Sony XM-DS1300P5 Operating & Mounting User manual

1
SERVICE MANUAL
US Model
Canadian Model
XM-DS1300P5
MONAURAL POWER AMPLIFIER
Other Specifications
Circuit system Class D Technology
Pulse power supply
Inputs RCA pin jacks
High level input connector
Outputs Speaker terminals
Through out pin jacks
Suitable speaker impedance
2 – 8 Ω
Maximum outputs 400 W (at 4 Ω)
800 W (at 2 Ω)
Rated outputs (supply voltage at 14.4V)
200 W (20 Hz – 300 Hz, 0.2% THD, at 4 Ω)
400 W (20 Hz – 300 Hz, 0.6% THD, at 2 Ω)
Frequency response 5 – 300 Hz ( dB)
Harmonic distortion 0.06% or less (at 100 Hz, 4 Ω)
Input level adjustment range
0.3 – 6.0 V (RCA pin jacks)
1.2 – 12.0 V (High level input)
Sub-sonic filter 15 Hz, –12 dB/oct
Low-pass filter 50 – 300 Hz, –12 dB/oct
Low boost 0 – 10 dB (40 Hz)
Power requirements 12 V DC car battery
(negative ground)
Power supply voltage 10.5 – 16 V
Current drain at rated output : 50 A (at 2 Ω)
Remote input : 2 mA
Dimensions Approx. 295 ×57 ×290 mm
(11 5/8 ×2 1/4 ×11 1/2 in.) (w/h/d) not incl.
projecting parts and controls
Mass Approx. 2.8 kg (6 lb. 3 oz.) not incl. accessories
Supplied accessories Mounting screws (5)
High level input cord (1)
Protection cap (1)
Design and specifications are subject to change without
notice.
SPECIFICATIONS
AUDIO POWER SPECIFICATIONS (US MODEL)
POWER OUTPUTAND TOTAL HARMONIC DISTORTION
200 watts minimum continuous average power into 4 ohms,
20 Hz to 300 Hz with no more than 0.2% total harmonic
distortion per Car Audio Ad Hoc Committee standards.
+0.5
–3
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Ver 1.0 2003. 12
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-961-897-01
2003L04-1
© 2003. 12

2
TABLE OF CONTENTS
1. GENERAL
Location and Function of Controls.......................................... 3
Connections ............................................................................. 4
2. DISASSEMBLY
2-1. Bottom Plate ........................................................................ 6
2-2. Main Board Section ............................................................. 7
2-3. Disassembly and Assembly of Ornamental Plate ................ 7
2-4. Main Board .......................................................................... 8
2-5. LED Board ........................................................................... 8
3. DIAGRAMS
3-1. IC Block Diagram................................................................ 9
3-2. Printed Wiring Boards –Main Section (1/2)– .................... 10
3-3. Printed Wiring Boards –Main Section (2/2)– .................... 11
3-4. Schematic Diagram –Main Section (1/2)– ........................ 12
3-5. Schematic Diagram –Main Section (2/2)– ........................ 13
4. EXPLODED VIEWS
4-1. Heat Sink (Main) Section .................................................. 15
4-2. Main Board Section ........................................................... 16
5. ELECTRICAL PARTS LIST......................................... 17
XM-DS1300P5

3
XM-DS1300P5
SECTION 1
GENERAL This section is extracted
from instruction manual.

4
XM-DS1300P5

5
XM-DS1300P5

6
XM-DS1300P5 SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. BOTTOM PLATE
Note : This set can be disassemble according to the following sequence.
2-1. BOTTOM PLATE
(Page 6)
2-2. MAIN BOARD SECTION
(Page 7)
2-5. LED BOARD
(Page 8)
SET
2-4. MAIN BOARD
(Page 8) 2-3. DISASSMBLY AND ASSEMBLY
OF ORNAMENTAL PLATE
(Page 7)
3 bottom plate
4 insulating sheet
1 five screws
(+P 3 x 6)
2 three screws
(+P 3 x 6)

7
XM-DS1300P5
2-3. DISASSEMBLY AND ASSEMBLY OF ORNAMENTAL PLATE
2-2. MAIN BOARD SECTION
heat sink (main)
7 CNT2
6 MAIN board section
3 three screws
(+BTP 3 x 14)
4 three screws
(+BTP 3 x 14)
5 three screws
(+BTP 3 x 14)
1 screw
(+P 3 x 8)
2 screw
(+P 3 x 6)
heat sink (main)
At disassembly:
At assembly:
ornamental plate
cut
welding
heat sink (main)
ornamental plate

8
XM-DS1300P5
2-4. MAIN BOARD
2-5. LED BOARD
3 panel (front)
4 MAIN board
2 two screws
(+P 3
x 8)
1 screw
(+P 3
x 8)
2 LED board
heat sink (main
)
1 screw
(+P 3 x 6)

99
XM-DS1300P5
3-1. IC BLOCK DIAGRAM
IC6 TL494CN
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
Note:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•%: indicates tolerance.
•2: nonflammable resistor.
SECTION 3
DIAGRAMS
Caution:
Pattern face side: Parts on thepatternfaceside seenfrom the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
OSC
REF 5V
ERROR
ERROR
0.1V
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
NON INV VREF VCC C2 E1 E2 OUT
+IN
-IN
COMP EN
CT
RT
C1
GND
TIME
Note:
The components identi-
fied by mark 0or dotted
linewithmark0are criti-
cal for safety.
Replace only with part
number specified.
Note:
Lescomposantsidentifiéspar
une marque 0sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
•A: B+ Line.
•B: B– Line.
•Total current is measured with no-signal condition.
•Powervoltage is dc 14.4V and fed with regulated dc power
supply from +12V and REM terminals.
•Voltage is dc with respect to ground under no-signal
condition.
•Voltages are taken with aVOM (Inputimpedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
F:AUDIO
for printed wiring boards:
Note:
•X: parts extracted from the component side.
•: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)

10 10
XM-DS1300P5
3-2. PRINTED WIRING BOARDS — MAIN SECTION (1/2) — • Refer to page 9 for Common Note on Printed Wiring Boards.
1
A
B
C
D
E
F
G
H
I
J
23456789101112
MAIN BOARD (SIDE A)
BCE
1-861-420-
11
(11)
BCE
BCE
BCE
ECB
ECB
BCE
ECB
ECB
BCE
8
1
5
4
BCE
BCE
BCE
BCE
BCE
ECB
ECBECBECB
1
814
7
1
4
8
5
1
4
8
5
1
4
8
5
1
4
8
5
1
4
8
5
ECB
BCE BCE
LED BOARD
(SIDE A)
1-861-421-
11
(11)
GR
(POWER)
(PROTECTOR)
POWER/PROTECTOR
R139
R93
R88
RG2
RG1
R95
R94
R92
C44
R90
C33
C10
R89
C37
C32
R71 R86
C34
R91
R140
R83
R58
R81
R54
C35
C31
R77
R67
R68
R78
R75R74
R80
R57 R56
R51 R50
C2 C58 C1
R63
C3
C56
RS2
R20
R27
R143
CF1
R65
R5
RS3
RS5
R15
R16
RS4
R13
MC1
C59
R28
C57
R103
R170
R72
R181
R82
R182
R106
R180
C36
R55 R165
R175R168
R76
R104
R85
R167
R149
R96
THR1
C38
C7
R137
R178
R153
C45R154
R126 R105
R97
R173
R172
R161
R130
R127
C47
R184 R183
R131
R129
R128
R108
C40
C41
R125
R132
R186 R185 R136
R164
R163
R155
R157
R134
R123
RG7
RG8
THR3
R169
R109
R171
R174
R162
R160
R69
R70 C6 R79
C14
C12
R23
R14
R35 R25
R24
R3
C5
C13
R8
C42
R73
R113
R116
R121
R118
R117
RG10
RG9
R122
R114
R115
R112
R111
R110
R119
R66
R64
R29
R19
R12
IC4
C9
C22
R158
R1
R156
C21
R159
R2 R4
RS1
R43
R11 C55
C50 C53
C28
C27
R6
C29
C30
R61R62
R18
C43
C16
C19
RG6
RG5
RG4
RG3
R17
C51
R10
C52
R7
R52
R60
R53 C15
R59
C20
R151 R150
D26
R141
R142
R102
R99
R100
Q44
Q5 Q6
D9
Q46
Q36
Q34
Q10
Q35
D3
Q16
Q45
Q13
Q8
Q9
Q7
Q11
Q40
Q39
D11
Q43 D17
Q42
Q41
Q17
Q14
IC3
IC1
IC5
IC2
IC7
IC8
R166
R138
LED2 LED3
D3 F-6
D9 E-4
D11 G-4
D17 G-6
D26 G-6
IC1 F-3
IC2 F-3
IC3 F-3
IC4 E-2
IC5 G-4
IC7 G-6
IC8 H-6
LED2 F-11
LED3 F-12
Q5 E-4
Q6 E-4
Q7 G-5
Q8 G-5
Q9 G-5
Q10 H-6
Q11 G-6
Q13 E-8
Q14 G-6
Q16 F-6
Q17 H-7
Q34 I-6
Q35 I-7
Q36 H-6
Q39 G-6
Q40 G-6
Q41 H-6
Q42 H-6
Q43 G-6
Q44 F-6
Q45 G-7
Q46 E-2
• Semiconductor
Location (Side A)
Ref. No. Location