Texas Instruments LOG200EVM User manual

EVM User's Guide: LOG200EVM LOG200
LOG200 Evaluation Module
Description
The LOG200 evaluation module (EVM) is a
development platform for evaluating the LOG200,
which is a precision, high-speed logarithmic amplifier
with integrated photodiode bias and dark current
correction. The LOG200 is optimized for current
measurements across 160 dB wide dynamic range,
over several decades with unparalleled speed and
accuracy.
Features
• High-accuracy logarithmic transfer function
• Logarithmic ratio internally set to 250 mV/decade
of current-to-voltage conversion
• Footprint for photosensor connection
• Integrated photodiode bias and dark current
correction adaptive biasing circuit
• Integrated precision 1 µA current reference
• Integrated precision 1.65 V and 2.5 V voltage
references
• Single supply (+5 V) or dual supply (±5 V)
operation
• Sub-miniature version A (SMA) connectors and
test points allow for quick tests
Applications
•Optical modules
•Inter_DC interconnect
•Optical network terminal unit
•Chemistry/gas analyzer
LOG200EVM Hardware Board
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1 Evaluation Module Overview
1.1 Introduction
The LOG200EVM is the evaluation module (EVM) for the LOG200 precision, high-speed logarithmic amplifier.
The device features two logarithmic amplifiers followed by a high-accuracy differential amplifier to convert
current signals into a single-ended voltage that represents the log-compressed ratio of the two currents. The log
amplifier ratio is internally set to 250 mV/decade of current-to-voltage conversion.
The LOG200 device integrates an uncommitted high-speed amplifier to allow the output to be configured for
differential or filtered responses.
The LOG200EVM operates over a 4.5 V to 12 V range unipolar supply or dual supply of ±2.25V to ±6 V supply.
See Table 2-2 for details. SMA and Test points provide convenient access to all critical functions of the LOG200.
For a full schematic of the LOG200EVM, see Figure 3-1.
1.2 Kit Contents
Table 1-1. LOG200EVM Kit Contents
Item Description Quantity
LOG200EVM PCB 1
1.3 Specification
The LOG200EVM offers the following features:
• The evaluation board enables users to connect the LOG200 to current sources through SMA connections via
series resistors.
• The PCB includes a footprint to mount an optional photodiode to the INUM input for optical power
measurement applications. The photosensor can be biased externally through a test point, or through the
use of the LOG200 IBIAS adaptive biasing current output function by modifying the EVM.
• Allows access to the integrated precision 1 µA current reference
• Allows the use of the Integrated precision 1.65 V and 2.5 V voltage references in different circuit
configurations
• The LOG200EVM provides access to the inputs and output of the secondary op-amp. The PCB provides
optional passive component footprints to support different op-amp or filter configurations.
1.4 Device Information
The EVM is built with the LOG200IRGT device in the 16-pin QFN package with the thermal pad.
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2 Hardware
2.1 Read this first: EVM Cleaning Guidelines
Logarithmic amplifier applications requiring picoampere range performance are very sensitive to PCB board
contamination. Contaminants in the form of solder flux, oils and other impurities can form conductive paths
over the sensitive PCB traces that allow small currents to leak from the input traces or other sensitive nodes,
degrading performance. For best performance, make sure to keep the LOG200EVM as clean as possible. The
following list shows best practices to clean the evaluation board and to help prevent the EVM from becoming
contaminated:
• Leakage currents from solder flux contamination can disturb the logarithmic amplifier's operation, specially at
lower current levels. The LOG200EVM undergoes a standard cleaning protocol after the fabrication, soldering
and assembly process prior shipping to customers, providing picoampere level performance. The EVM must
be re-cleaned anytime devices are soldered into the PCB or modified near the logarithmic amplifier sensitive
nodes, if the LOG200 U1 device is replaced, or if these input sensitive connections become contaminated by
other means.
• The recommended cleaning procedure requires access to an ultrasonic deionized (DI) water bath:
– Place the EVM in the ultrasonic cleaner and fill with fresh deionized (DI) water.
– Run the ultrasonic cleaner for 20 minutes at 45°C.
– Remove all moisture from PCB.
• If an ultrasonic bath is not available, then a manual cleaning procedure is possible:
– Scrub contaminants from the top layer I1 and I2 inputs at top layer.
– Use a toothbrush to gently scrub for 60 seconds. Focus on areas surrounding U1 I1, I2, VCM, and IREF
inputs, R9, R13, R16, R17, R35, D1, input SMA connectors J4 and J6 and guard traces.
– Scrub contaminants from the bottom layer around the diode D1 photosensor footprint and input SMA
connectors J4 and J6.
– Flush the scrubbed areas with fresh DI water, tilting the board to allow runoff to flow away from the input
areas.
– Remove all moisture from PCB.
• When handling the EVM, always hold the board by the edges.
• When not in use, place the EVM in ESD bag or other enclosure to prevent dust and other contaminants from
settling on the board.
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2.2 Input and Output Connections
The current input signals for the logarithmic numerator, I1, and logarithmic denominator, I2, are provided through
SMA connectors J4 and J6. These inputs are located at the left of the EVM. The input connections of the log
amplifier have a series 10 kΩ resistors, R9 and R10. The logarithmic output connection is provided through SMA
J5 and test point TP4 at the right side of the EVM.
The secondary op-amp inputs are accessible through SMA J14 and the output amplifier connection is provided
through SMA connector J14, and test point TP16, located at the right side of the EVM. For a full schematic of the
LOG200EVM, see Figure 3-1 and Figure 3-2.
Table 2-1 summarizes the input and output connectors and corresponding test points.
Table 2-1. LOG200EVM Input and Output Connections
Designator Signal Connector Type Description
J4 I1_IN SMA Current input for logarithm numerator
J6 I1_IN SMA Current input for logarithm denominator
J5 OUT_A SMA Logarithm function voltage output
J13 IN_AMP_B SMA Secondary op-amp voltage non-inverting
and inverting input
J14 OUT_B SMA Secondary op-amp voltage output
J16 REF_GND Banana plug Optional ext voltage reference negative
J10 Ext_RefA Banana plug Optional ext Logarithm function voltage
output reference
J12 GND Banana plug EVM PCB ground
TP1 DBIAS Test point Optional ext Photodiode Vbias Cathode
TP4 OUT_A Test point Logarithm function voltage output
TP16 OUT_B Test point Secondary op-amp voltage output
TP11 VCM Test point Input common-mode voltage
TP14 REF1 Test point REF25: 2.5V reference output
TP15 REF2 Test point REF165: 1.65V reference output
TP18 REF_GND Test point Voltage reference negative
TP2, TP3,
TP8, TP12,
TP17
GND Test point EVM PCB ground
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2.3 Power Requirements
The power-supply connections for the LOG200EVM are provided through standard banana jack connectors J1,
J2, and J3 at the top of the EVM. The LOG200EVM can be set up with a single unipolar supply or with dual
bipolar supplies by setting jumper J9. Table 2-2 summarizes the pin definition for supply connector J1, J2, and
J3 and the allowed voltage range for each supply connection when configured with either unipolar or bipolar
supplies.
Table 2-2. LOG200EVM Supply-Range Specifications
Connector
Number
Supply Connection Voltage Range
J1 (V+) supply Unipolar: +4.5 V to +12 V
Bipolar: +2.25 V to +6 V
J2 Ground 0 V
J3 (V-) Supply Unipolar: Do not Connect
Bipolar: –2.25 V to –6 V
The EVM is configured by default using bipolar supply by opening jumper J9. To configure the device with
unipolar supply, set jumper J9 to shunt pin 1–2.
Figure 2-1 shows the J1, J2, and J3 standard banana supply connectors, and jumper J9 configuration.
J3
J2
GND
J1
VS+
VS+
10µF
C6 C5
TP5
VS+
12V
D3
VS+
VS+
12V
D2
GND
12V
D4
LOG200
+
–
+
–
+
–
+
–
+
–
PD
BIAS
+
–
1µA
2.5V 1.65V
VS+
C7
100 nF
C11
100 nF
VS–
C8
100 nF
I1
I2
VCM
IBIAS
IN– IN+
VS+
OUTB
OUTA
REFA
IREF REF25 REFGND REF165
TP6
VS–
VS–
R4
10.0 
R5
10.0 
10µF
VS–
VS–
VS–
PAD
Thermal Pad
Connected to
VCM
1
2
J9
VS–
Power-Supply
Connector
Jumper J9
Shunt 1-2 for Unipolar Supply
Open 1-2 for Bipolar Supply
VS–
Shunt
GND
TP9
Figure 2-1. LOG200EVM Voltage Supply Connections
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2.4 Jumper Information
Figure 2-2 details the default jumper settings of the LOG200EVM. Table 2-3 explains the configuration for these
jumpers.
Figure 2-2. LOG200EVM Default Jumper Settings
Table 2-3. Default Jumper Configuration
Jumper Function Default Position Description
J7 Out_A
SMA J5 reference Shunt 2-3 Shunt 2-3: SMA connector J3 referred to GND
Shunt 1-2: SMA connector J3 referred to REFA
J8 VCM
Select Shunt 1-2 Shunt 1-2: VCM input connected to GND Shunt 3-4: Connects VCM input to 2.5V reference
J9 VS– connection Open
Open: Bipolar supply configuration
Shunt 1-2: Connects VS– to GND for unipolar supply
configuration
J11 REF A Select Shunt 7-8
Shunt 1-2: Sets log voltage REFA to external voltage through J10
Shunt 3-4: Sets REFA to REF25
Shunt 5-6: Sets REFA to REF165
Shunt 7-8: Sets REFA to GND
J15 Secondary
op-amp input Shunt 1-2 Shunt 1-2: Connects Aux AMP+IN to OUTA Shunt 3-4: Connects Aux AMP -IN to OUTA
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2.5 Optional Photodiode Connections
The LOG200EVM PCB board layout includes a photosensor footprint (D1) to install a radial photodiode on
current input I1 for the logarithmic numerator. See Figure 2-3 for the photosensor input and photosensor biasing
connections.
The photodiode IBIAS adaptive biasing current output is accessible through optional jumper resistor R2. The
adaptive current output biasing scheme creates a voltage to bias a photodiode with a current that is proportional
to the photocurrent. This allows small bias voltages for low photodiode currents, reducing the dark current of
the photodiode, and higher reverse-bias voltages as the photocurrent increases, reducing the capacitance of the
photodiode.
The IBIAS function produces a current that is approximately 1.1x larger than the numerator current I1. Since
the photosensor produces the input numerator current, the remaining 0.1*I1 current flows through the RBIAS
resistor R3. The RBIAS resistor R3 needs to be scaled depending on the photosensor biasing requirements, the
photosensor current range and the LOG200 supply voltage. The voltage at the IBIAS pin must not exceed (V+)
- 1 V at the photosensor maximum current. If the IBIAS function is not used, then leave the IBIAS pin floating by
removing resistor jumper R2.
Alternatively, the photosensor cathode can be reverse biased via test point TP1, DBIAS. Verify the resistor R2 is
removed when biasing the photosensor through TP1.
Capacitors C1 and C3 can help providing dynamic currents during fast transients and help to improve stability.
The value for best bias response depends on the photosensor and application requirements.
Figure 2-3 presents a simplified diagram of the photodiode connections. For a detailed schematic of the
photosensor connections, see Figure 3-1.
LOG200
+
–
+
–
+
–
+
–
+
–
PD BIAS
1.1x I1
+
–
1µA
2.5V 1.65V
I1
I2
VCM
IBIAS
IN– IN+
OUTB
OUTA
REFA
IREF
REF25 REFGND REF165
J6
SMA
Connector
I2_IN
R9
C1
VCM2
R16
0

R2 0

D1
RBIAS
R3
GND
C3
Photodiode
Guard
Guard
R1 TP1
DBIAS
Guard
C2
GND
C9
GND
1000 pF
1000 pF
PAD / VCM
J8
1
2
To
REF25
GND
3
4
Jumper J8
Shunt 1-2 VCM to GND
Shunt 3-4 VCM to 2.5V reference
Shunt
Figure 2-3. LOG200EVM Photodiode Connections
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3 Hardware Design Files
3.1 Schematics
Figure 3-1 and Figure 3-2 show the EVM schematics.
Pin1_I1
Pin2_Vcm
Pin3_I2
Pin4_Iref
Pin15_IBias
Pin16_Vcm2
Current Reference
Pin10_RefA
Pin11_OUTA
Vcm
Vcm
Vcm
GND
I1_IN
I2_IN
GND
GND
GND
GND Vcm
Vcm
GND GND
VCM
2
VCM2
16
REF25
5
REF165
9
VS+
8
VS- 7
IN+
14
IN-
13
I1
1
I2
3
IBIAS
15
IREF
4
OUTA 11
OUTB 12
REFA
10
Thermal_Pad
17
REFGND 6
LOG200RGT
U1
Pin1_I1
Pin2_Vcm
Pin3_I2
Pin4_Iref
Pin5_Ref25
Pin6_RefGND
VS-
VS+
Pin9_Ref165
Pin10_RefA
Pin11_OUTA
Pin12_OUTB
Pin13_-IN
Pin14_+IN
Pin15_IBias
Pin16_Vcm2
Pin17_Pad
GND
TP8
GND
TP12
GND
TP4
OUT_A1
R8
100
R6
TP10
REFA1
TP3
GND
0
R14
0
R10
1
2
3
4 5
J6
I2_IN
1
2 3
4
5
J4
I1_IN 1
2 3 4 5
J5
OUT_A1
TP1
DBias
GND
Vcm
R3
R11
Vcm
R15
OUTA
100V
100pF
C4
1 2
3
D1
TP2
GND
R1
Vcm
GND
GND
GND
0
R7
1000pF
50V
C9
Pin2_Vcm
C3C1
1000pF
50V
C2
1 2
3 4
J8
Vcm_Sel1
TP11
Vcm
Pin5_Ref25
R2
249
R31
R32
GND
0
R12
C18
GND
R35
C10
1
2
3
J7
OutA_Ref_conn
GND
10.0k
R9
10.0k
R13
0
R16
R17
Pin10_RefA Pin5_Ref25
Pin9_Ref165
Ext_RefA
J10
Ext_RefA1
TP14
Ref1
TP15
Ref2
1 2
3 4
5 6
7 8
J11
REFA_Sel
GND
REFA Diff Amp Select
LOG200
DNP
DNP
DNP
DNP
DNP
DNP
DNP DNP DNP
DNP
DNP
DNP
DNP
Note: DNP components are not populated.
Figure 3-1. LOG200EVM Schematic
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GND
VS-
1
2
J9
VS-_to_GND
Power Supplies
Pin17_Pad
Vcm
Voltage Reference Bypass Cap
Pin6_RefGND
GND
GND
GND
Pin9_Ref165
Pin5_Ref25
GND
Pin12_OUTB
Pin13_-IN
Pin14_+IN AMP_B
GND
AMPB_IN+
AMPB_IN-OUTA
LOG200 Operational Amplifier B
GND
GND
GND
GND
J3
VS-
J2
GND
J1
VS+
GNDVS+ VS-
TP5
VS+
VS+VS+
TP6
VS-
GND
VS+
VS-
TP9
GND
VS-GND
VS-
10.0
R4
10.0
R5
10uF
C5
GND
10uF
C6
GND
100nF
50V
C8
100nF
50V
C7
100nF
50V
C11
12V
D2
12V
D4
12V
D3
R19
0
R26
TP17
GND
TP16
OUT_B1
R28
100
R25
0
R24
J12
GND
20pF
C13
R23
0
R30
J16
Ref_GND1
TP18
Ref_GND1
J13
IN_AMP_B1
J14
OUT_B1
1 2
3 4
J15
INB_SEL1
1.00k
R21
1.00k
R20
1.00k
R27
R29
20pF
C16
AMPB_IN+
AMPB_IN-
100V
100pF
C15
100V
330pF
C12
100V
330pF
C14
0
R18
0
R22
R33
Pin9_Ref165
C17
1.00k
R34
DNP
DNP
DNP
DNP
DNP
DNP
Note: DNP components are not populated.
Figure 3-2. LOG200EVM Schematic
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3.2 PCB Layout
The LOG200EVM is a four-layer PCB design. Figure 3-3 to Figure 3-7 show the PCB layer illustrations.
The top layer routes the sensitive input current signal path traces. The logarithmic amplifier is optimized to
perform current measurements across several decades. At the low current level ranges, leakage current can
cause significant errors. To minimize leakage current paths, a complete guard ring is implemented with traces
that encircle the complete signal path of each high-impedance current input of the log amplifier. The guard
presents a low-impedance path for leakage currents of equal potential to the high-impedance traces that are
being guarded. The guard traces are driven to the input common-mode voltage (VCM); therefore, the current
flowing between the input current traces and the guard is negligible because both traces are similarly at the
same potential.
The LOG200EVM provides a footprint to connect a photodiode to the I1 input pin. The photosensor is kept in
close proximity to the I1 input to minimize parasitic capacitance. The evaluation board provides all the necessary
photosensor and adaptive bias circuit connections through resistor R2, R3 and optional capacitors C1, C3. For a
detailed explanation, refer to the photodiode connections section of the User Guide.
Decoupling capacitors C7, C8 and C11 are positioned on the top layer as close as possible to the power-supply
pins of the device. Similarly, reference bypass capacitor C12 and C14 are located in close proximity to the
reference pins.
The second internal layer is a dedicated to the power supplies connections and contains a common-mode
(VCM) plane. The third internal layer and bottom layers contain a ground plane and route additional auxiliary
amplifier/reference signals.
Figure 3-3. Top Overlay PCB Layout
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Figure 3-4. Top Layer PCB Layout
Figure 3-5. Mid Layer 1 PCB Layout
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Figure 3-6. Mid Layer 2 PCB Layout
Figure 3-7. Bottom Layer PCB Layout
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3.3 Bill of Materials (BOM)
Table 3-1 lists the LOG200EVM bill of materials (BOM).
Table 3-1. LOG200EVM Bill of Materials
Designator Qty Value Description Package
Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board AMPS176 Any
C2, C9 1000 pF CAP, CERM, 1000 pF, 50 V,+/- 5%,
C0G/NP0, AEC-Q200 Grade 1, 0603
0603 GCM1885C1H102J
A16D
MuRata
C4, C15 2 100 pF CAP, CERM, 100 pF, 100 V, +/- 10%,
C0G/NP0, 1206
1206 12061A101KAT2A AVX
C5, C6 2 10uF CAP, CERM, 10 uF, 25 V, +/- 20%,
X7R, 1206_190
1206_190 C3216X7R1E106M
160AE
TDK
C7, C8, C11 3 0.1uF CAP, CERM, 0.1 uF, 50 V, +/- 10%,
X7R, 0805
0805 GRM21BR71H104
KA01L
MuRata
C12, C14 2 330 pF CAP, CERM, 330 pF, 100 V, +/- 5%,
C0G/NP0, 0603
0603 C1608C0G2A331J
080AA
TDK
C13, C16 2 20 pF CAP, CERM, 20 pF, 100 V, +/- 5%,
C0G/NP0, 0805
0805 08051A200JAT2A AVX
D2, D3, D4 3 12 V Diode, TVS, Uni, 12 V, 19.9 Vc, SMB SMB SMBJ12A-13-F Diodes Inc.
H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4,
Nylon, Philips panhead
Screw NY PMS 440 0025
PH
B&F Fastener
Supply
H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone
J1, J2, J3, J10,
J12, J16
6 Standard Banana Jack, Uninsulated,
5.5mm
Keystone_575-4 575-4 Keystone
J4, J5, J6, J13,
J14
5 Connector, End launch SMA, 50
ohm, SMT
End Launch SMA 142-0701-801 Cinch Connectivity
J7 1 Header, 100mil, 3x1, Gold, TH 3x1 Header TSW-103-07-G-S Samtec
J8, J15 2 Header, 2.54mm, 2x2, Gold, TH Header, 2.54mm,
2x2, TH
PBC02DAAN Sullins Connector
Solutions
J9 1 Header, 2.54mm, 2x1, Tin,
THHeader, 2.54mm, 2x1, TH
Header, 2.54mm,
2x1, TH
22284023 Molex
J11 1 Header, 2.54 mm, 4x2, Gold, TH Header, 2.54 mm,
4x2, TH
802-10-008-10-001
000
Mill-Max
R1, R24, R26,
R30
4 0 RES, 0, 5%, 0.125 W, 0805 0805 MCR10EZPJ000 Rohm
R4, R5 2 10 RES, 10.0, 1%, 0.25 W, 0805 0805 RNCP0805FTD10R
0
Stackpole
Electronics Inc
R6, R25 2 100 RES, 100, 1%, 0.125 W, AEC-Q200
Grade 0, 0805
0805 CRCW0805100RF
KEA
Vishay-Dale
R7, R10, R14,
R16
4 0 RES, 0, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402 CRCW04020000Z0
ED
Vishay-Dale
R9, R132 2 10.0k RES, 10.0 k, .1%, .0625 W, 0402 0402 RT0402BRD0710K Yageo America
R12, R18, R22 3 0 RES 0 OHM JUMPER 1/4W 0603 0603 HCJ0603ZT0R00 Stackpole
Electronics
R20, R21, R27,
R34
4 1.00k RES, 1.00 k, 0.1%, 0.125 W, 0805 0805 RT0805BRD071KL Yageo America
R31 1 249 RES, 249, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
0603 CRCW0603249RF
KEA
Vishay-Dale
SH-J1, SH-J2,
SH-J3, SH-J4,
SH-J5
5 Shunt, 100mil, Gold plated, Black Shunt 2 pos. 100
mil
881545-2 TE Connectivity
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Table 3-1. LOG200EVM Bill of Materials (continued)
Designator Qty Value Description Package
Reference Part Number Manufacturer
TP1, TP2, TP3,
TP4, TP5, TP6,
TP8, TP9, TP10,
TP11, TP12,
TP14, TP15,
TP16, TP17,
TP18
16 Test Point, Compact, SMT 5016 Keystone
U1 1 Precision, High-Speed Logarithmic
Amplifier With Integrated Photodiode
Bias and Dark Current Correction
VQFN16 LOG200RGT Texas Instruments
D1 DNP InGaAs PIN Photodiode. Pigtail type,
1.3/1.55 μm, 2 GHz
RADIAL G8195 Hamamatsu
4 Additional Information
4.1 Trademarks
All trademarks are the property of their respective owners.
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STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

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3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.

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4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

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5
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated

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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
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These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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Copyright © 2023, Texas Instruments Incorporated