Sony MDR-RF875RK User manual

MDR-RF875R
AEP Model
UK Model
SERVICE MANUAL
HEADPHONES
Headphones MDR-RF875R
Transmitter TMR-RF875R
MDR-RF875R is the component model block one in the MDR-RF875RK.
COMPONENT MODEL NAME FOR MDR-RF875RK
SPECIFICATIONS
Headphones
Power source DC 2.4 V: Built-in rechargeable
battery
Mass Approx. 350 g (12.25 oz.) incl.
built-in rechargeable battery
Built-in Ni-MH rechargeable battery
Model name NH-AAC
Voltage 1.2 V
Capacity 1,000 mAh
Design and specifications are subject to change without
notice.
Ver 1.0 2000. 08

— 2 —
SECTION 1
GENERAL This section is extracted
from instruction manual.
5 Turn up the volume to a moderate
level with the VOL control.
Press the TUNING button briefly for
automatic tuning of the headphones.
If you do not receive a clear audio
signal, press it again.
Try the above steps 3 and 5 until the
receiving performance becomes better.
Auto power on/off function
When you remove the headphones from your
head, the power turns off automatically. Do not
allow the self adjusting band to be pulled up,
otherwise the headphones will be switched on.
The power turns on.
Note
If a hissing noise is heard move closer to the transmitter.
TUNING
VOL control
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

— 3 —
SECTION 2
DISASSEMBLY
2-1. DRIVER (R SIDE), RX-BASE BOARD
Note : Follow the disassembly procedure in the numerical order given.
•The equipment can be removed using the following procedure.
Driver (R side), RX-BASE board
Driver (L side), Hanger (L)
Set SW board, Harger (R)
Holder (L)
Holder (R)
Four
claws
RX-BASE board
SW board
SW board
(Housing (R) side)
Housing (R)
Solder the each leads directly to the position as shown
while being cautions of colors.
Set the each leads as illustrated below.
Precaution for installtion
Precaution for installtion
Precaution for installtion
Head band
assy (front)(natural)
Head band
assy (front)(black)
Head band
assy (rear)(green)
Head band
assy (rear)(natural)
Driver (red)
Driver (natural)
Red Natural
From RX-BASE board.
From head
band assy (front).
From head
band assy (rear).
From
SW board.
Driver (R side)
ANT
qa RX-BASE board
0 Remove the
eight solderings.
2 Four screws (M 2 × 5)
1 Ear pad
4 Ear pad holder (R)
3 Front plate (R) assy
6 Driver
8 Charge terminal
9 Volume knob
5 Remove the
two solderings.
7 Remove the
two solderings.
Groove
Groove
Groove
Groove

— 4 —
2-2. SW BOARD, HANGER (R)
2 Housing (R)
5 Holder lid (R)
3 Holder (R)
8 SW board
SW board
3 Hanger lid (R)
9 Hanger (R)
Hanger (R)
1
1
Precaution for installtion
Set the each leads as illustrated below.
7 Remove the
two solderings.
4 Two screw
s
(P 2 × 8)
1 Screw (P 2 × 8)
2 Spring
4 Head cushion assy
6 Shassis
5 Two screws
(P 2
× 8)
7 Head band assy (rear)
8 Head band assy (front)
From head
band assy (front).
From head
band assy (rear).
From
SW board.
Groove
Groove Groove
Groove
Groove
Groove
6
2-3. HOLDER (R)

— 5 —
2-4. DRIVER (L SIDE)

Housing (L)
Set the each leads as illustrated below.
Precaution for installtion
Precaution for installtion
Green Natural
Green
Natural
From head band assy (rear).
From head
band assy (front).
From head
band assy (rear).
Driver (L side)
2 Four screws (M 2 × 5)
1 Ear pad
6 Ear pad
holder (L)
3 Front plate (L) assy
8 Driver
Four
claws
7 Remove the
two solderings.
4 Two nickle
hydrogen batterys
5 Remove the
two solderings.
Groove
Groove

— 6 —
2-5. HANGER (L)
2-6. HOLDER (L)
2 Housing (L)
5 Holder lid (L)
2 Holder (L)
3 Hanger lid (L)
7 Hanger (L)
Hanger (L)
1

1
Precaution for installtion
Set the each leads as illustrated below.
4 Two screws
(M 2
× 5)
1 Screw (M 2 × 5)
3 Head cushion assy
5 Shassis
4 Two screws
(M 1.7 × 3)
7 Head band
assy (rear)
6 Head band assy (front)
From head
band assy (front).
From head
band assy (rear).
Groove
Groove
Groove
6

— 7 —
SECTION 3
ELECTRICAL ADJUSTMENTS
Notes:
1. Use a transmitter to which check and adjustment are already
completed.
2. On adjusting the headphones section, use the transmitter as a jig.
Headphones:MDR-RF875R
Transmitter:TMR-RF875R
Procedure:
1. Connect an oscillator with attenuator and terminator (600 Ω)
to the transmitter AUDIO IN-A connector (J402).
2. Connect anACadapter tothetransmitterDCIN9Vjack (J404).
3. Short between Q303 collector and GND on the RX board.
4. Connect DC 2.4V to the +B power line externally.
5. Connect lead wires to IC301 pin 4, pin 6, pin 7, IC 307 pin 7,
IC 308 pin 7 and GND on the RX-BASE board.
6. Connect a 33KΩ resistor between IC301 pin 4 and pin 7.
7. Connect lead wires to the speakers’ terminals (L+,L-,R+,R-)
on the RX-BASE board. (See page 9)
3-1. Free Run Frequency Check and Adjustment
1. Set the transmitterAUDIO IN-A connector (J402) to no signal.
Note: In this case, operation time is about 4 or 5 minutes.
2. Check the transmitter power indicator (red) lights.
3. Set the transmitter CHANNEL switch to 1.
4. Connect DC 1.2V across TP and GND.
5. Connect a frequency counter to IC301 pin 4 and GND on the
RX-BASE board.
6. Adjust the value of the frequency counter to specification by
RV301 on the RX-BASE board.
Specified values: 76kHz ± 50Hz.
Setting :
3-2. Receive Frequency Check and Adjustment
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A (L-ch) connector only.
4. Keep distance between transmitterand headphones to 5 meters over.
5. Set the headphones volume (RV302) to minimum.
6. Connect DC 1.2V across TP and GND.
7. Connect an oscilloscope CH1 and CH2 to IC301 pin 6 and pin 4.
8. Check the waveform of the oscilloscopeto CH1 is demodulated
1kHz signal and CH2 is GND.
9. If CH1 andCH2 are not satisfied in step8, adjust the coil (L301)
on the RX board to satisfied step 8.
10. Open between Q303 corrector and GND on the RX board.
11. When the transmitter off, check the waveform of the
oscilloscope as follows:
12. Set the transmitter CHANNEL switch to 1.
13. Push the headphones tuning switch (S301) to receive radio
frequency.
14. Check same step 8.
15. Set the transmitter CHANNEL switch to 3.
16. Push the headphones tuning switch (S301) to receive radio
frequency.
17. Check same step 8.
0.6V
2–3 sec
1.8V
GND
+
–
Requlated power supply
(DC 1.2V) Frequency counter
TP
+
–
IC301 pin
4
3-3. Carrier Modulation Check
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A (L-ch) connector only.
4. Set the headphones volume (RV302) to minimum.
5. Connect an oscilloscope CH1 and CH2 to IC301 pin 6 and pin 4.
6. Push the headphones tuning switch (S301) to receive radio
frequency.
7. Check the waveform of the oscilloscope that the CH1 is
demodulated 1kHz signal and CH2 is GND.
8. Connect anAC voltmeter with LPF to IC301 pin 6 and GND.
9. Check the value of the AC voltmeter to 40mVrms ± 5mV
Setting :
3-4. Expander Output Check
1. Set the transmitter CHANNEL switch to 2.
2. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A L and R connector.
3. Connect anAC voltmeter to IC307 pin 7 and IC308 pin 7.
4. Measure the value of the AC voltmeter.
5. Input a signal of 1kHz, 31.6mVrms to transmitter AUDIO IN-
A L and R connector.
6. Measure the value of the AC voltmeter.
7. Check the difference of the step 4 and step 6 to more than 20
dB ± 3 dB.
Setting :
3-5. Separation Check
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A (L-ch) connector only.
4. Connect an oscilloscope CH1 to speakers terminal (L+,L-) and
CH2 to IC301 pin 4 and GND.
5. Push the headphones tuning switch (S301) to receive radio
frequency.
6. Check the waveform of the oscilloscope that the CH1 is
demodulated 1kHz signal and CH2 is GND.
7. Connect an AC voltmeter with LPF to speakers terminal (L+,L-).
8. Adjust the value of the AC voltmeter to specification by
headphones volume RV302.
Specified values: 155mVrms
9. Connect anAC voltmeter with LPF to speakers terminal (R+,R-).
10. Measure the value of theAC voltmeter.
11. Check the difference of the L and R to more than 25dB.
12. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A (R-ch) connector only.
+
–
Requlated power supply
(DC 1.2V)
TP
+
–+ –
IC301 pin6 IC301 pin
4
OSCILLOSCPE
CH1 CH2
+
–
Digital voltmeter
(AC range)
IC301 pin6 +
–+ –
IC301 pin6 IC301 pin4
OSCILLOSCPE
CH1 CH2
+
–
Digital voltmeter
(AC range)
IC307 pin
7
IC308 pin
7
Setting :

— 8 —
13. Connect anAC voltmeter with LPF to speakers terminal (R+,R-).
14. Adjust the value of the AC voltmeter to specification by
headphones volume RV302.
Specified values: 155mVrms
15. Connect an AC voltmeter with LPF to speakers terminal (L+,L-).
16. Measure the value of the AC voltmeter.
17. Check the difference of the L and R to more than 25dB.
18. Remove a 33KΩ resistor between IC301 pin 4 and pin7.
Setting :
3-6. MPX Signal Modulation Check
1. Set the transmitter CHANNEL switch to 2.
2. Set the transmitter NOISE FILTER switch to OFF.
3. Input a signal of 1kHz, 316mVrms to transmitter AUDIO IN-
A (L-ch) connector only.
4. Connect an oscilloscope CH1 to speakers terminal (L+,L-) and
CH2 to IC301 pin 4 and GND.
5. Push the headphones tuning switch (S301) to receive radio
frequency.
6. Check the waveform of the oscilloscope that the CH1 is
demodulated 1kHz signal and CH2 is GND.
7. Set the headphones volume (RV302) to max.
8. Connect an AC voltmeter with LPF to speakers terminal (L+,L-).
9. Check the value of theAC voltmeter to specification.
Specified values: 450mVrms to 650mVrms
Note: When the specification is not satisfied in step 9, adjust
RV402 of the TMR-RF875R until the specification of 450
to 650mVrms is obtained.
Setting :
Adjustment Location : (See page 9)
+
–
Digital voltmeter
(AC range)
L+ / R+
L– / R–
+
–+ –
L+ IC301 pin
4
OSCILLOSCPE
L–
CH1 CH2
+
–
Digital voltmeter
(AC range)
L+
L–
+
–+ –
L+ IC301 pin
4
OSCILLOSCPE
L–
CH1 CH2

— 9 —
IC301 7
IC301 4
IC301 6
GND
Short
L–
L+
R–
R+
GND
TP
L301
Receive Frequency
Check and Adjustment
RV302
Corrier Modulation/Separation/
MPX Signal Modulation Check
+B
power line
RV301
Free Run Frequency
Check and Adjustment
(Connect a 33 K Ω resistor)
Adjustment Location :
[RX-BASE BOARD]
(Conductor side)

— 10 —
SECTION 4
DIAGRAMS
• IC BLOCK DIAGRAMS
IC302 LA4533M IC305 TC7W74FU
POWER
SWITCH
MUTE
CIRCIUT
BIAS
1
2
3
4
56
7
8
9
10 MT/SW
OUT1
POWER GND
OUT2
VCC
P/SW
IN1
PRE GND
IN2
REF
AMP2
AMP1
6
CLR
7
PR
8
VCC
5
Q
RSQ
3
Q
2
D
4
GND
1
CK
QDC
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF:µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise specified.
•¢: internal component.
•A: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 2.4V and fed with regulated dc power supply
from battery terminal.
• Voltages are dc with respect to ground under no-signal conditions.
• Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
F:FM
L: AUDIO
Note on PrintedWiring Board:
•X: parts extracted from the component side.
•®:Through hole.
•b: Pattern from the side which enables seeing.
Caution:
Pattern face side: Partsonthepattern faceside seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.

MDR-RF875R
4-1. BLOCK DIAGRAM
— 11 — — 12 —
L301
RECEIVE
FREQ.
D301
+V +V
FRONT END
FE UNIT 18 1316 FM IF/
DISCRI
DECODE
AMP
DETUNE
MUTE
TUNING
IND
STEREO
IND
CF301
26
CF302
10.7MHz
6 2
10
9
5R-CH
R-CH
RV302
VOLUME
SPEAKER
L-CH
SPEAKER
R-CH
POWER AMP
IC302
MUTE
Q304
22
20
FM FE
L302
+V
D/A
CONV
IC303
DETECT
IC304
HPF
Q306
LPF EQ
IC309 IC306
EXPANDER
AMP
IC307
FF
IC305
OSC
Q301
SWITCH
Q303
10
12
27
S301
TUNING
Q305
DQ
Q
AUTO
BLEND
MUTE MONO/ST
SW
1/2
COUNTER
PD1
PD1
VCO
21
REG
RV301
FREE RUN
FREQ.
IF AMP/DECODE
IC301
D304
S1
ON/OFF SW
+
-
B+
• Signal path.
• R-ch is omitted due to same as L-ch.
: FM
16
(POWER)

MDR-RF875R
4-2. SCHEMATIC DIAGRAM
— 13 — — 14 —
• See page 10 for Note on Schematic Diagrams.
• See page 10 for IC Block Diagrams.

MDR-RF875R
4-3. PRINTEDWIRING BOARD
— 15 — — 16 —
Ref. No. Location
D301 B-1
D303 B-3
D304 B-2
D310 C-2
IC301 A-2
IC302 C-2
IC303 A-1
IC304 B-3
IC305 B-2
IC306 C-5
IC307 C-6
IC308 B-6
IC309 B-5
Q301 B-3
Q303 B-2
Q304 B-2
Q305 B-2
Q306 A-5
Q307 B-5
• Semiconductor
Location
1234567
RX SW board
(power)
C
VOL
TUNE
• See page 10 for Note on Printed Wiring Board.

— 17 — — 18 —
SECTION 5
EXPLODED VIEWS
NOTE:
• -XX, -X mean standardized parts, so they may
have some differences from the original one.
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delayshould be anticipated when ordering these
items.
• Themechanical parts with noreference number
in the exploded views are not supplied.
• Accessories and packing materials are given in
the last of this parts list.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
SECTION 6
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specifiedin the diagrams or the components
used on the set.
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS:
uF: µF
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• COILS
uH: µH
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference number,
please include the board name.
RX-BASE
1
2
3
36
4
14
15
#1
#1
#3
#2
#1
#1
#2
#3
#3
#3
#3
#3
#3
#3
d
b
a
c
d
c
b
e
e
a
14
20
6
5
24
25
34
32
28
35
31
7
26
27
6
4
33
30
12
11
13
21
22
10 37
38
39
40
37
41
17
9
18
19
16
8
23
29
not
supplied
not
supplied
1 X-3379-300-1 BAND ASSY (REAR), HEAD
2 X-3379-299-1 BAND ASSY (FRONT), HEAD
3 X-3379-301-1 CUSHION ASSY, HEAD
4 3-046-718-01 PAD,EAR
5 X-3379-304-1 PLATE (L) ASSY, FRONT
6 1-542-416-11 DRIVER (030F031)
7 3-046-723-01 HOLDER (L), EAR PAD
8 1-756-109-11 BATTERY, NICKEL HYDROGEN
9 3-046-717-01 TERMINAL (SMALL), BATTERY
10 3-224-570-01 FILM (L), HOLOGRAM
11 3-046-709-01 CAP(L), ORNAMENTAL
12 3-046-716-01 TERMINAL (LARGE), BATTERY
13 3-046-696-01 HOLDER (L)
14 3-046-695-01 CHASSIS
15 3-046-698-01 LID (L), HOLDER
16 3-220-123-01 PLATE (L), HOUSING ORNAMENTAL
17 3-046-707-01 HOUSING (L)
18 3-049-953-01 LID(L), HANGER
19 3-046-705-01 HANGER (L)
20 3-046-699-01 LID(R), HOLDER
*21 1-678-685-11 RX-SW BOARD
22 3-046-697-01 HOLDER (R)
23 3-046-706-01 HANGER (R)
24 3-049-954-01 LID(R), HANGER
25 3-046-708-01 HOUSING (R)
26 3-046-710-01 CAP (R), ORNAMENTAL
27 3-224-571-01 FILM (R), HOLOGRAM
*28 A-4542-639-A RX-BASE BOARD, COMPLETE
29 3-049-797-01 LIGHT, MDR GUIDE
30 3-046-713-01 BUTTON, TUNING
31 3-220-124-01 PLATE (R), HOUSING ORNAMENTAL
32 3-046-715-01 TERMINAL, CHARGE
33 3-049-951-01 KNOB, VOLUME
34 3-046-724-01 HOLDER (R), EAR PAD
35 X-3379-305-1 PLATE (R) ASSY, FRONT
36 3-224-569-01 SPRING (ON/OFF)
37 3-223-909-01 SCREW (B2)
38 3-224-572-01 SHEET, HOLOGRAM (L), ADHESIVE
39 3-224-688-01 SHEET (L), LIGHT PREVENTION
40 3-224-689-01 SHEET (R), LIGHT PREVENTION
41 3-224-573-01 SHEET, HOLOGRAM (R) ADHESIVE
#1 7-621-255-15 SCREW +P 2X3
#2 7-685-103-14 SCREW +P 2X5 TYPE2 NON-SLIT
#3 7-685-104-14 SCREW +P 2X6 TYPE2 NON-SLIT
*A-4542-639-A RX-BASE BOARD, COMPLETE
***********************
*A-4542-642-A FE UNIT (FRONT END)
< CAPACITOR >
C301 1-164-346-11 CERAMIC CHIP 1uF 16V
C302 1-164-005-11 CERAMIC CHIP 0.47uF 25V
C303 1-124-259-11 ELECT 4.7uF 20.00% 16V
C304 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C305 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C306 1-124-234-00 ELECT 22uF 20% 16V
C307 1-163-059-91 CERAMIC CHIP 0.01uF 10.00% 50V
C308 1-124-234-00 ELECT 22uF 20% 16V
C309 1-104-942-11 ELECT 1uF 20.00% 50V
C310 1-104-942-11 ELECT 1uF 20.00% 50V
C311 1-124-233-11 ELECT 10uF 20.00% 16V
C312 1-126-162-11 ELECT 3.3uF 20% 50V
C313 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C314 1-164-441-11 CERAMIC CHIP 68PF 5.00% 50V
C315 1-163-235-11 CERAMIC CHIP 22PF 5.00% 50V
C316 1-124-233-11 ELECT 10uF 20.00% 16V
C317 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C318 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C319 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C320 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C321 1-164-346-11 CERAMIC CHIP 1uF 16V
C322 1-164-346-11 CERAMIC CHIP 1uF 16V
C323 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C324 1-124-635-00 ELECT 220uF 20.00% 6.3V
C325 1-124-635-00 ELECT 220uF 20.00% 6.3V
C326 1-124-635-00 ELECT 220uF 20.00% 6.3V
C327 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C328 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C329 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C330 1-124-242-00 ELECT 33uF 20% 25V
C331 1-164-346-11 CERAMIC CHIP 1uF 16V
C332 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C333 1-163-220-11 CERAMIC CHIP 3PF 0.25PF 50V
C336 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C337 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C340 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C341 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C342 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C343 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C344 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C345 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C346 1-164-489-11 CERAMIC CHIP 0.22uF 10.00% 16V
C347 1-124-589-11 ELECT 47uF 20% 16V
C352 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C353 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C354 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C355 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C356 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C357 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C359 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C361 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C362 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C363 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C370 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C371 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C372 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C373 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C374 1-163-259-91 CERAMIC CHIP 220PF 5.00% 50V
C375 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C376 1-163-259-91 CERAMIC CHIP 220PF 5.00% 50V
C377 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C378 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C379 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C380 1-124-259-11 ELECT 4.7uF 20.00% 16V
C381 1-124-259-11 ELECT 4.7uF 20.00% 16V
C382 1-164-346-11 CERAMIC CHIP 1uF 16V
C383 1-164-346-11 CERAMIC CHIP 1uF 16V
C384 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C385 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C386 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C387 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C388 1-163-255-11 CERAMIC CHIP 150PF 5.00% 50V
C389 1-163-255-11 CERAMIC CHIP 150PF 5.00% 50V
C391 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C392 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C393 1-124-233-11 ELECT 10uF 20.00% 16V
C394 1-124-233-11 ELECT 10uF 20.00% 16V
C395 1-164-346-11 CERAMIC CHIP 1uF 16V
C396 1-164-346-11 CERAMIC CHIP 1uF 16V
C397 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C398 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C399 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C400 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C402 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C403 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C404 1-164-346-11 CERAMIC CHIP 1uF 16V

— 18 —
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
SECTION 6
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts
specifiedin the diagrams or the components
used on the set.
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
• CAPACITORS:
uF: µF
• RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
• COILS
uH: µH
• SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
When indicating parts by reference number,
please include the board name.
RX-BASE
*A-4542-639-A RX-BASE BOARD, COMPLETE
***********************
*A-4542-642-A FE UNIT (FRONT END)
< CAPACITOR >
C301 1-164-346-11 CERAMIC CHIP 1uF 16V
C302 1-164-005-11 CERAMIC CHIP 0.47uF 25V
C303 1-124-259-11 ELECT 4.7uF 20.00% 16V
C304 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C305 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C306 1-124-234-00 ELECT 22uF 20% 16V
C307 1-163-059-91 CERAMIC CHIP 0.01uF 10.00% 50V
C308 1-124-234-00 ELECT 22uF 20% 16V
C309 1-104-942-11 ELECT 1uF 20.00% 50V
C310 1-104-942-11 ELECT 1uF 20.00% 50V
C311 1-124-233-11 ELECT 10uF 20.00% 16V
C312 1-126-162-11 ELECT 3.3uF 20% 50V
C313 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C314 1-164-441-11 CERAMIC CHIP 68PF 5.00% 50V
C315 1-163-235-11 CERAMIC CHIP 22PF 5.00% 50V
C316 1-124-233-11 ELECT 10uF 20.00% 16V
C317 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C318 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C319 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C320 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C321 1-164-346-11 CERAMIC CHIP 1uF 16V
C322 1-164-346-11 CERAMIC CHIP 1uF 16V
C323 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C324 1-124-635-00 ELECT 220uF 20.00% 6.3V
C325 1-124-635-00 ELECT 220uF 20.00% 6.3V
C326 1-124-635-00 ELECT 220uF 20.00% 6.3V
C327 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C328 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C329 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C330 1-124-242-00 ELECT 33uF 20% 25V
C331 1-164-346-11 CERAMIC CHIP 1uF 16V
C332 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C333 1-163-220-11 CERAMIC CHIP 3PF 0.25PF 50V
C336 1-163-245-11 CERAMIC CHIP 56PF 5.00% 50V
C337 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C340 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C341 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C342 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C343 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C344 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C345 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C346 1-164-489-11 CERAMIC CHIP 0.22uF 10.00% 16V
C347 1-124-589-11 ELECT 47uF 20% 16V
C352 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C353 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C354 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C355 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C356 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C357 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C359 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C361 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C362 1-163-251-11 CERAMIC CHIP 100PF 5.00% 50V
C363 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C370 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C371 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C372 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C373 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C374 1-163-259-91 CERAMIC CHIP 220PF 5.00% 50V
C375 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C376 1-163-259-91 CERAMIC CHIP 220PF 5.00% 50V
C377 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C378 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C379 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C380 1-124-259-11 ELECT 4.7uF 20.00% 16V
C381 1-124-259-11 ELECT 4.7uF 20.00% 16V
C382 1-164-346-11 CERAMIC CHIP 1uF 16V
C383 1-164-346-11 CERAMIC CHIP 1uF 16V
C384 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C385 1-164-161-11 CERAMIC CHIP 0.0022uF 10% 100V
C386 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C387 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C388 1-163-255-11 CERAMIC CHIP 150PF 5.00% 50V
C389 1-163-255-11 CERAMIC CHIP 150PF 5.00% 50V
C391 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C392 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C393 1-124-233-11 ELECT 10uF 20.00% 16V
C394 1-124-233-11 ELECT 10uF 20.00% 16V
C395 1-164-346-11 CERAMIC CHIP 1uF 16V
C396 1-164-346-11 CERAMIC CHIP 1uF 16V
C397 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C398 1-164-505-11 CERAMIC CHIP 2.2uF 16V
C399 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V
C400 1-163-038-11 CERAMIC CHIP 0.1uF 25V
C402 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C403 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
C404 1-164-346-11 CERAMIC CHIP 1uF 16V

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
— 19 —
RX-BASE
< FILTER >
CF301 1-577-588-11 FILTER, CERAMIC 10.7MHz
CF302 1-577-572-11 FILTER, CERAMIC 10.7MHz
< DIODE >
D301 8-719-002-81 DIODE 1T363
D303 8-719-056-71 DIODE UDZ-TE-17-2.2B
D304 8-719-077-16 LED TLSU124(TPJ52)(power)
D310 8-719-975-40 DIODE RB411D
< IC >
IC301 8-752-072-12 IC CXA1538N
IC302 8-759-802-75 IC LA4533M
IC303 8-759-453-43 IC TC74HC4024AF(EL)
IC304 8-759-510-73 IC BA10393F-E2
IC305 8-759-083-94 IC TC7W74FU
IC306 8-759-344-00 IC NJM2100E(TE2)
IC307 8-759-384-90 IC TK10691M
IC308 8-759-384-90 IC TK10691M
IC309 8-759-344-00 IC NJM2100E(TE2)
< JUMPER >
JC303 1-216-295-11 SHORT 0
JC304 1-216-295-11 SHORT 0
JC306 1-216-295-11 SHORT 0
JC309 1-216-295-11 SHORT 0
JC311 1-216-295-11 SHORT 0
< COIL >
L301 1-422-317-31 COIL, AIR-CORE
L302 1-412-933-11 INDUCTOR 0.33uH
L304 1-414-234-11 INDUCTOR CHIP 0uH
L305 1-414-234-11 INDUCTOR CHIP 0uH
L306 1-414-234-11 INDUCTOR CHIP 0uH
L307 1-414-234-11 INDUCTOR CHIP 0uH
L308 1-414-234-11 INDUCTOR CHIP 0uH
L309 1-414-234-11 INDUCTOR CHIP 0uH
L350 1-414-234-11 INDUCTOR CHIP 0uH
< TRANSISTOR >
Q301 8-729-903-10 TRANSISTOR FMW1
Q303 8-729-200-72 TRANSISTOR 2SC2712-L
Q304 8-729-200-72 TRANSISTOR 2SC2712-L
Q305 8-729-027-44 TRANSISTOR DTC114TKA-T146
Q306 8-729-200-72 TRANSISTOR 2SC2712L-TE85L
Q307 8-729-200-72 TRANSISTOR 2SC2712L-TE85L
< RESISTOR >
R302 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R304 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R305 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R308 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R309 1-216-097-11 RES-CHIP 100K 5% 1/10W
R310 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R312 1-216-077-00 RES-CHIP 15K 5% 1/10W
R314 1-216-097-11 RES-CHIP 100K 5% 1/10W
R315 1-216-001-00 METAL CHIP 10 5% 1/10W
R316 1-216-001-00 METAL CHIP 10 5% 1/10W
R318 1-216-089-11 RES-CHIP 47K 5% 1/10W
R320 1-216-001-00 METAL CHIP 10 5% 1/10W
R321 1-216-053-00 METAL CHIP 1.5K 5% 1/10W
R322 1-216-069-00 METAL CHIP 6.8K 5% 1/10W
R325 1-216-037-00 METAL CHIP 330 5% 1/10W
R330 1-216-001-00 METAL CHIP 10 5% 1/10W
R331 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R332 1-216-049-11 RES-CHIP 1K 5% 1/10W
R333 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R334 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R340 1-216-065-91 RES-CHIP 4.7K 5% 1/10W
R341 1-216-113-00 METAL CHIP 470K 5% 1/10W
R342 1-216-106-00 METAL CHIP 240K 5% 1/10W
R343 1-216-099-00 METAL CHIP 120K 5% 1/10W
R344 1-216-092-00 RES-CHIP 62K 5% 1/10W
R345 1-216-084-00 METAL CHIP 30K 5% 1/10W
R346 1-216-077-00 RES-CHIP 15K 5% 1/10W
R347 1-216-070-00 METAL CHIP 7.5K 5% 1/10W
R348 1-216-089-11 RES-CHIP 47K 5% 1/10W
R349 1-216-073-00 METAL CHIP 10K 5% 1/10W
R350 1-216-077-00 RES-CHIP 15K 5% 1/10W
R351 1-216-121-11 RES-CHIP 1M 5% 1/10W
R352 1-216-121-11 RES-CHIP 1M 5% 1/10W
R353 1-216-077-00 RES-CHIP 15K 5% 1/10W
R354 1-216-081-00 METAL CHIP 22K 5% 1/10W
R355 1-216-089-11 RES-CHIP 47K 5% 1/10W
R356 1-216-081-00 METAL CHIP 22K 5% 1/10W
R357 1-216-081-00 METAL CHIP 22K 5% 1/10W
R358 1-216-081-00 METAL CHIP 22K 5% 1/10W
R360 1-216-081-00 METAL CHIP 22K 5% 1/10W
R361 1-216-081-00 METAL CHIP 22K 5% 1/10W
R362 1-216-073-00 METAL CHIP 10K 5% 1/10W
R363 1-216-081-00 METAL CHIP 22K 5% 1/10W
R364 1-216-081-00 METAL CHIP 22K 5% 1/10W
R366 1-216-029-00 METAL CHIP 150 5% 1/10W
R367 1-216-089-11 RES-CHIP 47K 5% 1/10W
R370 1-216-071-00 METAL CHIP 8.2K 5% 1/10W
R371 1-216-071-00 METAL CHIP 8.2K 5% 1/10W
R372 1-216-071-00 METAL CHIP 8.2K 5% 1/10W
R373 1-216-071-00 METAL CHIP 8.2K 5% 1/10W
R374 1-216-064-00 METAL CHIP 4.3K 5% 1/10W
R375 1-216-064-00 METAL CHIP 4.3K 5% 1/10W
R376 1-216-097-11 RES-CHIP 100K 5% 1/10W
R377 1-216-097-11 RES-CHIP 100K 5% 1/10W
R378 1-216-063-91 RES-CHIP 3.9K 5% 1/10W
R379 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R380 1-216-049-11 RES-CHIP 1K 5% 1/10W
R381 1-216-049-11 RES-CHIP 1K 5% 1/10W
R382 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R383 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R384 1-216-067-00 METAL CHIP 5.6K 5% 1/10W
R385 1-216-067-00 METAL CHIP 5.6K 5% 1/10W
R386 1-216-065-91 RES-CHIP 4.7K 5% 1/10W
R387 1-216-065-91 RES-CHIP 4.7K 5% 1/10W
R390 1-216-097-11 RES-CHIP 100K 5% 1/10W

Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
— 20 —
R391 1-216-097-11 RES-CHIP 100K 5% 1/10W
R392 1-216-063-91 RES-CHIP 3.9K 5% 1/10W
R393 1-216-057-00 METAL CHIP 2.2K 5% 1/10W
R394 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R395 1-216-061-00 METAL CHIP 3.3K 5% 1/10W
R396 1-216-083-00 METAL CHIP 27K 5% 1/10W
R397 1-216-083-00 METAL CHIP 27K 5% 1/10W
R398 1-216-073-00 METAL CHIP 10K 5% 1/10W
R399 1-216-073-00 METAL CHIP 10K 5% 1/10W
R400 1-216-025-11 RES-CHIP 100 5% 1/10W
R401 1-216-025-11 RES-CHIP 100 5% 1/10W
R403 1-216-073-00 METAL CHIP 10K 5% 1/10W
R404 1-216-073-00 METAL CHIP 10K 5% 1/10W
< VARIABLE RESISTOR >
RV301 1-241-763-11 RES, ADJ, CARBON 4.7K
RV302 1-227-189-11 RES, VAR CARBON 20K/20K (VOL )
< SWITCH >
S301 1-771-980-11 SWITCH, TACTILE (TUNE)
**************************************************************
MISCELLANEOUS
**************
6 1-542-416-11 DRIVER (030F031)
8 1-756-109-11 BATTERY, NICKEL HYDROGEN
*21 1-678-658-11 RX-SW BOARD
RX-BASE
MDR-RF875R
Sony Corporation
Audio Entertainment Group 2000H1646-1
Printed in Japan © 2000.8
Published by PE General Engineering Dept.
9-927-967-11