Sun Microsystems GDM-5510 User manual

CHASSIS
SERVICE MANUAL
SPECIFICATIONS
GDM-5510
CR1
N. Hemisphere Model
S. Hemisphere Model
Chassis No. SCC-L33N-A
COLOR GRAPHIC DISPLAY
CRT 0.24 mm aperture grille pitch
21 inches measured diagonally
90-degree deflection
FD Trinitron
Viewable image size Approx. 403.8 ×302.2 mm (w/h)
(16 ×12 inches)
19.8" viewing image
Resolution
Recommended
Maximun
Horizontal: 1600 dots
Horizontal: 2048 dots
Vertical: 1536 lines
Vertical: 1200 lines
Input signal levels Video signal
Analog RGB: 0.700 Vp-p
(positive), 75 Ω
SYNC signal
H/V separate or composite sync:
TTL 2.2 kΩ, Polarity free
Sync on Green: 0.3 Vp-p
(negative)
Standard image area Approx. 388 ×291 mm (w/h)
(15
3
/8×11
1
/2inches)
or
Approx. 364 ×291 mm (w/h)
(14
3
/8×11
1
/2inches)
Deflection frequency* Horizontal: 30 to 130 kHz
Vertical: 48 to 170 Hz
AC input voltage/current 100 to 240 V, 50 – 60 Hz, 2.0 – 1.0 A
Power consumption Approx.135W
Dimensions
Operating temperature Approx. 510 10°C to 40°C
×508 ×505mm (w/h/d)
Mass Approx. 31.5 kg (69 lb 7 oz)
Plug and Play DDC2B/DDC2Bi, GTF**
* Recommended horizontal and vertical timing condition
• Horizontal sync width duty should be more than 4.8% of
total horizontal time or 0.8 µs, whichever is larger.
• Horizontal blanking width should be more than 2.3 µsec.
• Vertical blanking width should be more than 450 µsec.
** If the input signal is Generalized Timing Formula (GTF)
compliant, the GTF feature of the monitor will automatically
provide an optimal image for the screen.
Design and specifications are subject to change without notice.
(19
3
/4×20 ×20 inches)

GDM-5510 (E) 2
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and from all
exposed metal parts to any exposed metal part having a return to chassis,
must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA WT-
540A. Follow the manufacturers’instructions to use these instruments.
2. A battery-operated AC milliammeter. The Data Precision 245 digital
multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM or
battery-operated AC voltmeter. The “limit”indication is 0.75 V, so
analog meters must have an accurate low-voltage scale. The Simpson 250
and Sanwa SH-63Trd are examples of a passive VOMs that are suitable.
Nearly all battery operated digital multimeters that have a 2 V AC range
are suitable. (See Fig. A)
After correcting the original service problem, perform the following safety
checks before releasing the set to the customer:
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”or
contact high-wattage resistors.
3. Check that all control knobs, shields, covers, ground straps, and
mounting hardware have been replaced. Be absolutely certain that you
have replaced all the insulators.
4. Look for unauthorized replacement parts, particularly transistors, that
were installed during a previous repair. Point them out to the customer
and recommend their replacement.
5. Look for parts which, though functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
6. Check the line cords for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
7. Check the B+ and HV to see if they are specified values. Make sure your
instruments are accurate; be suspicious of your HV meter if sets always
have low HV.
8. Check the antenna terminals, metal trim, “metallized”knobs, screws, and
all other exposed metal parts for AC Leakage. Check leakage as
described below.
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k Ω 0.15 µF
AC
Voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
SAFETY CHECK-OUT

GDM-5510 (E) 3
WARNING!!
NEVER TURN ON THE POWER IN A CONDITION IN WHICH THE
DEGAUSS COIL HAS BEEN REMOVED.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY SHADING AND MARK ¡ON THE
SCHEMATIC DIAGRAMS, EXPLODED VIEWS AND IN THE
PARTS LIST ARE CRITICAL FOR SAFE OPERATION. REPLACE
THESE COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY. CIRCUIT ADJUST-
MENTS THAT ARE CRITICAL FOR SAFE OPERATION ARE
IDENTIFIED IN THIS MANUAL. FOLLOW THESE PROCEDURES
WHENEVER CRITICAL COMPONENTS ARE REPLACED OR IM-
PROPER OPERATION IS SUSPECTED.
AVERTISSEMENT!!
NE JAMAIS METTRE SOUS TENSION QUAND LA BOBINE DE
DEMAGNETISATION EST ENLEVÉE.
ATTENTION AUX COMPOSANTS RELATIFS À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE TRAME ET UNE
MARQUE ¡SONT CRITIQUES POUR LA SÉCURITÉ. NE LES
REMPLACER QUE PAR UNE PIÈCE PORTANT LE NUMÉRO
SPECIFIÉ.LES RÉGLAGESDE CIRCUITDONT L’IMPORTANCEEST
CRITIQUE POUR LA SÉCURITÉ DU FONCTIONNEMENT SONT
IDENTIFIÉS DANS LE PRÉSENT MANUEL. SUIVRE CES
PROCÉDURES LORS DE CHAQUE REMPLACEMENT DE
COMPOSANTS CRITIQUES, OU LORSQU’UN MAUVAIS
FONCTIONNEMENT EST SUSPECTÉ.

GDM-5510 (E) 4
POWER SAVING FUNCTION
This monitor meets the power-saving guidelines set by VESA,
ENERGY STAR, and NUTEK. If no signal is input to the
monitor from your computer, the monitor will automatically
reduce power consumption as shown below.
* When your computer enters power saving mode, the input signal is
cut and NO SIGNAL appears on the screen before the monitor enters
active off mode.Aftera few seconds, the monitorenters power saving
mode.
** “Deep sleep” is power saving mode defined by the Environmental
Protection Agency.
Power mode Power
consumption !(power) indicator
normal
operation ≤135 W green
active off*
(deep sleep)** ≤3 W amber
power off Approx. 0 W off

GDM-5510 (E) 5
DIAGNOSIS
Failure
+B failure
Horizontal / Vertical Deflection
failure, Thermal protector
ABL protector
HV failure
Aging / Self Test
Out of scan range
Power LED
Amber →Off
(0.5 sec) (0.5 sec)
Amber →Off
(1.5 sec) (0.5 sec)
Amber →Off
(0.5 sec) (1.5 sec)
Amber →Off →Amber →Off
(0.25 sec) (0.25 sec) (0.25 sec) (1.25 sec)
Amber →Off →Green →Off
(0.5 sec) (0.5 sec) (0.5 sec) (0.5 sec)
Green (OSD indication)
Aging Mode (Video Aging) : During Power Save, press MENU button for longer than 2 second.
Self Test (OSD Color Bar) : During Power Save, push up Control button for longer than 2 second.
Reliability Check Mode : During Power Save, push down Control button for longer than 2 second.

GDM-5510 (E) 6
TIMING SPECIFICATION
MODE AT PRODUCTION MODE 1 MODE 2 MODE 3 MODE 4 MODE 5 MODE 6
RESOLUTIION 640 X 480 1152 X 900 1152 X 900 1024 X 768 1280 X 1024 1280 X 1024
CLOCK 25.175 MHz 94.500 MHz 108.000 MHz 78.750 MHz 117.000 MHz 135.000 MHz
– HORIZONTAL –
H-FREQ 31.469 kHz 61.846 kHz 71.809 kHz 60.023 kHz 71.691 kHz 79.976 kHz
usec usec usec usec usec usec
H. TOTAL 31.778 16.169 13.926 16.660 13.949 12.504
H. BLK 6.356 3.979 3.259 3.657 3.009 3.022
H. FP 0.636 0.423 0.296 0.203 0.137 0.119
H. SYNC 3.813 1.354 1.185 1.219 0.957 1.067
H. BP 1.907 2.201 1.778 2.235 1.915 1.837
H. ACTIV 25.422 12.190 10.667 13.003 10.940 9.481
– VERTICAL –
V. FREQ (HZ) 59.940 Hz 66.004 Hz 76.149 Hz 75.029 Hz 67.189 Hz 75.025 Hz
lines lines lines lines lines lines
V. TOTAL 525 937 943 800 1067 1066
V. BLK 45 37 43 32 43 42
V.FP 1022121
V. SYNC 2 48383
V. BP 33 31 33 28 33 38
V. ACTIV 480 900 900 768 1024 1024
– SYNC –
INT (G) NO NO NO NO NO NO
EXT (H/V)/POLARITY YES N/N NO NO YES P/P NO YES P/P
EXT (CS)/POLARITY NO YES/N YES/N NO YES/N NO
INT/NON INT NON INT NON INT NON INT NON INT NON INT NON INT

GDM-5510 (E) 7
MODE AT PRODUCTION MODE 7 MODE 8 MODE 9 MODE 10
RESOLUTIION 1280 X 1024 1280 X 1024 1600 X 1200 1600 X 1200
CLOCK 135.000 MHz 216.000 MHz 202.500 MHz 202.500 MHz
– HORIZONTAL –
H-FREQ 81.130 kHz 120.941 kHz 93.750 kHz 93.750 kHz
usec usec usec usec
H. TOTAL 12.326 8.269 10.667 10.667
H. BLK 2.844 2.343 2.765 2.765
H. FP 0.237 0.120 0.316 0.316
H. SYNC 0.474 0.741 0.948 0.948
H. BP 2.133 1.481 1.501 1.501
H. ACTIV 9.481 5.926 7.901 7.901
– VERTICAL –
V. FREQ (HZ) 76.107 Hz 111.982 Hz 75.000 Hz 75.000 Hz
lines lines lines line
V. TOTAL 1066 1080 1250 1250
V. BLK 42 56 50 50
V. FP 2 1 1 1
V. SYNC 8 8 3 3
V. BP 32 47 46 46
V. ACTIV 1024 1024 1200 1200
– SYNC –
INT (G) NO NO NO NO
EXT (H/V)/POLARITY NO YES P/P YES P/P NO
EXT (CS)/POLARITY YES/N NO NO YES/N
INT/NON INT NON INT NON INT NON INT NON INT
2001.8.17 VER.

GDM-5510 (E) 8
TABLE OF CONTENTS
Section Title Page Section Title Page
1. DISASSEMBLY
1-1. Cabinet Removal ................................................ 1-1
1-2. A1 Board (C BLOCK) Removal ........................ 1-2
1-3. A1 Board Removal ............................................. 1-3
1-4. Bezel Assembly, H6 Board Removal ................. 1-4
1-5. D Board Removal ............................................... 1-5
1-6. Service Position................................................... 1-6
1-7. Picture Tube Removal......................................... 1-7
1-8. Harness Location ................................................ 1-9
2. SAFETY RELATED ADJUSTMENT ............... 2-1
3. ADJUSTMENTS ...................................................... 3-1
4. DIAGRAMS
4-1. Block Diagrams................................................... 4-1
4-2. Frame Schematic Diagram .................................. 4-4
4-3. Circuit Boards Location ...................................... 4-5
4-4. Schematic Diagrams and Printed Wiring
Boards ................................................................. 4-6
(1) Schematic Diagram of A1 Board ....................... 4-8
(2) Schematic Diagrams of D (a, b, c) Board .. 4-10
(3) Schematic Diagram of DA Board ...................... 4-14
(4) Schematic Diagram of H6 Board ....................... 4-16
(5) Schematic Diagram of L2 Board ........................ 4-18
(6) Schematic Diagram of N Board .......................... 4-20
4-5. Semiconductors .................................................. 4-22
5. EXPLODED VIEWS .............................................. 5-1
5-1. Chassis ............................................................... 5-2
5-2. Picture Tube ...................................................... 5-3
5-3. Packing Materials................................................ 5-4
6. ELECTRICAL PARTS LIST ............................... 6-1

GDM-5510 (E) 1-1
SECTION 1
DISASSEMBLY
1-1. CABINET REMOVAL
1
Two screws
(+BVTP 4 x 16)
6
Slide the EMI shield in the direction
of arrow Cand remove four claws.
7
EMI shield
4
Two screws
(+BVTT 4 x 8)
5
Three Screws
(+BVTT 4 x 8)
5
Four screws
(+BVTT 4 x 8)
2
Two claws
Bezel assembly Bezel assembly
EMI shield
Cabinet Cabinet
Push in the tip of a screwdriver
about 10mm to unlock the claw.
B
A
C
3
Push the upper side of the cabinet
in the direction of arrow A, disconnect claws
,
then remove the cabinet
lifting it up in the direction of arrow B.

GDM-5510 (E) 1-2
1-2. A1 BOARD (C BLOCK) REMOVAL
1
A1 board (C BLOCK)
CN315
CN318
GND
GND

GDM-5510 (E) 1-3
1-3. A1 BOARD REMOVAL
1
Two screws
(+BVTT 4 x 8)
2
Video block assembly
3
Four screws
(+BVTP 3 x 8)
4
Video shield
5
Four screws (HEX)
6
Screw
(+BVTP 3 X 8)
7
Video case
8
A1 board
CN315

GDM-5510 (E) 1-4
1-4. BEZEL ASSEMBLY, H6 BOARD REMOVAL
2
1
Four tapping screws (5)
5
Bezel assembly
7
Joy stick
Input slide
button
4
Screw
(+BVTP 4 x 16)
4
Screw
(+BVTP 4 x 16)
3
Screw
(+BVTP 4 x 16)
Three screws
(+BVTP 3 x 10)
10
Two claws
9
H6 board
12
Magnetic
MIU-221D sensor
11
L1 blacket
CN1400
CN1500
CN1401
Picture tube shield
Before removing the bezel assembly, secure
the picture tube by attaching two screws to
the picture tube shield at the positions shown
with an arrow (diagonal two places) to prevent
the picture tube from falling.
(Use the screws +BVTT 4 x 8 that fix EMI shield.)
6
8

GDM-5510 (E) 1-5
1-5. D BOARD REMOVAL
2
A board
(C block)
1
Anode cap
(Refer to 1-8)
3
Two screws
(+BVTT 4 x 8)
7
Two screws
(+BVTT 3 x 8)
Pig tail cover
14
D board
13
PWB bracket
4
Video block assembly
6
Cable assembly
8
Rear plate assembly
Screw (+BVTT 3 x 8)
11
Seven screws
(+BVTP 3 x 10)
12
9
Extension bar
CN315 CN313
CN304
GND
CN600 CN601
CN1103
CN1602
Connector (2P)
CN501
CN701 GND
GND
GND
CN
10
5

GDM-5510 (E) 1-6
1
2
4
1
Remove the D board.
D board
2
Remove the Video block assembly.
3
Install the Adaptor board
(XT MOUNT) (A-1391-123-A).
4
Lay the Video block assembly.
Video block assembly
Video block assembly
5
Install the video block assembly.
6
Put a box which is about 15cm in height
under the D board to fix it.
(Please disconnect the CN 701 first.)
D board
Box
3
1-6. SERVICE POSITION

GDM-5510 (E) 1-7
1-7. PICTURE TUBE REMOVAL
4
Picture tube
1
Anode cap (Refer to 1-8)
2
A1 board (C block)
3
Neck assembly
CN1 CN2
CN3
CN2
GND

GDM-5510 (E) 1-8
3When one side of the rubber cap is
separated from the anode button, the
anode-cap can be removed by turning up
the rubber cap and pulling up it in the
direction of the arrow c.
•HOW TO HANDLE AN ANODE-CAP
1Don’t scratch the surface of anode-caps with sharp shaped
material!
2Don’t press the rubber hardly not to damage inside of anode-
caps!
A material fitting called as shatter-hook terminal is built in the
rubber.
3Don’t turn the foot of rubber over hardly!
The shatter-hook terminal will stick out or damage the rubber.
•REMOVAL OF ANODE-CAP
NOTE: Short circuit the anode of the picture tube and the anode cap to the metal chassis, CRT shield or carbon painted on the CRT, after
removing the anode.
•REMOVING PROCEDURES
1Turn up one side of the rubber cap in the
direction indicated by the arrow a.2Using a thumb pull up the rubber cap
firmly in the direction indicated by the
arrow b.
a
b
c
Anode Button

GDM-5510 (E) 1-9
1-8. HARNESS LOCATION
CN602
CN601 CN604 CN1102
CN312 CN311
CN318
CN319
CN320
CN316
CN315
CN303
CN1103
CN1400
CN1500
CN1401
CN701
CN501
CN1601
CN1600
CN1602
CN2
CN1
CN1
5P
CN3
CN1003
CN904
4P
4P
D board
A1 board
N board
L2 board
Magnetic sensor
H6 board
Picture tube
AC inlet (3P)

GDM-5510 (E) 2-1
SECTION 2
SAFETY RELATED ADJUSTMENT
HV Regulator
Circuit Check
HV Protector
Circuit Check
When replacing or repairing the shown below table, the
following operational checks must be performed as a
safety precaution against X-rays emissions from the unit.
Part Replaced ([)
RV901
HV ADJ
* Confirm one minute after turning on the power.
a) HV Regulator Circuit Check
1) Turn the RV901 slowly, and adjustment so that high
voltage is in the specified range.
[Specification]: 27.00 ±0.05 kV
2) Check that the voltage of D912 cathode on the D
board is 17.0 V or more.
b) HV Protector Circuit Check
1) Using external DC Power Supply, apply the voltage
shown below between cathode of D912 and GND,
and check that the RASTER disappers.
[Specification]: 19.95 + 0.00/–0.05 V
Part Replaced (])
D Board C925, IC901, R901,
R902, R905, R924,
R925, R926, RV901,
T901 (FBT)
•Mounted D Board
D Board C920, C923, D911,
D912, R903, R917,
R918, R919, R920,
R923, T901 (FBT)
•Mounted D Board
N Board IC1001, RB1001
•Mounted N Board
Beam Current
Protector Circuit
Check
Part Replaced (])
D Board C930, D917, R921,
R932, R933, R935,
T901 (FBT)
•Mounted D Board
N Board IC1001, RB1001
•Mounted N Board

GDM-5510 (E) 2-2
c) Beam Current Protector Circuit Check
1) Connect constant current source to a section between
T901 (FBT) qa pin and GND, and check that the
RASTER disappers when the specified current flows
to the qa pin.
[Specification]: 2.12 + 0.00/–0.01 mA

GDM-5510 (E) 3-1
SECTION 3
ADJUSTMENTS
Note:Hand degauss must be used on stand-by or power-off condition.
This model has an automatic earth magnetism correction function by using an earth magnetism sensor and a LCC coil. When
using a hand degauss while monitor (LCC coil) is being operated, it sometimes gets magnetized, and the system may not
work properly as a result.
•Landing Rough Adjustment
1. Display all white pattern (or black dot pattern).
2. Set contrast to 255.
3. Display green plain pattern.
4. Side back DY and roughly adjust green plain pattern to be centered on
the useful screen with Purity Magnet.
5. Adjust DY tilt.
Note:Set ROTATION to 128 and LCC_NS to 128 when adjusting DY tilt.
6. LIghtly tighten the DY screw.
•Landing Fine Adjustment
Note: (1) After adjust W/B (9300k), measure the average of IK with all
white video input, while CONTRAST is maximum and
BRIGHTNESS is center. And adjustment shall be made so that the
miss-landing become least after aging 2H with the IK 30% of
measured value shown above.
(2) The magnetic field shall be BH = 0.
(3) When adjusting at other than BH = 0, calculate the shifted value
from BH = 0.
1. Put the monitor in helmholz coil.
2. Set as follows;
LCC_SW = 0 (LCC Correction Current = 0)
FUNCTION_SW bit1 = (Auto Degauss = On)
CONTRAST = 255
3. Display green plain pattern.
4. Degauss the iron part of chassis with a hand degausser and degauss coil.
5. Degauss CRT face with a hand degausser again.
6. Input AC 230V to AC IN and turn the monitor off and on. Then auto-
degauss works.
7. Reset FUNCTION_SW bit1 to 0 (auto-degauss = off)
8. Degauss CRT face with a hand degausser again.
9. Attach wobbling coil to the specified place on CRT neck.
10. Put on landing sensor to CRT face.
11. Set LCC_SW to 12.
12. With landing checker, adjust DY position, purity, DY center and
landing of the 4 corners.
13. Read VX and VY value which are the read out of magnetic sensor, and
write to "LCC_VX_REF" and "LCC_VY_REF".