Texas Instruments LMQ61460-Q1 User manual

User’s Guide
LMQ61460EVM-400K User's Guide
Sam Jaffe
The LMQ61460-Q1 evaluation module (EVM) is designed to help customers evaluate the performance of the
LMQ61460-Q1 synchronous step-down voltage converter. This EVM implements the LMQ61460-Q1 in a 14-pin
wettable flanks Hotrod™ package, as shown in Table 1-1. It is capable of delivering 5-V output voltage and up to
6-A load current switching at 400 kHz with exceptional efficiency and output accuracy in a very small solution
size. The EVM provides multiple power connectors and test points. In addition to an optimized EMI board layout,
the LMQ61460-Q1 utilizes integrated bypass capacitors which results in great EMI performance.
Table 1-1. Device and Package Configurations
CONVERTER IC PACKAGE
U1 LMQ61460-Q1 14-pin wettable flanks Hotrod package 4.0 mm × 3.5 mm × 1.0 mm
Figure 1-1. LMQ61460EVM-400K Top View
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Table of Contents
1 Introduction.............................................................................................................................................................................3
1.1 LMQ61460-Q1 Synchronous Step-Down Voltage Converter.............................................................................................3
2 Quick Start Guide....................................................................................................................................................................4
3 Detailed Descriptions............................................................................................................................................................. 5
4 Schematic................................................................................................................................................................................7
4.1 Alternative BOM Configurations.........................................................................................................................................8
5 Board Layout...........................................................................................................................................................................9
6 LMQ61460EVM-400K Board Test Results...........................................................................................................................12
6.1 EMI...................................................................................................................................................................................12
6.2 Board Efficiency............................................................................................................................................................... 13
6.3 Load Regulation............................................................................................................................................................... 14
6.4 Thermals.......................................................................................................................................................................... 15
7 Bill of Materials..................................................................................................................................................................... 17
8 Revision History................................................................................................................................................................... 19
Trademarks
Hotrod™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
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1 Introduction
1.1 LMQ61460-Q1 Synchronous Step-Down Voltage Converter
The LMQ61460-Q1 is an easy-to-use synchronous step-down DC/DC converter capable of delivering up to 6 A
of load current from a supply voltage ranging from 3 V to 36 V. The LMQ61460-Q1 provides exceptional
efficiency and output accuracy in a very small solution size. The LMQ61460-Q1 is capable of delivering 6 A of
load current and implements peak current mode control. The following are additional features that provide both
flexible and easy-to-use solutions for a wide range of applications:
• Adjustable switching frequency (RT)
• Synchronization to an external clock (CLK jumper)
• FPWM variant (LMQ61460AFS) (IC swap)
• Power-good flag (PG jumper)
• Precision enable (EN jumper with RENT and RENB resistors)
Automatic frequency foldback at light load and optional external bias improve efficiency over the entire load
range. The device requires few external components and has a pinout designed for optimal EMI and thermal
performance. Protection features include the following:
• Thermal shutdown
• Input undervoltage lockout
• Cycle-by-cycle current limiting
• Hiccup short-circuit protection
For a quick reference, Figure 1-1 shows the pin configuration of the LMQ61460-Q1.
3.5 mm
4 mm
BIAS
CBOOT RBOOT
EN/
SYNC
RESET
VIN1 VIN2
PGND1 PGND2
SW
FB
AGND
VCC
RT
Figure 1-1. LMQ61460-Q1 Pin Configuration (Top View)
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2 Quick Start Guide
1. Connect the voltage supply between the VIN and GND connectors or between VIN_EMI and GND_EMI to
include the on-board input filter in the input path. Use short and thick gauge wires to minimize inductance and
IR drop. Note that sense points for VIN and VOUT are provided.
2. Connect the load of the converter between VOUT and GND connectors using short and thick wires.
3. Set the supply voltage at an appropriate level between 6 V to 36 V. The 6 V minimum input voltage ensures
enough head room for VOUT to equal 5 V at a 6 A load current. Set the current limit of the supply to an
appropriate level to supply needed current and protection.
4. Turn on the power supply. With the default configuration, the EVM powers up and provides VOUT equal to 5 V.
5. Monitor the output voltage with sense points. The maximum load current is 6 A with the LMQ61460-Q1. Note
that the maximum output current may need to derate if ambient temperature is high, especially if device is
operated at higher frequency, that is 2.1 MHz.
See Figure 5-1 for connector locations.
CAUTION
Caution Hot surface.
Contact may cause burns.
Do not touch.
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3 Detailed Descriptions
This section describes the connectors on the EVM and how to properly connect, set up, and use the EVM. See
Figure 1-1 for a top view of the EVM.
VOUT Output voltage of the converter
VOUT connectors connect to the power inductor and output capacitors. Connect the load between
the VOUT connector and the GND connector to provide load current. Connect the loading device to
the board with short and thick wires to handle the large DC output current.
GND Ground of the converter
The GND is connected to the PGND and AGND pins of the device as well as the ground of the input
and output capacitors. The GND connections next to VIN, VIN_EMI, and VOUT connectors are
meant for current return path for the supply voltage and load, respectively. Connectors are provided
in pairs to allow easy and accurate sensing of voltages. Connect to supply and load grounds with
short and thick wires. Other GND connectors are for signal measurement and probing.
VIN Input voltage to the converter
The VIN connector connects to the input capacitors and the VIN pins of the LMQ61460-Q1. Connect
the supply voltage from a power supply or a battery between VIN and GND connectors as power
input to the device. The input voltage (VIN) range must be higher than 3.9 V for the device to start up
and above 3 V to maintain operation. A VIN higher than 6 V provides a regulated 5-V output voltage.
Maximum VIN is limited to 36 V to avoid damaging the device. The current limit on the supply must
be high enough to provide the needed supply current. The supply voltage must be connected to the
board with short and thick wires to handle the required input current at maximum load current. If long
cables are used to power up the board, damping must be provided by adding CFLT3 and RFLT3 to
avoid oscillation between the cable parasitic inductance and the existing low-ESR ceramic
capacitors.
VIN_EMI Low EMI option
If the input filter is required, connect the supply voltage between VIN_EMI and GND_EMI. The
supply voltage must be connected to the board with short and thick wires.
The input filter consists of the following: CF1, CF2, CF3, CF4, CF5, CF6, and L2. CD1, CD2, RD1,
and RD2 are provided to allow more options for filter optimization. To include the input filter in the
power path, connect the supply voltage between the VIN_EMI and GND_EMI connectors. The
output of the filter is connected to VIN, which is connected to the VIN pins of the LMQ61460-Q1.
Conducted EMI arises from the operation of switching circuits.
GND_EMI Ground return for the input filter
This is the current return path for the supply connected to VIN_EMI. It provides a short-loop
connection to the input filter capacitors to best filter the conducted noise generated from the PCB.
Use VIN_EMI and GND_EMI connection if input filter is used and conducted EMI test is desired.
CLK For synchronization clock input
The CLK input connector is designed for external clock input to the EN/SYNC pin. Switching action
of the buck is synchronized to the external clock when it is present. The operation mode
automatically changes to forced PWM mode, maintaining a constant switching frequency over the
entire load range while the clock signal is present.
EN To monitor the EN pin or control EN signal
This test point is used to monitor the voltage on the device EN pin. By default, the EN pin is
connected to the mid-point of an enable divider. Note that the lower resistor in this divider, RENB, is
not populated so the IC turns on by default. Populate RENB to adjust UVLO. Apply a voltage to EN
to externally enable or disable the device.
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PG To monitor the PGOOD/RESET pin
The PGOOD flag indicates whether the output voltage is within the regulation band. The RESET pin
(synonymous with PGOOD pin) of the device is an open-drain output and is pulled up to VOUT
through a 100 k resistor. This pin pulls to GND when the output voltage is out of regulation.
Vinj For measuring AC response
A low value resistor, Rinj, is placed between VOUT and this node. The feedback divider of the board
is connected to this node. An AC signal is applied across Rinj when taking measurements for bode
plots.
VOUTS VOUT sense
This connector is provided for measuring the output voltage accurately.
VINS VIN sense
This connector is provided for measuring the input voltage accurately.
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4 Schematic
The bill of materials is tabulated in Section 7. In addition, Figure 4-1 shows the corresponding schematic.
Figure 4-1. LMQ61460EVM-400K Schematic
Note
Long leads and additional inductance in used to power the DC/DC may cause issues for ideal device operation. RD2, CD2, RD1, and CD1 are
placeholders for damping networks to be populated. For more information regarding this topic, reference the EMI Filter Components and Their
Nonidealities for Automotive DC/DC Regulators Technical Brief.
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4.1 Alternative BOM Configurations
Table 4-1. Different BOM Configurations
VOUT FREQUENCY RFBB RT COUT CIN + CHF L1
3.3 V 400 kHz 43.2 kΩ 33.2 kΩ 6 x 22 µF 2 x 4.7 µF + 2 x
100 nF
4.7 µH
(XHMI6060)
3.3 V 2100 kHz 43.2 kΩ 6.04 kΩ 3 x 22 µF 2 x 4.7 µF + 2 x
100 nF
1 µH (XEL5030)
5 V 400 kHz 24.9 kΩ 33.2 kΩ 4 x 22 µF 2 x 4.7 µF + 2 x
100 nF
4.7 µH
(XHMI6060)
5 V 2100 kHz 24.9 kΩ 6.04 kΩ 3 x 22 µF 2 x 4.7 µF + 2 x
100 nF
1 µH (XEL5030)
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5 Board Layout
Figure 5-1 through Figure 5-5 show the board layout for the LMQ61460-Q1 EVM. The EVM offers resistors,
capacitors, and test points to configure the following:
• Output voltage (RFBT and RFBB)
• Precision enable pin (RENT and RENB)
• Set frequency (RT)
• External clock synchronization (CLK jumper)
The 14-pin Hotrod package with integrated capacitors offers a very small size and low-noise solution. The PCB
consists of a 4-layer design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer
planes to route signals and dissipate heat with an array of thermal vias to connect to all four layers.
Test points have been provided for ease of use to connect the power supply and required load, and to monitor
critical signals.
The board measures 3.00" x 4.00" (76mm x 101mm).
Figure 5-1. Top View with Silkscreen
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Figure 5-2. Top Layer
Figure 5-3. Signal Layer 1 - Ground Plane
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Figure 5-4. Signal Layer 2 - Routing
Figure 5-5. Bottom Layer
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6 LMQ61460EVM-400K Board Test Results
6.1 EMI
The EMI measurements were taken following CISPR 25, Class 5 standards. The measurements were taken at
13.5 VIN, 5 VOUT with a 6 A load switching at 400kHz.
Figure 6-1. Conducted EMI Measurement with
CISPR 25 Class 5 Limit Lines (150 kHz to 30 MHz)
Figure 6-2. Conducted EMI Measurement with
CISPR 25 Class 5 Limit Lines (30 MHz to 108 MHz)
Figure 6-3. Radiated EMI Measurement with
Horizontal Bicon Antenna Under CISPR 25 Class 5
Limits
Figure 6-4. Radiated EMI Measurement with
Vertical Bicon Antenna Under CISPR 25 Class 5
Limits
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Figure 6-5. Radiated EMI Measurement with
Horizontal Log Antenna Under CISPR 25 Class 5
Limits
Figure 6-6. Radiated EMI Measurement with
Vertical Log Antenna Under CISPR 25 Class 5
Limits
6.2 Board Efficiency
This section provides efficiency plots for the board with LMQ61460AAS populated for Auto mode efficiency and
LMQ61460AFS populated for FPWM mode efficiency. For 2.1-MHz data, the output stage has to be changed
from the default BOM. The inductor (L1) selected was XEL5030-102MEB.
Load Current (A)
Efficiency (%)
0.0001 0.001 0.01 0.1 0.2 0.5 1 2 3 5 710
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-7. FSW = 400 kHz, 5 VOUT, Auto Mode
Load Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-8. FSW = 400 kHz, 5 VOUT, FPWM Mode
Output Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-9. FSW = 400 kHz, 3.3 VOUT, Auto Mode
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-10. FSW = 400 kHz, 3.3 VOUT, FPWM Mode
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Load Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-11. FSW = 2.1 MHz, 5 VOUT, Auto Mode
Load Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-12. FSW = 2.1 MHz, 5 VOUT, FPWM Mode
Output Current (A)
Efficiency (%)
0.001 0.010.02 0.05 0.1 0.2 0.5 1 2 3 45 7 10
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-13. FSW = 2.1 MHz, 3.3 VOUT, Auto Mode
Output Current (A)
Efficiency (%)
0 1 2 3 4 5 6 7
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
LM61
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-14. FSW = 2.1 MHz, 3.3 VOUT, FPWM Mode
6.3 Load Regulation
This section provides efficiency plots for the board with LMQ61460AAS populated for Auto mode efficiency and
LMQ61460AFS populated for FPWM mode efficiency. For 2.1-MHz data, the output stage has to be changed
from the default BOM. The inductor (L1) selected was XEL5030-102MEB.
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-15. FSW = 400 kHz, 5 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-16. FSW = 400 kHz, 5 VOUT, FPWM Mode
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Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-17. FSW = 400 kHz, 3.3 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-18. FSW = 400 kHz, 3.3 VOUT, FPWM Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-19. FSW = 2.1 MHz, 5 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
4.95
4.97
4.99
5.01
5.03
5.05
5.07
5.09
5.11
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-20. FSW = 2.1 MHz, 5 VOUT, FPWM Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-21. FSW = 2.1 MHz, 3.3 VOUT, Auto Mode
Output Current (A)
Output Voltage (V)
0 1 2 3 4 5 6 7
3.29
3.31
3.33
3.35
3.37
SNVS
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
Figure 6-22. FSW = 2.1 MHz, 3.3 VOUT, FPWM Mode
6.4 Thermals
A thermal image of the IC was captured to determine rise in temp with a 5-V, 6-A load. The device was soaked
for 30 minutes to obtain accurate measurement.
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Figure 6-23. Thermal Image Capture of IC at VIN = 13.5 V, VOUT = 5 V, Load = 6 A
Note
Thermal image captures top of case temperature. This is essentially junction temperature as the case
package is very thin, resulting in low psi-jt. This demonstrates device capability of operating greater
than 85°C ambient with headroom.
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7 Bill of Materials
The bill of materials is shown Table 7-1 for the LMQ61460EVM-400K.
Table 7-1. LMQ61460EVM-400K EVM Bill of Materials
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
C1, C4 2 4.7 µF CAP, CERM, 4.7 µF, 50 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 UMK325B7475MMHT Taiyo Yuden
C2, C3 2 0.022 µF CAP, CERM, 0.022 µF, 50 V, ±10%, X7R, 0402 0402 GRM155R71H223KA12D MuRata
C5 1 1 µF CAP, CERM, 1 µF, 25 V, ±10%, X7R, 0805 0805 C0805C105K3RACTU Kemet
C6, C7, C8, C9 4 22 µF CAP, CERM, 22 µF, 16 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 CGA6P1X7R1C226M250
AC
TDK
C12 1 1000 pF CAP, CERM, 1000 pF, 50 V, ±0%, X7R, 0603 0603 C0603C102K5RACTU Kemet
C13 1 0.1 µF CAP, CERM, 0.1 µF, 10 V, ±10%, X7R, 0603 0603 C0603X104K8RACTU Kemet
C15 1 1 µF CAP, CERM, 1 µF, 16 V, ±10%, X7R, 0603 0603 885012206052 Wurth Elektronik
C16 1 22 pF CAP, CERM, 22 pF, 50 V, ±5%, C0G/NP0,
AEC-Q200 Grade 1, 0603
0603 CGA3E2C0G1H220J080
AA
TDK
C17, C18, C19, C20 4 2.2 µF CAP, CERM, 2.2 µF, 50 V, ±10%, X7R, AEC-
Q200 Grade 1, 0805
0805 CGA4J3X7R1H225K125
AB
TDK
C21, C22 2 0.47 µF CAP, CERM, 0.47 µF, 50 V, ±10%, X7R, AEC-
Q200 Grade 1, 0603
0603 CGA3E3X7R1H474K080
AE
TDK
J1, J2, J3 3 Terminal Block, 5 mm, 2x1, Tin, TH Terminal Block, 5 mm,
2x1, TH
691 101 710 002 Wurth Elektronik
J4 1 Header, 100 mil, 3x1, Gold, TH Header, 100 mil, 3x1, TH HTSW-103-07-G-S Samtec
L1 1 4.7 µH Inductor, Shielded, Hyperflux, 4.7 µH, 7.4 A,
0.0143 Ω, SMD
6.65x6.45 mm 74439346047 Wurth Elektronik
L2 1 1.2 µH Shielded Molded Inductor 7.5 A, 11.3
mΩ Max 2-SMD
SMD2 744316220 Wurth Electronics
LBL1 1 PCB Label 0.650 x 0.200
inch
THT-14-423-10 Brady
R1, R6 2 1.00 k Ω RES, 1.00 k, 1%, 0.25 W, 1206 1206 RC1206FR-071KL Yageo America
R2 1 0 Ω RES, 0, 5%, 0.1 W, 0603 0603 RC0603JR-070RL Yageo
R3 1 33.2 kΩ RES, 33.2 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603 CRCW060333K2FKEA Vishay-Dale
R4, R7 2 100 kΩ RES, 100 k, 1%, 0.1 W, 0603 0603 RC0603FR-07100KL Yageo
R5 1 100 Ω RES, 100, 1%, 0.1 W, 0603 0603 RC0603FR-07100RL Yageo
R8 1 24.9 kΩ RES, 24.9 k, 1%, 0.1 W, 0603 0603 RC0603FR-0724K9L Yageo
R9 1 1.00 kΩ RES, 1.00 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1001V Panasonic
R10 1 255 kΩ RES, 255 k, 1%, 0.1 W, 0603 0603 RC0603FR-07255KL Yageo
SH-J1 1 Shunt, 100 mil, Gold plated, Black Shunt 2 pos. 100 mil 881545-2 TE Connectivity
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Table 7-1. LMQ61460EVM-400K EVM Bill of Materials (continued)
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
TP1, TP9 2 Test Point, Multipurpose, Red, TH Red Multipurpose
Testpoint
5010 Keystone
TP2, TP3, TP5, TP6 4 Test Point, Multipurpose, Black, TH Black Multipurpose
Testpoint
5011 Keystone
TP4, TP7 2 Test Point, Multipurpose, Orange, TH Orange Multipurpose
Testpoint
5013 Keystone
TP8, TP10 2 Test Point, Multipurpose, White, TH White Multipurpose
Testpoint
5012 Keystone
U1 1 Automotive 6-A Low Noise Synchronous Buck
Regulators, RJR0014A (VQFN-HR-14)
RJR0014A LMQ61460AASQRJRRQ
1
Texas Instruments
C10, C11 0 22 µF CAP, CERM, 22 µF, 16 V, ±20%, X7R, AEC-
Q200 Grade 1, 1210
1210 CGA6P1X7R1C226M250
AC
TDK
C14 0 1 µF CAP, CERM, 1 µF, 10 V, ±10%, X7R, 0603 0603 GRM188R71A105KA61D MuRata
C23, C24 0 1 µF CAP, CERM, 1 µF, 50 V, ±10%, X7R, 0603 0603 UMK107AB7105KA-T Taiyo Yuden
FID1, FID2, FID3, FID4,
FID5, FID6
0 Fiducial mark. There is nothing to buy or
mount.
N/A N/A N/A
R12 0 0.51 Ω RES, 0.51, 1%, 0.25 W, 0805 0805 CRM0805-FX-R510ELF Bourns
R13 0 100 kΩ RES, 100 k, 1%, 0.1 W, 0603 0603 RC0603FR-07100KL Yageo
Bill of Materials www.ti.com
18 LMQ61460EVM-400K User's Guide SNVU698B – SEPTEMBER 2020 – REVISED DECEMBER 2020
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8 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (September 2020) to Revision B (January 2021) Page
• Revised Board Efficiency Curve - 5V, 2.1MHz, FPWM.....................................................................................13
Changes from Revision * (March 2020) to Revision A (September 2020) Page
• Changed image from 3D imaging to a physical board image............................................................................. 1
• Added Board Efficiency.....................................................................................................................................13
• Added Load Regulation.................................................................................................................................... 14
• Added Thermals............................................................................................................................................... 15
www.ti.com Revision History
SNVU698B – SEPTEMBER 2020 – REVISED DECEMBER 2020
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LMQ61460EVM-400K User's Guide 19
Copyright © 2021 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.