Tektronix 8001A User manual

1'!ktron00
COMMITTEDTO EXCELLENCE
WARNING
THE FOLLOWING SERVICING INSTRUCTIONS ARE
FOR USE BY QUALIFIED PERSONNEL ONLY. TO
AVOID PERSONAL INJURY, DO NOT PERFORM ANY
SERVICING OTHER THAN THAT CONTAINED IN
OPERATING INSTRUCTIONS UNLESS YOU ARE
QUALIFIED TO DO SO.
Tektronix, Inc.
P.O. Box 500
Beaverton, Oregon 97077
070-2717-00
INSTRUCTION MANUAL
Serial Number _____ _
First Printing JUL 1978

';, ·~ .,_ \ f;t i=:_,;~; ;·~, "'., :~-,;'. '''.:. -~ '.~~,':ii.=~\,=;,;:~
itternpts,lo.'i,~~\~n~ r~~r;·.or ·.ser.vic:e 'the .equipment· ·are.·'
,ft1·ad.e by 'persq~e1 othef'than Tektroni" service. . ·· ·. .
·representatives.
. . . .' ·~·J . :, ' '. ·(.:.·~. 1.L; .,· .. ~ ;:·;:.: " :,r;/·:,Tf< , ·::.· •. , ...... 1~.t).
· Modific"~or,t~'ar~. ~~r~ .. tp the ·hardw~,~
11
?1'.~Ylar'e b~f~ .. ·
person"f!t! t:?t~~: tharr,!~tron~x serviC:~: ~presenta,tives;:,L' ··>.
'~ ·: : . ' : '. :, : ~ ~,. ,,
Specifications'and pric~ change privileges reserved.
Copy~gllt·:\t) 1978 by Tektronix, Inc., Beaverton, Oregon. Printed
in theUnited States of America. All rights reserved. Contents of
this publication may not be reproduced in any form without
permission of Tektronix, Inc.
U.S.A. and foreign Tektronix products covered by U.S. and
foreign patents and/or patents pending.
TEKTRONIX is a registered trademark of Tektronix, Inc.

PREFACE
This manual provides information about installation, peripheral interfacing, and internal
switch and jumper positions for the 8001/8002 µProcessor Lab. Use it as a reference source
rather than as a text.
Throughout this manual, zeros are slashed where needed for clarity.
Schematic diagrams and specific information on the 8001/8002 µProcessor Lab may be
found in the following service manuals.
8001/8002 µProcessor Lab 1702A PROM Programmer Service Manual
8001/8002 µProcessor Lab 2704/2708 PROM Programmer Service Manual
8001 /8002 µProcessor Lab Real-Time Prototype Analyzer System Service Manual
8001/8002 µProcessor Lab System Service Manual
8001/8002 µProcessor Lab 8080 Emulator Processor Service Manual
8001/8002 µProcessor Lab 6800 Emulator Processor Service Manual
8001/8002 µProcessor Lab 9900 Emulator Processor Service Manual
8001/8002 µProcessor Lab Z80 Emulator Processor Service Manual
8001/8002 Installation Guide @

Contents
Page
LIST OF TABLES .................................................... v
LIST OF ILLUSTRATIONS ............................................ vi
SECTION 1 GENERAL INFORMATION
Unpacking .............................................. 1-1
8001/8002 µProcessor Lab Installation ........................... 1-2
Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Power Source ............................................ 1-6
Static Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
Module Installation ........................................ 1-8
Module Component Naming .................................. 1-11
SECTION 2 RS-232-C PORTS
General . . . . . . . . . . . . . . . . . ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Port Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
SECTION 3 SYSTEM PROCESSOR MODULE
Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Description ............................................. 3-1
General .............................................. 3-1
Software Transformation in TEKDOS When Using ASCII Transfers ...... 3-5
Baud Rate Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
SECTION 4 8001 SYSTEM MEMORY MODULE
InstalIation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Description ............................................. 4-1
Jumpers ................................................ 4-3
SECTION 5 PROGRAM MEMORY/8002 SYSTEM MEMORY MODULE
Installation .............................................. 5-1
Switch and Jumper Options ................................... 5-1
8001/8002 Installation Guide @ ii

Contents
iii
Page
SECTION 6 HIGH SPEED MEMORY MODULE
Installation .............................................. 6-1
Switch and Jumper Options ................................... 6-1
Jumper Functions ....................................... 6-4
Word Mode ........................................... 6-4
SECTION 7 SYSTEM COMMUNICATIONS MODULE
Installation .............................................. 7-1
Description ...................... : ...................... 7-1
Memory Mapping ......................................... 7-1
RS-232-C 1/0 Communications Ports ............................ 7-2
General .............................................. 7-2
1/0 Port Interfacing ...................................... 7-5
Software Transformation in TEKDOS When Using ASCli Transfers ...... 7-8
Baud ................................................ 7-13
Jumpers .............................................. 7-14
SECTION 8 REAL-TIME PROTOTYPE ANALYZER
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Data Acquisition Probe .................................... 8-3
Data Acquisition Interface ................................. 8-3
Installation .............................................. 8-4
Data Acquisition Interface Panel ............................... 8-6
Jumpers/Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-8
SECTION 9 PROM PROGRAMMER MODULES
Installation .............................................. 9-1
1702A PROM Programmer ................................. 9-1
2704/2708 PROM Programmer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3
Complementary Address and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3
1702A Complementary Address and Data ....................... 9-3
2704/2708 Complementary Address and Data .................... 9-5
@
8001/8002 Installation Guide

Contents
Page
SECTiOi'J iO EMULATOR PROCESSOR MODULES
Installation ................... .- .......................... 10-1
General .............................................. 10-1
8080 Emulator Processor .................................. 10-3
6800 Emulator Processor .................................. 10-3
Z80 Emulator Processor ................................... 10-4
9900 Emulator Processor .................................. 10-4
SECTION 11 PROTOTYPE CONTROL PROBES
8080, 6800 Emulater Processors ............................... 11-1
9900, Z80 Emulator Processors ................................ 11-1
The Mobile Microprocessor ................................. 11-1
9900, Z80 Prototype Control Probe ........................... 11-6
8001/8002 Installation Guide
@
iv

v
Table No.
2-1
3-1
3-2
3-3
3-4
3-5
4-1
5-1
5-2
5-3
6-1
7-1
7-2
7-3
7-4
7-5
7-6
Tables
Page
Jack and Device Assignments .................................. 2-4
RS-232-C Control Signals .................................... 3-4
Port J100 EIA, TTY Pin Assignments ............................ 3-6
Port J100 Software Transformations ............................. 3-7
Port J100 Output Characteristics ............................... 3-8
Port J100 Baud Select ...................................... 3-8
8001 System Memory ROM Configuration ......................... 4-3
Program Memory/8002 System Memory Switch Options ................. 5-3
Program Memory/8002 System Memory Mode Jumpers ................ 5-3
Program Memory Byte/Word Mode Jumpers ........................ 5-4
High Speed Memory Switch Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
Jack and Device Assignments .................................. 7-2
RS-232-C Control Signals .................................... 7-7
Port J101 Software Transformations ............................. 7-10
Port J102, J103 Software Transformations ........................ 7-12
Port J101, J102, J103 Output Characteristics ....................... 7-13
Port J101, J102, J103 Baud Selection ............................ 7-14
@
8001/8002 Installation Guide

Fig. No.
1-1
1-2
1-3
2-1
3-1
3-2
3-3
4-1
5-1
5-2
6-1
6-2
7-1
7-2
7-3
8-1
8-2
8-3
8-4
9-1
9-3
10-1
10-2
10-3
10-4
11-1
11-2
11-3
11-4
11-5
8001/8002 Installation Guide
Illustrations
Page
8001/8002 µProcessor Lab System Interconnect Diagram ............... 1-3
8001/8002 µProcessor Lab Module Arrangement ..................... 1-4
Circuit Number Guide ...................................... 1-6
8001 /8002 µProcessor Lab RS-232-C 1/0 Ports. . . . . . . . . . . . . . . . . . . . . . 2-2
8001/8002 µProcessor Lab System Interconnect Diagram ............... 3-2
8001/8002 µProcessor Lab RS-232-C 1/0 Ports ...................... 3-3
8001/8002 System Processor Module ............................ 3-9
8001 System Memory Module ................................. 4-2
Program Memory/8002 System Memory Moduie ..................... 5-2
Program Memory-9900 Word Mode Modification . . . . . . . . . . . . . . . . . . . . 5-5
High Speed Memory Module .................................. 6-2
TEKOOS Bootstrap Loader. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
System Communications Module ............................... 7-3
8001/8002 µProcessor Lab RS-232-C 1/0 Ports ...................... 7-6
Null Modem ............................................. 7-11
Real-Time Prototype Analyzer ................................. 8-2
Data Acquisition Interface Installation ........................... 8-5
Data Acquisition Interface Panel ............................... 8-7
Data Acquisition Interface Board ............................... 8-9
8001/8002 µProcessor Lab System Interconnect Diagram ............... 9-2
1 '7n'>A ODr'\11.11 Dr~~r~~~~r 11.11~.....1 .. 1~ n A
1 IVL.r'\ I llVIVI I 1v~1a111111c;1 1v1vuu1c; •••••••••••••••••••••••••••••• ;;;/.....,.
2704/2708 PROM Programmer Module ........................... 9-5
8001 /8002 µProcessor Lab Module Arrangement ..................... 10-2
6800 EmulatOi Prncsssoi Clock Rats JumpeiS ...................... 10-3
6800 Emulator Processor Module ............................... 10-5
Z80 Emulator Processor Module ................................ 10-6
8001/8002 µProcessor Lab System Interconnect Diagram ............... 11-2
Grounding of Ribbon Interconnect Cables ......................... 11-3
Mobile Microprocessor in Emulation Mode 0 ....................... 11-4
Emulator Processor Emulation Modes 0, 1, and 2 .................... 11-5
9900/Z80 Prototype Control Probe ............................. 11-7
@ vi

2393-20
8002 µProcessor Lab System.
vii
@
8001/8002 Installation Guide

Section 1
GENERAL INFORMATION
UNPACKING
The 8001 /8002 µProcessor Lab and Flexible Disc Unit are shipped in separate cartons.
Before unpacking these units, inspect each carton for signs of external damage. If any
damage is detected, contact your nearest Tektronix representative.
Unpacking the 8001 /8002 µProcessor Lab
To unpack the 8001i8002 µProcessor Lab, open the outer carton and remove the co!"ner
packing supports. Lift the inner carton and place on a flat surface. Remove the coiled
power cord taped to the top of the inner carton and set it aside until the unit is to be
connected to the primary power source. Open both ends of the inner carton and slide the
µProcessor Lab out of the carton. Remove the plastic bag, cardboard packing, and front
panel protective foam cushion from around the unit. The top cover is secured to the
µProcessor Lab with three screws located along each side of the unit. Remove the screws
and lift the top cover straight up. Set the cover aside. Remove the protective foam cushion
on top of the modules (printed circuit boards).
Unpacking the Flexible Disc Unit
To unpack the Flexible Disc Unit, follow the same procedure for removing the outer
carton, inner carton, and protective cushion as for the µProcessor Lab. Remove the three
screws along each side and lift the top cover straight up. Set the cover aside. Visually
inspect the inside of the unit for physical damage that may occur during shipping. Uncoil
the Flexible Disc Unit interconnect cable and feed it through the channel opening provided
in the rear panel. Replace the top cover on the Flexible Disc Unit.
8001/8002 Installation Guide REV A, OCT 1978
1-1

General Information
1-2
Repacking for Shipment
If either the µProcessor Lab or Flexible Disc Unit is to be shipped to a Tektronix Service
Center for service or repair, attach a tag showing: owner (with address), name of individual
at your firm that can be contacted, complete serial number, and a description of the service
required. If the original packaging is unfit for use or not available, repackage the equipment
as follows:
1. Obtain acarton of corrugated cardboard having inside dimensions that are at least six
inches more than the equipment dimensions, to allow for cushioning.
2. Surround the equipment with polyethylene sheeting to protect the finish.
3. Cushion the equipment on all sides with packing material or urethane foam between the
carton and the sides of the equipment.
4. Seal with shipping tape or industrial stapler.
8001/8002 µPROCESSOR LAB INSTALLATION
The 8002 µProcessor Lab and Flexible Disc Unit should be installed and operated on a flat
surface. The units should be close enough to each other for the interconnecting cables to
reach. Both units draw cooling air through openings in the bottom of the cabinets. The
air is expelled out the back by two fans. These units should not be located where paper,
plastic, carpeting, or other materials might block the air intakes and cause overheating.
Allow at least four inches clearance behind the units so the air flow is not restricted.
The 8001 µProcessor Lab installation requirements are the same as for 8002 µProcessor
Lab.
Cable Interconnections
Refer to Fig. 1-1 for the 8001 /8002 µProcessor Lab System interconnect diagram. Connect
the cables as follows:
@
8001/8002 Installation Guide

General Information
u
·a,
j
...
Cl)
Ill
::::>
0
I-
~
~
Data
Acquisition
Interface
...
e
E
e N
gi a.
ct
:E
0
a:
a.
<(
N
0
I' N
.... a.
NOTES:
!6
E
E
e
=
0
ct
:E
0
a:
Q.
co
0
"
N
~
0
"
N
.t:.
u
c
:I
a.
-
!6
"Cl
ca
Cl)
a:
M
0
....
..,
...
Cl)
...
·=
Q:
Cl)
c:
::i
N
0
....
..,
E
Cl)
"Cl
0
:E
0
....
..,
N
Q.
I I
r---CPSystem ControlI
Console
I (CRT or TTY) I
0
0
....
..,
Ill
c:
0
·;: ('I)
ca a.
u
·c:
:I
E
E o
o E ~
CJ :! ~
i ~E
ti Cl) Q.
>
Cl)
~,
...
.!!
2
...
c:
0
CJ
Flexible Disc Unit
n
N
a.
('I)
a.
0
~
a;
c:
:.
...
c:
E
u.
-
=
:I
,g
Cl)
c
Front Panei
8002 µProcessor Lab
N
Q.
Probe Probe
8080
6800
Prototype
Prototype
Control Control
I i 0 0
Ill
I
rs
u u
0 0
ct
ct
0 0
...
...
ca
ca
:;
:;
Cl)
('I)
E E
u
Q.
w w
e 0 0
I-
co
0
0
co
Cl)
co
('I)
CD
E Q.
15:
I
ca
Cl)
a:
1. P2 to front panel cable used only when the Maintenance Front Panel is used on the µProcessor Lab.
2. All units shown (except Emulation Cable Assemblies) are connected to primary power source (115 or 230
Vac). Power cables not shown.
3. PROM 1 may be connected to either 1702A or 2704/2708 PROM Programmers. PROM 2 is connected only
to 2704/2708 PROM Programmer.
Fig. 1-1. 8001/8002 µProcessor Lab System Interconnect Diagram.
8001/8002 Installation Guide REV
A, OCT 1978
l
Emulation
Cable
Assembly
2312-2A
1-3

General Information
1-4
I. Route the interconnecting ribbon cable from the rear of the Flexible Disc Unit through
the center cableway located on the power supply cover on the back panel of the 8002
µProcessor Lab. The cable should be gripped between the metal grounding bars of the cable
clamp assembly. Make sure the bared ground plane of the ribbon cable is making contact
with the cable clamps to ensure a good ground connection. Connect P3 of the cable to the
board edge connector, labeled P3, of the System Processor module. Replace the top cover
on the µProcessor Lab.
2. Connections and routing for interconnecting cables to optional or peripheral equipment
must be accomplished in accordance with Fig. 1-1 and instructions in the individual
equipment manuals. The emulation cable assemblies that enter the center and right cableways
(from a front panel view) on the back panel of the µProcessor Lab must be correctly installed
in the cable clamps. Make sure the bared ground plane of the ribbon cables are making
contact with the cable clamps to ensure a good ground connection.
3. Auxiliary bus and ground connections on terminal block TB2, located on the back
panel of the µProcessor Lab, provide access to an auxiliary power bus, logic or common
ground, and chassis ground. Connections are as follows:
TB2-1 to auxiliary power bus lines on the motherboard.
TB2-2 to logic ground bus lines on the motherboard.
TB2-3 to chassis ground.
NOTE
A shortingstrap is installed between TB2-2 and TB2-3 to provide a single common
tie point between logic (common) groundand chassis ground (earth). In the event
the shortingstrap is removed, a one megohm bleeder resistor between TB2-2 and
TB2-3, ensures a limited potential difference between logic and chassis ground.
@
8001/8002 Installation Guide

General Information
GROUNDING
The instaiiation of a proper ground system for the overaii µProcessor Lab System (inciuding
any optional and peripheral equipment) is extremely important. The following grounding
procedures are recommended to provide a proper ground system.
1. Make sure the primary power cords of all units (including the user's prototype
equipment) are connected to outlets that are on the same ground system.
2. If the 8002 µProcessor Lab System (including the user's prototype equipment( is
operated in a high static environment, use a grounding strap that is as short as possible
between the µProcessor Lab and Flexible Disc Unit. Use copper braid strap or other low
impedance wire, with soldered terminal lugs, for the grounding straps.
3. Attach grounding strap lugs to the chassis of the units. Ensure lugs make good contact
with bare metal by removing paint or protective coating from the metai before attaching
grounding lug.
When the 8001/8002µProcessor Lab System is being used with an oscilloscope or other
test equipment during In-prototype testing, proper grounding will eliminate ground loops
and reduce susceptibility to static discharge.
A grounding strap between the µProcessor Lab chassis and the oscilloscope chassis is
necessary to prevent static discharge. The oscilloscope, when connected to the trigger
from the Data Acquisition Interface unit, establishes asecond tie point between the logic
and chassis ground of the µProcessor Lab. To prevent ground loops when the oscilloscope
is connected, remove the strap between TB2-2 and TB2-3 on the back panel of the
µProcessor Lab. This establishes the common tie point between logic and chassis ground
at the oscilloscope, not at both units.
Any unused leads of the P6451 Logic Probes.should be grounded or, if the probe is not in
use, disconnect it from the Data Acquistition Interface unit.
8001/8002 Installation Guide 1-5

General Information
1-6
POWER SOURCE
The µProcessor Lab and Flexible Disc Unit are both designed to be operated from a
single-phase power source that has one of its current-carrying conductors (neutral)
at ground (earth) potential. Operating from power sources where both current-
carrying conductors are isolated or above ground potential (such as phase-to-phase
on a multiphase system, or across the legs of a 110-220 volt single-phase, three-wire
system) is not recommended, since only the line conductor has over-current (fuse)
protection within the unit.
The ac power connector is a three-wire polarized plug with the ground (earth) lead
connected directly to the instrument frame to provide electric shock protection. Connect
this plug only to a three-wire outlet which has an earth ground. If the unit is connected
to any other power source, the unit frames must be connected to an earth ground system.
The µProcessor Lab and Flexible Disc Unit are both designed to operate from a 115-230
volt nominal line voltage that has a frequency of 50-60 Hz. The Flexible Disc Unit is
factory wired for 115 volts, 60 Hz operation; however, 230 volts, 50 Hz configuration is
available by special order. Each unit has aseparate power cord and requires a separate
outlet for the primary power. The system power requirements are as follows:
8002 µProcessor Lab
Flexible Disc Unit
3.5 amps at 115V,±10%, 60 Hz
2.0 amps at 230 V, ±10%, 50 Hz
3.0 amps at 115 V, ± 10%, 60 Hz
1.5 amps at 230 V, ± 10%, 50 Hz
NOTE
The Flexible Disc Unit has a warning sign above the primary input powerjack
stating the unit is wired for a specific voltage and frequency at the factory.
8001/8002 Installation Guide

General Information
The system fusing requirements for 115 volt or 230 volt primary power sources are as
follows:
8002 µProcessor Lab
Primary (F4)
± 12 Vdc Supply (F3)
Flexible Disc Unit
Primary (F1)
Disc Drive (F3)
AMP
6A
3A
2A
1 A
4A
2A
2.5A
1.5 A
WARNING I
VOLTS
115 v
230 v
115 v
230 v
115 v
230 v
i i5 v
230 v
Dangerous voltages existseveral places inside the units. Disconnect the µProcessor
Lab and Flexible Disc Unit from the power source before removing or replacing the
top cover. Only qualified technical personnel should attempt to change the power
supply jumperarrangement. Unfamiliarity with electronic equipmentandsafety
procedures can result in personal injury.
STATIC PRECAUTIONS
Static discharge can damage many semiconductor components used in these
assemblies.
8001/8002 Installation Guide 1-7

General Information
1-8
Many semiconductor components, especially MOS type components, can be damaged by
static discharge. Damage may not be catastrophic, therefore, not immediately apparent. It
usually appears as a "weakening" of the semiconductor characteristics. Devices that are
particularly susceptible are: MOS, CMOS, JFETs, and high impedance OP amps. Damage
can be significantly reduced by observing the following precautions:
1. Minimize handling by keeping assemblies, modules, or components in their original
containers until ready for use. Minimize the removal and installation of semiconductors
from their circuit boards.
2. Observe precautionary measures to reduce or eliminate static discharge when handling
static sensitive devices or circuit assemblies, by grounding yourself on the instrument
chassis when installing or removing an assembly with semiconductor components.
3. Hold the assembly or device by its sides rather than touching semiconductor terminals
or conductive lines to these terminals.
4. All test equipment, accessories, and soldering tools should be connected to earth
ground.
5. Use containers made of conductive material or filled with conductive material for
storage and transportation. Avoid using ordinary plastic containers. Any static sensitive
part or assembly (circuit board) that is to be returned to Tektronix, Inc. should be pack-
aged in its original container or one with anti-static packaging material.
MODULE INSTALLATION
Before installing or removing a module, switch the POWER to the µProcessor
Lab OFF.
NOTE
The red wire on each cable designates the side of the cable plug that is connected to
pin 1in the mating connector. In the µProcessor Lab, pin 1 of the mating connector
on the module is always located toward the rear of the unit.
REV A, OCT 1978
8001/8002 Installation Guide

General Information
The module card connector is offset to ensure that the module cannot be plugged in
backvvards. After the module has been correctly positioned, press down fiimly on the two
plastic lifters (at the board edge) until the 100 pin edge connector (P1) snaps into place.
The recommended arrangement for the modules (printed circuit boards) is shown in Fig.
1-2. The modules may be arranged in other configurations if the following guidelines are
not violated:
1. Positions 1 and 2
2. Positions 3 thru 8
3. Position 9
4. Positions 10 thru 20
PROM Programmer modules may be located
in either of these positions. (2 positions)
The system modules may be located in any
position within this section. (6 positions)
Debug/Front Panel module. (1 position)
The program modules may be located in any
positions within this section. ( 11 positions)
NOTE
The location of a module within a section may be limited by the length of
interconnecting cables.
Due to power supply limitations, no more than two emulator processor modules should be
installed in a 8001 /8002 µProcessor Lab configured for 60 Hz operation. No more than one
emulator processor moduie shouid be instaiied in a 800i /8002 µProcessor Lab configured
for 50 Hz operation (special order).
8001/8002 Installation Guide
REV A, OCT 1978
1-9

General Information
1-10
...
CD
E
E 0
~
e
Ill ::::
E
.,,
c
0 0
a;
E
ct
·.;:::
c
e
Cll Cll
0
::?:
u Q.
gi
·c:
0
...
5!
>
0
:J > c 0
ct
a:
E 0
5!
0 u
u:
E E
::?:
Q.
E E u
Q.
CD
0
CIO
0
CD
E "C
...
::?:
0
CJ
::?:
c
CD
a:
"
Q.
Cll
::c
E
Q. N E E E
~
.,,
E e
N f f f
CD
CD CD
:J
f E f
CD
f
CD
f
CD
f
0 0
...
... ...
.c
CD
.,,
i i i
Cll
Cll
Cll
Ill
Ill Ill
~
0
Cll Cll
Cll
[
Cll Cll
" "
CL
CL CL > > >
CD
CL CL CL
CL CL
....
N en en en en en en
c
<t
ct en en en en en en
en
en
en
0
...
N M
<r::I'
Ln
(0
"
CIO
.,,
0
....
N M
<r::I'
Ln
(0
"
CIO
.,,
.... .... .... .... ....
....
.... ....
....
.... N
9 9
.., ..,
..,
..,
..,
..,
..,
.., ..,
..., ...,
..,
..., ...,
..,
..,
..,
( 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 ~
MEM ASSEM~RTTR EMLTR EMLTR
L
JL
COMM PRCS I I MEM PRCSR 1 PRCSR 2 I
PROM SYS SECTION PRGM SECTION
~ PRGM DBUG
Front Panel
2313-21
Fig. 1-2. 8001/8002 µProcessor Lab Module Arrangement.
The ribbon cables and connectors within the µProcessor Lab are installed prior to shipping.
Make sure each connector is properly seated. Fig. 1-2 illustrates the correct location for
each connector on the modules. Visually inspect the inside of the unit for physical damage
that may have occurred during shipping. Do not replace the top cover on the µProcessor
Lab at this time.
REV A, OCT 1978
8001/8002 Installation Guide

General Information
MODULE COMPONENT NAMING
The module card is divided into a grid of rows and columns (see Fig. 1-3) to locate
components. The component name is determined by the location of the component on the
module. The component name consists of four parts. The first part is a letter designating
the type of component. The next is a single digit indicating the row and then two digits
indicating the column of the component. Finally a digit ranging from 0 to 9 indicates where
the component is located between two columns.
8001/8002 Installation Guide @
1-11