Telit Wireless Solutions NE310H2 Guide

[01.2017]
Mod.0818 2017-01 Rev.0
NE310H2
Hardware Design Guide
1VV0301608 Rev. 10 –2020-08-12

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligationto notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software(SW) products described in this instructionmanual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) orreproduced inany manner without theexpress written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party
supplied SW, except for the normal non-exclusive, royalty free license to use that arises by
operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities”). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE
PRODUCTS
NE310H2-W1

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Contents
NOTICE 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
I. License Agreements..................................................................... 3
II. Copyrighted Materials................................................................... 3
III. High Risk Materials....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights......................................................................... 3
APPLICABILITY TABLE................................................................................ 4
CONTENTS.................................................................................................... 5
1. INTRODUCTION.......................................................................... 8
Scope........................................................................................... 8
Audience....................................................................................... 8
Contact Information, Support........................................................ 8
Text Conventions.......................................................................... 9
Related Documents.................................................................... 10
2. GENERAL PRODUCT DESCRIPTION ...................................... 11
Overview..................................................................................... 11
Product Variants and Frequency Bands...................................... 11
Target market............................................................................. 12
Main features.............................................................................. 12
TX Output Power........................................................................ 12
RX Sensitivity ............................................................................. 13
Mechanical specifications........................................................... 14
2.7.1. Dimensions................................................................................. 14
Temperature Range.................................................................... 14
3. PINS ALLOCATION................................................................... 15
Pin-out........................................................................................ 15
LGA Pads Layout........................................................................ 23
4. POWER SUPPLY....................................................................... 24

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Operating Modes........................................................................ 24
Power Supply Requirements....................................................... 25
Power Consumption ................................................................... 26
General Design Rules................................................................. 28
4.4.1. Electrical Design Guidelines ....................................................... 28
4.4.1.1. +5V/+12V Source Power Supply Design Guidelines................... 28
4.4.1.2. Battery Source Power Supply Design Guidelines........................ 29
4.4.2. Thermal Design Guidelines......................................................... 30
4.4.3. Power Supply PCB layout Guidelines......................................... 31
RTC Bypass out.......................................................................... 31
VAUX Power Output................................................................... 32
5. DIGITAL SECTION .................................................................... 33
Logic Levels................................................................................ 33
Power On.................................................................................... 34
Power Off.................................................................................... 38
Unconditional Restart.................................................................. 40
5.4.1. PIN DESCRIPTION.................................................................... 40
5.4.2. Operating levels.......................................................................... 41
WAKEUP from PSM ................................................................... 42
5.1.1. Pin Description ........................................................................... 42
5.1.2. Application Example................................................................... 44
SPI.............................................................................................. 45
Communication ports.................................................................. 46
5.3.1. Serial Ports................................................................................. 46
5.3.1.1. MODEM SERIAL PORT 0 (USIF0)............................................. 46
5.3.1.2. MODEM SERIAL PORT 1 (USIF1)............................................. 48
5.3.1.3. MODEM SERIAL PORT 3 (Auxiliary –DEBUG ONLY)............... 49
5.3.1.4. RS232 LEVEL TRANSLATION................................................... 50
5.3.1.5. 3.3V/5V UART level translation................................................... 52
General purpose I/O................................................................... 53
5.4.1. Using a GPIO as INPUT............................................................. 54
5.4.2. Using a GPIO as OUTPUT ......................................................... 54
5.4.3. Indication of network service availability ..................................... 55
External SIM Holder.................................................................... 56
ADC............................................................................................ 56
6. RF SECTION.............................................................................. 57
Antenna requirements................................................................. 57

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6.1.1. Main Antenna ............................................................................. 57
6.1.2. PCB Design guidelines............................................................... 58
6.1.2.1. Transmission line design ............................................................ 59
6.1.2.2. Transmission Line Measurements .............................................. 60
6.1.2.3. Antenna Installation Guidelines................................................... 61
7. MECHANICAL DESIGN............................................................. 62
8. APPLICATION PCB DESIGN .................................................... 63
PCB pad design.......................................................................... 64
PCB pads ................................................................................... 64
Stencil......................................................................................... 65
Solder paste ............................................................................... 65
Solder Reflow............................................................................. 65
9. PACKAGING.............................................................................. 66
Tray............................................................................................ 66
Moisture sensitivity ..................................................................... 68
10. CONFORMITY ASSESSMENT ISSUES .................................... 69
Approvals.................................................................................... 69
Declaration of Conformity ........................................................... 69
11.SAFETY RECOMMENDATIONS................................................ 70
READ CAREFULLY.................................................................... 70
12. REFERENCE TABLE OF RF BANDS CHARACTERISTICS..... 71
13. ACRONYMS............................................................................... 72
14. DOCUMENT HISTORY.............................................................. 74

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1. INTRODUCTION
Scope
This document introduces the Telit NE310H2 modules and presents possible and
recommended hardware solutions for developing a product based on this module. All the
features and solutions detailed in this document are applicable to all NE310H2 variants,
where NE310H2 refers to the variants listed in the applicability table.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for
properly developing your product with the Telit module.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
•TS[email protected]
•[e-mail]
•[e-mail]
•[e-mail]
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.

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Text Conventions
Danger –This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning –Alerts the user to important points about
integrating the module, ifthese points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information –Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents
•AT Commands User Guide, 1VV0301611
•xE310 TLB Documentation, 1VV0301617

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2. GENERAL PRODUCT DESCRIPTION
Overview
The NE310H2 is part of a new generation of modules in Telit’s NBIoT module portfolio.
With its compact LGA footprint, it is designed for those m2m applications requiring
miniature foot print.
It is a multi band LTE NBIoT communication product based on the market’ latest NBIoT
core which allows integrators to plan on availability for even the longest lifecycle
applications, highly recommended for new designs specified for NBIoT coverage
worldwide.
It is highly recommended for new designs requiring NBIoT coverage in a small and robust
LGA package, which implies easy integration and low impact on final application size and
costs. Ease of production and small foot print makes it the ideal solution for applications in
security alarms, automated meter reading, and pos terminals.
The NE310H2 operates with 1.8 V GPIOs, minimizing power consumption and making it
even more ideally suited for battery powered and wearable device applications.
Product Variants and Frequency Bands
Product
2G Band
(MHz)
3G Band
(MHz)
4G Band
(MHz)
Region
NE310H2-W1
-
-
B1, B2, B3, B4,
B5, B8, B12, B13,
B18, B19, B20,
B25, B26, B28,
B66, B71, B85
Worldwide
Refer to “RF Section” for details information about frequencies and bands.
NOTE:
The module is supporting the Multi-Frequency Band Indicator (MFBI)

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Target market
The NE310H2 enables enterprises to deploy new small footprint designs across many
application areas including:
•Utility metering
•Home and commercial security
•POS devices
•Logistics terminals
Main features
Function
Features
Modem
•3GPP Rel.14 LTE Cat.NB2
•SMS support (text and PDU)
•Real Time Clock
Interfaces
•3 UARTs (Main and secondary with flow control and Auxiliary with RX
TX only)
•USB V1.1 (debug only)
•SPI
•I2C
•6 GPIOs
•Antenna pad
TX Output Power
Band
Power class
All Bands
Class 3 (23dB)

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RX Sensitivity
Band
REFsens (dBm)Typical
3GPP REFsens (dBm)*
Band 1
-115.1
-108.2
Band 2
-115.1
-108.2
Band 3
-114.1
-108.2
Band 4
-114.9
-
Band 5
-115.3
-108.2
Band 8
-115.5
-108.2
Band 12
-115.2
-108.2
Band 13
-115.3
-108.2
Band 18
-115.1
-108.2
Band 19
-115.4
-108.2
Band 20
-115.1
-108.2
Band 25
-114.5
-
Band 26
-115.1
-108.2
Band 28
-115.4
-108.2
Band 66
-114.9
-108.2
Band 71
-115.1
-
Band 85
-115.2
-

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Mechanical specifications
2.7.1. Dimensions
The overall dimensions of NE310H2 family are:
Length: 15 mm
Width: 18 mm
Thickness: 2.3 mm
Temperature Range
Condition
Range
Note
Operating Temperature Range
-20°C to +55°C
The module is fully functional(*)
within this 3GPP temperature
range and meets 3GPP
specifications.
Extended Temperature Range
-40°C to +85°C
The module is fully functional(*)
within this temperature range.
The RF Performance may
deviate from 3GPP
requirements in this extended
range.
For example: receiver sensitivity
or maximum output power may
deviate by a few dB due to
limitations of physics like higher
thermal noise floor at high
temperature.
Storage Temperature Range
-40°C to +85°C
-
(*) Functional: if applicable, the module is able to make and receive data calls, send and receive
SMS and data traffic.

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3. PINS ALLOCATION
Pin-out
Pin
Signal
I/O
Function
Type
Comment
Asynchronous Serial Port (USIF0) –Prog. / Data + HW Flow Control
Y16
TXD0
I
Serial data input (TXD) from DTE
CMOS 1.8
AA15
RXD0
O
Serial data output (RXD) to DTE
CMOS 1.8
Y18
RTS0
I
Input for Request to send signal (RTS) from
DTE
CMOS 1.8
AA17
CTS0
O
Output for Clear to send signal (CTS) to
DTE
CMOS 1.8
Asynchronous Serial Port (USIF1)
Y12
TXD1
I
Serial data input (TXD) from DTE
CMOS 1.8
AA11
RXD1
O
Serial data output (RXD) to DTE
CMOS 1.8
AA13
RTS1
I
Input for Request to send signal (RTS) from
DTE
CMOS 1.8
Y14
CTS1
O
Output for Clear to send signal (CTS) to
DTE
CMOS 1.8
USB 1.1 (Debug Port)
U19
USB_D+
I/O
USB differential Data (+)
V18
USB_D-
I/O
USB differential Data (-)
T18
USB_VBUS
-
Power sense for the internal USB
transceiver
Compliant to VUSB
from USB V1.1
specification
(from 4.4 V to 5.5V)
Auxiliary UART
Y10
TX_AUX
O
AUX UART (TX Data to DTE)
CMOS 1.8
AA9
RX_AUX
I
AUX UART (RX Data from DTE)
CMOS 1.8

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SIM card interface
L1
SIM_CLK
O
External SIM signal –Clock
1.8 V
M2
SIM_RST
O
External SIM signal –Reset
1.8 V
N1
SIM_DAT
I/O
External SIM signal –Data I/O
1.8 V
P2
SIM_VCC
-
External SIM signal –Power supply for the
SIM
1.8 V
X
SIMIN
I
Presence SIM input
CMOS 1.8
See next chapters
DIGITAL IO
V11
IO1
I/O
Configurable GPIO01
Alternate 1: I2C_SDA
Alternate 2: SIMIN
CMOS 1.8
GPIO is pull-down
and Input in default,
Alternate function
can be configured
by AT#GPIO
When reused for
I2C, these two pins
are used in pairs
V13
IO2
I/O
Configurable GPIO02
Alternate 1: I2C_SCL
Alternate 2: SIMIN
CMOS 1.8
D7
IO3
I/O
Configurable GPIO03
Alternate 1: I2C_SDA
Alternate 2: SIMIN
CMOS 1.8
GPIO is pull-down
and Input in default,
Alternate function
can be configured
by AT#GPIO
When reused for
I2C, these two pins
are used in pairs
D9
IO4
I/O
Configurable GPIO04
Alternate 1: I2C_SCL
Alternate 2: SIMIN
CMOS 1.8
D11
IO5
I/O
Configurable GPIO05
Alternate 1: SIMIN
CMOS 1.8
GPIO is pull-down
and Input in default,
Alternate function
can be configured
by AT#GPIO
D13
IO6
I/O
Configurable GPIO06
Alternate 1: SIMIN
CMOS 1.8
GPIO is pull-down
and Input in default,
Alternate function
can be configured
by AT#GPIO
ADC
B18
ADC
I
Analog To Digital converter Input
A/D
10-bit ,range 0-1.4V

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RF Section
A5
MAIN ANTENNA
I/O
Main Antenna (50 ohm)
RF
Main Antenna
(50 ohm)
Miscellaneous Functions
B2
S_LED
O
Status LED
CMOS 1.8V
N16
ON_OFF*
I
Input Command for Power ON/OFF
CMOS 1.8V
Active Low
R19
RST*
I
Reset
CMOS 1.8V
Active Low
L16
WAKE*
O
Input Command to Wake from PSM
CMOS 1.8V
Falling edge trigger
R1
VAUX
O
Supply Output for external accessories /
Power ON Monitor
Power
Max10mA
Audio Section
C1
DVI_WA0
I/O
Digital Audio Interface I2S (WA0)
CMOS 1.8V
Digital audio left-
right clock output
D2
DVI_RX
I
Digital Audio Interface I2S (RX)
CMOS 1.8V
Send digital signal
to codec’s DAC pin
E1
DVI_TX
O
Digital Audio Interface I2S (TX)
CMOS 1.8V
Receive digital
signal from codec’s
ADC
F2
DVI_CLK
I/O
Digital Audio Interface I2S (BCLK)
CMOS 1.8V
Digital audio bit
clock output
L4
DVI_MCLK
I/O
Digital Audio Interface I2S (MCLK)
CMOS 1.8V
Master clock output
Bus SPI Master
Y6
SPI_CS
O/I
SPI - Circuit Select
CMOS 1.8V
AA7
SPI_CLK
O/I
SPI - Clock
CMOS 1.8V
AA5
SPI_MOSI
O/I
SPI - MOSI
CMOS 1.8V
Y8
SPI_MISO
I/O
SPI - MISO
CMOS 1.8V

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Power Supply
W1
VBATT_PA
-
Main power supply (Radio PA)
Power
Range: 3.0~3.6 V,
recommended
value is 3.3V
AA3
VBATT
-
Main power supply (Baseband)
Power
Range: 3.0~3.6 V,
recommended
value is 3.3V
A3
GND
-
RF Ground
Power
A7
GND
-
RF Ground
Power
A9
GND
-
RF Ground
Power
A13
GND
-
RF Ground
Power
A17
GND
-
RF Ground
Power
B4
GND
-
RF Ground
Power
B6
GND
-
RF Ground
Power
B10
GND
-
RF Ground
Power
B12
GND
-
RF Ground
Power
B14
GND
-
RF Ground
Power
B16
GND
-
RF Ground
Power
C19
GND
-
RF Ground
Power
D18
GND
-
RF Ground
Power
F8
GND
-
Thermal Ground
Power
F12
GND
-
Thermal Ground
Power
F18
GND
-
Thermal Ground
Power
G19
GND
-
Thermal Ground
Power

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H6
GND
-
Thermal Ground
Power
H14
GND
-
Thermal Ground
Power
J19
GND
-
Thermal Ground
Power
K18
GND
-
Thermal Ground
Power
M18
GND
-
Thermal Ground
Power
N19
GND
-
Thermal Ground
Power
P6
GND
-
Thermal Ground
Power
P14
GND
-
Thermal Ground
Power
T8
GND
-
Thermal Ground
Power
T12
GND
-
Thermal Ground
Power
U1
GND
-
Power Ground
Power
V2
GND
-
Power Ground
Power
W19
GND
-
Power Ground
Power
Y2
GND
-
Power Ground
Power
Y4
GND
-
Power Ground
Power
RESERVED
G1
RESERVED
-
RESERVED
H2
RESERVED
-
RESERVED
J1
RESERVED
-
RESERVED
K2
RESERVED
-
RESERVED
J4
RESERVED
-
RESERVED

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WARNING
Reserved pins must not be connected.
G4
RESERVED
-
RESERVED
L19
RESERVED
-
RESERVED
A11
RESERVED
-
RESERVED
N4
RESERVED
-
RESERVED
R4
RESERVED
-
RESERVED
V7
RESERVED
-
RESERVED
V9
RESERVED
-
RESERVED
P18
RESERVED
-
RESERVED
AA13
RESERVED
-
RESERVED
T2
RESERVED
-
RESERVED
E19
RESERVED
-
RESERVED
R16
RESERVED
-
RESERVED
H18
RESERVED
-
RESERVED
G16
RESERVED
-
RESERVED
J16
RESERVED
-
RESERVED
B8
RESERVED
-
RESERVED