
TABLE
OF
CONTENTS
1.
SERVICING
NOTES
------:-:ssssecsssecsssseccssseessssseccsssseesssnees
3
9.
GENERAL
sisiciisectdetentipeniacies
pteert
dovact
earns
5
3.
DISASSEMBLY
---------:ssssessssssessoseeccossececsseesesseeesssseecsssevece
7
A.
SERVICE
MODE
-.1-:--s+v--sssssesssosessossesessseessssseccssteesenssenee
11
5.
ELECTRICAL
CONFIRMATIONS
AND
ADJUSTMENTS.
-1-sss-ssssssseesssssseesscssssesscsssseesecsssseesesssssens
12
6.
DIAGRAMS
6-1.
Circuit
Boards
Locations
-escs:ccrrerteeeeeeseeeeeeeeeeeeeaeecsnesenaeees
14
6-2.
Block
Diagram
—
TAPE
Section
—
-++-++++s-sesssseseeeseeeereseeees
15
6-3.
Block
Diagram
—
MAIN
Section
—
--s+ssssssseesssseeeteeeseenne
16
6-4.
Block
Diagram
—
DISPLAY/POWER
SUPPLY
Section
—
--+-+--++1:s-1ee
17
6-5.
Printed
Wiring
Board
-
MAIN
Section
—
--------
18
6-6.
Schematic
Diagram
—
MAIN
Section
(1/2)
—
eres
19
6-7.
Schematic
Diagram
—
MAIN
Section
(2/2)
—
s-+-+ssse
eee
20
6-8.
Printed
Wiring
Boards
—
LCD/HEADPHONE/LOADING/SPEAKER
Section
—-
21
6-9.
Schematic
Diagrams
—
HEADPHONE/SPEAKER
Section
—-:reeeseseceseeeteeeeeers
21
6-10.
Printed
Wiring
Boards
-
CONTROL
Section
—--
ts
6-11.
Schematic
Diagram
-
CONTROL
Section
—
-++-----++--+
23
6-12.
Printed
Wiring
Board
-
POWER
Section
—
-+-++++++:+1+ss+
24
6-13.
Schematic
Diagram
-
POWER
Section
—-----
we
25
6-14.IC
Block
Diagrams
+-++++++++++
seteeeeenesees
26
6-15.IC
Pin
Function
Description
Dee
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28
7.
EXPLODED
VIEWS.
...-------:ccccsccccccecsssreceessecesenteeeseeeene
30
8.
ELECTRICAL
PARTS
LIST
---s--:-:cscscccssecseeseeeeee
34
SECTION
1
SERVICING
NOTES
NOTES
ON
HANDLING
THE
OPTICAL
PICK-UP
|
BLOCK
OR
BASE
UNIT
The
laser
diode
in
the
optical
pick-up
block
may
suffer
electrostatic
break-down
because
of
the
potential
difference
generated
by
the
charged
electrostatic
load,
etc.
on
clothing
and
the
human
body.
During
repair,
pay
attention
to
electrostatic
break-down
and
also
use
the
procedure
in
the
printed
matter
which
is
included
in
the
repair
parts.
The
flexible
board
is
easily
damaged
and
should
be
handled
with
care.
NOTES
ON
LASER
DIODE
EMISSION
CHECK
The
laser
beam
on
this
model
is
concentrated
so
as
to
be
focused
on
the
disc
reflective
surface
by
the
objective
lens
in
the
optical
pick-
up
block.
Therefore,
when
checking
the
laser
diode
emission,
observe
from
more
than
30
cm
away
from
the
objective
lens.
Notes
on
chip
component
replacement
¢
Never
reuse
a
disconnected
chip
component.
¢
Notice
that
the
minus
side
of
a
tantalum
capacitor
may
be
dam-
aged
by
heat.
Flexible
Circuit
Board
Repairing
*
Keep
the
temperature
of
the
soldering
iron
around
270
°C
dur-
ing
repairing.
¢
Do
not
touch
the
soldering
iron
on
the
same
conductor
of
the
circuit
board
(within
3
times).
¢
Be
careful
not
to
apply
force
on
the
conductor
when
soldering
or
unsoldering.
CAUTION
Use
of
controls
or
adjustments
or
performance
of
procedures
other
than
those
specified
herein
may
result
in
hazardous
radiation
exposure.
This
appliance
is
classified
as
a
CLASS
1
LASER
product.
The
CLASS
1
LASER
PRODUCT
MARKING
is
located
on
the
rear
exterior.
CLASS
1
LASER
PRODUCT
LUOKAN
1
LASERLAITE
KLASS
1
LASERAPPARAT
Laser
component
in
this
product
is
capable
of
emitting
radiation
exceeding
the
limit
for
Class
1.
The
following
caution
label
is
located
inside
the
unit.
CAUTION
—:
INVISIBLE
LASER
RADIATION
WHEN
OPEN
AND
INTERLOCKS
DEFEATED.
AVOID
EXPOSURE
TO
BEAM.
ADVARSEL
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NAKYMATTOMALLE
LASERSATEILYLLE.
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VARNING
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LASERSTRALING
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FOR
STRALEN.
VIGYAZAT!
:
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BURKOLAT
NYITASAKOR
LATHATATLAN
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KEROLJE
A
BESUGARZAST!