Telit Wireless Solutions G30 Installation manual

G30 Hardware User Guide
1VV0300919 Rev.0 – 2011-05-04

G30 Hardware User Guide
1VV0300919 Rev.0 – 2011-05-04
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 104
APPLICABILITY TABLE
PRODUCT
G30

G30 Hardware User Guide
1VV0300919 Rev.0 – 2011-05-04
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the United States and other countries
preserve for Telit and its licensors certain exclusive rights for copyrighted material, including
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contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
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copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
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The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the United States and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
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manual may not be copied (reverse engineered) or reproduced in any manner without the
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of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd
Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises
by operation of law in the sale of a product.

G30 Hardware User Guide
1VV0300919 Rev.0 – 2011-05-04
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in the US Patent & Trademark Office. All other
product or service names are the property of their respective owners.
© Copyright 2011 Telit

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Contents
1. Introduction ......................................................................................................... 12
1.1. Scope.......................................................................................................................... 12
1.2. Audience..................................................................................................................... 12
1.3. Contact Information, Support .................................................................................... 12
1.3.1. Required Query Information ..........................................................................................13
1.4. Testing a Standalone Unit.......................................................................................... 14
1.4.1. Test Setup ......................................................................................................................14
1.4.2. Test Procedure...............................................................................................................15
1.5. Document Organization ............................................................................................. 16
1.6. Text Conventions........................................................................................................ 16
1.7. Related Documents ................................................................................................... 16
1.8. Regulatory Requirements.......................................................................................... 16
1.9. Regulatory Statement (Safety)................................................................................... 17
1.10. FCC Notice to Users ............................................................................................... 17
1.11. Precautions............................................................................................................. 18
1.12. Antenna and Transmission Safety Precautions..................................................... 18
1.12.1. User Operation...............................................................................................................18
1.12.2. Antenna Installation.......................................................................................................18
1.12.3. Section 15.203 - Antenna Requirements ....................................................................... 19
1.13. Standards................................................................................................................ 19
1.14. General Safety ........................................................................................................ 20
1.14.1. Remember!. . . safety depends on you!.........................................................................20
1.14.2. Ground the instrument ..................................................................................................20
1.14.3. Do not operate in an explosive atmosphere ..................................................................20
1.14.4. Do not service or adjust alone .......................................................................................20
1.14.5. Keep away from live circuits..........................................................................................21
1.14.6. Do not substitute parts or modify equipment................................................................21
1.14.7. Dangerous procedure warnings ....................................................................................21
1.15. Caring for the Environment.................................................................................... 21
1.15.1. Disposal of Telit equipment in EU countries .................................................................21
1.15.2. Disposal of Telit equipment in non-EU countries..........................................................21
1.15.3. Turkey ............................................................................................................................22

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2. General Product Description................................................................................ 23
2.1. Product Specifications ............................................................................................... 23
2.2. Regulatory and Approvals.......................................................................................... 27
2.2.1. European Union Directives Conformance Statement....................................................28
2.2.2. CFR 47 Part 15.19 specifies label requirements ...........................................................28
2.2.3. CFR 47 Part 15.21 Information to user ..........................................................................28
2.2.4. CFR 47 Part 15.105 Information to the user.................................................................. 28
3. Hardware Interface Description ........................................................................... 30
3.1. Architecture Overview ............................................................................................... 30
3.1.1. Baseband .......................................................................................................................31
3.1.2. RF Block.........................................................................................................................31
3.2. Operating Modes........................................................................................................ 31
3.3. Power Supply ............................................................................................................. 33
3.3.1. Power Supply Design .....................................................................................................33
3.3.2. Power Consumption.......................................................................................................34
3.4. Power On/Off Operation............................................................................................. 35
3.4.1. Turning the G30 On ........................................................................................................35
3.4.2. Power Supply Turn-on ...................................................................................................36
3.4.3. Turning the G30 On Using PWR_ON ..............................................................................36
3.4.4. Turning the G30 Off........................................................................................................36
3.4.5. Turning the G30 Off Using PWR_ON..............................................................................37
3.4.6. Power Loss shut down...................................................................................................37
3.4.7. Turning the G30 Off Using AT+MRST .............................................................................37
3.5. Low Power Mode........................................................................................................ 37
3.5.1. Activating Low Power Mode...........................................................................................37
3.5.2. Serial Interface During Low Power Mode......................................................................38
3.5.3. Terminating Low Power Mode.......................................................................................39
3.6. Real Time Clock ......................................................................................................... 41
3.7. Serial Interfaces......................................................................................................... 41
3.7.1. UART ..............................................................................................................................41
3.7.2. Serial Peripheral Interface (SPI)....................................................................................43
3.7.3. Flashing and Data Logging ............................................................................................44
3.7.4. I2C Bus Interface ............................................................................................................46
3.8. SIM Interface.............................................................................................................. 47

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3.8.1. External SIM Card..........................................................................................................48
3.8.2. Embedded SIM ...............................................................................................................49
3.8.3. eSIM Connection ............................................................................................................49
3.9. Audio Interface........................................................................................................... 50
3.9.1. Handset Microphone Port..............................................................................................50
3.9.2. Headset Microphone Port ..............................................................................................51
3.9.3. Differential Speaker (Handset) Port ..............................................................................53
3.9.4. Mono Speaker (Headset) Port........................................................................................54
3.9.5. Headset Detection..........................................................................................................55
3.9.6. Digital Audio Interface ...................................................................................................56
3.9.7. Voiceband Audio.............................................................................................................56
3.9.8. Operating Modes............................................................................................................57
3.9.9. Audio Programming Interface .......................................................................................59
3.9.10. Audio Design ..................................................................................................................60
3.10. A/D Interface........................................................................................................... 61
3.10.1. Power Supply A/D ..........................................................................................................62
3.10.2. General Purpose A/D .....................................................................................................62
3.11. Controls and Indicators Interface .......................................................................... 63
3.11.1. Reset ..............................................................................................................................65
3.11.2. VREF Reference Regulator ............................................................................................65
3.11.3. VRTC...............................................................................................................................66
3.11.4. Wakeup Out....................................................................................................................66
3.11.5. Antenna Detection..........................................................................................................67
3.11.6. GPRS Detection..............................................................................................................68
3.11.7. General Purpose I/O ......................................................................................................68
3.12. Antenna Interface ................................................................................................... 68
4. Electrical and Environmental Specifications ........................................................ 71
4.1. Absolute Maximum Ratings....................................................................................... 71
4.2. Operating Parameters ............................................................................................... 72
4.2.1. Supply/power Pins .........................................................................................................72
4.2.2. Digital Pins .....................................................................................................................73
4.2.3. Audio Pins ......................................................................................................................77
4.2.4. ADC Pins ........................................................................................................................80
4.3. Environmental Specifications.................................................................................... 81
4.4. Application Interface Specifications .......................................................................... 82

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5. Mechanical Specifications.................................................................................... 92
5.1. Board Dimensions ..................................................................................................... 92
5.2. LGA Tape & Reel Specification .................................................................................. 94
5.3. Interface Connector Specifications ........................................................................... 95
5.3.1. Mating Connector...........................................................................................................96
5.4. U.FL Connector Specifications .................................................................................. 96
5.4.1. Mating Connector...........................................................................................................98
5.5. G30 Mounting ............................................................................................................. 98
5.6. Layout Recommendation........................................................................................... 99
5.6.1. Soldering Footprint...................................................................................................... 100
5.6.2. RF Recommendation ...................................................................................................100
5.7. Soldering Re-flow .................................................................................................... 101
6. Acronyms and abbreviations .............................................................................. 103
6.1. Document history..................................................................................................... 104

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List of tables
Table 2-1: G30 Product Specifications .............................................................................................................. 27
Table 3-1: G30 Operating Modes ...................................................................................................................... 32
Table 3-2: Power supply Signals ....................................................................................................................... 33
Table 3-3: Recommended Power supply filtering ............................................................................................. 34
Table 3-4: G30 Current Ratings......................................................................................................................... 35
Table 3-5: SPI Interface Connections ................................................................................................................ 44
Table 3-6: Data Logging and SW Upgrading Application Connector............................................................... 46
Table 3-7: I2C Interface Connections................................................................................................................ 47
Table 3-8: SIM Interface Signals....................................................................................................................... 48
Table 3-9: Handset Microphone Port Specifications ......................................................................................... 51
Table 3-10: Headset Microphone Port Specifications ....................................................................................... 52
Table 3-11: Speaker Port Specifications............................................................................................................ 54
Table 3-12: Mono Speaker Port Specifications ................................................................................................. 55
Table 3-13: Digital Audio Modes ...................................................................................................................... 56
Table 3-14: Basic Mode Audio Paths ................................................................................................................ 58
Table 3-15: Advanced Mode Commands .......................................................................................................... 59
Table 3-16: Speech Processing Features............................................................................................................ 60
Table 3-17: Gain Control Features..................................................................................................................... 60
Table 3-18: Supply A/D Specifications ............................................................................................................. 62
Table 3-19: GPAD Specifications...................................................................................................................... 63
Table 3-20: Controls and indicators................................................................................................................... 65
Table 3-21: VREF Specifications ...................................................................................................................... 66
Table 3-22: Antenna Interface Specifications.................................................................................................... 70
Table 4-1: Maximum Ratings ............................................................................................................................ 71
Table 4-2: Input Characteristics......................................................................................................................... 72
Table 4-3: Output Characteristics ...................................................................................................................... 72
Table 4-4: Input Characteristics......................................................................................................................... 73
Table 4-5: Output Characteristics ...................................................................................................................... 75
Table 4-6: Pad Pull-up and Pull-down Characteristics ...................................................................................... 76
Table 4-7: Audio Transmit Path Characteristics................................................................................................ 78
Table 4-8: Microphone Supply Characteristics ................................................................................................. 78
Table 4-9: G30 Low Power Single-ended Audio Receive Path Characteristics ................................................ 79
Table 4-10: G30 High Power Differential Audio Receive Path Characteristics................................................ 80
Table 4-11: Input Characteristics....................................................................................................................... 81
Table 4-12: Environmental Ratings ................................................................................................................... 82
Table 4-13: Interface Specifications .................................................................................................................. 91
Table 5-1: Interface Connector Specifications................................................................................................... 95
Table 5-2: U.FL Connector Specifications ........................................................................................................ 98
Table 5-3: Soldering Re-flow Process ............................................................................................................. 101

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List of figures
Figure 1-1: Test Setup........................................................................................................................................ 15
Figure 3-1: G30 Block Diagram ........................................................................................................................ 30
Figure 3-2: Transmission Power Drops ............................................................................................................. 33
Figure 3-3: Power Supply Turn-on .................................................................................................................... 36
Figure 3-4: PWR_ON Power On Timing .......................................................................................................... 36
Figure 3-5: PWR_ON Power Off Timing.......................................................................................................... 37
Figure 3-6: ATS24 Operation ............................................................................................................................ 38
Figure 3-7: CTS Signal During Sleep Mode...................................................................................................... 38
Figure 3-8: WKUPI Signal Operation ............................................................................................................... 39
Figure 3-9: Serial Interface Data........................................................................................................................ 40
Figure 3-10: UART Interface Signals................................................................................................................ 42
Figure 3-11: RI Behaviour When Receiving A Call.......................................................................................... 42
Figure 3-12: G30 External SIM Interface .......................................................................................................... 48
Figure 3-13: G30 eSIM Interface....................................................................................................................... 49
Figure 3-14: Audio Interface Topology ............................................................................................................. 50
Figure 3-15: Handset Microphone Circuit......................................................................................................... 51
Figure 3-16: Headset Microphone Circuit ......................................................................................................... 52
Figure 3-17: Differential Speaker Circuit .......................................................................................................... 53
Figure 3-18: Single-ended Speaker Circuit........................................................................................................ 53
Figure 3-19: Mono Speaker (Headset) Circuit................................................................................................... 54
Figure 3-20: I2S BUS Format............................................................................................................................ 57
Figure 3-21: Voiceband Mode PCM Bus Coding Format ................................................................................. 57
Figure 3-22: Audio Programming Interface....................................................................................................... 59
Figure 3-23: WKUPO Operation ....................................................................................................................... 67
Figure 4-1: G30 - 70 Pin Connector Quick Integration Connections ................................................................ 83
Figure 4-2: G30 - 81 Pin LGA Interface Quick Integration Connections.......................................................... 84
Figure 5-1: G30 Mechanical Characteristics - 81 Pin LGA Interface................................................................ 92
Figure 5-2: G30 Mechanical Characteristics - B2B Connector (70 Pin) ........................................................... 93
Figure 5-3: LGA Tape & Reel Specification..................................................................................................... 94
Figure 5-4: Mating Connector Dimensions ....................................................................................................... 96
Figure 5-5: U.FL Connector Dimensions .......................................................................................................... 97
Figure 5-6: U.FL Mating Connector .................................................................................................................. 98
Figure 5-7: G30 Mounting Area ........................................................................................................................ 99
Figure 5-8: G30 Soldering Footprint (Top View)............................................................................................ 100
Figure 5-9: Soldering Re-flow Process............................................................................................................ 101