TDK EV MOD CH101 User manual

AN-000231
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specifications and information herein without notice.
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Document Number: AN-000231
Revision: 1.0
Release Date: 08/18/2020
EV_MOD_CH101 Evaluation Module User Guide

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Revision: 1.0
TABLE OF CONTENTS
1Scope and Purpose............................................................................................................................................................................. 3
2EV_MOD_CH101 Evaluation Module Board ...................................................................................................................................... 4
2.1 Pin Assignments ......................................................................................................................................................................... 4
2.2 Electrical Specifications.............................................................................................................................................................. 4
2.3 Schematic................................................................................................................................................................................... 4
2.4 Bill of Materials .......................................................................................................................................................................... 5
3Configuration, Programming, and Operation .................................................................................................................................... 6
3.1 Configuration and Programming................................................................................................................................................ 6
3.2 Operation ................................................................................................................................................................................... 6
4Mechanical Specifications.................................................................................................................................................................. 7
5Sensor Mounting and Beam Patterns ................................................................................................................................................ 8
5.1 Sensor Mounting........................................................................................................................................................................ 8
5.2 Beam Patterns............................................................................................................................................................................ 8
6Revision History ............................................................................................................................................................................... 10
LIST OF FIGURES
Figure 1. View of EV_MOD_CH101 evaluation module with an omnidirectional acoustic housing.......................................................... 3
Figure 2. EV_MOD_CH101 Schematic........................................................................................................................................................ 4
Figure 3. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down) ............................................................ 5
Figure 4. Dimensions of the EV_MOD_CH101 assembly ........................................................................................................................... 7
Figure 5. Recommended EV_MOD_CH101 module mounting .................................................................................................................. 8
Figure 6. Beam pattern measurements of module in 100 mm plate (raw linear LSB units left, normalized dB right)..............................8
Figure 7. Beam pattern measurements of an EV_MOD_CH101 (w/o a mounting plate).......................................................................... 9
LIST OF TABLES
Table 1. EV_MOD_CH101 ZIF Connector Pin-Out...................................................................................................................................... 4
Table 2. Recommended Flat Flex Cable and Connector ............................................................................................................................ 5
Table 3. Bill of Material .............................................................................................................................................................................. 5
Table 4. Geometric Dimensions for EV_MOD_CH101 ............................................................................................................................... 7

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1SCOPE AND PURPOSE
This document details the specification, programming and operation of an EV_MOD_CH101-03-01 (referred to as the EV_MOD_CH101
in the remainder of this document) ultrasonic sensor evaluation module. The module board incorporates a CH101 Ultrasonic Sensor
device with an omnidirectional acoustic housing assembly, a capacitor and an FPC/FFC connector. This evaluation module can perform
pitch-catch and pulse-echo range-finding at distances from 4 cm to 1.2m. Several programming options are available for medium and
short-range applications.
Figure 1. View of EV_MOD_CH101 evaluation module with an omnidirectional acoustic housing

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2EV_MOD_CH101 EVALUATION MODULE BOARD
2.1 PIN ASSIGNMENTS
PIN
NAME
DESCRIPTION
1
INT
Interrupt output. Can be switched to input for triggering and calibration functions
2
SCL
SCL Input. I2C clock input. This pin must be pulled up to VDD externally.
3
SDA
SDA Input/Output. I2C data I/O. This pin must be pulled up to VDD externally.
4
PROG
Program Enable. This pin must be pulled down to ground externally.
5
RESET_N
Active-low reset. This pin must be pulled up to VDD externally.
6
VSS
Power return.
7
VSS
Power return.
8
VDD
Power supply input. Connect to externally regulated 1.8V supply
Table 1. EV_MOD_CH101 ZIF Connector Pin-Out
2.2 ELECTRICAL SPECIFICATIONS
Please refer to DS-000331 CH101 Datasheet for information on the device’s electrical characteristics. Please note that the datasheet
covers CH101 part numbers with different suffixes. Regardless, the electrical specifications in the datasheet still apply.
2.3 SCHEMATIC
Electrical connection to the EV_MOD_CH101 module is via an 8-pin 0.5 mm pitch flat flex cable (FFC) connector. Part numbers of the
FFC connectors on the module PCB and the recommended FFC cables are shown in Table 2. The electrical schematic of the module,
including the connector pinout and the connections to the EV_MOD_CH101 module, are shown in Figure 2. Note that the 0.1 μF
decoupling capacitor, as recommended in the CH101 datasheet, is included in the module. Consult the CH101 datasheet and
application notes for additional information on the electrical connections and operation.
Figure 2. EV_MOD_CH101 Schematic
Each EV_MOD_CH101 requires its own PROG and INT lines, the remaining connections can be shared. Refer to the CH101 datasheet
for additional information.
Module connections using a flat flex cable (FFC) are shown in Figure 3.

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Figure 3. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down)
FLAT CABLE CONNECTOR TYPE
Molex 503480-0800
RECOMMENDED FLAT CABLE
Molex 151660073...151660094
Table 2. Recommended Flat Flex Cable and Connector
2.4 BILL OF MATERIALS
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
MANUFACTURER
MANUFACTURER
PART NUMBER
1
PCB
PCB
NA
1
U1
CH101-03
Custom – 8 Pin
TDK
CH101-03
1
C1
100n 6.3V 20% X7R 0402
0402
TDK
CGA2B1X7R1C104K050BC
1
J1
Connector, FPC-FFC, 8-Pin
8Pin, 0.5 mm Pitch
Molex
503480-0800
Table 3. Bill of Material

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3CONFIGURATION, PROGRAMMING, AND OPERATION
Please refer to DS-000379 CH101 Datasheet for information on the device’s electrical characteristics.
3.1 CONFIGURATION AND PROGRAMMING
Please refer to the following documents for configuration and programming information:
•AN-000154 SmartSonic Hello Chirp Hands-On Document
•AN-000175 SonicLib Programmers Guide
3.2 OPERATION
Please refer to the following documents for operating information:
•AN-000155 CHx01 SonicLink Software Quick Start Guide
•AN-000180 CH101 and CH201 SmartSonic Evaluation Kit Users Guide

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4MECHANICAL SPECIFICATIONS
DIMENSION
EV_MOD_CH101
UNIT
Acoustic port hole
0.7
mm
Maximum width
8.15
mm
Module height
3.57
mm
Table 4. Geometric Dimensions for EV_MOD_CH101
The outer dimensions of the EV_MOD_CH101 assembly are shown in Figure 4. The acoustic port hole has a diameter of 0.7 mm and is
in the center of the front face. During transducer operation, the port cannot be occluded or covered.
Figure 4. Dimensions of the EV_MOD_CH101 assembly

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5SENSOR MOUNTING AND BEAM PATTERNS
5.1 SENSOR MOUNTING
To achieve the best acoustic performance, users are recommended to mount the EV_MOD_CH101 module in a flat mounting plate.
An example mounting plate is shown in Figure 5, where the sensor has been inserted into a 5.3 mm diameter hole has been drilled in
a 1 mm thick plastic plate measuring 135 mm x 175 mm.
Figure 5. Recommended EV_MOD_CH101 module mounting
5.2 BEAM PATTERNS
Pulse-echo beam-pattern plots of the EV_MOD_CH101 module are shown in Figure 6. This beam-pattern was measured by placing a
1m2target at a 30 cm distance from the EV_MOD_CH101 module and recording the ToF amplitude as the sensor is rotated 180°. The
plots are shown in both raw LSB units and normalized dB units, where 0 dB corresponds to the peak amplitude (5000 LSB) recorded
on-axis. Chirp defines the field-of-view (FoV) as the full-width at half-maximum (FWHM) of the beam pattern; in other words, the FoV
is the range of angles over which the amplitude remains above half the peak amplitude (or -6 dB). When mounted in the recommended
plate, the sensor’s FoV is approximately 180° and the pulse-echo amplitude diminishes relatively smoothly from 0° to ±80°.
Figure 6. Beam pattern measurements of module in 100 mm plate (raw linear LSB units left, normalized dB right)
CH101 sensor module

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For comparison, the pulse-echo beam-pattern plot measured for an EV_MOD_CH101 when tested without a sensor mounting plate is
shown in Figure 7. The beam pattern has three lobes: a main lobe and two side-lobes that are centered at ±45°. The sensor device will
work well for detecting on-axis targets, but targets located at ±25° will have approximately 70% lower (-10 dB) amplitude, possibly
resulting in poor range-finding performance.
Figure 7. Beam pattern measurements of an EV_MOD_CH101 (w/o a mounting plate)
(raw linear LSB units left, normalized dB right)

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6REVISION HISTORY
REVISION DATE REVISION DESCRIPTION
08/18/2020 1.0 Initial Release
This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp
Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
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