Tektronix P6231 User manual

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INSTRUCTION Part No. 070-6027-00
TEK MANUAL Product Group 60
-
PROBE
Please Check for
CHANGE INFORMATION
at the Rear of This Manual
First Printing MAY 1986
Revised MAR 1987

Copyright a 1986 Tektronix, Inc. All rights reserved.
Contents of this publication may not be reproduced in any
form without the written permissionof Tektronix, Inc.
Products of Tektronix, Inc. and its subsidiaries are covered
by U.S. and foreign patents and/or pending patents.
TEKTRONIX, TEK, SCOPE-MOBILE, and are
registered trademarks
of Tektronix, Inc. TELEQUIPMENT
is a registeredtrademark of Tektronix U.K. Limited.
Printed in
U.S.A. Specification and price change privileges
are reserved.

TABLE OF CONTENTS
...
..............................................
- LIST OF ILLUSTRATIONS 111
LIST OF TABLES ............................................................ v
................................
OPERATORS SAFETY SUMMARY vi
--
...................................
SERVICING SAFETY SUMMARY vii
SECTION 1 SPECIFICATION
DESCRIPTION ............................................... 1-1
.............................................
ACCESSORIES 1-1
PERFORMANCECONDITIONS .................... 1-2
-
SECTION 2 OPERATING INSTRUCTIONS
INTRODUCTION ............................................ 2-1
- OPERATING CONSIDERATIONS ................. 2-1
Probe Handling
........................................... 2-1
Input Dynamic Range
................................ 2-1
Probe Grounding ........................................ 2-2
-
................
CONTROLS AND CONNECTORS 2-4
................................
PROBE ACCESSORIES 2-4
OPERATION
.................................................. 2-7
SECTION 3 PERFORMANCE CHECK
...................................................... PURPOSE 3-1
TEST EQUIPMENT REQUIRED
................. .3-1
LIMITS AND TOLERANCES ......................... 3-1
.............................................. PREPARATION 3-1
....................................
PROCEDURESTEPS 3-3
DC Offset Check
........................................ 3-3
BandwidthIRise Time
High-FrequencyAberrations Check
........... 3-5
The following servicing instructions are for use by
qualified personnel only. To avoid personal injury, do
not perform any servicing other than that contained in
operating instructions unless you are qualified to do so.

TABLE OF CONTENTS (cont)
SECTION 4 ADJUSTMENT PROCEDURE
PURPOSE ...................................................... 4-1
.................... TEST EQUIPMENT REQUIRED 4-1
ADJUSTMENT SEQUENCE .......................... 4-1
......................... ADJUSTMENT LOCATIONS 4-1
.............................................. PREPARATION 4.2
PROCEDURE STEPS .................................... 4-4
............................
CheckIAdjust Offset Null 4-4
CheckIAdjust Attenuation Accuracy
................... and Mid-Frequency Response 4-4
SECTION 5 THEORY OF OPERATION
INTRODUCTION ............................................ 5-1
GENERALCIRCUIT DESCRIPTION ............. 5-1
DETAILEDCIRCUIT DESCRIPTION ............5-1
TROUBLESHOOTING ................................... 6-4
Troubleshooting Techniques ...................... 6-9
CORRECTIVEMAINTENANCE ..................6-10
MaintenancePrecautions .......................... 6-10
....................
Obtaining ReplacementParts 6-10
................................ PROBE DISASSEMBLY 6-11
..........................
Control Box Disassembly 6-11
CableAssembly Replacement ................... 6-12
.............................
Probe Tip Replacement 6-13
..................................
Button Replacement 6-13
READJUSTMENTAFTER REPAIR .............. 6-13
INSTRUMENTREPACKING ......................... 6-13
SECTION 6 MAINTENANCE SECTION
7 REPLACEABLE PARTS
INTRODUCTION ............................................ 6-1 DIAGRAMS
STATIC-SENSITIVECOMPONENTS
........... 6-1
REPLACEABLEELECTRICALPARTS
PREVENTIVE MAINTENANCE
..................... 6-3
REPLACEABLEMECHANICAL PARTS
......................................................
Cleaning 6-3 OPTIONAL ACCESSORIES
........................................
Visual Inspection 6-4
..............................
SemiconductorChecks 6-4

LIST OF ILLUSTRATIONS
Figure Page
...
The P6231 Probe ............................................. VIII
Typical input impedance versus
frequency..
....................................................... .I-6
Damaging effects of ground-
lead inductance
................................................ 2-2
Reducing the effects of
ground-leadinductance
.................................... 2-3
Controls, connectors, and
probe accessories
............................................ 2-5
Example of reducedloading ............................ 2-7
iii

LIST OF ILLUSTRATIONS (cont)
Figure Page
3-1 Offset-check setup ........................................... 3-4
3-2 High-frequency check setup
............................ 3-4
4-1 P6231 adjustment locations ............................ 4-5
.................................
5-1 Functionalblock diagram 5-2
.............................
6-1 Disassembly of control box 6-12
7-1 Main circuit-boardlayout.
7-2 Flexible circuit-boardlayout.
7-2 Component layout for trouble shooting.

LIST OF TABLES
Table Page
................................
ElectricalCharacteristics ..I-2
.........................
Environmental Characteristics 1-5
................................
PhysicalCharacteristics. ..I-5
Typical Performance Effects
of Grounding Configurations
............................ 2-6
Test Equipment Required ................................ 3-2
Test Equipment Required ................................ 4-2
RelativeSusceptibility To Static
Discharge Damage
........................................... 6-2
Troubleshooting Equipment
............................. 6-5
..............
Fault Indication and Probable Cause 6-5

OPERATORS SAFETY SUMMARY
The general safety information in this part of the summary isfor both operating and servicing personnel. Specijic warnings and
cautions will befound throughout the manual where they apply, but may not appear in this summary.
Terms In This Manual Do Not Operate In ExplosiveAtmospheres
WARNING statements identify conditions or practices that TOavoid explosion, do not operate this product in any ex-
could result in personal injury or loss of life. plosive atmosphere unless it has been specifically certified
for such operation.
Do Not Remove Covers
CAUTION statements identify conditions or practices that
To avoid personal injury, do not remove the product cov-
could result in damage to the equipment or other property. ers. Do not operate the product without the covers prop-
erly installed.

SERVICE SAFETY SUMMARY
FOR QUALIFIED SERVICE PERSONNEL ONLY
Refer also to [he preceding Operators Safety Summary.
Do Not Service Alone Use Care When Servicing With Power On
-
Do not perform internal service or adjustment of this pro- To avoid personal injury, do not touch exposed connec-
duct unless another person is present and capable
of tions and components while power is on.
renderingfirst aid and resuscitation.
vii

The P6231 probe.
p623 1

SPECIFICATION
DESCRIPTION
The TEKTRONIX P6231 is a low-impedance, subminia-
--
ture, 10X active probe with identification capability. The
probe is designed for use with
11000 Series oscilloscopes
and is equipped with the new
TEKPROBE~~ interface
which draws power from the host instrument and provides
- data communication between the oscilloscope and the
probe. Data contained within the probe informs the instru-
ment of the probe's attenuation, model number and
identification number, and causes the input to automatical-
ly terminate with 50 ohms. The ID button on the probe
head activates the ID function in the instrument. The ID
signal can also set an SRQ (Service Request) flag on an
-
IEEE-488 bus if the instrument is programmed to do so.
The P6231 meets the requirementsof
UL 1244.
-
The P6231 offers a variable offset voltage at the probe
tip to reduce loading effects. The offset is controlled
through the
TEKPROBE~~ interface by the host instru-
ment. The voltage available at the probe tip spans the
-
range from -5V to + 5V, allowing the probe to minimize
loading effects on most logic families in use today.
The P6231 is available with a 1.5-meter signal cable.
No power cable is necessary, as power is drawn from the
host instrument plug-in through the
TEKPROBE~~ inter-
face.
The subminiature probe head of the P6231 is fully com-
patible with the Tektronix family
of subminiature probe ac-
cessories.
ACCESSORIES
The P6231 is shipped with the following standard ac-
cessories:
1 Instructionmanual
1 Accessory Pouch
1 Hook tip
2 Circuit-board-to-probe-tipconnectors
1 Ground lead with microhook/alligatorclip
1 Low inductanceground-lead assembly
1
A packetof assorted cable-marker sets.
Use of these accessories is described in the "Operating
Instructions" section of this manual. Part numbers and
optional accessories are listed in the "Replaceable Parts
List" (Section
7).
REV AUG 1986
Section 1 - P6231

PERFORMANCE CONDITIONS
in the "Supplemental Information" column are not verified
in the "Performance Check Procedure" (Section
31; thev
-
The electrical characteristics listed in Table 1-1 apply are either explanatory notes, calibration setup descrid-
when a calibrated probe is used with a calibrated oscillo- tions, performance characteristics for which no absolute
scope system operating within the environmental condi- limits are specified, or characteristics that are impractical
-
tions stated in Table 1-2.
to check.
Items listed in the "Performance Requirement" column The probe's physical characteristics are listed in Table
are verifiable qualitative or quantitative limits. Items listed 1-3.
Table
1-1
Electrical Characteristics
Characteristic Probe attached to 11000series
plug-in.
Attenuation
(system)
Performance Requirement
10X ?l0/0atdc.
Specification
- P6231
Supplemental Information
Input Resistance
(system)
InputCapacitance
(1 kHz to 1.5 GHz)
REV
AUG 1986
450Q ? 1 O/O at d~.~
Less than
1.6 PF.~
Probe attached to 11000series
plug-in.
Typically 1.3 pF. See Figure 1-1for
-
a graph of input impedance
versus frequency.

Table 1-1 (cant)
--
Characteristic
Bandwidth (-3 dB)
(Probeonly)
-
Rise Time
(Probeonly)
Aberrations
- (Probe only)
Signal Delay
-
Input Dynamic Range
Offset Null
-
DC Offset Range
-
-
DC Thermal Drift
' Performancerequirement not checked in manual.
Performance Requirement
I
SupplementalInformation
DC to at least 1.5 GHz.
I
Calculatedfrom probe rise time.
BW
= 0.35lrise time.
Less than
230 ps.
Test system must have a rise time
less than
100 ps.
< +4%, - 6'10, 6% p-pfor 1 st 1 ns
(ref. from
1 ns); +4%, -6% for 1 st
20 ns (ref.from 20 ns); + 3%
thereafter.
8.70 ns 100 p~.~
In addition to system
aberrations.
Probe tip to output
BNC.
o to at least + 5 V, ? 2% and
-5 V, +2%.
REV AUG 1986
Measuredfrom probe tip
to ground with a high
impedance
(a 50 kQ/V)voltmeter.
I
Specification - P6231
1-3
Less than 10 rnV/"C. Equivalent input offset

Table 1-1 (cont)
Characteristic
Output Load
Requirement
Maximum Nondestructive
Input Voltage
PerformanceRequirement
50Q + 0S0/0.
- - ---
10 Vdc continuo~~.~
30 V (dc + peak ac) for 1 sec.
Power Supply
Requirements
Specification - P6231
Supplemental Information
Power is drawn from thea
host instrument.
ID Button Life
>50 Kcyclesa
a Performance Requirement not checked in manual.

Table 1-2
Table 1-3
Environmental Characteristics
Characteristic
-
Temperature Range
(Operating)
Humidity
-
Information
0°C to +50°C
(+3Z°F to +12Z°F).
- Temperature Range
(Nonoperating)
Five cycles (120 hr.)
at 90% to 95% relative
humidity at 30°C to 60°C.
-55°C to +75"C
(-67°F to +167"F).
Transportation
- National Safe Transit
Association's
Pre-shipment Test
Procedures;
1 A-6-1.
I
PhysicalCharacteristics
-. Altitude
(Operating)
Characteristic I Information
I
To 4,600 m (1 5,000 ft).
Signal Cable Length I 1.5 m (60 in).
Net Weight (includes
accessories)
Specification - P6231
354 g (12.5 oz).

I
100kHz 1 MHz 10MHz 100 MHz 1 GHz 10GHZ
I
FREQUENCY (Hz)
Figure 1-1. Typical input impedance versus frequency.
1-6 Specification - P6231

OPERATING INSTRUCTIONS
This section of the manual is intendedto familiarize the operator with the use of the P6231 Probe. Includedare operat-
ing considerations, descriptions of the controls and connectors, instructions for the use of the accessories, and a descrip-
-
tion of the use and operationof the probe.
- NOTE
The P6231 is shippedalong with its standardacces-
--
series. At installation, save the shipping and pack-
aging materials for reuse shouldreshipment become
necessary. Refer to "Maintenance" (Section
6) for
-
further information.
OPERATING CONSIDERATIONS
Probe Handling
- The P6231's subminiature body has been designed for
ease of use when probing small circuitry. Both the probe
itself and its accessories should be handled carefully at all
times. Avoid dropping the probe body, since damage to
its tip may result. Exercise care to prevent crushing the
cable or placing excessive strain on it by pulling.
Input Dynamic Range
The input dynamic range of the P6231 is limited by the
ability of the internal amplifier to drive the
500 termination.
This limitation exists whether the input signal originates at
the probe tip (test signal) or as internal offset voltage.
Therefore, the limitation on the signal that can be applied
to the probe tip is dependent on the amount of offset
volt-
age being used. To maintain signal fidelity, the test signal
should not exceed the limits imposed by the following for-
mula:
REV AUG 1986
Section 2 - P6231

Probe Grounding
-
Inductance caused by either a long signal lead or lead and signal input connections should be kept as short
ground lead will form a series-resonantcircuit that can dis- as possible to maintain the best waveform fidelity. (Refer
tort the true waveform or degrade the bandwidth. Ground to Figures
2-1 and 2-2.)
w
T
- Probe
C,, 1.6 pF
GROUND LEAD
-
P6231 - Probe with 6' ground lead, Tr = 4 ns.
I
Ground lead inductance can significantly reduce the performance of a probe. As shown in the model above, the
ground lead inserts a series inductance into the signal path forming a series-resonant circuit between
Gin of the probe
and ground lead
L, with only Rsourceas damping. This forms a resonant circuit with an fo = 1 + (2~ q). A six-
inch ground lead has -150 nH of self inductance causing an
fo of 325 MHz, which is within the frequency response of
the instrument. This greatly degrades risetime, bandwidth, and transient accuracy (see illustration). For best results,
make sure that ground lead inductance is minimized. Three methods for doing so are described on the following page.
6027-2
Figure 2-1. Damaging effects of ground-lead inductance.
2-2 Operating instructions - P6231
REV AUG 1986

ECB to Probe-Tip Adapters pro-
vide high-quality connection test
points when installed on circuit
boards. The ribbed-plastic tip cov-
er on the probe must be removed.
The probe will then plug into the
test point directly. Adapters are
available in bags of
100 (see "Re-
placeable Parts.")
The low-inductance lead provided
with all Tek subminiature probes
allows for a substantial reduction
of ground-lead
L (-32 nH instead
of
150 nH). To use, unscrew the
ribbed-tip cover and slide off the
ground
collar with ground lead.
Slip on the low-inductance lead
ground collar (1) and reinstall the
ribbed-tip cover. Install the low-
inductance lead
(2) from the acces-
sory pack.
The Tektronix Klipkit (optional, see
"Replaceable Parts.") provides a
hands-off connection of signal and
ground to an IC (up to 16 pins).
Klipkit ground is acquired by insert-
ing a connecting pin (included) into
the Klipkit at the proper pin. The
probe body will then make ground
connection when inserted into the
other contact locations.
6027-3
Figure 2-2. Reducing the damaging effects of ground-lead inductance.
Operating Instructions - P6231