Texas Instruments BoosterPack BOOST-ADS7042 User manual

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BOOST-ADS7042 BoosterPack™ Plug-In Module
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User's Guide
SBAU273–June 2016
BOOST-ADS7042 BoosterPack™ Plug-In Module
This user's guide describes the characteristics, operation, and use of the BOOST-ADS7042
BoosterPack™ plug-in module, a quick and low-cost solution to evaluate the ADS7042. This document
also includes the schematic, printed circuit board (PCB) layout, and a bill of materials (BOM).
Contents
1 BOOST-ADS7042 BoosterPack™ Overview ............................................................................ 2
2 ADS7042 Information ....................................................................................................... 3
3 Getting Started............................................................................................................... 3
4 Using the BOOST-ADS7042 with the MSP430FR4133 LaunchPad™ Development Kit .......................... 5
5 Schematic, PCB Layout, and Bill of Materials ........................................................................... 9
6 References ................................................................................................................. 15
7 Appendix A.................................................................................................................. 15
List of Figures
1 BOOST-ADS7042 BoosterPack™ Overview ............................................................................ 2
2 Jumper Settings for the MSP430FR4133 LaunchPad™ Development Kit........................................... 3
3 Launching the Code Composer Studio™ Cloud......................................................................... 4
4 Importing the Energia Sketch File......................................................................................... 4
5 Loading the Energia Sketch File (Firmware) Into the MSP430FR4133 LaunchPad™ Development Kit ........ 5
6 Connecting the MSP430FR4133 LaunchPad™ Development Kit to the BOOST-ADS7042 ...................... 6
7 Configuring Jumper J6...................................................................................................... 7
8 Software Flow Diagram for the BOOST-ADS7042...................................................................... 8
9 Connecting to the COM Port............................................................................................... 9
10 Selecting the COM Port..................................................................................................... 9
11 Debug Window............................................................................................................... 9
12 Schematic ................................................................................................................... 10
13 PCB Top Layer ............................................................................................................. 11
14 PCB Bottom Layer ......................................................................................................... 12
15 Step I for the TI Cloud Agent Installation ............................................................................... 15
16 Step II for the TI Cloud Agent Installation............................................................................... 15
17 Step III for the TI Cloud Agent Installation.............................................................................. 16
18 Step IV for the TI Cloud Agent Installation.............................................................................. 16
19 Step V for the TI Cloud Agent Installation .............................................................................. 17
20 Step VI for the TI Cloud Agent Installation.............................................................................. 17
List of Tables
1 Jumper Settings for the MSP430FR4133 LaunchPad™ Development Kit........................................... 3
2 Bill of Materials ............................................................................................................. 13

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1 BOOST-ADS7042 BoosterPack™ Overview
1.1 Description
The BOOST-ADS7042 BoosterPack™ plug-in module provides a quick and low-cost solution to evaluate
the ADS7042. To quickly get started, a firmware for this BoosterPack™ is available for the
MSP430FR4133 LaunchPad™ development kit (MSP-EXP430FR4133). Figure 1 shows an overview of
the BoosterPack™ hardware.
Figure 1. BOOST-ADS7042 BoosterPack™ Overview
1.2 Features
• Designed using the ADS7042 precision analog-to-digital converter (ADC), the OPA316 precision ADC
driver, and the REF3330 precision voltage reference
• Nanowatt power consumption of the ADS7042 ADC when sampling at 1 kSPS
• ADC sampling rates between 1 kSPS and 1 MSPS
• SMA jack for an optional external analog signal input
• User-programmable push button and LEDs
• On-board ambient light sensor

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2 ADS7042 Information
The ADS7042 is a 12-bit, 1-MSPS ADC. The device consumes 690 µW of power at 3-V AVDD and at a
throughput of 1 MSPS. The ADS7042 is available in 8-pin, miniature, leaded, VSSOP and 8-pin X2QFN
packages. The ADS7042 datasheet (SBAS608) contains all relevant analog and digital electrical
information pertaining to the device.
3 Getting Started
3.1 Configuring the LaunchPad™ Development Kit
The BOOST-ADS7042 functions with default jumper settings of the MSP430FR4133 LaunchPad™
development kit. Figure 2 and Table 1 provide the default jumper settings for the MSP430FR4133
LaunchPad™ development kit.
Figure 2. Jumper Settings for the MSP430FR4133 LaunchPad™ Development Kit
Table 1. Jumper Settings for the MSP430FR4133 LaunchPad™ Development Kit
Jumper Position
5V Installed
GND Installed
3V3 Installed
RTS Not installed
CTS Not installed
RXD Installed
TXD Installed
SBWTDIO Installed
SBWTCK Installed

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3.2 Obtaining Firmware
Download the firmware for the BOOST-ADS7042 with the MSP430FR4133 LaunchPad™ development kit
from the SLYC144 zip file. The zip file downloaded must be loaded into the MSP430FR4133
LaunchPad™ development kit as per the steps described in Section 3.2.1.
3.2.1 Downloading Firmware
1. Extract and save the BOOST-ADS7042_Firmware_xx.ino file from the SLYC144 zip file.
2. Connect the MSP430FR4133 LaunchPad™ development kit to a PC using a USB cable; see Figure 2.
Verify that jumpers are installed as per Table 1.
3. Go to dev.ti.com using either Chrome™ or Firefox®.
4. Click on the Code Composer Studio™ (CCS) cloud logo to launch the Code Composer Studio™
Cloud, as shown in Figure 3.
Figure 3. Launching the Code Composer Studio™ Cloud
5. Login with your myTI™ account.
6. Install the TI Cloud Agent (for the first time only) as described in Section 7.
7. Import the Energia Sketch file (BOOST-ADS7042_Firmware_xx.ino), as shown in Figure 4, that was
extracted and saved in step 1.
Figure 4. Importing the Energia Sketch File

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8. Load the Energia Sketch file (BOOST-ADS7042_Firmware_xx.ino) into the MSP430FR4133
LaunchPad™ development kit by clicking Run, as shown in Figure 5.
Figure 5. Loading the Energia Sketch File (Firmware) Into the
MSP430FR4133 LaunchPad™ Development Kit
4 Using the BOOST-ADS7042 with the MSP430FR4133 LaunchPad™ Development Kit
After downloading the firmware to the MSP430FR4133 LaunchPad™ development kit, the BoosterPack™
plug-in module must be connected to the LaunchPad™ development kit; see Figure 6.
• Verify that the 3V3 supply pin on the BoosterPack™ plug-in module mates with the 3V3 supply pin on
the LaunchPad™ development kit.
• Connect the LaunchPad™ development kit to a PC using a USB cable.
4.1 Changing the Sampling Rate of the ADS7042
• Press the S2 switch on the LaunchPad™ development kit to increase the sampling rate of the
ADS7042.
• Press the S1 switch on the LaunchPad™ development kit to decrease the sampling rate of the
ADS7042.
4.2 Changing the Display
• Press the S1 switch on the BoosterPack™ plug-in module to change the display from power
consumption in µW to ADC code in hexadecimal.

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Figure 6. Connecting the MSP430FR4133 LaunchPad™ Development Kit to the BOOST-ADS7042

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4.3 Measuring the Output of the Ambient Light Sensor
The output of the ambient light sensor can be directly measured with the ADS7042 by installing jumper J6
between pin 1 and pin 2 of J6, as shown in Figure 7. The light intensity can be estimated from Equation 1.
Figure 7. Configuring Jumper J6
where
• IPC = 23 µA / 100 Lux for the ambient light sensor TEMT6200FX01 (U4) (1)
4.4 Applying an External Analog Input
An external analog input can be applied on the SMA connector J10 on the BoosterPack™ plug-in module.
The analog input must be between 0 V and 3 V. The external analog input is provided to the noninverting
input of the OPA316 amplifier (U9) that drives the analog input of the ADS7042.
4.5 Measuring Power Consumption
The BoosterPack™ plug-in module has the provision of measuring the sum of power consumption of the
REF3330 (U1) and the analog power consumption of the ADS7042 (U6). The power measured is
displayed on the LCD of the MSP430FR4133 LaunchPad™ development kit. Equation 2 provides an
estimate of the measured power.
where
• Fsis the sampling rate of the ADS7042 in kSPS. (2)

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4.6 Software Flow Diagram for the BOOST-ADS7042
Figure 8 shows the software flow for the firmware of the BOOST-ADS7042.
Figure 8. Software Flow Diagram for the BOOST-ADS7042

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4.7 UART Communication
The output codes from the ADS7042 are sent over the universal asynchronous receiver, transmitter
(UART) to the PC through the serial communication port of the MSP430FR4133 LaunchPad™
development kit. The codes can be captured in the Code Composer Studio™ Cloud by following these
steps:
• Connect the LaunchPad™ development kit to the BoosterPack™ plug-in module; see Figure 6.
• Connect the LaunchPad™ development kit to a PC with a USB cable.
• Launch the Code Composer Studio™ Cloud and run the firmware as described in step 8 of
Section 3.2.1.
• Click on the Connect COM port from the Target menu, as shown in Figure 9.
Figure 9. Connecting to the COM Port
• Select the COM port for MSP430FR4133 LaunchPad™ development kit, as shown in Figure 10.
Figure 10. Selecting the COM Port
• Click Ok and the data are displayed in the Debug window, as shown in Figure 11.
Figure 11. Debug Window
5 Schematic, PCB Layout, and Bill of Materials
This section contains the block diagram, schematic diagram, printed circuit board (PCB) layout, and a
complete bill of materials for the BOOST-ADS7042 BoosterPack™ plug-in module.
5.1 Schematic
Figure 12 illustrates the schematic of the BOOST-ADS7042 BoosterPack™ plug-in module.

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Figure 12. Schematic

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5.2 PCB Layout
Figure 13 and Figure 14 illustrate the PCB layout of the BOOST-ADS7042 BoosterPack™ plug-in module.
Figure 13. PCB Top Layer

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Figure 14. PCB Bottom Layer

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5.3 Bill of Materials
Table 2 lists the bill of materials.
Table 2. Bill of Materials
Item No. Ref Des Value Description Vendor/Mfr Part Number
1 J1, J2 10Pin socket Connector, Pin Socket, Straight, Female, 1x10 Pin, 2.54MM
pitch, 8.5, 3.2, Gold Flash 1u, black, DIP JXT FH2543-10GT10
2 J6 3Pin Header Connector, Pin Header, Straight, Male, 1x3 Pin, 2.54MM pitch,
6.00, 3.00, Gold Flash 1u, black, DIP,alt_code:15071706 CHIN-BAN P6E03A-602530-B1
3 R8 0R RES, 0R, +/-5%, 1/16W, SMD0402 YAGEO RC0402JR-070RL
4 R9, R16 0R/DNP
5 R5 1M RES, 1M, +/-5%, 1/16W, SMD0402 YAGEO RC0402JR-071ML
6 R10 1M/DNP
7 C7 33nF CAP CER 0.033UF 10V X7R 0402 Kemet C0402C333K8RACTU
8 C2,C3,C12 1uF CAP, 1UF, +/-10%, X5R, 10V, SMD0402 Murata GRM155R61A105KE15D
9 C4 1uF/DNP GRM155R61A105KE15D
10 Q2 2N7002 Mosfet, N-Channel, 2N7002, 60V, 115mA, SOT-23, SMD Fairchild 2N7002
11 R14 10R RES, 10R, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-0710RL
12 R6, R32 10k RES, 10K, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-0710KL
13 R2, R3 4.99k RES SMD 4.99K OHM 1% 1/16W 0402 YAGEO RC0402FR-074K99L
14 C25 22nF CAP, 22NF, +/-10%, X7R, 16V, SMD0402 Murata GRM155R71C223KA01D
15 R11 30.1k RES, 30K1, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-0730K1L
16 R18, R19, R20 49.9R RES, 49R9, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-0749R9L
17 R1 200R RES SMD 200 OHM 1% 1/16W 0402 YAGEO RC0402FR-07200RL
18 R7 68R RES, 68R, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-0768RL
19 R15, R17 100R RES, 100R, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-07100RL
20 R4,R25 100k RES, 100K, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-07100KL
21 C6, C8, C21, C28 100nF CAP, 100NF, +/-10%, X7R, 16V, SMD0402 Murata GRM155R71C104KA88D
22 C1, C24 220n CAP, 220NF, +/-10%, X7R, 16V, SMD0402 Murata GRM155R71C224KA12D
23 C5 220n/DNP GRM155R71C224KA12D
24 R33, R34, R35 470R RES, 470R, +/-1%, 1/16W, SMD0402 YAGEO RC0402FR-07470RL
25 R12, R13 1.5M RES SMD 1.5M OHM 1% 1/16W 0402 YAGEO RC0402FR-071M5L
26 C23 1500pF CAP CER 1500PF 25V NP0 0402 Kemet C0402H152J3GAC7867
27 U6 ADS7042IRUGR Ultra-Low Power, Ultra-Small Size, 12-Bit, 1-MSPS, SAR ADC TI ADS7042IRUGR
28 JP1, JP2, JP3 2Pin header/DNP P6E02A-602530-B1
29 LED2 Green led LED, Super Yellow Green, Water Clear, 20mA, SMD0805 Everlight 17-215SYGC/S530-E2/TR8

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Table 2. Bill of Materials (continued)
Item No. Ref Des Value Description Vendor/Mfr Part Number
30 U3 OPA378AIDBVT 1-MHz, Micro-Power, Low-Noise, RRIO, .8-V CMOS
OPERATIONAL AMPLIFIER TI OPA378AIDBVT
31 U9 OPA316IDBV 10-MHz, Low-Power, Low-Noise, RRIO, 1.8-V CMOS
Operational Amplifier TI OPA316IDBVR
32 U1 REF3330AIRSE 3.9µA, SC70-3, 30ppm/°C Drift VOLTAGE REFERENCE TI REF3330AIRSER
33 Jump Connector, Shunt, 2 Pin, 2.54MM Pitch, 6MM Height, Gold
Flash 1u, black, Bulk Townes MJ501-EOGF-B-K
34 LED1, LED3 Red led LED, Brilliant Red, Water Clear, 20mA, SMD0805 Everlight 17-215SURC/S530-A2/TR8
35 J10 SMA SMA Jack, Edge Mount, Gold, Straight SAMTEC SMA-J-P-X-ST-EM1
36 F1 SMD1206P050TF Polyswitch, SMD1206P050TF, 6V, Ihold = 0.5A, Itrip = 1A,
0.4ohm, SMD1206 PTTC SMD1206P050TF
37 S1 TP-1138K9-BE1125 Switch, Tacticle, 160gf+/-50gf, black housing, black plunger Toneparts TP-1138K9-BE1125
38 U4 TEMT6200FX01 AMBIENT LIGHT SENSOR 0805 SMD Vishay TEMT6200FX01
39 U2 TLV70730DQN/DNP TLV70730DQN
40 R21,R22 100k/DNP RC0402FR-07100KL
41 PCB

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6 References
1. ADS7042 Datasheet, SBAS608
2. REF3330 Datasheet, SBOS392
3. OPA378 Datasheet, SBOS417
4. OPA316 Datasheet, SBOS703
7 Appendix A
The TI Cloud Agent must be installed when the MSP430FR4133 LaunchPad™ development kit is
connected to a PC and the BOOST-ADS7042 firmware is downloaded for the first time. The following
steps describe the procedure for installing the TI Cloud Agent:
Click Download to save the ticloudagent_xx_msp430.exe file, as shown in Figure 15.
Figure 15. Step I for the TI Cloud Agent Installation
Run the ticloudagent_xx_msp430.exe file from the saved location and click Next, as shown in Figure 16.
Figure 16. Step II for the TI Cloud Agent Installation

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Select the default installation directory and click Next, as shown in Figure 17.
Figure 17. Step III for the TI Cloud Agent Installation
Click Next, as shown in Figure 18.
Figure 18. Step IV for the TI Cloud Agent Installation

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Click Finish, as shown in Figure 19.
Figure 19. Step V for the TI Cloud Agent Installation
Click Refresh, as shown in Figure 20.
Figure 20. Step VI for the TI Cloud Agent Installation

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
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2Limited Warranty and Related Remedies/Disclaimers:
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2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
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3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
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FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
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l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
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3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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