Texas Instruments BQ2573 Series User manual

User’s Guide
BQ2573X Evaluation Module
ABSTRACT
The BQ25730EVM and BQ25731EVM evaluation modules (EVM) are I2C-controlled NVDC-1 buck boost
charger. The input voltage range is between 3.5 V and 26 V, with a programmable output of 1–5 cells and a
charge output current range of 128 mA to 15 A. This EVM does not include the EV2400 interface device. The
EV2400 must be ordered separately to evaluate the BQ2573X EVM.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 EVM Features.................................................................................................................................................................... 2
1.2 General Description........................................................................................................................................................... 2
2 Test Summary......................................................................................................................................................................... 5
2.1 Definitions.......................................................................................................................................................................... 5
2.2 Equipment.......................................................................................................................................................................... 5
2.3 Equipment Setup................................................................................................................................................................6
2.4 Procedure...........................................................................................................................................................................9
3 Bill of Materials, Board Layout, and Schematics...............................................................................................................10
3.1 Bill of Materials.................................................................................................................................................................10
3.2 Board Assembly Layout................................................................................................................................................... 13
3.3 Schematic........................................................................................................................................................................ 19
Revision History.......................................................................................................................................................................21
List of Figures
Figure 2-2. Original Test Setup for BMS051 (BQ2573X EVM).................................................................................................... 7
Figure 2-3. BQ2573X Evaluation Software Main Window........................................................................................................... 8
Figure 2-4. EN_OTG....................................................................................................................................................................9
Figure 3-1. Top Assembly.......................................................................................................................................................... 13
Figure 3-2. Bottom Assembly.................................................................................................................................................... 14
Figure 3-3. PCB Layer 1............................................................................................................................................................ 15
Figure 3-4. PCB Layer 2............................................................................................................................................................ 16
Figure 3-5. PCB Layer 3............................................................................................................................................................ 17
Figure 3-6. PCB Layer 4............................................................................................................................................................ 18
Figure 3-7. BQ25730 EVM Schematic.......................................................................................................................................19
Figure 3-8. BQ25731 EVM Schematic.......................................................................................................................................20
List of Tables
Table 1-1. I/O Description............................................................................................................................................................ 2
Table 1-2. Controls and Key Parameters Setting.........................................................................................................................3
Table 1-3. Recommended Operating Conditions.........................................................................................................................4
Table 3-1. BQ2573X EVM Bill of Materials................................................................................................................................ 10
Trademarks
USB Type-C™ is a trademark of USB Implementer's Forum, Inc..
All trademarks are the property of their respective owners.
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1 Introduction
1.1 EVM Features
This EVM supports the following features:
• Evaluation module for the BQ2573X devices
• Supports 3.5- to 26-V input source
– 3.5- to 26-V, 0- to 10-A input operating range and 1–5 cell battery configuration
– Supports USB2.0, USB 3.0, USB 3.1 ( USB Type-C™) and USB_PD
– Supports USB OTG with 3- to 24-V adjustable output
– Supports Fast Role Swap (FRS) feature for USB_PD
• Narrow VDC (NVDC) power path management
– Instant-on works with no battery or deeply discharged battery
– Battery supplements system when adapter is fully-loaded
• 400-kHz or 800-kHz switching frequency for high efficiency
• Power Path (BQ25730) or Non Power Path (BQ25731) options
• Power and Current Monitor for CPU Throttling
• Safety
– Thermal shutdown
– Input and system overvoltage protection
– MOSFET overcurrent protection
• Charge status outputs for LED or host processor
• Maximum power tracking capability by input voltage regulation
• Test points for key signals available for testing purposes. Easy probe hook-up.
• Jumpers available. Easy-to-change connections.
1.2 General Description
The BQ2573X evaluation modules are complete charger modules for evaluating an I2C-controlled buck boost
charge using the BQ2573X devices.
The BQ2573X EVM does not include the EV2400 interface board. To evaluate the BQ2573X EVM, order an
EV2400 interface board separately.
The BQ2573X is a synchronous NVDC-1 battery buck boost charge controller, offering a low component count,
high efficiency solution for space-constrained, multi-chemistry battery charging applications.
The BQ2573X charges the battery from a wide range of input sources including a 5-V USB adapter to a high-
voltage USB PD source and traditional adapters.
During power up, the charger sets the converter to buck, boost, or buck-boost configuration based on the input
source and battery conditions. During the charging cycle, the charger automatically transits among buck, boost,
and buck-boost configuration without host control.
The BQ2573X monitors adapter current, battery current, and system power. The flexible programmed
PROCHOT output goes directly to the CPU for throttle back, when needed.
For more details on register functions, see the BQ25730 I2C 1-5 Cell Narrow VDC Buck-Boost Battery Charge
Controller With System Power Monitor and Power Path Control and BQ25731 I2C 1-5 Cell Narrow VDC Buck-
Boost Battery Charge Controller Data Sheets.
Table 1-1 lists the I/O descriptions.
Table 1-1. I/O Description
Jack Description
J1–VIN Input: positive terminal
J1–PGND Input: negative terminal (ground terminal)
J2-CHRG_OK CHRG_OK output
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Table 1-1. I/O Description (continued)
Jack Description
J2-OTG/VAP External OTG/VAP disable pin; Logic LOW to disable OTG/VAP
J2-CELL_CONTROL External battery removal control; Logic high to pull CELL pin down
J2-ILIM_HIZ External converter disable; Logic LOW to enable HIZ mode
J3-SCL SMBUS/I2C SCL
J3-GND Ground
J3–SDA SMBUS/I2C SDA
J4-GND Ground
J4-CMPIN External CMPIN pin input
J4-CMPOUT CMPOUT pin output
J5-VBAT Connected to battery pack output
J5-PGND Ground
J6-VSYS Connected to system output
J6-PGND Ground
J7–SDA SMBUS/I2C SDA
J7-SCL SMBUS/I2C SCL
J7-GND Ground
Table 1-2 displays the controls and key parameters settings.
Table 1-2. Controls and Key Parameters Setting
Jumper Description Factory Setting
JP2 Jumper on: Forward Mode
Jumper off: Enable OTG Installed
JP3
CELL setting
spa1S: JP3(1-2) measure CELL pin voltage 1.2 V
spa2S: JP3(3-4) measure CELL pin voltage 2.7 V
spa3S: JP3(5-6) measure CELL pin voltage 3.9 V
spa4S: JP3(7-8) measure CELL pin voltage 4.2 V
spa5S: JP3(9-10) measure CELL pin voltage 6.0 V
JP3(3-4) installed
JP4 Jumper on: Bat removal
Jumper off: Cell setting by JP3 Not installed
JP6
HIZ Enable
spaJumper on: Enable HiZ mode.
spaJumper off: ILIM is set by external resistor divider
Not installed
JP8 Jumper on: Onboard LDO to drive the EVM 3V3
Jumper off: disconnect onboard LDO to drive the EVM 3V3 Installed
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Table 1-3 lists the recommended operating conditions.
Table 1-3. Recommended Operating Conditions
Symbol Description MIN TYP MAX Unit
Supply voltage, VIN Input voltage from ac adapter input 3.5 5/12/20 26 V
Battery voltage, VBAT Voltage applied at VBAT terminal 0 23 V
Supply current, IAC
Maximum input current from ac adapter
input 0 10 A
Output current, IOUT Output current 0 15 A
Operating junction temperature
range, TJ
0 125 °C
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2 Test Summary
2.1 Definitions
This procedure details how to configure the BMS051 evaluation board. For the test procedure, the following
naming conventions are followed. Refer to the BMS051 schematic for details.
VXXX: External voltage supply name (VADP, VBT, VSBT).
LOADW: External load name (LOADR, LOADI).
V(TPyyy): Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at TP12.
V(Jxx): Voltage at jack terminal Jxx.
V(TP(XXX)): Voltage at test point “XXX”. For example, V(ACDET) means the voltage at the test point which is
marked as “ACDET”.
V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of jack XX.
Jxx(BBB): Terminal or pin BBB of jack xx.
Jxx ON : Internal jumper Jxx terminals are shorted.
Jxx OFF: Internal jumper Jxx terminals are open.
Jxx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as “YY” are shorted.
Measure: → A,B Check specified parameters A, B. If measured values are not within specified limits, the unit under test
has failed.
Observe → A,B Observe if A, B occurs. If they do not occur, the unit under test has failed.
Assembly drawings have locations for jumpers, test points, and individual components.
2.2 Equipment
The following list of equipment is required for fully testing the EVM:
1. Power Supplies
A power supply capable of supplying 26 V at 10 A is required. While this part can handle larger voltage and
current, it is not necessary for this procedure.
2. Load #1
A 0- to 23-V/0- to 15-A, system DC electronic load and setting as constant current load mode.
3. Load #2
A Kepco load: BOP36-12M, DC 0 to ±36 V, 0 to ±12 A (or higher), or equivalent.
4. Meters
Six Fluke 75 multimeters, (equivalent or better) or: Four equivalent voltage meters and two equivalent current
meters.
5. Computer
A computer with at least one USB port and a USB cable.
6. EV2400 Communication Kit
7. Software
Download and properly install BQstudio from http://www.ti.com/tool/BQstudio.
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2.3 Equipment Setup
Use the following guidelines to set up the equipment:
1. Set power supply #1 for 10-V DC, 5-A current limit and then turn off the supply.
2. Connect the output of power supply #1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load #1 in series with a current meter to J6 (VSYS and PGND). Connect a voltage meter across J6
(VSYS and PGND). Set 1 A at the constant current mode. Turn off load #1.
5. Connect Load #2 in series with a current meter to J5 (VBAT and PGND). Connect a voltage meter across J5
(VBAT and PGND). Set 7 V at KEPCO load output. Turn off Load #2.
Note
Add a 47-µF capacitor on the BAT pin when testing without real battery.
6. Connect J3 to the EV2400. Connect J3 to the I2C PORT 2 on the EV2400. The connections are shown in
Figure 2-1.
The picture shows the SMBus version EVM connection. For I2C version, move the connector to the I2C port.
Figure 2-1. EV2400 Connections
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7. Install jumpers using the “factory settings” from Table 1-2.
After completing these steps, the test setup for BMS051 is as shown in Figure 2-2.
Figure 2-2. Original Test Setup for BMS051 (BQ2573X EVM)
8. Turn on the computer and power supply #1. Open the BQstudio software.
a. Select Charger and click the Next button.
b. Select “Charger_1_00_BQ2573x.bqz” on the Select a Target Page.
c. After selecting the target device, change “update mode” from “immediate” to “manual”, click “Read
Register” and the following interface is presented.
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Figure 2-3. BQ2573X Evaluation Software Main Window
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2.4 Procedure
2.4.1 Charge Function
1. Make sure Equipment Setup steps are followed.
2. Set Tgt Address to D6(6B)
3. Write “020A” to charge option 0 register 0x00H.
Measure → V(J1(VIN)) = 10 V ±0.5 V
Measure → V(TP28(CHG_OK)) = 3 V to 4.5 V
Measure → V(TP21(REGN)) = 6 V ±1 V
Measure → V(TP22(ILIM_HIZ)) = 2.2 V
4. Write “0400” to charge current 0x02H.
Turn on load #1.
Measure → V(J6(VSYS)) = 8.4 V ±0.5 V
5. Turn on LOAD #2 (VBAT Load).
Measure → V(J5(VBAT)) = 7 V ±0.5 V
Measure → I(J5(VBAT)) = 2 A ±0.5 A
2.4.2 OTG Function
Use the following for OTG function settings:
1. Connect a 7-V power supply to the VBAT load. Remove the VIN power supply from J1 (Connection must be
physically removed from board).
2. Write “09C4” to the OTG voltage register.
3. Write “1000” to the OTG current registers.
4. Remove JP2 (Enable OTG/VAP function).
5. Select EN_OTG in Charge Option 3.
Measure → V(J1(VIN)) = 5 V ±1 V
Figure 2-4. EN_OTG
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3 Bill of Materials, Board Layout, and Schematics
This section contains the EVM BOM, board layout images, and schematics.
3.1 Bill of Materials
Table 3-1 lists the BQ2573X EVM bill of materials.
Table 3-1. BQ2573X EVM Bill of Materials
Designator QTY Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board BMS051 Any
C3, C4, C5, C6, C7,
C8, C9, C10, C21,
C23, C24, C40, C42,
C43, C44, C45, C51,
C52
18 10uF CAP, CERM, 10 uF, 35 V, +/- 10%, X5R, 0805 805 GRM21BR6YA106KE43L MuRata
C11, C12, C41 3 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 5%, X7R, 0603 603 C0603C103J5RACTU Kemet
C15, C16 2 0.047uF CAP, CERM, 0.047 uF, 25 V, +/- 10%, X7R, 0603 603 GRM188R71E473KA01D MuRata
C17 1 1000pF CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0, 0402 402 C1005NP01H102J050BA TDK
C18, C28, C29 3 1uF CAP, CERM, 1 uF, 35 V, +/- 10%, X7R, 0603 603 CGA3E1X7R1V105K080AC TDK
C19, C20 2 150pF CAP, CERM, 150 pF, 50 V, +/- 5%, C0G/NP0, 0603 603 C0603C151J5GACTU Kemet
C22, C27, C38, C39 4 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, 0603 603 CGA3E2X7R1H104K080AA TDK
C25 1 0.47uF CAP, CERM, 0.47 uF, 50 V, +/- 10%, X7R, 0805 805 C2012X7R1H474K125AB TDK
C26, C55 2 10uF CAP, CERM, 10 uF, 25 V, +/- 10%, X7R, 1206 1206 GRM31CR71E106KA12L MuRata
C30 1 2.2uF CAP, CERM, 2.2 uF, 35 V, +/- 10%, X5R, 0603 603 GRM188R6YA225KA12D MuRata
C31 1 33pF CAP, CERM, 33 pF, 50 V, +/- 5%, C0G/NP0, 0402 402 GRM1555C1H330JA01D MuRata
C32 1 680pF CAP, CERM, 680 pF, 50 V, +/- 5%, C0G/NP0, 0402 402 GRM1555C1H681JA01D MuRata
C33 1 4700pF CAP, CERM, 4700 pF, 50 V, +/- 10%, X7R, 0402 402 GRM155R71H472KA01D MuRata
C34 1 15pF CAP, CERM, 15 pF, 50 V, +/- 5%, C0G/NP0, 0402 402 GRM1555C1H150JA01D MuRata
C35, C36, C37 3 100pF CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603 603 C0603C101J5GAC Kemet
C46, C47 2 0.033uF CAP, CERM, 0.033 uF, 50 V, +/- 10%, X7R, 0603 603 GRM188R71H333KA61D MuRata
C48, C49, C53 3 33uF CAP, TA, 33 uF, 35 V, +/- 20%, 0.065 ohm, SMD 7343-31 T521D336M035ATE065 Kemet
D2, D3 2 30V Diode, Schottky, 30 V, 0.2 A, SOD-323 SOD-323 BAT54HT1G ON Semiconductor
D4 1 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J1, J5, J6 3 Terminal Block, 5.08 mm, 2x1, Brass, TH 2x1 5.08 mm Terminal Block ED120/2DS On-Shore Technology
J2 1 Terminal Block, 3.5mm Pitch, 4x1, TH 14x8.2x6.5mm ED555/4DS On-Shore Technology
J3 1 Connector Header Through Hole, Right Angle 4 position 0.100"
(2.54mm)
HDR4 22053041 Molex
J4 1 Terminal Block, 3.5mm Pitch, 3x1, TH 10.5x8.2x6.5mm ED555/3DS On-Shore Technology
J7 1 Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M
JP2, JP4, JP6, JP8 4 Header, 100mil, 2x1, Gold, TH Header, 2x1, 100mil 5-146261-1 TE Connectivity
JP3 1 Header, 100mil, 5x2, Gold, TH 5x2 Header TSW-105-07-G-D Samtec
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Table 3-1. BQ2573X EVM Bill of Materials (continued)
Designator QTY Value Description Package Reference Part Number Manufacturer
L1 1 4.7µH Shielded Wirewound Inductor 13A 9mOhm Max 10x10x4mm SMT_IND_11MM2_10MM1 BMQADY1010404R7MA1 Chilisin Electronics
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per
roll
PCB Label 0.650 x 0.200
inch
THT-14-423-10 Brady
Q1, Q2, Q3, Q4 4 30V MOSFET, N-CH, 30 V, 27 A, DFN5x6 DFN5x6 AON6362 AOS
Q5 1 -30V MOSFET, P-CH, -30 V, -85 A, DFN5x6 DFN5x6 AON6407 AOS
Q6, Q7 2 -30V MOSFET, P-CH, -30 V, -8.5 A, AEC-Q101, 8-PowerVDFN 8-PowerVDFN DMP3035SFG-7 Diodes Inc.
Q9 1 50 V Transistor, NPN/PNP Pair, 50 V, 0.05 A, SC-74R SC-74R DCX124EK-7-F Diodes Inc.
Q10, Q11, Q12 3 60V MOSFET, N-CH, 60 V, 0.26 A, SOT-23 SOT-23 2N7002ET1G ON Semiconductor
R1, R2 2 0.005 RES, 0.005, 1%, 1 W, AEC-Q200 Grade 0, 1206 1206 WSLP12065L000FEA Vishay-Dale
R3, R4 2 3.9 RES, 3.9, 5%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12063R90JNEA Vishay-Dale
R7, R24, R29 3 300k RES, 300 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603300KFKEA Vishay-Dale
R8 1 0 RES, 0, 1%, 0.5 W, 0805 805 5106 Keystone
R9, R28 2 100k RES, 100 k, 1%, 0.1 W, 0603 603 RC0603FR-07100KL Yageo
R10, R38 2 10 RES, 10.0, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 ERJ-8ENF10R0V Panasonic
R11, R12 2 4.99 RES, 4.99, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06034R99FKEA Vishay-Dale
R13 1 1 RES, 1.0, 5%, 0.125 W, AEC-Q200 Grade 0, 0805 805 CRCW08051R00JNEA Vishay-Dale
R14 1 20k RES, 20 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060320K0JNEA Vishay-Dale
R15, R16, R18 3 10 RES, 10, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310R0JNEA Vishay-Dale
R17, R25, R32, R33,
R35, R39, R45
7 10.0k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310K0FKEA Vishay-Dale
R19 1 383k RES, 383 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603383KFKEA Vishay-Dale
R20 1 82k RES, 82 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060382K0JNEA Vishay-Dale
R21 1 1.00k RES, 1.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06031K00FKEA Vishay-Dale
R22 1 40.2k RES, 40.2 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 402 CRCW040240K2FKED Vishay-Dale
R23 1 15.0k RES, 15.0 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 402 CRCW040215K0FKED Vishay-Dale
R27 1 220k RES, 220 k, 1%, 0.1 W, 0603 603 RC0603FR-07220KL Yageo
R30 1 191k RES, 191 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603191KFKEA Vishay-Dale
R34 1 30.1k RES, 30.1 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060330K1FKEA Vishay-Dale
R36 1 2.00k RES, 2.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06032K00FKEA Vishay-Dale
R40 1 2.0Meg RES, 2.0 M, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW06032M00JNEA Vishay-Dale
R41 1 150k RES, 150 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603150KJNEA Vishay-Dale
R42 1 33k RES, 33 k, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060333K0JNEA Vishay-Dale
SH-JP2, SH-JP3,
SH-JP8
3 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
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Table 3-1. BQ2573X EVM Bill of Materials (continued)
Designator QTY Value Description Package Reference Part Number Manufacturer
TP2, TP3, TP12,
TP15, TP16, TP17,
TP18, TP19, TP20,
TP21, TP22, TP23,
TP24, TP25, TP26,
TP27, TP28, TP29,
TP30, TP32, TP33,
TP34, TP35, TP36,
TP37, TP38
26 SMT Test Point, Miniature, SMT Testpoint_Keystone_Miniatur
e
5015 Keystone
TP4, TP5, TP9 3 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone
TP6, TP7, TP10,
TP11, TP13, TP14
6 White Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone
TP8, TP31, TP39 3 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone
U1 1 I2C 1- to 5-Cell Narrow VDC Buck-Boost Battery Charge Controller WQFN32 BQ25730RSN for
BQ25730EVM;
BQ25731RSN for
BQ25731EVM
Texas Instruments
U2 1 100 mA, Quasi Low-Dropout Linear Voltage Regulator, 3-pin SOT-23,
Pb-Free
DBZ0003A LM3480IM3-3.3/NOPB Texas Instruments
Z1 1 26V Diode, TVS, Bi, 26 V, 42.1 Vc, 400 W, 9.5 A, SMA (non-polarized) SMA (non-polarized) SMAJ26CA Littelfuse
C2 0 47uF CAP, Aluminum Polymer, 47 uF, 25 V, +/- 20%, 0.03 ohm, F61 SMD F61 25SVPF47M Panasonic
C13, C14 0 330pF CAP, CERM, 330 pF, 50 V, +/- 10%, X7R, 0603 603 GRM188R71H331KA01D MuRata
C50, C54, C56 0 33uF CAP, TA, 33 uF, 35 V, +/- 20%, 0.065 ohm, SMD 7343-31 T521D336M035ATE065 Kemet
C57 0 0.068uF CAP, CERM, 0.068 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade 1, 0402 402 CGA2B3X7R1H683K050BB TDK
C58, C59 0 0.018uF CAP, CERM, 0.018 uF, 50 V, +/- 10%, X7R, 0603 603 GRM188R71H183KA01D MuRata
D1 0 20V Diode, Schottky, 20 V, 2 A, SMA SMA B220A-13-F Diodes Inc.
FID1, FID2, FID3,
FID4, FID5, FID6
0 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
R5, R6 0 56 RES, 56, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060356R0JNEA Vishay-Dale
R31 0 100 RES, 100, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603100RFKEA Vishay-Dale
R37 0 10.0k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW060310K0FKEA Vishay-Dale
R43, R46 0 0 RES, 0, 1%, 0.5 W, 0805 805 5106 Keystone
R44 0 100k RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 603 CRCW0603100KFKEA Vishay-Dale
SH-JP4, SH-JP6 0 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
1. For BQ25730EVM, Install Q5 and do not install R46; For BQ25731EVM, Install R46 and do not install Q5.
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3.2 Board Assembly Layout
Figure 3-1 and Figure 3-6 illustrate the board assembly layout images.
Figure 3-1. Top Assembly
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Figure 3-2. Bottom Assembly
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Figure 3-3. PCB Layer 1
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Figure 3-4. PCB Layer 2
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Figure 3-5. PCB Layer 3
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Figure 3-6. PCB Layer 4
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3.3 Schematic
Figure 3-7 and Figure 3-8 show the EVM schematics.
D
C
B
4.7µH
L1
0.047uF
C15
0.047uF
C16
4
7,8
1,2,3
5,6,
Q2
4
7,8
1,2,3
5,6,
Q1
10nF
50V
C12
0.005
R1
4.99
R11
4.99
R12
10uF
35V
C3
10uF
35V
C4
1uF
C18
3.9
R3
3.9
R4
4
7,8
1,2,3
5,6,
Q3
4
7,8 1,2,3
5,6,
Q4
0.1uF
C27
10uF
C7
1uF
C28
10
R15
10
R16
0.005
R2
1
2
J5
VSYS
PGND
PGND
VBAT
4
7,8 1,2,3
5,6,
Q5
AON6407
10uF
C8
10uF
C9
10uF
C10
10uF
C6
10uF
C5
2.2uF
C30
REGN
REGN
1uF
C29
383k
R19
10
R18
220k
R27
10.0k
R32
10.0k
R35
10.0k
R39
1
2
3
J4
Receptacle_3x1
3V3
300k
R7
GND
GND
GND
10.0k
R33
GND
100pF
C37 100pF
C36
30.1k
R34
VIN
PGND
10.0k
R25
3V3
VDDA
VDDA
100k
R28
GND
TP22
TP4 TP5
TP9
TP19
TP15
TP21
TP24
TP27
TP29
TP30
TP23
TP34
TP25
TP26
TP28
TP35
TP36
TP38
TP32
15.0k
R23
40.2k
R224700pFC33
GND
GND
1000pF
50V
C17
10uF
35V
C23
10uF
35V
C24
330pF
C13
DNP
56
R5
DNP
330pF
C14
DNP
56
R6
DNP
1
2
3
4
J2
Receptacle_4x1
680pF
C32
191k
R30
1
2
JP4
1
2
JP2
300k
R24
1CELL 2 CELL 4 CELL3 CELL
BAT Removal
2.0M
R40
D1
DNP
TP11
TP14
TP7
TP6
TP10
TP13
47uF
C2
DNP
3V3
2.00k
R36
Green
1
2
D4
60V
1
23
Q11
GND
PGND
NT1
Net-Tie
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
ILIM_HIZ
ILIM_HIZ GND
CHG_OK
CHG_OK
PGND
CELL_control
60V
1
23
Q12
CELL_control BAT
PGND
D2 D3
10.0
R38
VBUS
VBUS
0.1uF
C38
0.1uF
C39
IN
2OUT 1
3
GND
U2
PM-REG-LM3480-SOT3
3V3
TP37
1 2
JP8
BAT
1
2
J6
100k
R9
20k
R14
60V
1
23
Q10
PGND
0.1uF
C22
CHG_OK
GND
26V
Z1
PGND
1.0
R13
VIN
43
2
Q9A
DCX124EK-7-F
1
6
5
Q9B
DCX124EK-7-F
10.0
R10
PGND
10.0k
R17
3V3
4
7,8
1,2,3
5,6,
Q7
4
7,8 1,2,3
5,6,
Q6
470nF
50V
C25
GND
1
2
3
4
J3
0022053041
10uF
C26
300k
R29
33pF
C31
15pF
C34
100
R31
DNP
TP33
TP2 TP3
150pF
C20
150pF
C19
3V3
1
2
JP6
GND
TP12
100pF
C35
PGND
TP17
TP16
TP18 TP20
TP31
0.01uF
C41
TP39TP8
VSYS
VBUS
10uF
35V
C44
10uF
35V
C45
10uF
35V
C42
10uF
35V
C43
PGND
0.01uF
C11
0.033uF
C47
0.033uF
C46
GND
33uF
35V
C48
1
2
J1
10uF
C21
10uF
C40
3.5V to 26V
Input Voltage Range
SYS Output Voltage
BAT Output Voltage
23V MAX
23.16V MAX
33uF
C53
33uF
35V
C49
33uF
35V
C50
DNP
10uF
C51
10uF
C52
PGND
33uF
C54
DNP
VIN
10uF
C55
BQ25730RSN
VDDA
7
COMP1
16 COMP2 17
SW1
32 SW2 23
HIDRV1
31 HIDRV2 24
BTST1
30 BTST2 25
LODRV1
29 LODRV2 26
BATDRV 21
PROCHOT
11
ACN
2
ACP
3
CELL_BATPRESZ 18
CHRG_OK
4
CMPIN
14
CMPOUT
15
IADPT 8
IBAT 9
ILIM_HIZ
6
OTG/VAP
5PSYS 10
REGN 28
SCL
13
SDA
12
SRN 19
SRP 20
Thermal_Pad 33
VBUS
1VSYS 22
PGND 27
U1
150k
R41
33k
R42
12 34 56 78 910
JP3
5 CELL
GND
1 2
3 4
5 6
7 8
9 10
J7
N2510-6002-RB
GND
SDA
SCL
SCL SDA
82k
R20
1.00k
R21
33uF
35V
C56
DNP
100k
R44
DNP
10.0k
R45
0
R43
DNP
0
R46
DNP
ILIM_HIZ
0.068uF
50V
C57
DNP
HIZ
10A Max
15A MAX
15A MAX
18nF
50V
C59
DNP
18nF
50V
C58
DNP
GND GND
10.0k
R37
DNP
0
R8
GND
OTG
Figure 3-7. BQ25730 EVM Schematic
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L1
0.047uF
C15
0.047uF
C16
4
7,8
1,2,3
5,6,
Q2
4
7,8
1,2,3
5,6,
Q1
10nF
50V
C12
0.005
R1
4.99
R11
4.99
R12
10uF
35V
C3
10uF
35V
C4
1uF
C18
3.9
R3
3.9
R4
4
7,8
1,2,3
5,6,
Q3
4
7,8 1,2,3
5,6,
Q4
0.1uF
C27
10uF
C7
1uF
C28
10
R15
10
R16
0.005
R2
1
2
J5
VSYS
PGND
PGND
VBAT
4
7,8 1,2,3
5,6,
Q5
AON6407
DNP
10uF
C8
10uF
C9
10uF
C10
10uF
C6
10uF
C5
2.2uF
C30
REGN
REGN
1uF
C29
383k
R19
10
R18
220k
R27
10.0k
R32
10.0k
R35
10.0k
R39
1
2
3
J4
Receptacle_3x1
3V3
300k
R7
GND
GND
GND
10.0k
R33
GND
100pF
C37 100pF
C36
30.1k
R34
VIN
PGND
10.0k
R25
3V3
VDDA
VDDA
100k
R28
GND
TP22
TP4 TP5
TP9
TP19
TP15
TP21
TP24
TP27
TP29
TP30
TP23
TP34
TP25
TP26
TP28
TP35
TP36
TP38
TP32
15.0k
R23
40.2k
R224700pFC33
GND
GND
1000pF
50V
C17
10uF
35V
C23
10uF
35V
C24
330pF
C13
DNP
56
R5
DNP
330pF
C14
DNP
56
R6
DNP
1
2
3
4
J2
Receptacle_4x1
680pF
C32
191k
R30
1
2
JP4
1
2
JP2
300k
R24
1CELL 2 CELL 4 CELL3 CELL
BAT Removal
2.0M
R40
D1
DNP
TP11
TP14
TP7
TP6
TP10
TP13
47uF
C2
DNP
3V3
2.00k
R36
Green
1
2
D4
60V
1
23
Q11
GND
PGND
NT1
Net-Tie
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
ILIM_HIZ
ILIM_HIZ GND
CHG_OK
CHG_OK
PGND
CELL_control
60V
1
23
Q12
CELL_control BAT
PGND
D2 D3
10.0
R38
VBUS
VBUS
0.1uF
C38
0.1uF
C39
IN
2OUT 1
3
GND
U2
PM-REG-LM3480-SOT3
3V3
TP37
1 2
JP8
BAT
1
2
J6
100k
R9
20k
R14
60V
1
23
Q10
PGND
0.1uF
C22
CHG_OK
GND
26V
Z1
PGND
1.0
R13
VIN
43
2
Q9A
DCX124EK-7-F
1
6
5
Q9B
DCX124EK-7-F
10.0
R10
PGND
10.0k
R17
3V3
4
7,8
1,2,3
5,6,
Q7
4
7,8 1,2,3
5,6,
Q6
470nF
50V
C25
GND
1
2
3
4
J3
0022053041
10uF
C26
300k
R29
33pF
C31
15pF
C34
100
R31
DNP
TP33
TP2 TP3
150pF
C20
150pF
C19
3V3
1
2
JP6
GND
TP12
100pF
C35
PGND
TP17
TP16
TP18 TP20
TP31
0.01uF
C41
TP39TP8
VSYS
VBUS
10uF
35V
C44
10uF
35V
C45
10uF
35V
C42
10uF
35V
C43
PGND
0.01uF
C11
0.033uF
C47
0.033uF
C46
GND
33uF
35V
C48
1
2
J1
10uF
C21
10uF
C40
3.5V to 26V
Input Voltage Range
SYS Output Voltage
BAT Output Voltage
23V MAX
23.16V MAX
33uF
C53
33uF
35V
C49
DNP 33uF
35V
C50
DNP
10uF
C51
10uF
C52
PGND
33uF
C54
DNP
VIN
10uF
C55
BQ25731RSN
VDDA
7
COMP1
16 COMP2 17
SW1
32 SW2 23
HIDRV1
31 HIDRV2 24
BTST1
30 BTST2 25
LODRV1
29 LODRV2 26
BATDRV 21
PROCHOT
11
ACN
2
ACP
3
CELL_BATPRESZ 18
CHRG_OK
4
CMPIN
14
CMPOUT
15
IADPT 8
IBAT 9
ILIM_HIZ
6
OTG/VAP
5PSYS 10
REGN 28
SCL
13
SDA
12
SRN 19
SRP 20
Thermal_Pad 33
VBUS
1VSYS 22
PGND 27
U1
150k
R41
33k
R42
12 34 56 78 910
JP3
5 CELL
GND
1 2
3 4
5 6
7 8
9 10
J7
N2510-6002-RB
GND
SDA
SCL
SCL SDA
82k
R20
1.00k
R21
33uF
35V
C56
100k
R44
DNP
10.0k
R45
0
R43
DNP
0
R46
ILIM_HIZ
0.068uF
50V
C57
DNP
HIZ
10A Max
15A MAX
15A MAX
18nF
50V
C59
DNP
18nF
50V
C58
DNP
GND GND
10.0k
R37
DNP
0
R8
GND
OTG
Figure 3-8. BQ25731 EVM Schematic
1. DNP means "Do Not Populate".
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