Taoglas PA.11 User manual

SPE-11-8-091-D
Part No:
PA.11
Description:
2.4GHz Band Dielectric Ceramic PIFA
SMT Antenna for Bluetooth/WLAN/ZigBee Applications
Features:
2400-2484Mhz, 1.5dBi Peak Gain
Size: 10mm*4mm*3mm
Designed for the top right hand corner edge of the Component side
of the board (bottom left corner edge)
SMT Mount
RoHS Compliant

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SPE-11-8-091-D
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Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to
make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and
the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited.
1.
Introduction
3
2.
Specifications
4
3.
S11 Response Curve
5
4.
Test Position
6
5.
Summary of Test Results
7
6.
Antenna Pattern
8
7.
Mechanical Drawing
13
8.
Recommended Footprint for Evaluation Board
14
9.
Packaging
15
10.
Recommended Reflow Temperature Profile
17
Changelog
18

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This specification covers the Dielectric PIFA Antenna for 2400-2484MHz, covering such applications as Wi-Fi,
Bluetooth and Zigbee. A ceramic dielectric
PIFA antenna offers smallest footprint, superior gain characteristics and improved isolation over traditional PCB
based antennas. This antenna has been developed for the top right hand corner edge of the component side of
the Board (bottom left corner edge), the antenna has to be positioned on a non-ground (copper/metal free) area
with the feed-point matched direct to the module. Please refer to Recommended Foot print Diagram (8.0 Page
14).
Many module manufacturers specify peak gain limits for any antennas that are to be connected to that module.
Those peak gain limits are based on free-space conditions. In practice, the peak gain of an antenna tested in free-
space can degrade by at least 1 or 2dBi when put inside a device. So ideally you should go for a slightly higher
peak gain antenna than mentioned on the module specification to compensate for this effect, giving you better
performance.
Upon testing of any of our antennas with your device and a selection of appropriate layout, integration technique,
or cable, Taoglas can make sure any of our antennas’ peak gain will be below the peak gain limits. Taoglas can
then issue a specification and/or report for the selected antenna in your device that will clearly show it complying
with the peak gain limits, so you can be assured you are meeting regulatory requirements for that module.
For example, a module manufacturer may state that the antenna must have less than 2dBi peak gain, but you
don’t need to select an embedded antenna that has a peak gain of less than 2dBi in free-space. This will give you a
less optimized solution. It is better to go for a slightly higher free-space peak gain of 3dBi or more if available.
Once that antenna gets integrated into your device, performance will degrade below this 2dBi peak gain due to
the effects of GND plane, surrounding components, and device housing. If you want to be absolutely sure, contact
Taoglas and we will test. Choosing a Taoglas antenna with a higher peak gain than what is specified by the module
manufacturer and enlisting our help will ensure you are getting the best performance possible without exceeding
the peak gain limits.
1. Introduction
1. Introduction
1. Introduction
1. Introduction
1. Introduction
1. Introduction
1. Introduction
1. Introduction

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The antenna has the electrical characteristics given in Table 1 under the Taoglas standard installation
conditions as shown in the Evaluation Board figure.
Electrical
Working Frequency
2400MHz ~ 2484MHz
Peak Gain
1.5dBi max
Polarization
Linear
Impedance
50 Ω
VSWR
2.0 max
Mechanical
Dimensions
10*4*3mm
Termination
Ag (Environmentally Friendly Lead-Free)
Environmental
Operating Temperature
-40~+85°C
Moisture Sensitivity Level (MSL)
3 (168 Hours)
* Data is measured on Taoglas Standard Reference PCB
2. Specifications
3. Antenna Characteristics2. Specifications
3. Antenna Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics2. Specifications
3. Antenna Characteristics2. Specifications
3. Antenna Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics2. Specifications

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SPE-11-8-091-D
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* Gain is measured on test PCB
* Ant position: Right side, top corner edge, horizontal
3. S11 Response Curve
3. Antenna Characteristics2. Specifications
3. Antenna Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics2. Specifications
3. Antenna Characteristics2. Specifications
3. Antenna Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics2. Specifications

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x
z
y
4. Test Position
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna

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5.1 Gain and Efficiency
Frequency (GHz)
Peak Gain(dBi)
Efficiency (%)
2.400
2.78
80.64
2.442
3.12
85.65
2.450
3.27
86.50
2.4835
2.76
75.91
2.500
2.34
68.07
5.2 Power Average Gain
Frequency (GHz)
Plane
Average Gain (dB)
2.4000
XY Plane
-1.622
YZ Plane
-1.324
XZ Plane
-0.561
2.4420
XY Plane
-2.464
YZ Plane
-0.859
XZ Plane
-0.312
2.4500
XY Plane
-1.424
YZ Plane
-0.950
XZ Plane
-0.224
2.4835
XY Plane
-2.949
YZ Plane
-1.548
XZ Plane
-0.784
2.5000
XY Plane
-2.444
YZ Plane
-2.084
XZ Plane
-1.258
5. Summary of Test Results
6. Packaging5. Mechanical Drawing
6. Packaging
7. Application Note6. Packaging5. Mechanical
Drawing
6. Packaging5. Mechanical Drawing
6. Packaging
7. Application Note6. Packaging
7. Application Note
7. Application Note6. Packaging
7. Application Note6. Packaging5. Mechanical
Drawing
6. Packaging5. Mechanical Drawing

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6.1 Frequency: 2.400GHz
6. Antenna Pattern –Wi-Fi and Bluetooth
6. Packaging5. Mechanical Drawing
6. Packaging
7. Application Note6. Packaging5. Mechanical
Drawing
6. Packaging5. Mechanical Drawing
6. Packaging
7. Application Note6. Packaging
7. Application Note
7. Application Note6. Packaging
7. Application Note6. Packaging5. Mechanical
Drawing
6. Packaging5. Mechanical Drawing

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7. Mechanical Drawings (Unit:mm)
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna

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SPE-11-8-091-D
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8. Recommended Footprint for Evaluation Board
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna

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9. Packaging
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics

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SPE-11-8-091-D
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1. Time shown in the above figures is measured from the point when chip surface reaches temperature.
2. Temperature difference in high temperature part should be within 110°C.
3. After soldering, do not force cool, allow the parts to cool gradually.
General attention to soldering
●High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur.
●For soldering, please refer to the soldering curves above. However, please keep exposure to temperatures exceeding
200°C to under 50 seconds.
●Please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water soluble, be sure to wash thoroughly
to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause
cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below.
Frequency: 40kHz
Output Power: 20W
Cleaning Time: 5 minutes max
10. Recommended Reflow Temperature Profile
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns
4. Antenna Radiation Patterns3.Antenna
Characteristics
4. Antenna Radiation Patterns3.Antenna
Characteristics

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SPE-11-8-091-D
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Changelog for the datasheet
SPE-11-8-091 –PA.11
Revision: D (Current Version)
Date:
2020-11-10
Changes:
Updated to new format
Changes Made by:
Dan Cantwell
Previous Revisions
Revision: C
Date:
2016-01-06
Changes:
Added Packaging
Changes Made by:
Jack Conroy
Revision: B
Date:
2015-08-24
Changes:
Amended note on Gain
Changes Made by:
Aine Doyle
Revision: A (Original First Release)
Date:
2011-05-09
Notes:
Author:
Technical Writer
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