ST STEVAL-STWINBX1 User manual

Introduction
The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design that simplifies prototyping and testing of
advanced industrial sensing applications in IoT contexts such as condition monitoring and predictive maintenance.
It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features a higher mechanical accuracy in the
measurement of vibrations, an improved robustness, an updated BoM to reflect the latest and best-in-class MCU and industrial
sensors, and an easy-to-use interface for external add-ons.
The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery, an adapter for the ST-LINK debugger, a
plastic case, an adapter board for DIL 24 sensors and a flexible cable.
The many on-board industrial-grade sensors and the ultra-low power MCU enable applications that feature: ultra-low power,
9 DoF motion sensing, wide-bandwidth vibration analysis, audio and ultrasound acoustic inspection, very precise local
temperature, and environmental monitoring.
A rich set of software packages is available in source code. Optimized firmware libraries and a complete companion cloud
application help to speed up the design cycle to develop end-to-end solutions.
The kit supports a broad range of connectivity options, including the built-in RS485 transceiver, BLE, Wi-Fi, and NFC.
The STWIN.box also includes a 34-pin expansion connector for small form factor daughter boards associated with the STM32
family, such as the STEVAL-C34KAT1 vibrometer and temperature sensors expansion board.
The STWIN.box is suitable for field trials, demonstrations, and PoC for industrial IoT applications that use ST software and
third-party software.
Figure 1. STWIN.box mounted with the plastic case
Getting started with the STEVAL-STWINBX1 SensorTile wireless industrial node
development kit
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User manual
UM2965 - Rev 1 - December 2022
For further information contact your local STMicroelectronics sales office. www.st.com

1Getting started
1.1 Precautions for use
Warning: Charge your device with a DC 5 V–500 mA USB charger at a temperature from 10°C to
35°C.
The kit must be used within the working temperature range. It must never be exposed to
excessive heat such as direct sunlight, fire, or heating equipment.
Danger: Use only USB chargers equipped with short-circuit protections to prevent fire hazard.
Danger: Use only the LiPo battery provided with the kit (HiMax 752535). A replacement of the battery
with an incorrect type can defeat a safeguard.
LiPo batteries can be damaged and even explode if they are short-circuited or overcharge
or with an improper usage, such as mechanical crushes, hot oven, or battery cutting.
1.2 Features
• Multisensing wireless platform for vibration monitoring and ultrasound detection
•Built around STWIN.box core system board with processing, sensing, connectivity, and expansion
capabilities
• Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048 kBytes Flash memory
(STM32U585AI)
• MicroSD card slot for standalone data logging applications
• On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi (EMW3080) and NFC
(ST25DV04K)
• Option to implement authentication and brand protection secure solution with STSAFE-A110
• Wide range of industrial IoT sensors:
– Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
– 3D accelerometer + 3D gyro iNEMO inertial measurement unit (ISM330DHCX) with Machine
Learning Core
– High-performance ultra-low-power 3-axis accelerometer for industrial applications (IIS2DLPC)
– Ultra-low power 3-axis magnetometer (IIS2MDC)
– High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Embedded Machine
Learning Core (IIS2ICLX)
– Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in full-mold package
(ILPS22QS)
– Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature sensor (STTS22H)
– Industrial grade digital MEMS microphone (IMP34DT05)
– Analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
• Expandable via a 34-pin FPC connector
1.3 Kit components
The STEVAL-STWINBX1 development kit includes:
• the STWIN core system (main board);
• a plastic case with M3 bolts;
• a 480 mAh 3.7 V LiPo battery;
• STEVAL-MKIGIBV4 ST-LINK adapter with programming cable;
• an adapter board for DIL24 sensors with a flexible cable.
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Figure 2. STEVAL-STWINBX1 components
1.4 Layout of the core system board (STEVAL-STWINBX1) components
Figure 3. Layout of the core system board top components
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Layout of the core system board (STEVAL-STWINBX1) components
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Figure 4. Layout of the core system board bottom components
1.5 Core system board
Figure 5. STEVAL-STWINBX1 block diagram
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Figure 6. STEVAL-STWINBX1 evaluation kit (top view)
Figure 7. STEVAL-STWINBX1 evaluation kit (bottom view)
1.6 Functional blocks
1.6.1 Sensing
The core system board offers a comprehensive range of sensors specifically designed to support industrial
applications and satisfy the demanding requirements of the Industry 4.0.
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Figure 8. STEVAL-STWINBX1 - overview of the sensing components
The motion sensors communicate with the STM32U585AI microcontroller via SPI in order to accommodate the
high data rates, whereas the magnetometer and environmental sensors communicate via I²C. The suitably filtered
signal from the IMP23ABSU analog microphone is amplified by a TSV912 op-amp and then sampled by the
internal 12-bit ADC of the MCU. The signal from the digital microphone is directly managed by the audio digital
filter (ADF) interface of the MCU.
Figure 9. STEVAL-STWINBX1 - sensors on the top side
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Figure 10. STEVAL-STWINBX1 - sensors on the bottom side
• U3: ILPS22QS MEMS pressure sensor
•U6: STTS22H digital temperature sensor
• U8: TSV912 wide-bandwidth (8 MHz) rail-to-rail I/O op-amp
• U9: ISM330DHCX iNEMO IMU, 3D accelerometer and 3D gyroscope with Machine Learning Core and
Finite State Machine
• U11: IIS3DWB wide bandwidth accelerometer
• U12: IIS2DLPC high-performance ultra-low-power 3-axis accelerometer for industrial applications
• U13: IIS2MDC 3-axis magnetometer
• U21: IIS2ICLX high-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Machine Learning
Core
• M1: IMP23ABSU analog MEMS microphone
• M2: IMP34DT05 digital MEMS microphone
1.6.1.1 ILPS22QS
The ILPS22QS is an ultra-compact piezoresistive absolute pressure sensor, which functions as a digital output
barometer. It supports dual full-scale up to 4 bar, selectable by the user.
The ILPS22QS embeds a sensing element and an IC interface that communicates over I²C, MIPI I3CSM or SPI
interfaces from the sensing element to the application. It also supports a 1.2 V digital interface.
The ILPS22QS features an analog hub-sensing functionality, which is able to connect an analog input and convert
it to a digital signal for embedded processing.
The ILPS22QS is available in a full-mold, holed LGA package. It is guaranteed to operate over a temperature
range extending from -40°C to +105°C. The package is holed to allow the external pressure to reach the sensing
element.
Table 1. ILPS22QS I/O configuration
I/O Configuration
PH4 I2C2_SCL
PF0 I2C2_SDA
1.6.1.2 STTS22H
The STTS22H is an ultra-low-power, high-accuracy, digital temperature sensor. It offers a high performance over
the entire operating temperature range.
The STTS22H is coupled with an ASIC featuring A/D converter, signal processing logic, and an I²C/SMBus 3.0
interface.
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The sensor is housed in a small 2 x 2 x 0.50 mm 6-lead UDFN package with the exposed pad down for a better
temperature match with the surrounding environment.
The STTS22H is factory-calibrated and requires no additional calibration.
The STTS22H units are 100% tested on a production setup that is NIST traceable and verified with equipment
calibrated in accordance with the IATF 16949:2016 standard.
Table 2. STTS22H I/O configuration
I/O Configuration
PH4 I2C2_SCL
PF0 I2C2_SDA
PF5 INT
1.6.1.3 TVS912
The TSV91x and TSV91xA operational amplifiers offer low voltage operation and rail-to-rail input and output.
They also offer an excellent speed/power consumption ratio, providing an 8 MHz gain-bandwidth product while
consuming only 1.1 mA maximum at 5 V.
The op amps are unity-gain stable and feature an ultra-low input bias current. The devices are ideal for sensor
interfaces, battery-supplied, and portable applications, as well as active filtering.
1.6.1.4 ISM330DHCX
The ISM330DHCX is a system-in-package that features a high-performance 3D digital accelerometer and a 3D
digital gyroscope tailored for Industry 4.0 applications.
The various sensing elements are manufactured using specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed
to match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the
same silicon die, guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of
±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy,
stability, extremely low noise, and full data synchronization. The embedded features (Machine Learning Core,
programmable FSM, FIFO, sensor hub, event decoding, and interrupts) enable smart and complex sensor nodes,
which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.
Table 3. ISM330DHCX I/O configuration
I/O Configuration
PI1 SPI2_CLK
PI3 SPI2_MOSI
PD3 SPI2_MISO
PH15 SPI_CS
PB8 INT1
PF4 INT2
1.6.1.5 IIS3DWB
The IIS3DWB is a system-in package that features a 3-axis digital vibration sensor with low noise over an
ultra-wide and flat frequency range.
The wide bandwidth, low noise, very stable, repeatable sensitivity, and the capability of operating over an
extended temperature range (up to +105°C) make the device particularly suitable for vibration monitoring in
industrial applications.
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The high performance delivered at low power consumption, the digital output, and the embedded digital features,
such as FIFO and the interrupts, enable features for battery-operated industrial wireless sensor nodes.
The IIS3DWB has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring
accelerations with a bandwidth up to 6 kHz with an output data rate of 26.7 kHz.
The device integrates a 3 kB first-in, first-out (FIFO) buffer to avoid any data loss and to limit intervention of the
host processor.
The ST MEMS sensor module family leverages the robust and mature manufacturing processes already used for
the production of micromachined accelerometers and gyroscopes to serve automotive, industrial, and consumer
markets. The sensing elements are manufactured using the ST proprietary micromachining process, whereas the
embedded IC interfaces are developed using CMOS technology.
The IIS3DWB has a self-test capability, which allows checking whether the sensor is correctly working in the final
application.
The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an
extended temperature range from -40°C to +105°C.
Table 4. IIS3DWB I/O configuration
I/O Configuration
PI1 SPI2_CLK
PI3 SPI2_MOSI
PD3 SPI2_MISO
PF12 SPI_CS
PF15 INT1
- INT2
1.6.1.6 IIS2DLPC
The IIS2DLPC is a three-axis linear accelerometer with digital I²C/SPI output interface.
It has full scales of ±2g/±4g/±8g/±16g selectable by the user and can measure accelerations with output data
rates from 1.6 Hz to 1600 Hz.
The IIS2DLPC has a high-performance mode and four low-power modes, which can be changed on-the-fly,
providing outstanding versatility and adaptability to the requirements of the application.
The accelerometer has an integrated 32-level first-in, first-out (FIFO) buffer that allows the user to store data in
order to limit intervention by the host processor. The embedded self-test capability allows checking whether the
sensor is correctly working in the final application.
The IIS2DLPC has a dedicated internal engine to process motion and acceleration detection, including free-fall,
wake-up, highly configurable single/double-tap recognition, activity/inactivity, stationary/motion detection, portrait/
landscape detection, and 6D/4D orientation.
The IIS2DLPC is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate
over an extended temperature range from -40°C to +85°C.
Table 5. IIS2DLPC I/O configuration
I/O Configuration
PI1 SPI2_CLK
PI3 SPI2_MOSI
PD3 SPI2_MISO
PH6 SPI_CS
PF1 INT1
PF2 INT2
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1.6.1.7 IIS2ICLX
The IIS2ICLX is a high-accuracy (ultra-low noise, high stability, and repeatability) and low-power two-axis linear
accelerometer with digital output.
The IIS2ICLX has a selectable full scale of ±0.5/±1/±2/±3 g. It can provide the measured accelerations to the
application over an I²C or SPI digital interface. Its high accuracy, stability over temperature, and repeatability
make IIS2ICLX particularly suitable for inclination measurement applications (inclinometers).
The sensing element is manufactured using a dedicated micromachining process developed by
STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a
dedicated circuit, which is trimmed to match the characteristics of the sensing element.
The IIS2ICLX has an unmatched set of embedded features (programmable FSM, machine learning core, sensor
hub, FIFO, event decoding, and interrupts). These features are enablers for implementing smart and complex
sensor nodes, which deliver high accuracy and performance at very low power.
The IIS2ICLX is available in a high-performance (low-stress) ceramic cavity land grid array (CCLGA) package. It
can operate within a temperature range of -40°C to +105°C.
Table 6. IIS2ICLX I/O configuration
I/O Configuration
PI1 SPI2_CLK
PI3 SPI2_MOSI
PD3 SPI2_MISO
PI7 SPI_CS
PF3 INT1
PF11 INT2
1.6.1.8 IIS2MDC
The IIS2MDC is a high-accuracy, ultra-low-power, 3-axis digital magnetic sensor. It features a magnetic field
dynamic range up to ±50 gausses.
The IIS2MDC includes an I²C serial bus interface, which supports standard, fast mode, fast mode plus, and
high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz), and an SPI serial standard interface.
You can configure the device to generate an interrupt signal for magnetic field detection.
The IIS2MDC is available in a plastic land grid array package (LGA) and is guaranteed to operate over an
extended temperature range from -40°C to +85°C.
Table 7. IIS2MDC I/O configuration
I/O Configuration
PH4 I2C2_SCL
PF0 I2C2_SDA
PF9 INT
1.6.1.9 IMP23ABSU
The IMP23ABSU is a compact, low-power microphone with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon-
micromachining process to produce audio sensors.
The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.
The microphone sensitivity is -38 dBV ±1 dB at 94 dBSPL, 1 kHz.
The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an
extended temperature range from -40°C to +85°C.
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