Sony HTC-VX500 User manual

SERVICE MANUAL
COMPACT DISC DECK
MICROFILM
SPECIFICATIONS
HTC-VX500
E Model
This stereo system is equipped with the Dolby B-
type noise reduction system.
* Manufactured under license from Dolby
Laboratories Licensing Corporation.
DOLBY, the double-D symbol ;and “PRO LOGIC”
are trademarks of Dolby Laboratories Licensing
Corporation.
Model Name Using Similar Mechanism HTC-V5550
CD CD Mechanism Type CDM38-5BD24
Section Base Unit Type BU-5BD24
Optical Pick-up Name KSS-213BA/F-NP
Tape deck Model Name Using Similar Mechanism HTC-V5550
Section Tape Transport Mechanism Type TCM-230AWR2
TCM-230PWR2
• This set is the deck andVideo CD
section in MHC-VX500/VX700AV.
Video section
Inputs AV INPUT VIDEO (phono jack):
1Vp-p, 75 Ω
VIDEO IN (phono jack)
1Vp-p, 75 Ω
Outputs MONITOR OUT (phono jack):
1Vp-p, 75 Ω
VIDEO OUT (phono jack)
1Vp-p, 75 Ω
S-VIDEO (4-pin/mini-DIN jack):
Y: 1Vp-p, unbalanced, sync negative
C: 0.286Vp-p, load impedance 75 Ω
VIDEO CD/CD player section
System Compact disc, digital audio and video
system
Laser Semiconductor laser (λ=780nm)
Emission duradon: continuous
Laser output Max. 44.6µW*
*This output is the value measured at a
diatance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
Frequency response 20 Hz – 20 kHz (±1 dB)
Wavelength 780 – 790 nm
Signal to noise ratio More than 90 dB
Dynamic range More than 90 dB
Video Color System format
NTSC, PAL
CD OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength 600 nm
Output Level –18 dBm
Tape player section
Recording system 4-track 2-channel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
(DOLBY NR OFF) using Sony TYPE
cassette
40 – 14,000 Hz (±3 dB),
using Sony TYPE
cassette
General
Dimensions (w/h/d) Approx. 288 ×205 ×360 mm
Mass Approx. 4.6 kg
Design and specifications are subject to change without notice.

2
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on the
rear exterior.
NOTES ON HANDLINGTHE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment”and check
that the S curve waveform is output three times.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINEWITH
MARK !ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

3
TABLE OF CONTENTS
1. SERVICING NOTE ····················································· 4
2. GENERAL ····································································· 7
3. DISASSEMBLY
3-1. Loading Panel ····································································· 8
3-2. Back Panel and CD Mechanism Deck ······························· 8
3-3. Front Panel ········································································· 9
3-4. TC Mechanism Deck and Cassette Holder························· 9
3-5. Disk Tray ········································································· 10
4. MECHANICAL ADJUSTMENTS·························· 11
5. ELECTRICAL ADJUSTMENTS ··························· 11
6. DIAGRAMS
6-1. Circuit Boards Location ··················································· 15
6-2. Block Diagrams
• Servo Section ································································· 16
• Audio/Video CD Section················································ 17
• Tape Deck Section·························································· 18
• Power Section ································································ 19
6-3. Printed Wiring Board CD Section ·································· 20
6-4. Schematic Diagram CD Section····································· 21
6-5. Schematic Diagram Deck Section·································· 22
6-6. Printed Wiring Board Deck Section ······························· 23
6-7. Printed Wiring Board Main Section ······························· 24
6-8. Schematic Diagram Main (1/2) Section ························· 25
6-9. Schematic Diagram Main (2/2) Section ························· 26
6-10. Printed Wiring Board Leaf SW Section ························· 27
6-11. Schematic Diagram Leaf SW Section ···························· 27
6-12. Printed Wiring Board Panel Section·······························28
6-13. Schematic Diagram Panel Section ································· 29
6-14. Schematic Diagram CD Motor Section·························· 30
6-15. Printed Wiring Board CD Motor Section ······················· 31
6-16. Printed Wiring Board Video Section ······························ 32
6-17. Schematic Diagram Video (1/2) Section ························ 33
6-18. Schematic Diagram Video (2/2) Section ························ 34
6-19. IC Block Diagrams ···························································38
6-20. IC Pin Function Description ············································· 40
7. EXPLODED VIEWS
7-1. Case and Back Panel Section ··········································· 47
7-2. Front Panel Section ·························································· 48
7-3. CD Mechanism Section 1 (CDM38-5BD24) ··················· 49
7-4. CD Mechanism Section 2 (CDM38-5BD24) ··················· 50
7-5. Base Unit Section (BU-5BD24) ······································· 51
7-6. TC Mechanism Section 1 (TCM-230AWR2/230PWR2) · 52
7-7. TC Mechanism Section 2 (TCM-230AWR2/230PWR2) · 53
8. ELECTRICAL PARTS LIST ··································· 54

4
SECTION 1
SERVICING NOTE
HOW TO OPENTHE DISC TRAY WHEN POWER SWITCH
TURNS OFF
1 Remove the Case.
Note for Installation (ROTARY ENCODER)
3 Pull-out the disc tray.
2 Turn the cam to the
direction of arrow.
BU cam
Groove Section A
Note:When attaching the Base unit, Insert th
e
section A into the groove of BU cam.
Note:When attaching the BU cam,
engage the Rotary encoder
switch as shown in the figure.

5
CD >(AMS) s(TAPE B) button + DISC3 button
.(AMS) s(TAPE B) button + DISC1 button
Ms(TAPE A) button + DISC3 button
ms(TAPE A) button + DISC1 button
TAPE A >(AMS) DISC SKIP button + H(TAPE B)
TAPE B .(AMS) DISC SKIP button + h(TAPE B)
MDISC SKIP button + H(TAPE A)
mDISC SKIP button + h(TAPE A)
Connection and Operations of the Unit by Itself
This unit cannot be operated by itself as it does not come with a power supply.
Connect STR-VX500/VX700 as shown in “Connection 1” before beginning servicing.
Connection 1: If there is STR-VX500/VX700.
Use a power supply jig (PFJ-1) if the STR-VX500/VX700 is not available.
Connect the conversion jig for connection (J-2501-138-A) as shown in “Connection 2” before beginning servicing.
Connection 2: If there is not STR-VX500/VX700.
To operate the unit by itself, turn on the power of the conduction jig (PFJ-1), and press the s(TAPE A) , s(TAPE B) ,
and H(TAPE B) buttons together in this order.
As this unit is not equipped with fast forward and rewind buttons, buttons need to be combined and pressed together for different functions
when operating the unit by itself. (See Table-2.)
However, it will not operate properly if operations are performed without switching the functions.
Perform the following procedure to switch the functions before operating the unit.
The function selected is indicated by the DISC NUMBER indicator.
Table 1 Switching the Functions Table 2 Pressing Combination of Buttons When Operated by Itself
Function
CD x(CD) button 1< 2< 3
+ HI-SPEED DUBBING button
TAPE A x(CD) button 1< 2 3
+ zREC button
TAPE B x(CD) button 1 2< 3
+ h(TAPE A) button
Operation
The function can be differentiated by the lighting of this part of the indicator.
↓↓
1< 2< 3
Indicator Deck Function Operation
STR-VX500/VX700
SYSTEM CABLE 17P
SET
AC IN
Set
Conversion
Jig
(J-2501-138-A)
Power SW
Service Box (PFJ-1) Connector
cable 17P
(Supplied with PFJ-1)
Connector
cable 17P
(Supplied with
Conversion Jig or Set)
FH-E939,838,737
MHC-6600,5600,3600,2600
CDP/TC SYSTEM CONTROL

6
Procedure:
1. After turning ON the power of the conduction jig (PFJ-1), press the s(TAPE A) button, s(TAPE B) button, and H(TAPE B)
button together in this order.
2. Press the s(TAPE B) button while pressing the x(CD) button to set the aging mode and start aging.
3. To end aging, press the three buttons in step 1.
Cold Reset
NOTE: This is the mode for operating the unit by itself. Take note that the operating method differs when connected to the STR-VX500/
VX700. This method is described in the manuals of the STR-VX500 and STR-VX700. Refer to these manuals for details.
This mode is used for initializing the RAM contents. Perform this mode when returning the repaired product to the customer.
Procedure:
1. After turning ON the power of the conduction jig (PFJ-1), press the s(TAPE A) button, s(TAPE B) button, and H(TAPE B)
button together in this order.
2. Press the X(TAPE) button while pressing the x(CD) button.
CD Delivery Mode
NOTE: This is the mode for operating the unit by itself. Take note that the operating method differs when connected to the STR-VX500/
VX700. This method is described in the manuals of the STR-VX500 and STR-VX700. Refer to these manuals for details.
This mode moves the pickup to areas where the anti-vibration is stronger. Perform this mode when returning the repaired product
to the customer.
Procedure:
1. After turning ON the power of the conduction jig (PFJ-1), press the s(TAPE A) button, s(TAPE B) button, and H(TAPE B)
button together in this order.
2. Press the CD SYNCHRO button while pressing the x(CD) button.
3. Wait untill z(TAPE B) indicator is on befor disconnect from the conduction jig (PFJ-1).
LED All Lit Mode
NOTE: Always perform this mode when operating the unit by itself.
This mode is used for lighting up the whole LED.
Procedure:
1. After turning ON the power of the conduction jig (PFJ-1), press the s(TAPE A) button, s(TAPE B) button, and H(TAPE B)
button together in this order.
2. The whole LED can be turned on and off each time the s(TAPE A) button is pressed while pressing the x(CD) button.
3. Press the three buttons in step 1 at the end.
Key Check Mode
NOTE: Always perform this mode when operating the unit by itself.
This mode is used for checking the key inputs of the buttons of the unit.
Procedure:
1. After turning ON the power of the conduction jig (PFJ-1), press the s(TAPE A) button, s(TAPE B) button, and H(TAPE B)
button together in this order.
2. Press the DOLBY NR button while pressing the x(CD) button to set the key check mode, and the indicator displays “3HX”.
3. The number of buttons pressed are indicated in binary digits by the indicator LED. Buttons pressed once are not counted when pressed
again.
4. Press the two buttons in step 2 at the end.
Display: 1< 2< 3
Aging Mode
NOTE: Perform the following procedure only when operating the unit by itself.
This mode is used for checking the operations of the CD player and tape deck.
The operations are the same as the aging mode described in the service manual for the STR-VX500/VX700. However as this unit
does not have a fluorescent indicator tube, operating states and error statuses cannot be checked.
If the STR-VX500/VX700 is available, set the aging mode according to those service manuals.
Aging continues in the following sequence as long as no errors occur.
MSB ↑↑LSB
Aging of CD player (12 minutes)
Aging of deck A
Aging of deck B 12 minutes

7
SECTION 2
GENERAL
Front Panel
Location of Parts and Controls
1DISC SKIP/EX-CHANGE button
2DISC 1 button
3DISC 2 button
4DISC 3 button
5DISC NUMBER 1< 2< 3indicator
6N(CD play) indicator
7X(CD pause) indicator
8AOPEN/CLOSE button
9x(CD stop) button
0HX (CD play pause) button
qa bB (Deck A play) indicator
qs z(Deck B rec) indicator
qd X(Tape (Deck B pause)) indicator
qf bB (Deck B play) indicator
qg H(Deck B play) button
qh h(Deck B play) button
qj s(Deck B stop) button
qk A(Deck B eject) button
ql Casette lid (Deck B)
w; DIRECTION MODE button
wa XPAUSE button
ws zREC button
wd HI-SPEED DUBBING button
wf CD SYNCHRO button
wg DOLBY NR button
wh Casette lid (Deck A)
wj AEJECT (Deck A) button
wk s(Deck A stop) button
wl h(Deck A play) button
e; H(Deck A play) button
ea Video CD Disc tray
es RETURN button
ed PREV button
ef SELECT button
eg NEXT button
eh PBC OFF indicator
ej VCD indicator
ek PBC indicator
234 5 6 7 8 9
0
qa qs qd qf
ekejeh
qg
qh
qj
qk
w;
wawswdwfwg qlwh
wj
wk
wl
e;
ea
es
eg
ed
ef
1

8
SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
3-1. LOADING PANEL
3-2. BACK PANEL AND CD MECHANISM DECK
2 Pull-out the disc tray.
1 Turn the cam to the
direction of arrow.
3 Loading panel
(Remove two claws)
Two claws
1 Screw
(BVTP3
× 8)
2 Cover (SC)
4 Two screws
(BVTP3
× 10)
3 System cable
5 Three screws
(BVTP3
× 10)
6 Four screws
(BVTP3
× 8)
7 Back panel
8 Two screws
(BVTP3
× 10)
0 Screw
(BVTP3
× 10)
qa Flat type wire
(19core, CNS103)
qs Connector
(CN111)
qd Connector
(CN112)
qf CD mechanism deck
9 Dummy board

9
3-3. FRONT PANEL
3-4.TC MECHANISM DECK AND CASSETTE HOLDER
1 Flat type wire
(17core, CNS102)
4 Connecto
r
(CN113)
2 Flat type wire
(17core, CNS104)
5 Two screws
(BVTP3
× 10)
6 Lead (with connector)
7 Connector (CNP105)
Catcher
8 Front panel
(Remove the catcher)
3 Flat type wire
(15core, CNS101)
A
1
Three screws
(BVTP2.6 × 8)
2 Two screws
(BVTP2.6 × 8)
3 TC mechanism deck
4 Two springs
C
D
D
C
5
Remove the Cassette holder A
and Cassette holder B.
(Remove C first, and remove D .)
6 Eject button A
7 Eject button B
Note for installation
Set the Spring to be at the position
in the figure.
B
(Push out in the direction
of the arrow A .)
(Push out in the direction
of the arrow B .)

10
3-5. DISCTRAY
Note: When installing the Disc tray, pull around the flat type wire to
pass through the claw A and claw B , as shown in the figure.
Claw B
Claw A
1
Turn the cam the
direction of arrow.
2 Pull-out the disc tray.
5 Remove the disc tray.
4 Two claws
3 Flat type wire (8 core)

11
Read before adjustments
To adjust the unit, operate the unit by itself using the conduction jig
(PFJ-1).
For details on switching functions and fast forwarding the unit, etc.
when operating it by itself, refer to “Connection and Operations of
the Unit by Itself” on page 5 of Servicing Notes.
• Turning on the power
When operating the unit by itself:
1. After turning ON the power of the conduction tool (PFJ-1),
press the s(TAPEA) button, s(TAPE B) button, and H
(TAPE B) button together in this order.
Inputting/outputting audio signals:
Use the jack of the power supply jig (PFJ-1).
DECK SECTION 0 dB=0.775V
1. Demagnetize the record/playback head with a head
demagnetizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the
parts adjusted.
4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in this
service manual. (As a general rule, playback circuit adjustment
should be completed before performing recording circuit
adjustment.)
6. The adjustments should be performed for both L-CH and R-
CH.
7. Switches and controls should be set as follows unless otherwise
specified.
Record/Playback Head Azimuth Adjustment
(Deck A, Deck B)
Note: Perform this adjustments for both decks.
Procedure:
1. Mode : Playback
Precaution
1. Clean the following parts with a denatured alcohol-moistened
swab:
record/playback heads pinch rollers
erase head rubber belts
capstan idlers
2. Demagnetize the record/playback head with a head
demagnetizer.
3. Do not use a magnetized screwdriver for the adjustments.
4. After the adjustments, apply suitable locking compound to the
parts adjusted.
5. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
Torque Measurement
SECTION 4
MECHANICAL ADJUSTMENTS SECTION 5 ELECTRICAL ADJUSTMENTS
Tape
P-4-A100
WS-48B
P-4-L300
Signal
10 kHz, –10 dB
3 kHz, 0 dB
315 Hz, 0 dB
Used for
Azimuth Adjustment
Tape Speed Adjustment
Level Adjustment
Mode
FWD
FWD
back tension
REV
REV
back tension
FF/REW
FWD tension
REV tension
Torque meter
CQ-102C
CQ-102C
CQ-102RC
CQ-102RC
CQ-201B
CQ-403A
CQ-403R
Meter reading
31 to 71 g • cm
(0.43 – 0.98 oz • inch)
2 to 6 g • cm
(0.02 – 0.08 oz • inch)
31 to 71 g • cm
(0.43 – 0.98 oz • inch)
2 to 6 g • cm
(0.02 – 0.08 oz • inch)
71 to 143 g • cm
(0.98 – 1.99 oz • inch)
100 g or more
(3.53 oz or more)
100 g or more
(3.53 oz or more)
PFJ-1
Output point
Input point
set
test tape
P-4-A100
(10kHz, -10dB)
PFJ-1
level meter
output point

12
2. Turn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1 dB of peak.
3. Mode: Playback
4. After the adjustments, apply suitable locking compound to the
parts adjusted.
Adjustment Location: Playback Head (Deck A)
Record/Playback/Erase Head (Deck B)
L-CH
peak
R-CH
peak
screw
position
output
level within
1 dB
L-CH
peak R-CH peak
screw
position
within 1dB
Waveform of oscilloscope
in phase 45
°
90 °
135 °
180 °
good wrong
set PFJ-1
oscilloscop
e
test tape
P-4-A100
(10kHz, -10dB) output point
Tape Speed Adjustment (Deck B)
Note: Set the test mode using the following method and begin tape
speed adjustment.
In the test mode, the speed will switch to double speed or
normal speed each time the HI-DUB button is pressed.
Procedure:
Press the x(CD) button while pressing the DIRECTION MODE
button.
1. Insert the WS-48B into deck B, while pressing the x(CD)
button, press the h(TAPE A) button, set the function to
“deck B”.
2. Press the Hbutton of deck B.
3. Press the HI-DUB button and play the tape at double speed.
4. Adjust RV1001 of the LEAF SW board so that the reading of
the frequency counter becomes 6000 ± 180 Hz.
5. Press the HI-DUB button and play the tape at normal speed.
6. Adjust RV1002 of the LEAF SW board so that the reading of
the frequency counter becomes 3000 ± 90 Hz.
Adjustment Location: LEAF SW board
SampleValue of Wow and flutter
W.RMS (JIS) less than 0.3%
(test tape: WS-48B)
Playback Level Adjustment (Deck A, Deck B)
Procedure:
Mode: Playback
Deck A is RV311 (L-CH) and RV411 (R-CH), deck B is RV301
(L-CH) and RV401 (R-CH)
so that adjustment within the following adjustment level.
Adjustment level:
Output point from PFJ-1 playback level: 301.5 to 338.3 mV (–8.2
to –7.2 dB)
level difference between the channels: within ± 0.5 dB
Adjustment Location:AUDIO board
Forward
Reverse
set
test tape
P-4-L300
(315Hz, 0dB)
PFJ-1
level meter
output point
RV1002 RV1001
RV1002(Normal Speed
)
RV1001(High Speed)
Adjustment Location
[LEAF SW BOARD]

13
Record Level Adjustment (Deck B)
Procedure:
1. Press the x(CD) button while pressing the DIRECTION
MODE button.
2. While pressing the x(CD) button, press the h(TAPEA)
button, set the function to “deck B”.
3. Insert a tape into deck B, press the zREC button, and then
press the Nbutton to start recording.
4. Mode: Record
5. Mode: Playback
6. Confirm playback the signal recorded in step 2 become
adjustment level as follows.
If these levels do not adjustment level, adjust the RV301 (L-
CH) and RV351 (R-CH) on the MAIN board to repeat steps 3
and 4.
Adjustment level:
Output point from PFJ-1 playback level: 47.2 to 53.0 mV (–24.3 to
–23.3 dB)
Adjustment Location: MAIN board
Record Bias Adjustment (Deck B)
Procedure:
1. Press the x(CD) button while pressing the DIRECTION
MODE button.
2. While pressing the x(CD) button, press the h(TAPEA)
button, set the function to “deck B”.
3. Insert a tape into deck B, press the zREC button, and then
press the Nbutton to start recording.
4. Mode: Record
5. Mode: Playback
6. Confirm playback the signal recorded in step 2 become
adjustment level as follows.
If these levels do not adjustment level, adjust the RV341 (L-
CH) and RV441 (R-CH) on theAUDIO board to repeat steps 3
and 4.
Adjustment level: The playback output of 10 kHz level difference
against 315 Hz reference should be ± 1.0 dB.
Adjustment Location:AUDIO board
AF OSC
INPUT POINT
1) 315 Hz
2) 10 kHz
blank tap
e
CS-123
PFJ-1
set
attenuator 600
Ω
} 50 mV (–23.8 dB)
recorded
position level meter
set
PFJ-1
output
point
AF OSC blank tape
CS-123
PFJ-1 set
attenuator 600
Ω
INPUT POINT
315Hz 50 mV (–23.8 dB)
recorded
position level meter
set
PFJ-1
output
point
Adjustment Location
[AUDIO BOARD] (Conductor Side)
RV441 RV341
RV301(Lch),RV401(Rch)
Playback Level (Deck B)
RV301 RV401
RV341(Lch),RV441(Rch)
Record Bias RV311(Lch),RV411(Rch)
Playback Level (Deck A)
RV311 RV411
CNS102
CNP105
CNS101 RV351
Record
Level (R ch)
RV301
Record
Level (L ch)
[MAIN BOARD] (Component Side)

14
CD SECTION
Notes:
1. CD block basically constructed to operate without adjustment. There-
fore, check each item in order given.
2. UseYEDS-18 disc (Part No.: 3-702-101-01) unless otherwise indicated.
3. Use the oscilloscope with more than 10 MΩimpedance.
4. Clean an object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S-Curve Check
Connection:
Procedure:
1. Connect the oscilloscope to TP (FE) and TP (VC) on BD board.
2. Connect between test pointTP (FOK) and Groundbyleadwire.
3. Turned power switch on.
4. Put disc (YEDS-18) in and turned power switch on again and
actuate the focus search. (actuate the focus search when disc
table is moving in and out.)
5. Confirm that the oscilloscope waveform (S-curve) is
symmetrical betweenA and B. And confirm peak to peak level
within 3.0 ± 1.0 Vp-p.
S-curve waveform
6. After check, remove the lead wire connected in step 2.
Note: • Try to measure several times to make sure that the ratio ofA : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness
to obtain best waveform.
RF Level Check
Connection:
Procedure:
1. Connect the oscilloscopetoTP (RF) andTP (VC) on BD board.
2. Turned power switch on.
3. Put disc (YEDS-18) in and press the G button.
4. Confirm that the oscilloscope waveform is clear and check RF
signal level is correct or not.
Note: Clear RF signal waveform means that the shape “≈” can be clearly
distinguished at the center of the waveform.
within 3.0 ± 1.0 Vp-p
RF signal waveform
When observing the eye pattern, set the oscilloscope forAC range
and raise vertical sensitivity.
When a general remote commander is not used (1 Track Jump
Check):
Procedure:
1. Connect the oscilloscopetoTP (TE) andTP (VC) on BD board.
2. Turned power switch on.
3. Put disc (YEDS-18) in and press the G button, and play the
number five track.
4. Press the G button. (Becomes the 1 track jump mode)
5. Confirm that the level B of the oscilloscope's waveform and
the A (DC voltage) of the center of the traverse waveform.
Confirm the following:
1 track jump waveform
Connection Location:
[BD Board] (Side A)
A – B
2 (A + B) ×100 = ± 7 (%)
level: 1.3 ± 0.6 Vp-p
+
–
BD board
TP (FE)
TP (VC)
oscilloscop
e
A
B
symmetry
+
–
BD board
TP (RF)
TP (VC)
oscilloscop
e
(AC range)
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
(with the 10: 1 probe
in use)
level: 1.3 Vp-p
+0.25
–0.20
Center of the waveform
B
symmetry
A (DC voltage
)
0V
CN102
CN101
IC103
IC101
TP
(FOK)
TP
(TE)
TP
(FE)
TP (RF)
TP (VC
)

HTC-VX500
1515
VIDEO SECTION
Frequency Adjustment
Connection:
Procedure:
1. Connect the frequency counter to TP508 (27 MHz) onVIDEO
board.
2. Turned power switch on.
3. Press the FUNCTION button to select the CD.
4. Adjust CT503 on the VIDEO board so that the frequency
counter reading 27.0 MHz ± 80 Hz at stop status.
Adjustment Location:
[VIDEO BOARD] (Side A)
+
–
TP508 (27 MHz)
VIDEO board frequency counte
r
IC505
IC507
TP508
(27 MHz)
CT503
VIDEO
Frequency
Adjustment
SECTION 6
DIAGRAMS
6-1. CIRCUIT BOARDS LOCATION
MAIN board
REG board
VIDEO IN/OUT board
VIDEO board
TC (A) board
TC LED board
TC (B) board
TC PANEL board
CD PANEL board
AUDIO board
LEAF SW board
SENSOR board
CONNECTOR board
BD board
MOTOR (SLIDE) board
MOTOR (TURN) board

HTC-VX500
1616
6-2. BLOCK DIAGRAMS
SERVO SECTION
CD MECHANISM
CONTROLLER
IC502 (1/2)
A/D
CONVERTER
OUT+
OUT–
3
4
7
2
1
5
10
6
4
5
6
16
15
14
13
8
9
19
2
1
77
78
71
55
54
45
47
46
6320
31 33 34 32
36
38
39
26
93
27
28 29
80
88
89
100
2
4
6
8
10
9
10
4
5
19
20
13
12
27
26
23, 24
A
E
B
C
D
A
A+5V
F
DETECTOR
A
B
C
D
RF
SUMMING
AMP
FOCUS
ERROR AMP
RF EQ
SWITCH
Q102, 103
RF EQ
AMP
TRACKING
ERROR AMP
RFO
17
RFE
FE
FE BIAS
RF AMP,
FOCUS/TRACKING ERROR AMP
IC103
TE
E
FF I-V AMP
E I-V AMP
AUTOMATIC
POWER
CONTROL
Q101
OPTICAL
TRANSCEIVER
IC107
CD OPTICAL
DIGITAL OUT
APC LD
AMP
APC PD
AMP
LD
LD
PD
LASER DIODE
RFAC MIX
ASYO
ASYI
CTL1
CTL2
FILTER
FILO
PCO
CLTV
FILI
DIGITAL PLL
ASYMMETRY
CORRECTOR
EFM
DEMODULATOR REGISTER
DIGITAL SIGNAL PROCESSOR
IC101 (1/2)(BD BOARD)
MON
MDP
MDS
94 95 96 97
FSW
CLV
PROCESSOR
18-TIMES
OVERSAMPLING
FILTER
NOISE
SHAPER
INTERNAL BUS
32K
RAM
ERROR
CORRECTOR
SUBQ
SQCK
83
SCLK
79
MUTE
76
EXCK
SUBCODE Q
PROCESSOR
SUBCODE P – W
PROCESSOR
SYNC
PROTECTOR
TIMING
GENERATOR 1
TIMING
GENERATOR 2
DATA DATA
BCK
LRCK
64
XTSL
VCKI
XTAO
62
XTAI
BCLK
LRCK
RFCK
GFS
56
C2PO C2PO
CTL1
DOUT
DIGITAL
OUT
SERIAL/PARALLEL
PROCESSOR
D/A DIGITAL
PROCESSOR
CLOCK
GENERATOR
ADDRESS
GENERATOR
PRIORITY
ENCODER
PEAK
DETECTOR
74
SCOR
73
WFCK
75
SBSO
18
28
SENSE CLK
1
SENSE
5
3
DSP CLK
DSP DATA
4
DSP LATCH
81
SE
TE
FE
RFDC
FOCUS/TRACKING/SLED
SERVO DSP
FOCUS/TRACKING/SLED
PWM GENERATOR
SFDR
IN+
IN–
OUT+
OUT–
IN–
IN+
IN–
IN+
15
MUTE
SRDR
TFDR
TRDR
FFDR
FRDR
SSTP
COUT
S101
(LIMIT)
A+5V
MIRR/DFCT/
FOK
DETECTOR
SERVO AUTO
SEQUENCER
SERVO
INTERFACE
CPU
INTERFACE
CLOK 86
DATA
87
99
XLAT
SENS
FOK
91
92
MIRR
DFCT
IN+, IN–
OUT+
OUT–
M101
(SPINDLE)
MOTOR
DRIVE
XRST
LDON
10
DSP MUTE
MOTOR
DRIVE
COIL
DRIVE
OUT–
OUT+
COIL
DRIVE
M
M
M102
(SLED)
16
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
IC102
2-AXIS
DEVICE
(TRACKING)
(FOCUS)
DIGITAL SERVO
PROCESSOR
IC101 (2/2)
(BD BOARD)
OPTICAL PICK-UP
(KSS-213BA/F-NP)
LDON
PD
(Page 17)
•SIGNAL PATH
: CD PLAY
: DIGITAL OUT
I-V AMP
2
1
17
16
2
CTRL1 CTL1
CTL2
11
CTRL2 27
SUBQ DATA
36
SUBQ CLK
SCOR
37
VARI-PITCH
DOUBLE SPEED
MCLK
33.8MHz
B(Page 17)
DATA, BCK,
LRCK, C2PO
C(Page 17)
RESET
IC104
D+5V
TBL-L
TBL-R M
3
6
7
2
MOTOR
DRIVE
DISC TRAY TURN MOTOR DRIVE
IC701
OUT1
OUT2
IN1
IN2 M701
(TURN MOTOR)
SYSTEM CONTROLLER
IC101 (1/3)(MAIN BOARD)
LEVEL SHIFT
Q701
DISC SENSOR
IC703
TABLE SENSOR
IC702
ROTARY
ENCODER
S811
DISC-SENS
OPEN
S801
(OPEN/CLOSE DET)
ENC1
ENC2
ENC3
75
T-SENS 76
4
80
CLOSE
OPEN
81
79
78
2
3
60
61
LOAD-OUT
LOAD-IN M
10
2
7
4
MOTOR
DRIVE
DISC TRAY SLIDE MOTOR DRIVE
IC801
OUT1
OUT2
FIN
RIN M801
(SLIDE MOTOR)
63
64

HTC-VX500
1717
AUDIO/VIDEO CD SECTION
PROGRAM ROM
IC506
16
• SIGNAL PATH
: CD PLAY (AUDIO)
: CD PLAY (VIDEO)
D/A
CONVERTER
INPUT
INTERFACE
CIRCUIT
OSC
BUFFER
IC504
LOW-PASS
FILTER
IC101
B.P.F.
B.P.F.
VIDEO
BUFFER
Q301
VIDEO
BUFFER
Q303
VIDEO
BUFFER
Q307
VIDEO
BUFFER
Q308
VIDEO
BUFFER
Q601
VIDEO
BUFFER
Q304
VIDEO AMP
IC401 (1/2)
VIDEO AMP
IC401 (2/2)
VIDEO SELECT
IC601
SHARPNESS
CONTROL SWITCH
Q306
SHARPNESS
FILTER
Q302
VIDEO
MUTE
Q454
VIDEO
MUTE
Q453
Y/C MIX
Q310
BUFFER
Q502
LOW-PASS
FILTER
MODE
CONTROL
TIMING CONTROL/
CLOCK GENERATOR
DIGITAL FILTER,
D/A CONVERTER
IC509
MPEG VIDEO/AUDIO DECODER,
VIDEO SIGNAL PROCESSOR
IC505
CD MECHANISM CONTROLLER
IC502 (2/2)
EXPANSION
IC402
14
11
VOUTL
VOUTR R-CH
10
RSTB
17
18
19
20
21
9 724 1
DATA
BCK
LRCK
CD-ROM
INTERFACE
CIRCUIT
MPEG
SYSTEM
DECODER MPEG
VIDEO
DECODER
VIDEO
PROCESS
CIRCUIT
CPU INTERFACE
AUDIO
INTERFACE
CIRCUIT
MPEG
AUDIO
DECODER
D-RAM/ROM INTERFACE
3
4
5
CD-DATA
C2PO
DATA
BCK
LRCK
DATA,
BCK,
LRCK,
C2PO
CD-BCK
CD-LRCK
6CD-C2PO
MA0 – MA10 MD0 – MD15
D0 – D15
D0 – D15
A0 – A10
A0 – A8
384FSO
768FSO
4MCKO
X503
27MHz
MD
XT2
XT1
37
14 132928
38 42 40
72
22
19
32
21
20
33
31
12
23
24
60
69
75
113
110
111
108
106
HRDY
Y-OUT
86
DA-XCLK
VCK-IN
DA-DATA
DA-BCK
DA-LRCK
C-OUT
93
114 121
HSEL
112
HD-OUT
119
HD-IN
117
HCK
ML
8
MC
LEVEL
SHIFT
IC501
B
(Page 16)
IIC-DATA, IIC-CLK
F
(Page 19)
D
(Page 19)
CD POWER J
(Page 19)
MCLK
33.8MHz
A
(Page 16)
CD-L E
(Page 19)
C
(Page 16)
C
Y
DIGITAL
FILTER,
NOISE
SHAPER
CIRCUIT
58 – 56, 54, 52 – 50, 48, 46 – 44 10 – 15, 17, 19, 21, 23 – 29
16 – 19, 22 – 26
A0 – A10
12 – 5, 27, 26, 23
D8 – D14
A11 – A17
25, 4, 28, 29, 3, 2, 30
D0 – D7
O0 – O7
A0 – A10
DQ1 – DQ16
ADDRESS BUS
DATA BUS
D-RAM
IC507
A0 – A8
13 – 15, 17 – 212 – 5, 7 – 10, 31 – 34, 36 – 39
WE
22
CE
RAS
LCAS
UCAS
CAS
RESET
HINT
CL680 RESET
CL680 HINT
CL680 HRDY
CL680 SEL
DATA1I
93 NT/PAL
TEST LED
CLK1
DATA1O
ITOU
UTOI
45 BUS
DATA
CLK
DF LATCH
34
73
2
1
7
5
SHARPNESS
65
VMUTE
77
XRESET
10918
UTAU
UTAI
29
30 TXD
RXD
29
30 DATA
CLK
14 13
12C.CLK
12C.DATA
IIC-DATA
IIC-CLK
IIC-DATA
IIC-CLK
XOUT
XIN
1112
RXD
TXD
RESET
RESET
RAS0
MWE MCE
DEVICE RESET RESET
13
1
2
3
4
J301
S VIDEO OUT
MONITOR OUT
J601
VIDEO IN
XOUT
XIN
X501
10MHz
X401
8MHz
NTSC
AUTO
PAL
S501
SYSTEM SELECT
D502
(SELF DIAGNOSIS)
73
1315
20
19
PGIO2/VSYNC/CSYNC

HTC-VX500
1818
TAPE DECK SECTION
PB EQ AMP
(DECK A)
IC611
PB LEVEL (L)
(DECK A)
REC-L
PB-L
CAPSTAN MOTOR
CONTROL SWITCH
Q1001
CAPSTAN
MOTOR DRIVE
Q336 – 339
1
G
(Page 19)
(Page 19)
L-CH
R-CH R-CH
HP101
(PLAYBACK)
PB EQ AMP
(DECK B)
IC601
L-CH
R-CH R-CH
16
R-CH
R-CH
HRPE101 (1/2)
(RECORD/PLAYBACK)
ALC REC
EQ AMP
AMS
CIRCUIT
DOLBY NR
AMP
CIRCUIT
BIAS
CONTROL
CIRCUIT
DOLBY PASS
R-CH
L.P.F.
BUFFER
Q335
M
M1
(CAPSTAN)
HRPE101 (2/2)
(ERASE)
BIAS OSC
T621
B+
(A+7V)
R-CH
3
46
28 43
36
40
35 34 39
26
31
19 15 16 18 20 22 23 24 2517
99 94 93 92 90 89 88 87
31
33
32
+
48
4
2
RV311
PB LEVEL (L)
(DECK B)
RV301
TAPE SPEED
(NORMAL)
RV1002
TAPE SPEED
(HIGH)
RV1001
REC LEVEL (L)
(DECK B)
RV301
REC BIAS (R)
(DECK B)
RV441
REC BIAS (L)
(DECK B)
BIAS OSC
Q621, 622
REC BIAS
SWITCH
Q623
ROTATION
DETECT SENSOR
(DECK A)
IC1001
RV341
BIAS
TRAP
C331, L331
REC/PB SWITCHING
IC602
SYSTEM CONTROLLER
IC101 (2/3)
DECK PROCESS
DECK A/B SELECT, PB/REC EQ AMP,
DOLBY NR AMP, ALC, AMS
IC301
AIN (L)
BIN (L)
MAOUT
PB OUT (L)
EQ OUT
(L)
MSIN
MSOUT
BIAS ON/OFF
70
120
BIAS (N)
BIAS (C)
BIAS (M)
S1004
A 120/70
B NORM/CROM ALC ON/OFF
PB A/B
NORM/HIGH
NR ON/OFF
RM ON/OFF
REC/PB/PASS
LM ON/OFF
(DECK A 120/70)
98
S1003
S1001
(A PLAY)
S1002
(B PLAY)
(A HALF)
S1008
(DECK B 120/70)
27
REC OUT (L)
ROUT (L)
RIN (L)
ALC (L)
EQ IN (L) ALC IN (L)
44 38
97
AMS-IN
26
A-SHUT
ROTATION
DETECT SENSOR
(DECK B)
IC1002
27
B-SHUT
TRIGGER
PLUNGER DRIVE
(DECK A)
Q333, 334
84
A-TRG
TC-MUTE
R/P-PASS
NR-ON/OFF
REC-MUTE
BIAS
EQ-H/N
PB-A/B
ALC-ON/OFF
TC-RELAY
A-PLAY-SW B-PLAY-SW A-HALF
28
S1006
(B HALF)
S1009
(REC B)
S1005
(REC A)
B-HALF
SL1
TRIGGER PLUNGER
DECK A
TRIGGER
PLUNGER DRIVE
(DECK B)
Q331, 332
83
B-TRG
82
CAP-M-H/L
CAPSTAN
MOTOR DRIVE
Q340 – 343
100
CAPM-ON/OFF(+)
1
CAPM-EMG(+)
85
86
CAPM-EMG(–)
CAPM-ON/OFF(–)
SL2
TRIGGER PLUNGER
DECK B
95 96
H
• SIGNAL PATH
: PB (DECK A)
: PB (DECK B)
: REC

HTC-VX500
1919
POWER SECTION
THIS NOTE IS COMMON FOR PRINTEDWIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this,the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•¢: internal component.
•1: fusible resistor.
•C: panel designation.
For printed wiring boards.
Note:
•X: parts extracted from the component side.
•p: parts mounted on the conductor side.
•®:Through hole.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Abbreviation
HK : Hong Kong model
SP : Singapore model
MY : Malaysia model
EA : Saudi Arabia model
TH : Thai model
IA : Indonesia model
•U: B+ Line.
•V: B– Line.
•H: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• VoltagesaretakenwithaVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM
f: AM
E: PB (DECK A)
d: PB (DECK B)
G: REC (DECK B)
J: CD (AUDIO)
L: CD (VIDEO)
c: DIGITAL OUT
• Indication of transistor
Q
C
These are omitted
EB
RESET
IC101
11
10
X101
5MHz
15
16
65
67
72
54
70
69
CD-PLAY
D224-230
DISC1
DISC2
DISC3
EXIST1
EXIST2
EXIST3
LED
ON/OFF
SWITCH
Q214-223
57 XRST
46 CD-POWER 55
56
IIC DATA
IIC CLK
RESET
X1
X2
MASTER CONTROL
IC101
DECO1
DECO2
CD-PAUSE
CD-L
CD-POWER
IIC-DATA
IIC-CLK
RESET
PB L
REC L
52
(Page 17)
(Page 17)
(Page 17)
(Page 17)
KEY
MATRIX
53
• R CH: Same as L ch
• SIGNAL PATH
: CD
: PB
: REC
68
66
LED1
LED2
LED3
LED4
LED5
LED6
2
3
4
5
7
KEY B
KEY A
30
29
6
D201-206
LED
ON/OFF
SWITCH
Q201-206
+7.5V REG
Q852
+12V REG
IC851
3 1
+5V SW
Q102-104
-7.5V REG
Q855
+5V REG
IC854
3 1
+
-
+7V REG
IC853
3
A+7.5V
D+5V
A+5V
M12V
+5V
M+7V
A-7.5V
117
13
(CD R)
R CH
(PB R)
R CH
(REC R)
R CH
CNB108
2
3
9
7
6
4
14
16
RECT
D901-904
SYSTEM
CONTROL
+5V REG
IC852
3 1
J
D
F
E
(Page 18)
G
(Page 18)
H
CThese are omitte
d
EB
Note: The components identified by mark !or dotted line
with mark !are critical for safety.
Replace only with part number specified.

HTC-VX500
2020
6-3. PRINTEDWIRING BOARD CD SECTION • Refer to page 15 for Circuit Boards Location.
16
(Page 32)
BA F
Ref. No. Location
IC101 E-4
IC102 C-10
IC103 E-2
IC104 F-9
Q101 E-12
Q102 C-2
Q103 C-2
• Semiconductor
Location