Telit Wireless Solutions GL865-DUAL V3 Installation manual

GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05

GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05
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APPLICABILITY TABLE
PRODUCT
GL865-DUAL V3

GL865-DUAL V3 Hardware User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A.

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Contents
1. Introduction
............................................................................................................ 9
1.1. Scope............................................................................................................................. 9
1.2. Audience........................................................................................................................ 9
1.3. Contact Information, Support .......................................................................................... 9
1.4. Document Organization ................................................................................................ 10
1.5. Text Conventions ......................................................................................................... 11
1.6. Related Documents....................................................................................................... 11
2. Overview
............................................................................................................... 12
3. GL865-DUAL V3 Mechanical Dimensions
................................................................ 13
4. GL865-DUAL V3 module connections
...................................................................... 14
4.1. PIN-OUT..................................................................................................................... 14
4.2. Pin Layout ................................................................................................................... 17
5. Hardware Commands
............................................................................................. 18
5.1. Auto-Turning ON the GL865-DUAL V3 ....................................................................... 18
5.2. Turning OFF the GL865-DUAL V3 .............................................................................. 20
5.3. Resetting the GL865-DUAL V3.................................................................................... 22
5.3.1. Hardware Unconditional restart .........................................................................................22
6. Power Supply
........................................................................................................ 24
6.1. Power Supply Requirements ......................................................................................... 24
6.2. Power Consumption ..................................................................................................... 25
6.3. General Design Rules ................................................................................................... 26
6.3.1. Electrical Design Guidelines .............................................................................................26
6.3.2. Thermal Design Guidelines............................................................................................... 29
6.3.3. Power Supply PCB layout Guidelines ................................................................................30
7. Antenna
................................................................................................................ 31
7.1. GSM Antenna Requirements......................................................................................... 31
7.1.1. GL865-DUAL V3 Antenna – PCB line Guidelines .............................................................31
7.2. PCB Design Guidelines ................................................................................................ 33

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7.2.1. Transmission line design...................................................................................................33
7.2.2. Transmission line measurements .......................................................................................34
7.3. GSM Antenna - Installation Guidelines.......................................................................... 36
8. Logic level specifications
......................................................................................... 37
8.1. Reset signal.................................................................................................................. 38
9. Serial Ports
............................................................................................................ 39
9.1. MODEM SERIAL PORT ............................................................................................. 39
9.2. RS232 level translation................................................................................................. 41
10. Audio Section Overview
....................................................................................... 43
10.1. MIC connection ........................................................................................................ 43
10.2. LINE-IN connection.................................................................................................. 44
10.3. EAR connection........................................................................................................ 46
10.4. Electrical Characteristics ........................................................................................... 48
10.4.1. Input Lines.......................................................................................................................48
10.4.2. Output Lines ....................................................................................................................49
11. General Purpose I/O
............................................................................................ 50
11.1. GPIO Logic levels..................................................................................................... 51
11.2. Using a GPIO Pad as INPUT..................................................................................... 52
11.3. Using a GPIO Pad as OUTPUT ................................................................................. 52
11.4. Using the RF Transmission Control GPIO4 ................................................................ 52
11.5. Using the RFTXMON Output GPIO5 ........................................................................ 52
11.6. Using the Alarm Output GPIO6................................................................................. 53
11.7. Using the Buzzer Output GPIO7 ................................................................................ 53
11.8. Magnetic Buzzer Concepts ........................................................................................ 54
11.8.1. Short Description..............................................................................................................54
11.8.2. Frequency Behavior..........................................................................................................55
11.8.3. Power Supply Influence ....................................................................................................55
11.8.4. Working Current Influence................................................................................................55
11.9. STAT LED Indication of network service availability................................................. 56
11.10. SIMIN detect function............................................................................................... 57

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11.11. RTC Bypass out........................................................................................................ 57
11.12. SIM Holder Implementation ...................................................................................... 57
12. DAC and ADC section
......................................................................................... 58
12.1. DAC Converter......................................................................................................... 58
12.1.1. Description ......................................................................................................................58
12.1.2. Enabling DAC.................................................................................................................. 59
12.1.3. Low Pass Filter Example...................................................................................................59
12.2. ADC Converter......................................................................................................... 60
12.2.1. Description ......................................................................................................................60
12.2.2. Using ADC Converter.......................................................................................................60
13. Mounting the GL865-DUAL V3 on your Board
...................................................... 61
13.1. General..................................................................................................................... 61
13.2. Module finishing & dimensions ................................................................................. 61
13.3. Recommended foot print for the application ............................................................... 62
13.4. Stencil ...................................................................................................................... 62
13.5. PCB pad design ........................................................................................................ 63
13.6. Recommendations for PCB pad dimensions (mm): ..................................................... 63
13.7. Solder paste .............................................................................................................. 65
13.8. GL865-DUAL V3 Solder reflow................................................................................ 65
13.9. Debug of the GL865-DUAL V3 in production............................................................ 66
14. Packing system
................................................................................................... 67
14.1. Packing on tray ......................................................................................................... 67
14.2. Packing on reel ......................................................................................................... 69
14.2.1. Carrier tape detail.............................................................................................................70
14.2.2. Carrier tape detail.............................................................................................................70
14.3. Moisture sensibility................................................................................................... 71
15. Conformity Assessment Issues
.............................................................................. 72
16. Safety Recommendations
..................................................................................... 75
17. Document History
............................................................................................... 76

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1. Introduction
1.1. Scope
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit GL865-DUAL V3 module.
1.2. Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our GL865-DUAL V3 modules.
1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Center (TTSC) at:
[e-mail]
[e-mail]
[e-mail]
[e-mail]
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.

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1.4. Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and support
information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “GL865-DUAL V3 Mechanical Dimensions”
Chapter 4: “GL865-DUAL V3 Module Connections” deals with the pin out configuration and layout.
Chapter 5: “Hardware Commands” How to operate on the module via hardware.
Chapter 6: “Power supply” Power supply requirements and general design rules.
Chapter 7: “Antenna” The antenna connection and board layout design are the most important parts in
the full product design.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic levels
for this module.
Chapter 9: “Serial ports” The serial port on the Telit GL865-DUAL V3 is the core of the interface
between the module and OEM hardware
Chapter 10: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the GL865-
DUAL V3 Telit Modules.
Chapter 11: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 12 “DAC and ADC Section” Deals with these two kind of converters.
Chapter 13: “Mounting the GL865-DUAL V3 on the application board” Recommendations and
specifics on how to mount the module on the user’s board.
Chapter 14: “Packaging system” Recommendations and specifics on how the system is packaged.
Chapter 15: “Conformity Assessment Issues”
Chapter 16: “Safety Recommendations”
Chapter 17: “Document History” Holds all document changes

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1.5. Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6. Related Documents
•Telit's GSM/GPRS Family Software User Guide, 1vv0300784
•Audio settings application note , 80000NT10007a
•Digital Voice Interface Application Note, 80000NT10004a
•GL865-DUAL V3 Product description, 80400ST10120a
•SIM Holder Design Guides, 80000NT10001a
•AT Commands Reference Guide, 80000ST10025a
•Telit EVK2 User Guide, 1vv0300704

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2. Overview
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit GL865-DUAL V3 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace all hardware solutions and products that may be designed. Avoiding the wrong
solutions shall be considered as mandatory. While the suggested hardware configurations
shall not be considered mandatory, the information given shall be used as a guide and a
starting point for properly developing your product with the Telit GL865-DUAL V3 module.
For further hardware details that may not be explained in this document refer to the Telit
GL865-DUAL V3 Product Description document where all the hardware information is
reported.
NOTICE:
The integration of the GSM/GPRS GL865-DUAL V3 cellular module within user application
shall be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement
of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent rights of Telit Communications S.p.A. other
than for circuitry embodied in Telit products. This document is subject to change without
notice.

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3. GL865-DUAL V3 Mechanical Dimensions
The GL865-DUAL V3 overall dimensions are:
•Length: 24.4 mm
•Width: 24.4 mm
•Thickness: 2.6 mm
•Weight 2.8 g

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4. GL865-DUAL V3 module connections
4.1. PIN-OUT
Pad Signal I/O Function Note Type
Audio
20 EAR- AO Earphone signal output, phase - Audio
21 EAR+ AO Earphone signal output, phase + Audio
22 MIC- AI Mic. signal input; phase- Audio
24 MIC+ AI Mic. signal input; phase+ Audio
23 AGND - Analog Ground -
SIM card interface
9 SIMVCC - External SIM signal – Power supply for the SIM 1,8 / 3V
10 SIMRST O External SIM signal – Reset 1,8 / 3V
11
SIMCLK
O
External SIM signal – Clock
1,8 / 3V
12 SIMIO I/O External SIM signal – Data I/O 4.7k Pull up 1,8 / 3V
X
All GPI0
can be
program
med
SIMIN I Presence SIM input CMOS 1.8V
Trace
44
RXD_AUX
I
Auxiliary UART (RX Data)
CMOS 1.8V
45 TXD_AUX O Auxiliary UART (TX Data) CMOS 1.8V
Prog. / Data + HW Flow Control
1 C109/DCD/GPO O
Output for Data carrier detect signal (DCD) to DTE
/ GP output
CMOS 1.8V
2 C125/RING/GPO O
Output for Ring indicator signal (RI) to DTE
/ GP output
CMOS 1.8V
3 C107/DSR/GPO O
Output for Data set ready signal (DSR) to DTE
/ GP output
CMOS 1.8V
4 C108/DTR/GPI I
Input for Data terminal ready signal (DTR) from DTE
/ GP input
CMOS 1.8V
5 C105/RTS/GPI I
Input for Request to send signal (RTS) from DTE
/ GP input
CMOS 1.8V
6 C106/CTS/GPO O
Output for Clear to send signal (CTS) to DTE
/ GP output
CMOS 1.8V
7 C103/TXD I Serial data input (TXD) from DTE CMOS 1.8V
8 C104/RXD O Serial data output to DTE CMOS 1.8V
DAC and ADC
13 ADC_IN1 AI Analog/Digital converter input A/D
14
ADC_IN2
AI
Analog/Digital converter input
A/D
15 DAC_OUT AO Digital/Analog converter output D/A
Miscellaneous Functions
30 VRTC AO VRTC Backup Power
47
RESET* I Reset input CMOS 1.8V
43 V_AUX / PWRMON O
1.8V stabilized output Imax=100mA
/ Power ON monitor
Power Out 1.8V
34 Antenna I/O Antenna pad – 50 Ω RF

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Pad Signal I/O Function Note Type
GPIO
42 GPIO_01 / DVI_WA0 I/O
GPIO01 Configurable GPIO
/ Digital Audio Interface (WA0)
CMOS 1.8V
41 GPIO_02 / JDR /
DVI_RX I/O
GPIO02 I/O pin
/ Jammer Detect Report
/ Digital Audio Interface (RX)
CMOS 1.8V
40 GPIO_03 / DVI_TX I/O
GPIO03 GPIO I/O pin
/ Digital Audio Interface (TX)
CMOS 1.8V
39 GPIO_04 / TX Disable
/ DVI_CLK I/O
GPIO04 Configurable GPIO
/ TX Disable input
/ Digital Audio Interface (CLK)
CMOS 1.8V
29 GPIO_05 / RFTXMON I/O
GPIO05 Configurable GPIO
/ Transmitter ON monitor
CMOS 1.8V
28 GPIO_06 / ALARM I/O
GPIO06 Configurable GPIO
/ ALARM
CMOS 1.8V
27 GPIO_07 / BUZZER I/O
GPIO07 Configurable GPIO
/ Buzzer
CMOS 1.8V
26 GPIO_08 / STAT_LED I/O
GPIO08 Configurable GPIO
/ Digital Audio Interface (CLK)
CMOS 1.8V
Power Supply
38
VBATT - Main power supply (Baseband) Power
37 VBATT_PA - Main power supply (Radio PA) Power
23 AGND - AF Signal Ground (see audio section) AF Signal
32 GND - Ground Power
33 GND - Ground Power
35
GND
-
Ground
Power
36 GND - Ground Power
46 GND - Ground Power
RESERVED
48 -
16 -
17 -
18 -
19 -
25 -
31 -
WARNING:
Reserved pins must not be connected.

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NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
Pin
signal
38, 37
VBATT & VBATT_PA
32, 33, 35, 36, 46
GND
23
AGND
7
TXD
8
RXD
5
RTS
43
V_AUX / PWRMON
47
RESET*
45
TXD_AUX
44
RXD_AUX

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4.2. Pin Layout
TOP VIEW
NOTE:
The pins defined as NC/RFU shall be considered RESERVED and must not be connected to
any pin in the application.

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5. Hardware Commands
5.1. Auto-Turning ON the GL865-DUAL V3
To Auto-turn on the GL865-DUAL V3, the power supply must be applied on the power pins
VBATT and VBATT_PA, after 1000 m-seconds, the V_AUX / PWRMON pin will be at the
high logic level and the module can be considered fully operating.
When the power supply voltage is between 3.22V and 3.4V, after 5000 m-seconds, the
V_AUX / PWRMON pin will be at the high logic level and the module can be considered
fully operating.
The following flow chart shows the proper turn on procedure:
Modem ON Proc.
PWR supply = ON?
Y
Delay 1s - 5s for Low
Voltage Operating
Y
Modem Reset Proc.
AT init sequence.
N
Start AT
CMD.
N
PWMON = ON?
Y
PWMON = ON?
Delay 300mS
Enter AT<CR>
AT answer in
1second ?
N
Y
N
Delay 1s

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NOTE:
The power supply must be applied either at the same time on pins VBATT and VBATT_PA,
or first applied on VBATT_PA and then on VBATT. The opposite sequence shall be avoided.
The reverse procedure applies for powering down the module: first disconnect VBATT, then
VBATT_PA, or both at once.
NOTE:
In order to prevent a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GL865-DUAL V3 when the module is powered
OFF or during an ON/OFF transition.
A flow chart showing the AT commands managing procedure is displayed below:
Modem ON Proc.
Disconnect PWR
supply
AT init sequence.
Delay 300mS
Enter AT<CR>
AT answer in
1second?
Y
N
Start AT CMD.

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5.2. Turning OFF the GL865-DUAL V3
Turning off of the device can be done in two ways:
•General turn OFF
•Processor turn OFF
General turn OFF – disconnect the power supply from the both power pins VBATT and
VBATT_PA at the same time. In this case all parts of the module are in OFF condition, no
power consumption is present.
Processor turn OFF – disconnect the power supply only from the power pin VBATT, the
power pin VBATT_PA can be connected to power supply, in this case a low, about 30uA,
power consumption is present
Before either of both OFF procedures is applied, the AT#SYSHALT AT command must be
sent (see AT Commands Reference Guide, 80000ST10025a), after the OK response message,
wait for 10 seconds, then the module can be consider fully not operating and at this moment is
possible disconnect the Power Supply.
The following flow chart shows the proper turnoff procedure:
Modem OFF
Proc.
AT#SYSHALT
Disconnect PWR
supply
10s timeout
Modem ON Proc.
Delay 1.5s