correctness.
Safety Instructions W
20 Drive System SD2 - Hardware Description
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