Intrinsyc LANTRONIX Open-Q 820 User manual

Open-Q™ 820/ 820Pro µSOM
Development Kit
User Guide
Part Number PMD-00043
Revision A August 2020

Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 7
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc
Purchase an Open-Q 820 µSOM Development Kit Based on Qualcomm™ APQ8096 Processor and
Software License Agreement for the Open-Q 820 µSOM Development Kit, which you or the legal
entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q
Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this
document, which shall be considered part of the defined term “Documentation” for purposes of the
Agreement, solely in support of your permitted use of the Open-Q 820 µSOM Development Kit under
the Agreement. Distribution of this document is strictly prohibited without the express written
permission of Intrinsyc Technologies Corporation and its respective licensors, which they can
withhold, condition or delay in its sole discretion.
Lantronix is a trademark of Lantronix, Inc., registered in the United States and other countries.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other
countries.
Qualcomm® and Snapdragon are trademarks of Qualcomm® Incorporated, registered in the United
States and other countries. Qualcomm APQ8096 is a product of Qualcomm Technologies, Inc. and/or
its subsidiaries. Other product and brand names used herein may be trademarks or registered
trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export,
or transfer (“export”) laws. Diversion contrary to U.S. and international law is strictly prohibited.
© 2020 Lantronix, Inc. All rights reserved.
Contacts
Lantronix, Inc.
7535 Irvine Center Drive, Suite 100
Irvine, CA 92618, USA
Toll Free: 800-526-8766
Phone: [phone]
Fax: [phone]
IES Customer Support Portal
https://helpdesk.intrinsyc.com
Lantronix Technical Support
http://www.lantronix.com/support
Sales Offices
For a current list of our domestic and international sales offices, go to the Lantronix web site at
http://www.lantronix.com/about-us/contact/

Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 8
Revision History
Date
Rev.
Comments
December 2016
1.0
Initial release.
Intrinsyc document number: ITC-01RND1239-UG-001
January 2017
1.1
Added info on battery charging software
Updated figure 16
February 2017
1.2
Added information on GPS antenna
February 2017
1.3
Added information on WiFi/ BT certification
June 2019
1.4
Update doc to include 820Pro µSOM development kit.
Updated USB port descriptions
August 2020
A
Initial Lantronix document.
Added Lantronix document part number, Lantronix logo,
branding, contact information, and links.
For the latest revision of this product document, please go to: http://tech.intrinsyc.com.

Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 9
Contents
1Introduction 11
1.1 Purpose____________________________________________________________11
1.2 Scope _____________________________________________________________11
1.3 Intended Audience ___________________________________________________11
2Documents 7
2.1 Applicable Documents _________________________________________________7
2.2 Reference Documents _________________________________________________7
2.3 Terms and Acronyms __________________________________________________7
2.4 List of Figures ________________________________________________________9
2.5 List of Tables ________________________________________________________9
3Open-Q 820 µSOM Development Kit 11
3.1 Introduction _________________________________________________________11
3.2 Development Platform Notice ___________________________________________11
3.3 Anti-Static Handling Procedures_________________________________________11
3.4 Kit Contents ________________________________________________________11
3.5 Hardware Identification Label ___________________________________________13
3.6 System Block Diagram ________________________________________________13
3.7 Open-Q 820 / 820Pro µSOM ___________________________________________14
3.7.1 µSOM Mechanical Properties________________________________________15
3.7.2 µSOM Block Diagram ______________________________________________15
3.8.1 Hardware Specification_____________________________________________17
3.8.2 µSOM RF Specification for WIFI, BT, GPS _____________________________18
3.9 Open-Q 820 / 820Pro µSOM Carrier Board ________________________________20
3.9.1 Dip switch S10 Configuration Options _________________________________20
3.9.2 Carrier Board Expansion Connectors__________________________________21
3.9.3 DC Power Input J21 _______________________________________________26
3.9.4 Battery Header J300_______________________________________________28
3.9.5 Power Probe Header J86 ___________________________________________29
3.9.6 Debug Serial UART Header J61 _____________________________________29
3.9.7 Debug Serial UART over USB J22____________________________________30
3.9.8 Sensor IO Expansion Header J53 ____________________________________31
3.9.9 Education / GPIO header J54 (EXP2) _________________________________34
3.9.10 ANC Headset Jack J27 ___________________________________________35
3.9.11 Audio Inputs Expansion Header J50 _________________________________36
3.9.12 Audio Outputs Expansion Header J26 ________________________________37
3.9.13 On Board PCB WLAN Antenna _____________________________________38
3.9.14 External and on-Board PCB GPS Antenna ____________________________39
3.9.15 Open-Q Display _________________________________________________39

Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 10
3.9.16 HDMI Connector J25 _____________________________________________40
3.9.17 Display Connector J2 _____________________________________________41
3.9.18 PCI Express 1X Slot J30 __________________________________________45
3.9.19 Mini PCI Express Connector J72 ____________________________________46
3.9.20 Camera Connectors ______________________________________________47
3.9.21 Power Header via 20 Pin Connector J60 ______________________________52
3.9.22 Ethernet AVB Expansion Header J73 ________________________________54
3.9.23 VIP Expansion Header J71 ________________________________________54
3.9.24 USB 2.0 Client Port Operation ______________________________________55
3.9.25 USB 2.0 Interface Operation _______________________________________55
3.9.26 USB 3.0 Interface Operation _______________________________________56

Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 11
1 Introduction
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™ 820 / 820Pro µSOM
Development Kit.
For more background information on this development kit, visit: https://www.intrinsyc.com/snapdragon-
embedded-development-kits/open-q-820-usom-development-kit/
1.2 Scope
This document will cover the following items on the Open-Q 820 / 820Pro µSOM Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•µSOM
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the Open-Q 820 /
820Pro µSOM Development Kit.

Documents
2 Documents
This section lists the supplementary documents for the Open-Q 820/ 820Pro µSOM development kit.
2.1 Applicable Documents
Reference
Title
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q Development
Kit
2.2 Reference Documents
Reference
Title
R-1
Hardware Document Set for the Qualcomm™ APQ8096/AP8096SG based Open-
Q Development Kit
R-2
Open-Q 820 / 820Pro Schematics (µSOM, Carrier)
R-3
Open-Q 820 / 820Pro µSOM Carrier Board Design Guide Tech Note 19
R-4
ITCNFA324 Module Certification OEM Integrator Instructions
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial
interfaces like UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only
memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission

Documents
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 8
Term and acronyms
Definition
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
µSOM
micro System On Module
SPMI
System Power Management Interface
(Qualcomm® PMIC / baseband proprietary
protocol)
SSBI
Single wire serial bus interface (Qualcomm®
proprietary mostly PMIC / Companion chip and
baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

Documents
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 9
2.4 List of Figures
Figure 1 Assembled Open-Q 820 / 820Pro µSOM Development Kit ................................................... 12
Figure 2 Open-Q 820 / 820Pro µSOM + Carrier Board Block Diagram ............................................... 14
Figure 3 Open-Q 820 / 820Pro µSOM................................................................................................. 15
Figure 4 µSOM Block Diagram............................................................................................................. 16
Figure 5 J21 12V DC Power Jack ........................................................................................................ 27
Figure 6 J300 Battery Header .............................................................................................................. 28
Figure 7 J86 Power Probe Header ....................................................................................................... 29
Figure 8 J61 3.3V TTL Debug UART ................................................................................................... 29
Figure 9 J22 Debug UART over USB................................................................................................... 30
Figure 10 J53 Sensor Expansion Header ............................................................................................ 31
Figure 11 J55 Gen-10 Sensor Connector (Samtec QSH-030 series) .................................................. 33
Figure 12 J54 Education / GPIO header .............................................................................................. 34
Figure 13 ANC Headphone Jack.......................................................................................................... 35
Figure 14 J50 Audio Inputs Expansion Header.................................................................................... 36
Figure 15 J26 Audio Outputs Expansion Header ................................................................................. 37
Figure 16 On Board PCB Antennas ..................................................................................................... 39
Figure 17 HDMI Type A Connector ...................................................................................................... 40
Figure 18 100-Pin Display Connector .................................................................................................. 41
Figure 19 Display Board Block Diagram .............................................................................................. 43
Figure 20 Display Board Default Configuration .................................................................................... 44
Figure 21 J30 PCIe Connector ............................................................................................................. 45
Figure 22 J72 Mini PCIe Connector ..................................................................................................... 46
Figure 23 Mounting holes for Mini PCIe Connector ............................................................................. 47
Figure 24 Camera Connectors (J5, J4, J3) .......................................................................................... 48
Figure 25 J60 Power Connector........................................................................................................... 52
Figure 26 J73 Ethernet AVB Expansion Header .................................................................................. 54
Figure 27 J71 VIP Expansion Header .................................................................................................. 54
Figure 28 J24 USB2.0 for ADB............................................................................................................. 55
Figure 29 J85 USB1 Connector............................................................................................................ 55
Figure 30 S1 Board Configuration Switch (on Bottom of Development Kit)......................................... 56
Figure 31 J23 USB3.0 Host Ports ........................................................................................................ 56
Figure 32 J2600 USB3.0 Expansion Connector................................................................................... 57
2.5 List of Tables
Table 3.7-1 Open-Q 820 / 820Pro µSOM Hardware Features............................................................. 17
Table 3.8-1 Dip Switch HW / SW configuration.................................................................................... 20
Table 3.8-2 Carrier Board Expansion Options and Usage................................................................... 21
Table 3.8-3 Sensor Expansion Header J53 Pin out ............................................................................. 31
Table 3.8-4 Education Connector Expansion Header J54 Pin Out ...................................................... 34
Table 3.8-5 Audio Inputs Expansion Header J50 Pin out .................................................................... 36
Table 3.8-6 Audio Outputs Expansion Header J26 Pin out.................................................................. 38

Documents
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 10
Table 3.8.20-1. MIPI CSI Camera Connector Pinouts (J5,J4,J3) ........................................................ 48
Table 3.8.20-2. MIPI CSI Camera Use Cases ..................................................................................... 51

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 11
3 Open-Q 820 µSOM Development Kit
3.1 Introduction
The Open-Q 820 / 820Pro µSOM provides a quick reference or evaluation platform for Qualcomm’s latest 820
series - Qualcomm™APQ8096 processor. This kit is suited for Android / Linux application developers, OEMs,
consumer manufacturers, hardware component vendors, video surveillance, robotics, camera vendors, and
flash chip vendors to evaluate, optimize, test and deploy applications that can utilize the Qualcomm®
Qualcomm™APQ8096 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering development,
engineering evaluation, or demonstration purposes only and is meant for use in a controlled environment. This
device is not being placed on the market, leased or sold for use in a residential environment or for use by the
general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available consumer
device including those requirements specified in the European Union directives applicable for Radio devices
being placed on the market, FCC equipment authorization rules or other regulations pertaining to consumer
devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have obtained
the necessary regulatory approvals for experimentation using a radio device and have appropriate technical
training. The device may not be used by members of the general population or other individuals that have not
been instructed on methods for conducting controlled experiments and taking necessary precautions for
preventing harmful interference and minimizing RF exposure risks. Additional RF exposure information can be
found on the FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 820 / 820Pro µSOM Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap
3.4 Kit Contents
The Open-Q 820 / 820Pro µSOM Development Kit includes the following:
oOpen-Q 820 µSOM with Qualcomm™processor or
Open-Q 820Pro µSOM with Qualcomm™processor
oMini-ITX form-factor carrier board
o4.5” FWVGA (480x854) 16.7 M LCD (Additional Accessory)
oAC power adapter and HDMI cable

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 12
Figure 1 Assembled Open-Q 820 / 820Pro µSOM Development Kit
The development kit comes with Android software pre-programmed on the CPU board (µSOM). Please
contact Lantronix for availability of camera modules, sensor boards, and other accessories:
[e-mail]

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 13
3.5 Hardware Identification Label
Labels are present on the CPU board and the mini-ITX form-factor carrier board. The following information is
conveyed on these two boards:
CPU board (µSOM).:
•Serial Number
•WIFI MAC address
Refer to http://tech.intrinsyc.com/projects/serialnumber/wiki for more details about locating the serial
number, as this will be needed to register the development kit. To register a development kit, please visit
https://tech.intrinsyc.com/account/register.
Mini-ITX form-factor carrier board:
•Serial Number
Note: Please retain the µSOM and carrier board serial number for warranty purposes.
3.6 System Block Diagram
The Open-Q 820 / 820Pro µSOM development platform consists of three major components
oOpen-Q 820 / 820Pro µSOM
oCarrier board for I/O and connecting with external peripherals
oDisplay Adapter Board (additional accessory)
The following diagram explains the interconnectivity and peripherals on the development kit.

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 14
5`
APQ8096 /
APQ8096SG
LPDDR4
3GB /
4GB
(PoP)
PMi8996
PM8996
4-bit SDIO
4L DSI
SPI/I2C
USB HS
HDMI
QCA6174
WiFi/BT
GPS
WGR7640
WCD9335
Codec
SOM
Carrier Board
SLIMBUS
IQ + SSBI
Display & Touch
Connector
4L DSI
CSI 0
CSI 1
CSI 2
Audio
Exp. Connectors
3 x DMICs
3 x AMICs
1 x HPH
Headset
conn.
(ANC)
DC
Jack
GPS
Antenna
SMA
(optional)
USB HS USB1
LEDs
RGB
BPLSs / MPPs / GPIOs
Sensor
Connector
SSCs / GPIOs / IRQs
3 x AMICs
4 x Line-out
DSI 0
DSI 1
/3
Controls
USB2
SLOT
I2S
PCIe0
GPIO’s
CCI0/1
MIC BIAS
UFS
32 to 64GB
UFS
1 lane
UFS
EXP1 (EDU)
Connector
BT/WiFi
Anetnnas
(2.5/5GHz)
Display Adapter
coax
coax
coax
PCM
UART
3.8V BUCK
VBAT
SPMI
SDC2
SDC1
Touchscreen
SPI/I2C
HDMI
RST/Vol -
POWER
VOL +
GENERAL
JTAG
UART
Sound wire
PCIe1
Type uB
USB
HUB
PCIe2
PCIe 2.1
PCIe 2.1
Type uB
(for Debug)
Mini card
I2S
CSI 4L
CSI 4L
CSI 4L
GPIOs/INTs
TTL to
USB
Automation
Conn
BOOT CONFIG
GPIO120
USB SS
Type A
BT1
Figure 2 Open-Q 820 / 820Pro µSOM + Carrier Board Block Diagram
3.7 Open-Q 820 / 820Pro µSOM
The µSOM provides the basic common set of features with minimal integration efforts for end users.
It contains the following:
•Qualcomm™ APQ8096 or APQ8096SG main application processor
•LPDDR4 up to 1866MHz 3GB or 4GB RAM (POP)
•PMI8996 + PM8996 – PMIC for Peripheral LDOs, Boost Regulators
•QCA6174 Atheros Wi-Fi + BT combo chip over PCIe, UART, PCM
•32 GB UFS 2.0.
•WGR7640 RF Front End

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 15
Figure 3Open-Q 820 / 820Pro µSOM
3.7.1 µSOM Mechanical Properties
Area
12.5 cm2(25 mm x 50 mm)
Interface
3 x 100-pins Hirose DF40 connectors (B2B
Connector).
Thermal
A top side heat sink is installed by default.
Shielding
A top side shield can for the GPS front end
is installed by default.
3.7.2 µSOM Block Diagram
The Open-Q 820 / 820Pro µSOM measuring 25mm x 50mm is where all the processing occurs. It is connected
to the carrier via three 100 pin Hirose DF40 connectors. The purpose of these connectors is to bring out essential
signals such that other peripherals can be connected to the platform.
3.8 Anti-Static Handling Procedures
50 mm
25 mm

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 16
5
`
APQ8096 /
APQ8096SG
LPDDR4
3GB / 4GB
(PoP)
PMi8996
PM8996
4-bit SDIO
4L DSI
SPI/I2C
USB HS
USB SS
HDMI
QCA6174
WiFi/BT
GPS
WGR7640
Open-Q™ 820 /
820Pro µSOM
Carrier Board
SLIMBUS
IQ + SSBI
4L DSI
CSI 0
CSI 1
CSI 2
USB HS USB2
BPLSs / MPPs / GPIOs
SSCs / GPIOs / IRQs
DSI 0
DSI 1
Controls
USB1
I2S
I2C
PCIe0
GPIO’s
CCI0/1
UFS
32 to 64GB
UFS 1 lane UFS
PCM
UART
SPMI
SDC2
SDC1
SPI/I2C
HDMI
JTAG
UART
PCIe1
PCIe2
PCIe 2.1
PCIe 2.1
I2S
CSI 4L
CSI 4L
CSI 4L
GPIOs/INTs
BOOT CONFIG
RF
RF
RF
Power Circuit
LEDs
RGBMPP
Carrier Board
VBAT
DSI 4L
DSI 0
DSI 1 DSI 4L
Figure 4 µSOM Block Diagram

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 17
3.8.1 Hardware Specification
The Open-Q 820 / 820Pro µSOM platform encompasses the following hardware features:
Table 3.7-1 Open-Q 820 / 820Pro µSOM Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
APQ8096 or
APQ8096SG
Qualcomm Processor
Qualcomm® Kyro CPU, quad
core, 64-bit ARM V8 compliant
processor, 2.2GHz (2.34GHz
for 820Pro)
PMIC (PM8996 &
PMI8996)
Qualcomm® PMIC,
Companion PMIC for
APQ8096 processor
NA
Memory
3GB LPDDR4
(4GB for 820Pro)
Memory POP
Up to 1866MHz LPDDR4 POP
on CPU BGA chip. Supports
via 4x16bit channels
32 GB UFS
Primary Storage for platform.
Mainly used for storing SW
applications and user data
etc.
Toshiba UFS on board. Can
support up to 256GB
Connectivity
Wi-Fi 2.4 GHz/
5GHz via
QCA6174 – SDIO
Wi-Fi Atheros QCA6174 Wi-
Fi + BT Combo Chip
802.11a/b/g/n/ac 2.4/5.0 GHz
via QCA6174 over PCIe0.
Full 2x2 antenna configuration
BT 2.4 GHz via
QCA6174 – UART
/ PCM
Wi-Fi Atheros 6174
Wi-Fi + BT Combo Chip
Support BT 4.1 + HS and
backward compatible with BT
1.x, 2.x + EDR
GPS via WGR7640
– SSBI
Qualcomm®
Proprietary
Protocol
GPS Frontend
GPS, GLONASS, COMPASS
RF Interfaces
2xWLAN / BT
Connect to antenna on
carrier board via coax cable
2.4/ 5 GHz
1x GPS
Connect to antenna on
carrier board via coax cable
GPS/GLONASS/COMPASS

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 18
Subsystem /
Connectors
Feature Set
Description
Specification
Interfaces
3 x MIPI CSI
Camera Connectors
CSI0, CSI1, CSI2
MIPI Alliance Specification
v1.0
2 x USB HS & 1 x
USB SS
1 x USB3.1 header, 1 x dual
stack type A USB3.0 via USB
HUB for front USB (from
USB1 line), 1 x USB 2.0 via
switch (from USB1 line), 1 x
micro AB USB 2.0 (from
USB2 line)
USB3.1 & USB2.0
1 x MIPI DSI (DSI0
& DSI1) + Touch
100-pin display
Connector
100- pin display connector.
Interfaces with Lantronix
Display Adapter Board
MIPI Alliance Specification
v1.01. MIPI D-PHY
Specification v0.65,v0.81,
v0.90, v1.01
3 X PCIe
PCIe 0 PCIe signal to Wi-Fi
module. PCIe 1, 2 routed out
of µSOM
PCI Express Specification, Rev
2.1
Connector
3 x board to board
connector
Connectors to interface with
carrier board
Hirose DF40C series 100pin
connector
3.8.2 µSOM RF Specification for WIFI, BT, GPS
The µSOM includes the following radio interfaces:
oWi-Fi + BT: ANT1
oWi-Fi only: ANT2
oWGR7640: For GPS RF Front end
Antenna 1: Antenna 1 is used for providing Wi-Fi and Bluetooth connectivity to QCA6174. This antenna is
meant to be connected to the carrier board via a coaxial cable. The function of this connector is for extending
the dual band capabilities of the Wi-Fi chip; therefore, enabling this antenna to be used simultaneously with
Antenna 2. For example, Antenna 2 can be connected to 2.4GHz while Antenna 1 can be connected to 5.1
GHz. To turn on Bluetooth, only Antenna 1 can be used.
Antenna 2: Antenna 2 provides Wi-Fi connectivity for QCA6174. This antenna connector is meant to be
connected to the carrier board PCB antenna via a coaxial cable. ANT2 is a standard dual band antenna from
2.4 GHz to 5.1 GHz.

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 19
The µSOM WiFi/BT module has received regulatory certifications (see FCC ID: 2AFDI-ITCNFA324 for
details). Please note that the on-board PCB antennas were not the antennas used for the µSOM WiFi/BT
module certification. Refer to the certification documents for the WiFi/ BT module (see R-4) for information
regarding the test configurations used for certification. Deviating from the documented configuration may
trigger the need for re-certification.
For details on connecting the WiFi module to the on-board PCB antennas on the carrier board, refer to section
3.8.13 below.
WGR7640: GPS Front End WGR7640 is the primary GPS radio interface used on the Open-Q 820 µSOM
development kit. This provides the RF capabilities for GNSS functions. It has both digital and RF interfaces.
Digital interface is required for configuration and status of the APQ8096 baseband processor.
The following are the operating frequencies for WGR7640
GPS: 1574.42 MHz – 1576.42 MHz
GLONASS: 1598 MHz to 1606 MHz

Open-Q 820 µSOM Development Kit
Open-Q™ 820 / 820Pro µSOM Dev Kit User Guide 20
3.9 Open-Q 820 / 820Pro µSOM Carrier Board
The Open-Q 820 / 820Pro µSOM Carrier board is a Mini-ITX form factor board with various connectors used
for connecting different peripherals. The following are the mechanical properties of the carrier board:
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major Interfaces
See section 3.9 for details regarding carrier board
interfaces
3.9.1 Dip switch S10 Configuration Options
There is a DIP switch S10 on the top side of the Open-Q 820 / 820Pro µSOM carrier board. The 8-bit switch
allows the user to control the system configuration and boot options. Table 3.8-1 below outlines the pin outs
and connections of this DIP switches.
Table 3.8-1 Dip Switch HW / SW configuration
Function
DIP
Switch Description Notes
FORCED_USB_BOOT
S10-1
Toggles between FORCE USB boot
and EDL mode. Enables FORCE
USB (GPIO 57) when DIP switch
turned on
Default out of the box
configuration is OFF which is the
EDL mode
Note: FORCE USB boot option
not supported by Lantronix
NC
S10-2
N/A
N/A
BOOT_CONFIG[3]
S10-3
Enables APQ boot configuration 3
when DIP switch turned on.
Controlled by APQ GPIO104
See schematic for boot configuration
options.
NOTE: µSOMe boot configurations
are not supported on the
development kit.
Default out of the box
configuration is ON
BOOT_CONFIG[2]
S10-4
Enables APQ boot configuration 2
when DIP switch turned on.
Controlled by APQ-GPIO103
Default out of the box
configuration is OFF