Teledyne Lecroy PCI Express 3.0 Mid-Bus Probe Setup guide

PCI Express 3.0 Mid-Bus Probe
Installation and Usage Manual
ForusewithSummit™T3‐16 / T3‐8 / T34Systems
Generated: January8,2018,13:08

TeledyneLeCroy
ii PCIe3.0Mid‐BusProbeInstallationandUsageGuide
TeledyneLeCroyProtocolSolutionsGroup
TrademarksandServicemarks
TeledyneLeCroy,CATCTrace,PETracer,PCIeProtocolSuite,PCIeProtocolAnalysis,PETracerSummit,SummitT34,
SummitT3‐8,SummitT3‐16,UniversalProtocolAnalyzerSystem,UPAS,andBusEnginearetrademarksofTeledyne
LeCroy.
MicrosoftandWindowsareregisteredtrademarksofMicrosoftCorporation.
IntelandPentiumareregisteredtrademarksofIntelCorporation.
Allothertrademarksandregisteredtrademarksarepropertyoftheirrespectiveowners.
THESPECIFICATIONSANDINFORMATIONREGARDINGTHEPRODUCTSINTHISMANUALARESUBJECTTOCHANGE
WITHOUTNOTICE.ALLINFORMATION,EXAMPLESANDRECOMMENDATIONSINTHISMANUALAREBELIEVEDTOBE
ACCURATEBUTAREREPRESENTEDWITHOUTWARRANTYOFANYKIND,EXPRESSORIMPLIED.USERSAREFULLY
RESPONSIBLEFORTHEIRAPPLICATIONOFANYPRODUCTS.
THESOFTWARELICENSEANDLIMITEDWARRANTYFORTHEACCOMPANYINGPRODUCTARESETFORTHIN
INFORMATIONTHATSHIPPEDWITHTHEPRODUCTANDAREINCORPORATEDHEREINBYTHISREFERENCE.IFYOU
AREUNABLETOLOCATETHESOFTWARELICENSEORLIMITEDWARRANTY,CONTACTTeledyneLeCroyFORACOPY.
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Thisdocumentmaybeprintedandreproducedwithoutadditionalpermission,butallcopiesshouldcontainthiscopy‐
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PCIe3.0Mid‐BusProbeInstallationandUsageGuide iii
Contents
Chapter 1: Introduction...........................................................................................1
1.1 Interposers .............................................................................................................................. 1
1.2 Specialty Probes..................................................................................................................... 1
1.3 PCIe Protocol Suite Analyzer Hardware and Software ....................................................... 1
1.4 Multi-Lead / Mid-Bus Probes ................................................................................................. 2
1.4.1 Complete Kits .........................................................................................................................................3
1.4.2 Individual Components..........................................................................................................................4
Chapter 2: Probe Components ..............................................................................7
2.1 Probe Components................................................................................................................. 7
Chapter 3: Mechanical Design ...............................................................................9
3.1 Probe Footprints..................................................................................................................... 9
3.2 Mid-bus Probe Retention ..................................................................................................... 11
3.3 Probe Connection to Analyzer ............................................................................................ 13
3.4 Probe Keepout Volume ........................................................................................................ 13
3.5 Reference Clock Probe Attachment.................................................................................... 13
3.6 Daisy Chain Cable (for x16 applications) ........................................................................... 14
Chapter 4: Electrical Design.................................................................................17
4.1 Probe Loading Effect............................................................................................................ 17
4.2 Probed Signal Electrical Requirements.............................................................................. 18
4.3 Overview of Probe - Pin Assignments................................................................................ 18
4.4 Pin Assignments for Full-size Probe Connectors ............................................................. 19
4.5 Pin Assignments for Half-Size Probe Connectors ............................................................ 31

TeledyneLeCroy
iv PCIe3.0Mid‐BusProbeInstallationandUsageGuide
Chapter 5: Installation ..........................................................................................37
5.1 Installation Steps for Mid-Bus Probe Pod and Related Components.............................. 37
5.2 Reference Clock Cable......................................................................................................... 40
5.3 Daisy-Chain Cable ................................................................................................................ 41
Chapter 6: Dual Probe Pod Setup Using External Clocking .............................43
Chapter 7: Recording Traffic................................................................................45
Chapter 8: Ordering Information .........................................................................47
Chapter 9: Updates and Licensing ......................................................................51
9.1 Updating the Analyzer.......................................................................................................... 51
9.2 License Keys......................................................................................................................... 51
9.3 License Information.............................................................................................................. 51
Appendix A: How to Contact Teledyne LeCroy..................................................53
Appendix B: China Restriction of Hazardous Substances Table.....................55

PCIe3.0Mid‐BusProbeInstallationandUsageGuide 1
Chapter1
Introduction
TeledyneLeCroyoffersawidevarietyofwaystoconnectPCIExpressprotocolanalyzersto
productsundertest.Therearefourcommonmethods:
Interposers
SpecialtyProbes
PCIeProtocolSuiteAnalyzerHardwareandSoftware
Mid‐BusProbesandMulti‐leadProbes
1.1 Interposers
IftheproductusesastandardPCIExpresscardconnector,aninterposerisusedwhichis
insertedbetweenthePCIeCardandthecardslot.Theinterposertapsoffthedatatraffic
toallowtheanalyzertomonitorandrecordtrafficwithminimalperturbationofthe
electricalinterface.
1.2 Specialty Probes
Specialtyprobesareusedwithspecificcardconfigurations,andareusedinthesame
mannerasaninterposercard(infactaspecialtyprobeisaninterposercarddesignedfora
specificinterface).TeledyneLeCroysupportsarangeofspecialtyprobesincluding
ExpressCard,AMC,XMC,MiniCard,ExternalCable,ExpressModule,HPBladeServerand
SFF8639interfaces.
1.3 PCIe Protocol Suite Analyzer Hardware and Software
Designedfordevelopersandvalidators,theTeledyneLeCroySummit T3‐16™isaGen1/
Gen2/Gen3PCIExpressadvancedverificationsystem.
Byleveragingyearsofexperienceinprotocolanalysistoolsforemergingmarkets,
Summit T3‐16blendssophisticatedfunctionalitywithpracticalfeaturestospeedthe
developmentofPCI Express™IPcores,semiconductors,bridges,switches,add‐inboards,
andsystems.

TeledyneLeCroy Multi‐Lead / Mid‐BusProbes
2 PCIe3.0Mid‐BusProbeInstallationandUsageGuide
1.4 Multi-Lead / Mid-Bus Probes
Themulti‐leadprobeallowsindividualconnectionstoeachbustraceontheboard.Ifthe
producthasanembeddedPCIExpressbus(e.g.,abuswhichrunsbetweenchipsonthe
samecircuitboard),theneitheramid‐busprobeoramulti‐leadprobecanbeused.The
mid‐busproberequiresaconnectionfootprint(seebelow)tobedesignedintotheboard.
TheTeledyneLeCroymid‐busprobesare16‐channeldifferentialsignalprobesthatmeet
thedemandforhigh‐densitysignalaccess,accuracyandrepeatabilitywhileproviding
connector‐lessattachmenttothedeviceundertest.Theyarebaseduponthe
configurationthatwasinitiallyrecommendedintheIntelPCIExpressMid‐BusProbing
FootprintandPinoutRevision1.0documentdated8/05/03andthesubsequentrevisions.
Amid‐busprobeisoneofthetoolsthatcangreatlyhelpengineersdebuggingPCIExpress
buses.APCIExpressmid‐busprobingsolutionprovidesdirectprobingcapabilityofaPCI
Expressbusatawidthofupto16lanes.Toaccommodateamid‐busprobe,aspecialpad
layoutisrequiredtoexposethePCIExpressdifferentialpairsonthesurfaceofthetarget
board.(Seefigurebelow).
Figure 1.1: Board Trace Layout for a Mid-Bus Probe
AlthoughnotpartofthePCIExpressspecifications,theindustryhasdevelopedcommon
mid‐busprobefootprintsforPCIe1.0a,PCIe2.0andPCIe3.0applications(the"full‐size"
PCIe3.0footprintisshownontheright).ThesefootprintsaredesignedintothePCB.For
PCIe3.0applications,theprobecableattachmentusesaprobeconnectorwhichis
mountedthePCBasshowninthelowerimageonthebelow.
Figure 1.2: Full Width Connector for a Mid-Bus Probe
Theappropriatefootprintisrecommendedforusewithalltypesoftestequipment
includingprotocolanalyzers,logicanalyzersandoscilloscopes.Therequiredpadlayout
canbeinx4(half‐size),x8(full‐size)orx16(dualfull‐size)configurationsdependingon
themaximumnumberoflanesthatneedtobeprobed.Allfootprintsizessupportprobing
atreducedlanewidths(e.g.,x1)andatlanewidthsuptothemaximumfootprintsize.
TheillustrationFigure 2.1onpage 7showsthecompletedassemblyforprobinguptox8
configurations(forx16configurations,asecondY‐cable,probepod,headercable

PCIe3.0Mid‐BusProbeInstallationandUsageGuide 3
Multi‐Lead / Mid‐BusProbes TeledyneLeCroy
assemblyandprobeconnectorareused,butconnectionismadetothesame
Summit T3‐16analyzer‐seeFigure 3.8onpage 15).Asnoted,asinglefull‐sizeprobe
connectorsupportsuptox8lanewidthsbidirectional,butcanalsobeconfiguredto
supportx16unidirectional(ascanahalf‐sizeprobeconnectorsupportx8unidirectional).
Note: Thismanualdocumentsthemid‐busfootprintusedforPCIe3.0applications;theprobe
footprintsforPCIe1.0aandPCIe2.0arecoveredintheGen2Mid‐BusProbeUserManual.
TeledyneLeCroymakestwoversionsofmid‐busprobes,oneforPCIe2.0(2.5and5GT/s
datarates,alsoreferredtoas"Gen2")andoneforPCIe3.0(2.5,5and8GT/sdatarates,
alsoreferredtoas"Gen3").ThePCIe3.0mid‐busprobeisforusewiththeSummitT3‐16,
SummitT3‐8,SummitT34analyzers,andisdocumentedinthismanual.
ThePCIe3.0mid‐busprobe,inasimilarfashiontothePCIe1.0aandPCIe2.0
implementationsthatprecededit,isavailableintwoversions:afull‐sizeprobeandahalf‐
sizeprobe.Thefull‐sizeprobeforisshownonFigure 2.1onpage 7.Ithasafour‐strand
ribboncableandax16connectionheader.Ahalf‐sizeprobehasatwostrandribboncable
andax8connectionheader.
ThepartnumbersandcomponentsoftheTeledyneLeCroyPCIe3.0mid‐busprobesareas
follows:
1.4.1 Complete Kits
1. PE090ACA‐XPCIe3.0Mid‐BusProbeKit*
x8LaneWidth,Full‐sizeConnector,whichincludes:
PE010UCA‐X:iPassY‐Cable
PE087ACA‐X:PCIe3.0Mid‐BusProbePodwithpowersupply
PE057ACA‐X:PCIe3.0x8Mid‐busProbeCable
PE009UCA‐X:DaisyChainClockCable
PE014UCA‐X:ReferenceClockCable
PE047UIA‐X:Gen3Mid‐busProbeConnectorFull‐size
*Supportsuptox8bi‐directionallinkorx16uni‐directionallink(forusewith
twoSummitT34s,oneT3‐8oroneT3‐16analyzers).
2. PE094ACA‐XPCIe3.0Mid‐BusProbeKit*
x4LaneWidth,Half‐sizeConnector,whichincludes:
PE010UCA‐X:iPassY‐Cable
PE087ACA‐X:PCIe3.0x8Mid‐BusPodwithpowersupply
PE056ACA‐X:Mid‐busProbeCable(x4)
PE009UCA‐X:DaisyChainClockCable
PE014UCA‐X:ReferenceClockCable
PE054UIA‐X:PCIe3.0Mid‐busProbeConnectorHalf‐Size
*Supportsuptox4bi‐directionallinkorx8uni‐directionallink(forusewith
oneT3‐8oroneT3‐16analyzer).

TeledyneLeCroy Multi‐Lead / Mid‐BusProbes
4 PCIe3.0Mid‐BusProbeInstallationandUsageGuide
3. PE091ACA‐XPCIe3.0Mid‐BusProbeKit*
x4LaneWidth,Half‐sizeConnector,whichIncludes:
PE013UCA‐X:x4‐to‐x8StraightiPassCable
PE087ACA‐X:PCIe3.0x8Mid‐BusPodwithpowersupply
PE056ACA‐X:Mid‐busProbeCable(x4)
PE009UCA‐X:DaisyChainClockCable(secondcableforfutureexpandability)
PE014UCA‐X:ReferenceClockCable(secondcableforfutureexpandability)
PE054UIA‐X:PCIe3.0Mid‐busProbeConnectorHalf‐Size
*Supportsuptox4bi‐directionallinkorx8uni‐directionallink(forusewith
oneSummitT‐34analyzeronly).
TABLE 1.1: Full Size Probe Kit Capabilities
*:Forbidirectionalx16,twoPE090ACA‐Xkitsarerequired.
TABLE 1.2: Half Size Probe Kit Capabilities
1.4.2 Individual Components
1. PE087ACA‐XPCIe3Mid‐busPodwithThumbscrews
Nocables(forusewithSummitT3‐16orSummitT3‐8),includespowersupply.
2. PE056ACA‐XPCIe3Mid‐busProbeCablewithThumbscrews
G3x4probecable(Halfsize‐‐connectstoG3Mid‐busbox,forusewithSummit
T34,SummitT3‐16orSummitT3‐8)
3. PE057ACA‐XPCIe3Mid‐busProbeCablewithThumbscrews
G3x8probecable(Fullsize‐‐connectstoG3Mid‐busbox,forusewithSummit
T3‐16orSummitT3‐8)
4. PE038UIA‐XPCIeGen3x8DishforMid‐busProbe
5. PE047UIA‐XGen3Mid‐busProbeConnectorFull‐Size
PE090ACA-X PCIe 3.0 x8 Full-Size Probe Kit
x1 x2 x4 x8 x16
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xxxxxxxxx*
PE094ACA-X / PE091ACA-X PCIe 3.0 x4 Half-Size Probe Kit
x1 x2 x4 x8 x16
Uni Bidir Uni Bidir Uni Bidir Uni Bidir Uni Bidir
xxxxxxx

PCIe3.0Mid‐BusProbeInstallationandUsageGuide 5
Multi‐Lead / Mid‐BusProbes TeledyneLeCroy
6. PE054UIA‐XGen3Mid‐busProbeConnectorHalf‐Size
7. PE010UCA‐XY‐CablefromMid‐busProbePodtoAnalyzer
8. PE013UCA‐Xx4‐to‐x8StraightiPassCable

TeledyneLeCroy Multi‐Lead / Mid‐BusProbes
6 PCIe3.0Mid‐BusProbeInstallationandUsageGuide