Sony MD Walkman MZ-E55 User manual

Ver 1.0 1998.10
MICROFILM
MZ-E55
SERVICE MANUAL
PORTABLE MINIDISC PLAYER
SPECIFICATIONS
E Model
Tourist Model
Model Name Using Similar Mechanism NEW
MD Mechanism Type MT-MZE55-150
Optical Pick-up Mechanism Type ODX-1A/1B
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation
MD Section
Audio playing system
Minidisc digital audio system
Laser diode properties
Material : GaAlAs
Wavelength : λ=790nm
Emission duration : continuous
Laser output : less than 44.6 µW*
* This output is the value measured at a distance of 200 mm from the
objective lens surface on the optical pick-up block with 7mm aperture.
Revolutions
400 rpm to 900 rpm (CLV)
Error correction
Advanced Cross Interleave Reed Solomon Code (ACIRC)
Sampling frequency
44.1kHz
Coding
Adaptive Transform Acoustic Coding (ATRAC)
Modulation system
EFM (Eight to Fourteen Modulation)
Number of channels
2 stereo channels
1 monaural channel
Frequency response
20 to 20,000 Hz ± 3 dB
Wow and Flutter
Below measurable limit
Outputs
Headphones : stereo mini-jack, maximum output level 5mW+5mW,
load impedance 16 ohm
General
Power requirements
Rechageable battery (supplied)
Nickel metal hydride rechargeable battery NH-9WM (N)
One LR6 (size AA) alkaline battery (not supplied)
Sony AC Power Adaptor (not supplied) connected at the DC IN
1.5V jack
Battery operation time
Batteries Playback
Nickel metal hydride Approx.
Rechargeable battery (NH-9WM (N)) 7.5 hours
One LR6 (size AA) Approx.
Sony alkaline dry batteries 10 hours
Nickel metal hydride (NH-9WM (N)) + Approx.
One LR6 (size AA) 20 hours
Dimensions
Approx. 79.7 x 14.9 x 71.9 mm (w/h/d)
(3 1/4x 19/32 x 2 7/8in) not including projecting parts and controls
Mass Approx. 80 g (2.9 oz.) the player only
Approx. 120 g (4.3 oz.) incl. a premastered MD and a nickel
metal hydride rechargeable battery NH-9WM (N)
Supplied accessories
Battery charger (1)
Rechargeable battery (1)
Rechargeable battery carrying case (1)
Headphones with a remote control (1)
Dry battery case (1)
Carrying pouch (1)
Plug adaptor (1) (Tourist model)
Design and specifications are subject to change without notice.

– 2 –
Specifications ............................................................................ 1
1. SERVICING NOTE...................................................... 2
2. GENERAL
Location and Function of Controls .................................... 3
3. DISASSEMBLY
3-1. Upper Panel Assy ....................................................... 4
3-2. Mechanism Deck Section ........................................... 4
3-3. Main board, Audio board ............................................ 5
3-4. Switch board ............................................................... 5
3-5. Optial Pick-up Block Assy ......................................... 6
4. TEST MODE................................................................... 7
SAFETY-RELATED COMPONENTWARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINEWITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICALTO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
IN NO EVENT SHALL SELLER BE
LIABLE FOR ANY DIRECT,
INCIDENTAL OR CONSEQUENTIAL
DAMAGES OF ANY NATURE, OR
LOSSES OR EXPENSES RESULTING
FROM ANY DEFECTIVE PRODUCT
OR THE USE OFANY PRODUCT.
“MD WALKMAN” is a trademark of Sony
Corporation.
This Mini Disc player is classi-
fied as a CLASS 1 LASER
product.
The CLASS 1 LASER
PRODUCT label is located on
the bottom exterior.
5. ELECTRICAL ADJUSTMENTS............................ 11
6. DIAGRAMS
6-1. Explanation of IC Terminals ..................................... 13
6-2. Block Diagram.......................................................... 15
6-3. Printed Wiring Boards .............................................. 18
6-4. Schematic Diagram................................................... 21
7. EXPLODED VIEWS
7-1. Main Section............................................................. 29
7-2. Mechanism Deck Section ......................................... 30
8. ELECTRICAL PARTS LIST ................................31
SECTION 1
SERVICING NOTE
When repairing this device with the power on, if you remove the main board, this device stops working.
In this case, you work without the device stopping by fastening the hook of the Open/Close detection switch (S801).
Open/Close detection switch (S801)
Mechanism deck section

– 3 –
SECTION 2
GENERAL
LOCATION AND FUNCTION OF CONTROLS
Headphones with Remote Control
Main Unit
1OPERA TElamp
2HOLDswitch
3DIGITALMEGA BASSs witc h
4AVLSs witc h
5Batterycompartment
6VOLUME+/–b uttons
7MDoperateb uttons
+”( FF • PLA Y )
=(REW)
p(STOP)
8Externalbatteryterminal(+/–)
9OPENknob
!º2/REMOTEjac k
1Headphones
2MDoperateswitchandbuttons
”• +(PLAY • FF)
=(REW)
p(STOP)
3VOL+/–button
4Displa ywindo w
5DISPLAYbutton
6PLAYMODEbutton
7P(PAUSE)b utton
8HOLD cswitch
9p(STOP)b utton
2
7
3
1
6
4
!º
9
5
8
1
2
3
4
56 8
9
7

– 4 –
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-1. UPPER PANEL ASSY
rThe equipment can be removed using the following procedure.
3-2. MECHANISM DECK SECTION
set Main board, Audio board Switch board
Mechanism deck section
Optical pick-up block ASSY
Upper panel ASSY
4 Screw (M1.4) step
5 Screws (M1.4) precision pan
3
7
1
2
6
OPEN knob
Upper panel ASSY
Lid, Battery case
Main unit
1 Screws (M1.4) precision pan
3 CLV flexible board
4 Flexible
board
Main unit
Main board
Slider ASSY, Open
Mechanism deck section
2
5

– 5 –
3-4. SWITCH BOARD
3-3. MAIN BOARD, AUDIO BOARD
5 Screws (M1.4) precision pa
n
6
7
8
1
2
3
Main board
* Audio board
Case, Battery
Panel, Buttom
Plate (R) ASSY, Fulcrum
Lid, Battery case
Terminal (plus) ASSY, Battery
4 Screws (M1.4) step
Claw
2
3
Main board
Switch board
Switch flexible board
* Label, Caution
Case, Battery
1 Screw
*NOTE :
When removing the audio board, lift up on the board so that the
connector separates vertically.
*NOTE :
The caution label (4-213-092-01) affixed to the switch-flexible
board will be damaged or deformed when the switch board or the
switch-flexible board is removed so replace it with a new caution
label.

– 6 –
3-5. OPTICAL PICK-UP BLOCK ASSY
1
45
3
Optical pick-up block ASSY
Chassis ASSY
Double sided adhesive tape
Shaft (Main)
Flexible board
Flexible board
2 Screw (M1.4) precision pan

– 7 –
SECTION 4
TEST MODE
Outline
• In this set, overall adjustment mode is made available by enter-
ing test mode to perform automatic adjustment of CD and MO.
In the overall adjustment mode, the disc is determined whether
it is CD or MO and adjustments are performed in sequence. If a
fault is found, the location of the fault is displayed.Also, in servo
mode, each adjustment can be automatically made.
• Operation in the test mode is performed with the Remote Com-
mander. A key having no particular description in the text, indi-
cates a Remote Commander key.
Setting theTest Mode
To enter the test mode, two methods are available :
1. Entering method with key input.
Turn on the HOLD switch on the set. While holding down the p
key on the set, press the following remote commander keys in
the following order :
+n+n=n=n+n=n+n
=nPnP
2. Entering method by shorting the test point
Solder bridge the test point TAP801 (TEST) on the main board
(connect IC801 pin #™ to GND), and turn on the POWER.
[MAIN BOARD] (Conductor side)
Releasing theTest Mode
1. When testmodewasenteredwithkeyinput, turn offthePOWER.
2. When test mode was entered by shorting the test point, turn off
the POWER and open the solder bridge of TAP801 (TEST
MODE) on the main board.
Operation of Setting onTest Mode
When the test mode is set, the LCD displays the following :
• The cycle - the above ROM version display nAll lit nAll off
- is repeated.
(The ROM version is constantly displayed.)
• When the PLAY MODE key is pressed and hold down, the dis-
play at that time is held so that display can be checked.
Configuration ofTest Mode
The test mode has the configuration given below.
Servo Mode
• Set the test mode, press the VOLUME – key and use the ”key
to set the servo mode.
• When the servo mode is set, use the +key and the =key
to move the optical pick-up to the outer circumference and to
the inner circumference respectively.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Servo Mode
V2. 000
ROM version display
LCD on remote commander
”key
”key
pkey
pkey
pkey
pkey
VOL
+ key
VOL
– key
(Start ?)
Overall
adjustment
mode (Auto?)
Adjustment
mode
(Manu ?) Servo mode
0 0 0
Audio mode
1 0 0
Power mode
3 0 0
+, – keys
+, – keys
+, – keys
Display when test mode is set
Displays of the LCD on the remote commander
are shown in parentheses.
Servo mode
0 0 0
Offset adjustment
0 1 0
Laser power
adjustment
0 2 0
011 to 013
*1
021 to 024
*1
23
1
pkey
pkey
pkey
pkey
”key
”key
”key
”key
”key
+, – keys+, – keys
(See page 8.)
*1 Repeatedly press ”key
to change the mode.
(Refer to the following list
for a description of each
mode.)
Test mode
Short : Test mode
Open : Normal mode
TAP801

– 8 –
2. Description of Each Mode
010 Offset adjustment
Mode Description
011 FE offset
012 TE offset
013 All servo ON
020 Laser power adjustment
Mode Description
021 MO power A
022 MO power E
023 CDL power
024 CD power
030 MO adjustment
Mode Description
031 MO EF balance
032 MO EF gain
033 MO ABCD gain
034 MO focus gain
035 MO tracking gain
036 MO RF gain
037 MO ADIP gain
038 MO focus bias E
039 CD focus bias A
040 Lower reflection CD adjustment
Mode Description
041 Lower reflection CD EF balance
042 Lower reflection CD EF gain
043 Lower reflection CD ABCD gain
044 Lower reflection CD focus gain
045 Lower reflection CD tracking gain
046 Lower reflection CD RF offset
047 Lower reflection CD RF gain
048 Lower reflection CD focus bias
050 CD adjustment
Mode Description
051 CD EF balance
052 CD EF gain
053 CD ABCD gain
054 CD focus gain
055 CD tracking gain
056 CD RF offset
057 CD RF gain
058 CD focus bias
(See page 7.)
pkey
pkey
pkey
pkey
+, – keys
MO adjustment
0 3 0
031 to 039
*1
”key
pkey
pkey
+, – keys
CD adjustment
0 5 0
051 to 058
*1
”key
pkey
pkey
+, – keys
Sled movement
0 6 0
061 , 062
*1
”key
+, – keys
041 to 048
*1
”key
Low reflection
CD adjustment
0 4 0
pkey
pkey
pkey
pkey
+, – keys
NV relation
0 9 0
091, 092,
093
*1
”key
”key
”key
”key
”key
”key
”key
+, – keys
071, 072,
073, 074
*1
”key
Automatic
adjustment
0 7 0
23
1
Retern the Offset
adjustment (010)
*1 : Repeatedly press ”key
to change the mode.
(Refer to the following list
for a description of each
mode.)

– 9 –
060 Sled movement
Mode Description
061 Sled in
062 Sled out 5
070 Automatic adjustment
Mode Description
071 Focus search
072 Access 32
073 ADER check
074 Tracking sensitivity adjust
090 NV relation
Mode Description
091 NV clear
092 Power OFF
093 Function code change
Audio Mode
• Enter the test mode and press the VOLUME – key. Then, press
the (key and the VOLUME + key in this turn to enter audio
mode.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Audio Mode
• The mode No. 111 is for S/N and crosstalk. The mode No. 115 is
for distortion factor and frequency characteristics.
• When the VOLUME +/– keys is pressed in any mode, the vol-
ume of the headphones is changed (increased/decreased) in units
of one step. When the+/ =keys is pressed, the volume of
the headphones is maximized/minimized.
• For the volume value, any changed value remains as it is basi-
cally.
However, when the volume is switched from 114 to 115 or 118
to 119, it returns the default value.
Audio mode
1 0 0
Audio playback test
1 1 0
1kHz 0dB L/R
1 1 1
Infinity Zero
1 1 2
–12dB
–
–12dB
–12dB
–20dB
–20dB
–20dB
–20dB
–40dB
1kHz 0dB L
1 1 3
1kHz 0dB R
1 1 4
1kHz –20dB L/R
1 1 5
20Hz –20dB L/R
1 1 6
20kHz –20dB L/R
1 1 7
16kHz De-Emphasis
L/R
1 1 8
100Hz 0dB L/R
1 1 9
headphones
output
pkey
pkey
”key
”key
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key
pkey
”key

– 10 –
Power Mode
• Enter the test mode and press the VOLUME – key. Then, press
the (key and the VOLUME – key in this turn to enter power
mode.
• When entering another mode, refer to the configuration of test
mode.
1. Structure of Power Mode
Overall Adjustment Mode
• Enter the test mode and press theVOLUME + key to enter over-
all adjustment mode.
• When entering another mode, refer to the configuration of test
mode.
• When the overall adjustment mode is entered, the LCD on the
remote commander display the following :
1. Structure of Overall Adjustment Mode
040 Auto?
Power mode
3 0 0
UNREG check
31 0
Power OFF
3 1 1
pkey
pkey
”key
”key
”key
Start ?
CD automatic
adjustment
MO automatic
adjustment
OK
NG
OK
NG
Overall
adjustment
mode
Auto?
Adjustment
mode
Manu ?
pkey
pkey
pkey
pkey
”key (to discriminate between CD and MO)
”key

– 11 –
• In MO Automatic adjustment Mode
No. Mode Description
1061 Sled in
2011 FE offset
3012 TE offset
4071 Focus search
5062 Sled out
6031 MO EF balance
7032 MO EF gain
8031 MO EF balance
9033 MO ABCD gain
10 034 MO focus gain
11 035 MO tracking gain
12 036 MO RF gain
13 037 MO ADIP gain
14 039 MO focus bias A
15 073 ADER check
16 071 Focus search
17 031 MO EF balance
18 032 MO EF gain
19 031 MO EF balance
20 033 MO ABCD gain
21 034 MO focus gain
22 035 MO tracking gain
23 036 MO RF gain
24 037 MO ADIP gain
25 039 MO focus bias A
26 073 ADER check
27 061 Sled in
28 071 Focus search
29 041 Low reflection CD EF balance
30 042 Low reflection CD EF gain
31 041 Low reflection CD EF balance
32 043 Low reflection CD ABCD gain
33 044 Low reflection CD focus gain
34 045 Low reflection CD tracking gain
35 046 Low reflection CD RF offset
36 047 Low reflection CD RF gain
37 061 Sled in
38 071 Focus search
39 041 Low reflection CD EF balance
40 042 Low reflection CD EF gain
41 041 Low reflection CD EF balance
42 043 Low reflection CD ABCD gain
43 044 Low reflection CD focus gain
44 045 Low reflection CD tracking gain
45 046 Low reflection CD RF offset
46 047 Low reflection CD RF gain
SECTION 5
ELECTRICAL ADJUSTMENTS
Notes for Adjustment
• In this set, automatic adjustment of CD and MO can be per-
formed by entering the test mode.
• Adjustments are performed in the overall adjustment mode. If
an item is determined as NG, the item is readjusted in servo
mode.
Adjustment Method in Overall Adjustment Mode
1. Enter the test mode and press the VOLUME + key to enter over-
all adjustment mode.
2. Insert the CD test disc (TGYS-1) or SONY MO disc (recorded)
commercially available.
3. Press the (key twice. The disc is determined whether it is CD
or MO and each adjustment mode is set.Automatic adjustments
are performed in the order of the items listed below.
• In CD Automatic adjustment Mode
No. Mode Description
1061 Sled in
2071 Focus search
3062 Sled out 5
4051 CD EF balance
5052 CD EF gain
6051 CD EF balance
7053 CD ABCD gain
8054 CD focus gain
9055 CD tracking gain
10 056 CD RF offset
11 057 CD RF gain
12 056 CD RF offset
13 058 CD Focus bias

– 12 –
* Remote commander display during automatic adjustment
4. If result of automatic adjustment is OK, the following display
appears.
5. If result of automatic adjustment is NG, the following display
appears.
* If NG, enter servo mode to perform automatic adjustment of the
item determined as NG.
057  
Adjustment value (flashing)
Mode No. under adjustment
047  End-OK 
051  NG 
Error code
NG mode No.
Adjustment in Servo Mode Method
1. When each adjustment mode is set according to the structure of
servo mode, the lower two digits of the mode No. and the ad-
justment value written in EEPROM are displayed and lit on the
LCD on the remote commander.
2. When the Pkey is pressed, the following display appears and
the automatic adjustment is performed.
Note)Although the VOLUME +/– keys can be used to change
the adjustment value to any value, they should not be
used whenever possible.
3. When the automatic adjustment is completed, the flashing ad-
justment value is lit.
052  
Adjustment value (lit)
Mode No.
052  
Adjustment value (flashing)
052  
Ad
j
ustment value
(
lit
)

– 13 –
Pin No. Pin Name I/O Pin Description
1 – Not used (Fixed at “L” ).
2 UREG MON I Unreg voltage monitor input.
3 – Not used (Fixed at “L” ).
4 VREF I Reference voltage for power supply voltage adjustlment.
5 PLAY KEY I Set PLAY key input.
6 OPEN/CLS SW I OPEN/CLOSE switch input. L : Close
7 RMC KEY I Remote commander key input.
8 SET KEY I Set key input.
9 XRESET I Systen reset input (At reset : “L” ).
10 AVDD – A/D converter power supply (+2.6V or +2.8V).
11 AVSS – A/D converter Ground.
12 TYPE 0 I Model discrimination terminal (Fixed at “H” ).
13 TYPE 1 I Model discrimination terminal (Fixed at “L” ).
14 TYPE 2 I Model discrimination terminal (Fixed at “L” ).
15 TYPE 3 I Model discrimination terminal (Fixed at “L” ).
16 HOLD SW I Set HOLD switch input.
17 VREG CON O 2.5V voltage on/off switch (Sub terminal) (not used).
18 – Not used (Open).
19 – Not used (Open).
20 MCK I Master clock input.
21 – Not used (Open).
22 VDD – Digital power supply (+2.6V or +2.8V).
23 VSS – Digital Ground.
24 – Not used (Open).
25 VSS – Digital Ground.
26 AVLS SW I Set AVLS switch input.
27 DSP SINT I Interrupt input from DSP.
28 DBB 0 I DIGITAL MEGA BASS switch input (MID).
29 DBB 1 I DIGITAL MEGA BASS switch input (MAX).
30 OPR LED O LED drive output.
31 XWK CLR O Power IC wakeup factor latch clear output and motor driver IC control signal outpt.
32 ADJUST I “Normally, Test mode select input (“L” : Test mode)
33 SLEEP O Power supply circuit OFF signal output.
34 SBUS CLK O SBB serial clock output.
35 SBUS DATA O SBB serial data output.
36 – Not used (Open).
37 SLD 1 MON I Sled servo timing signal input.
38 SLD 2 MON I Sled servo timing signal input.
39 CLV VCON O Spindle servo drive voltage control output.
40 APC REF O Laser power control output.
41 V28-CON O Power voltage (+2.6V or +2.8V) correction control output.
42 CLV U MON I Spindle servo timing signal input.
43 CLV V MON I Spindle servo timing signal input.
44 CLV W MON I Spindle servo timing signal input.
45 CLV U CON O Spindle servo drive signal output.
46 CLV V CON O Spindle servo drive signal output.
47 CLV W CON O Spindle servo drive signal output.
SECTION 6
DIAGRAMS
6-1. EXPLANATION OF ICTERMINALS
IC801 RU6815MF-0003 (FORMERTYPE), RU6815MF-0004 (NEWTYPE) (SYSTEM CONTROL)

– 14 –
Pin No. Pin Name I/O Pin Description
48 – Not used (Open).
49 – Not used (Open).
50 VDD – Digital power supply (+2.6V or +2.8V).
51 VPP – Power for on board light.
52 VSS – Digital ground.
53 SLD 1R CON O Sled motor control signal output.
54 SLD 1F CON O Sled motor control signal output.
55 SLD 2R CON O Sled motor control signal output.
56 SLD 2F CON O Sled motor control signal output.
57 – Not used (Open).
58 – Not used (Open).
59 – Not used (Open).
60 – Not used (Open).
61 SPCK O Serial clock output for Remote control communication. Not used (Open).
62 RMC DTCLK I/O Serial data input/output for Remote control communication.
63 – 66 – Not used (Open).
67 SLD V CON O Sled servo outer voltage control output.
68 SLC TR ON O Baypass transistor control output for sled drive power supply.
69 HP MUTE O Headphone amplifier mute output.
70 HP STBY O Headphone amplifier standby output.
71 RMC SEL O TSB/SSB selection signal output to remote commander terminal. Not used (Open).
72 NV D0 O Serial data signal output for NVRAM.
73 NV D1 I Serial data signal input from NVRAM.
74 NV CLK O Serial clock signal output for NVRAM.
75 NV CS1 O Chip select signal output for NVRAM.
76 VDD – Digital power supply (+2.6V or +2.8V).
77 – 79 LCD VL2 – 0 I LCD drive level power supply (Connected ground).
80 VSS – Digital ground.
81 – 87 – Not used (Open).
88 – 96 LCD SEG0 – 8 – LCD Segment terminal. Not used (Open).
97 – 100 LCD COM0 – 3 – LCD common terminal. Not used (Open).

– 15 – – 17 –– 16 –
MZ-E55
• Signal path.
J: PLAY
6-2. BLOCK DIAGRAM

– 21 – – 22 – – 24 –– 23 – – 25 –
MZ-E55
6-4. SCHEMATIC DIAGRAM rRefer to page 26 for IC Block Diagrams.
rWaveform.
1
IC501 @•
5
2 6
3 7
4 8
VOLT/DIV: 200 mV AC
TIME/DIV : 5 µsec IC901 !∞
VB
IC601 #ª IC901 @¡
DI
IC601 $¡ IC901 @™
PWMI
IC601 $ª
VOLT/DIV: 1V AC
TIME/DIV : 10 µsec
VOLT/DIV: 500 mV AC
TIME/DIV : 200 nsec
VOLT/DIV: 500mV AC
TIME/DIV : 20 nsec
VOLT/DIV : 0.1 V AC
TIME/DIV : 2 µsec
VOLT/DIV: 20 mV AC
TIME/DIV : 2 µsec
VOLT/DIV: 2V AC
TIME/DIV : 2 µsec
VOLT/DIV: 1V AC
TIME/DIV : 2 µsec
IC551 !∞
L1
743 mVp-
p
2.7 Vp-p
23
µ sec
2.6 Vp-p
482 nsec
2.0 Vp-
p
16.9344 MHz
269 mVp-p
5.76
µ
sec
63 mVp-p
5.78
µ sec
7.9 Vp-p
5.56
µ sec
3.2 Vp-p
5.68
µ sec
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
Note: The components identified by mark !or dotted
line with mark !are critical for safety.
Replace only with part number specified.
•A: B+ Line.
• Powervoltage isdc 1.5V and fed with regulateddc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY
• Voltages and currents are taken with a VOM (Input im-
pedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J: PLAY
*Note:
Use R1001 only with Ver.3 of
microprocessor (IC801).
UsingR1001 with other micro-
processor versions will cause
operating errors so be sure to
remove it.
You can checkthe version with
Test Mode (page 7).

IC552TLC372CPW-E20
– 26 –
IC601 UPD63731GC-9EU
rIC Block Diagrams
IC301 BA3577FS-E2
MUTE BEEP
20
19
18
17
16
15
14
12
11
13
2
1
3
4
5
6
7
8
9
10
R/F
NC
NC
VCC
VCC
+B
+B
NF1
OUT1
GND
OUT2
NF2
BEEP IN
RF IN
RF OUT
BIAS IN
BIAS OUT
V IN1
V IN2
PWSTB
PWSTB T
MUTE
MUTE T
PWSTB
23
5
4
6
7
8
1
VCC OUT2 IN-2 IN+2
OUT1 IN-1 IN+1 GND
21
22
23
24
25
26 27 28 29 30
2
3
5
4
6
7
8
9
10
1
11
12
13
14
15
16
17
18
19
20
31 32 33 34 35 36 37 38 39 40
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
41 42 43 44 45 46 47 48 49 50
71
72
73
74
75
767778798081828384
85
8687868990 100 919293
94
9597 96
98
99
ADC
ADIP
RF
FE
ABCD
TE DSSP
ADIP
PLL
EFM
PLL
SUBQ/ADIP
DECODER
EFM ACIRC
DECODER SECTOR
DECODER
SSB CONTROL
MONITOR I/O etc.
DRAM & PERIPHERAL CONTROL ADDRESS GENERATOR
AC
WDCK
S DATA
8
8
16
16
8
8
12
10
CLOCK
GENERATOR
ATRAC
DECODER
FLAG
AC LRCK
AC WDCK
AC BYCK
AC DATA
EFM DATA A/B
ECC DATA
EBA
WR REQ etc.
RD DT ECC
ATDT
XATWE
DREQ
XBUSY
58
8
SBD
SBA
SBW
SBR
SQREQ
2nd MSB
EFM
PLCK
34
8
VDD ADC
VREF
FE
ABCD
TE
VRT1
RF
VRT2
ADIP
VRT3
VSS ADC
T COUNT
DEFECT
OF TRX
VSS
NC
NC
NC
NC
VDD
TFOUT
TROUT
FROUT
FFOUT
CK176
VDD
DRA3
DRA2
DRA1
DRA0
DRA4
DRA5
DRA6
DRA7
DRA8
DRA10
DRA11
XRAS
DRA9
XOE2
XOE
XCAS
DRD2
DRD3
VSS
XWE2
XWE
DRD1
DRD0
VDD
NC
XRESET
SBUS
SCK
SINT
XBSY
DA-AVDD
AOVTR
VCON
AOUTL
DA AGND
VDD
EMP
LRCK
AUDATA
BCK VSS
DOUT
PMCK
MCK/2
VSS
MCK I-O
X1 X0
MCK
IO0 IO1 IO2 IO3 FOK FON ERFLAG CRCF TEST ADIP–DATA ADPLCK EFM PLCK VDD MO3 MO2 MO1 MO0 MOCK MICK MI3 MI2 MI1 MI0 VSS

– 27 –
IC551 MPC17A55FTA
21
22
23
24
25
26
27
28
29
30
235
4678910
111 12 13 14 15 16 17 18
19
20
31
32
33
34
35
36
3738394051525354
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
414243444546474849
50
71
72
PRE DRIVER PRE DRIVER PRE DRIVER PRE DRIVER
HI–BRIDGE
CONTROL
HI–BRIDGE
CONTROL
HI–BRIDGE
CONTROL
HI–BRIDGE
CONTROL
BIAS
CONTROL
SLEEP UP/DOWN
/POWER SW
DECODER
POWER SW
PRE DRIVER STEP UP/DOWN
PRE DRIVER STEP–UP
PRE DRIVER
PRE DRIVER
3 PHASE CONTROL
PRE
DRIVER
PWM
DRIVER
PRE
DRIVER
PWM
DRIVER
VC VC VG VC VC VG VC VC VG VC VC VG
VC VC VG
VC VC VG
VC VC VG
VC
VG
VGVG
VG
VG
VC
VC
VC
VC
REN
ROE
1ntSTB
1ntSTB
1ntOE
DO or DI
F12
R12
F11
R11
R13
F13
R14
F14
OE
VREG
VREG
CONT
CLPF
RGND
VC
GND
VG
PWM
DI
DO
VB1 VB1
VB VB
VB2
LI LI
UO
VO
WO
V0 V0
L2H
L2L
GND
DCC2
GND
DCC1
GND
DCC1
HIU
HIV
HIW
P11
P12
VPS2
PO2
GND
PS
PO1
VPS1
GND
3P2
HOW
VD2
HOV
GND
3PI
HOU
VD
IN
GND H2 FO2 VM2 RO2 GND H12 FO1 VM1 RO1 GND H13 RO3 VM3 FO3 GND H34 RO4 GND H4 VC VM4 FO4

– 28 –
IC802 AK93C55AV-L
IC901 MPC1830ADTB
INSTRUCTION
DECODE
CONTROL
AND
CLOCK
GENERATION
INSTRUCTION
REGISTER
ADD
BUFFERS
DATA
REGISTER
R/W AMPS
AND
AUTO ERASE
DECODER
VPP
SW
VREF VPP
GENERATOR
EEPROM
2048bit
128 X 16
2
3
5
4
6
7
8
1VCC
PE
NC
GND
CS
SK
DI
DO
21
22
23
24
25
26
27
28
29
30
2
3
5
4
6
7
8
9
10
1
11
12
13
14
15
16
17
18 19
20
31
32
33
34
35
36
GND
VRMC
VREF
INM
RF
DTC
CRST
XRST
VBMON
VC
SPCKI
SPCKO
C2L
C1L
VB
C1H
C2H
VG
BAND GAP
REFERENCE
RESET
VB SELECT
SPCK
BUFF
CHARGE
PUMP
VSTB
VBH
SYSTEM
CONTROL
OSC1
STEP-UP
DC / DC
CONVERTER
PWM1
MODE
SELECT
SAW
OSC2
XWK1
XWK2
XWK3
XWK4
FFCLR
SLEEP
VBSEL
CLK
VB2
VB1
PGND
SW
PWMI
DO
DI
VCON

– 29 –
SECTION 7
EXPLODED VIEWS
NOTE :
• -XX, -X mean standardized parts, so they
may have some difference from the original
one.
• Color indication of Appearance Parts
Example :
KNOB, BALANCE (WHITE) ••• (RED)
↑↑
Parts color Cabinet's color
• Items marked “ * ”are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering
these items.
• The mechanical parts with no reference
number in the exploded views are not
supplied.
• Accessories and packing materials are given
in the last of this parts list.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
7-1. MAIN SECTION
• Abbreviation
HK : Hong Kong
The components identified by mark !
or dotted line with mark !are critical
for safety.
Replaceonlywith partnumber specified.
1 4-212-867-01 PANEL, BOTTOM (GOLD)
1 4-212-867-11 PANEL, BOTTOM (BLUE) (HK)
2 4-212-872-01 KNOB, OPEN
3 X-4950-410-1 SLIDER ASSY, OPEN
4 4-963-883-61 SCREW (M1.4), PRECISION PAN
5 4-212-884-01 WINDOW (LED)
6 4-212-885-01 SHEET (LED), ADHESIVE
7 4-212-868-01 BUTTON, CONTROL
8 4-212-883-01 KNOB (HOLD) (GOLD)
8 4-212-883-11 KNOB (HOLD) (BLUE) (HK)
9 4-212-882-01 KNOB (MB) (GOLD)
9 4-212-882-11 KNOB (MB) (BLUE) (HK)
10 4-213-653-11 KNOB (AVLS) (BLUE) (HK)
10 4-213-653-01 KNOB (AVLS) (GOLD)
11 4-212-895-01 TERMINAL BOARD (MINUS)
12 4-963-883-21 SCREW (M1.4), PRECISION PAN (GOLD)
12 4-963-883-31 SCREW(M1.4), PRECISION PAN (BLUE) (HK)
13 4-963-883-21 SCREW (M1.4), PRECISION PAN
14 X-4950-413-1 PLATE (L) ASSY, FULCRUM
15 X-4950-578-1 UPPER PANEL ASSY (GOLD)
15 X-4950-579-1 UPPER PANEL ASSY (BLUE) (HK)
16 3-375-114-61 SCREW
17 1-670-708-11 SWITCH FLEXIBLE BOARD
18 4-213-092-01 LABEL, CAUTION
19 4-212-873-11 LID, BATTERY CASE (BLUE) (HK)
19 4-212-873-01 LID, BATTERY CASE (GOLD)
20 X-4950-411-1 TERMINAL (PLUS) ASSY, BATTERY
21 4-212-886-01 CASE, BATTERY
*22 1-670-711-11 AUDIO BOARD
*23 1-670-710-11 SWITCH BOARD
24 4-212-901-01 TERMINAL
25 A-3323-057-A MAIN BOARD, COMPLETE
26 4-212-871-01 SHEET, BLIND
27 4-212-870-01 SHEET, INSULATING
28 X-4950-419-1 PLATE (R) ASSY, FULCRUM
29 4-212-869-01 ESCUTCHEON
30 3-365-630-02 SCREW (M1.4) STEP
31 3-365-630-21 SCREW (M1.4) STEP (GOLD)
31 3-365-630-31 SCREW (M1.4) STEP (BLUE) (HK)
32 4-215-298-01 SPACER (FULCRUM)
33 4-214-628-01 SPACER (PLUS TERMINAL)
34 4-214-158-01 DAMPER (-)
1
2
34
5
6
7
8910
11
34
12
12
31
12
14
32
15
16 17
18
19
20
21
22
23 24
25
26
13
30
27
28
29
33