Texas Instruments MSPM0G3507 User manual

User’s Guide
MSPM0G3507 LaunchPad Development Kit
(LP ‑ MSPM0G3507)
ABSTRACT
The MSPM0G3507 LaunchPad™ development kit is an easy-to-use evaluation module for the MSPM0G3507
microcontroller (MCU). The LaunchPad kit contains everything needed to start developing on the MSPM0Gxxxx
microcontroller platform, including an onboard debug probe for programming, debugging, and EnergyTrace™
technology. The board also features onboard buttons, LEDs, an RGB LED, a light sensor, and a temperature
sensor.
The following figure shows the LP-MSPM0G3507 LaunchPad Development Kit.
MSPM0G3507 LaunchPad Development Kit
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Table of Contents
1 Getting Started........................................................................................................................................................................3
1.1 Introduction........................................................................................................................................................................ 3
1.2 Key Features......................................................................................................................................................................3
1.3 What's Included..................................................................................................................................................................3
1.4 First Step: Out-of-Box Experience..................................................................................................................................... 3
1.5 Next Steps: Looking Into the Provided Code..................................................................................................................... 4
2 Hardware................................................................................................................................................................................. 5
2.1 Jumper Map....................................................................................................................................................................... 5
2.2 Block Diagram....................................................................................................................................................................7
2.3 Hardware Features............................................................................................................................................................ 7
2.4 Power............................................................................................................................................................................... 13
2.5 External Power Supply and BoosterPack Plug-in Module............................................................................................... 13
2.6 Measure Current Draw of the MSPM0 MCU....................................................................................................................13
2.7 Clocking........................................................................................................................................................................... 14
2.8 BoosterPack Plug-in Module Pinout.................................................................................................................................14
2.9 Design Files..................................................................................................................................................................... 14
3 Software Examples...............................................................................................................................................................14
4 Resources............................................................................................................................................................................. 15
4.1 Integrated Development Environments............................................................................................................................15
4.2 MSPM0 SDK and TI Resource Explorer.......................................................................................................................... 15
4.3 MSPM0G3507 MCU........................................................................................................................................................ 15
4.4 Community Resources.....................................................................................................................................................16
5 Schematics............................................................................................................................................................................17
6 Revision History................................................................................................................................................................... 24
Trademarks
LaunchPad™, EnergyTrace™, BoosterPack™, Code Composer Studio™, and TI E2E™ are trademarks of Texas
Instruments.
IAR Embedded Workbench™ is a trademark of IAR Systems AB.
Arm®, Cortex®, Keil®, and µVision® are registered trademarks of Arm Limited.
All trademarks are the property of their respective owners.
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1 Getting Started
1.1 Introduction
The MSPM0G3507 is Arm® 32-bit Cortex®-M0+ CPU with a memory protection unit and frequency up to
80 MHz. The device features 128KB of embedded flash memory combined with 32KB of on-chip RAM. The
integrated high-performance analog peripherals include two 12-bit 4-Msps SAR ADCs, two zero-drift chopper
op-amps (OPA), and one general-purpose amplifier (GPAMP) to help users design their system.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range
of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose
among many already available from TI and third-party developers.
Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded
Workbench™ IDE, and Keil®µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology
when paired with the MSPM0G3507 LaunchPad™ development kit. Developer can easily measure the power
consumption of their applications. More information about the LaunchPad development kit, the supported
BoosterPack™ plug-in modules, and the available resources can be found at TI's LaunchPad development kit
portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit
the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive online collateral, training with
MSP Academy, and online support through the TI E2E™ support forums.
See the MSPM0 Quick Reference Guide for more resources surrounding MSPM0 devices.
1.2 Key Features
• Onboard XDS110 debug probe
• EnergyTrace technology available for ultra-low-power debugging
• 2 buttons, 1 LED and 1 RGB LED for user interaction
• Temperature sensor circuit
• Light sensor circuit
• External OPA2365 (default buffer mode) for ADC (up to 4 Msps) evaluation
• Onboard 32.768-kHz and 48-MHz crystals
• RC filter for ADC input (unpopulated by default)
1.3 What's Included
1.3.1 Kit Contents
• MSPM0G3507 LaunchPad development kit
• 1 Micro USB cable
• 1 Quick Start Guide
1.3.2 Software Examples
•Out-of-Box Software Example
•SDK Examples
1.4 First Step: Out-of-Box Experience
An easy way to get started with the EVM is by using the preprogrammed out-of-box code. This code
demonstrates some key features of the EVM and is meant to be used with the LP-MSPM0G3507 out-of-box
demo GUI.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
illuminates if power connects. For proper operation, drivers are needed. TI recommends that you get the drivers
by installing an IDE such as TI's Code Composer Studio IDE or IAR Embedded Workbench IDE. Standalone
drivers are also available.
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1.4.2 Running the Out-of-Box Experience
Access the GUI Composer powered GUI for the Out-of-Box Experience (OoBE) through the TI Cloud Gallery.
Alternatively, the GUI is provided with the MSPM0 SDK as well for offline operation. Figure 1-1 shows the
welcome screen for the GUI. The GUI runs through three main examples:
• Blink LED – Change the rate of LED blinking
• Light Sensor – Read light sensor and plot results, and also modulate RGB brightness
• Thermistor – Read thermistor voltage and plot converted temperature over time. The RGB LED changes
colors to signify differences of temperature measured.
• Function Generator – Generate sine, square, and sawtooth waveforms, sample with ADC, and plot on graph.
Figure 1-1. Out-of-Box Experience Welcome Screen
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It’s time to open an integrated development
environment and start editing the code examples. See Section 4 for available IDEs and where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI’s cloud development tools.
The cloud-based Resource Explorer provides access to all of the examples and resources in MSPM0 SDK.
Code Composer Studio Cloud is a simple Cloud-based IDE that enables developing and running applications on
the LaunchPad development kit. SysConfig for MSPM0 is another graphical tool that can be utilized to easily and
quickly setup your MSPM0G3507 device, pins, and peripherals to fit your development needs. The out-of-box
source code and more code examples are provided and available on the download page. Code is licensed under
BSD, and TI encourages reuse and modifications to fit specific needs. Section 1.3.2 describes all functions in
detail and provides a project structure to help familiarize you with the code. With the XDS110 debug probe,
debugging and downloading new code is simple. A connection between the EVM and a PC through the provided
USB cable is all that is needed.
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2 Hardware
Figure 2-1 shows an overview of MSPM0G3507 LaunchPad development kit hardware.
XDS110 onboard debug probe
Enables debugging and
programming as well as
communication to the PC. The
XDS110 can also provide power
to the target MCU.
EnergyTrace Technology
Real-time power consumption and
state updates from the MSPM0G3507
MCU viewable in the EnergyTrace GUI
Reset
MSPM0G3507 reset
USB to PC
Button/Switch S1
Button/Switch S2
40-pin BoosterPack plug-in
module connector (J1-J4)
Light sensor
Jumper Isolation Block J101
Power (GND, 5V, and 3V3)
Back-channel UART to the PC (RXD, TXD)
SWD (SWDIO, SWCLK)
BSL
MSPM0G3507
Pullup voltage selection
UART to BP/XDS selection
LED
Thermistor
SW1 Select
SW2 Select
Analog Power
RGB LED
QEI interface
OPA2365
MSPM0G3507 pinout
extension block
Figure 2-1. MSPM0G3507 LaunchPad Development Kit Hardware
2.1 Jumper Map
Table 2-1 lists the default installation of the jumpers.
Table 2-1. LaunchPad Kit Header Description and Jumper Shunt Installation
Jumper Description Default setting Connected Pin or Signal Low Power Measurement
Recommendation
J101 XDS110-ET isolation block Installed
GND, 5V, 3V3, RXD, TXD,
NRST, SWDIO, SWCLK,
BSL
OFF to disconnect from
XDS-110 circuitry
J102 XDS110-ET OUT NA GND, 3V3, SWDIO,
SWCLK, NRST No external connection
J103 XDS110-ET IN NA GND, 3V3, SWDIO, SWCLK No external connection
J1/J3 BoosterPack pin header NA See schematic for details No external connection
J2/J4 BoosterPack pin header NA See schematic for details No external connection
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Table 2-1. LaunchPad Kit Header Description and Jumper Shunt Installation (continued)
Jumper Description Default setting Connected Pin or Signal Low Power Measurement
Recommendation
J4 Red LED1 Installed PAO to LED OFF to disconnect pin from
LED
J5 RGB LED2 – blue channel Installed PB22 to RGB LED OFF to disconnect pin from
RGB LED
J6 RGB LED2 – red channel Installed PB26 to RGB LED OFF to disconnect pin from
RGB LED
J7 RGB LED2 – green channel Installed PB27 to RGB LED OFF to disconnect pin from
RGB LED
J8 S1 Button and
BSL invoke Installed PA18
OFF to avoid current from
external pulldown depending
on pin configuration
J9 Thermistor signal selection (1) short to (2) PB.24 PB24 to thermistor circuit OFF to disconnect from
thermistor circuit
J10 5V power header NA 5V, GND No external connection
J11 3V3 power header NA 3V3, GND No external connection
J12 QEI interface header NA PA29, PA30, PB14, 3V3,
GND No external connections
J13 Analog power – power to thermistor
and OPA2365 Installed 3V3
OFF to disconnect power
to thermistor, and OPA2365
circuits
J14 SW1 selection to BP header – PA9/
PB23 (1) short to (2) PB.23 PB23 to J1.3 Don't care if not used in BoosterPack connector
J15 SW2 selection to BP header – PA16/
PA18 (1) short to (2) PA16 PA16 to J3.29 Don't care if not used in BoosterPack connector
J16 OPA0_OUT for light sensor circuit Installed PA22 to light sensor OFF to disconnect from
photodiode circuit
J17 OPA0_IN0- for light sensor circuit Installed PA27 to light sensor OFF to disconnect from
photodiode circuit
J18 OPA0_IN0+ for light sensor circuit Installed PA26 to light sensor OFF to disconnect from
photodiode circuit
J19 PA0 Open-drain IO pullup (1) Short to (2) 3.3 V PA0 to 3V3
OFF if pin initialized as
output low or input with
pullup/pulldown
J20 PA1 Open-drain IO pullup (1) Short to (2) 3.3 V PA1 to 3V3
OFF if pin initialized as
output low or input with
pullup/pulldown
J21 UART0_TX selection (1) short to (2) XDS_UART
function PA10 to XDS OFF to disconnect pin
J22 UART0_RX selection (1) short to (2) XDS_UART
function PA11 to XDS OFF to disconnect pin
J23-J28 MSPM0G3507 pin extension header
(unlabeled – bottom of board) NA See schematic for details No external connection
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2.2 Block Diagram
LEDs
red and
green
Debug
MCU
Reset
button
Micro-B
USB
ESD
protection
Target device
MSPM0G3507
40-pin
LaunchPad kit
standard headers
Light sensor
Power, UART, SWD to target
EnergyTrace
technology
Thermistor RGB
LED
User interface:
Buttons and red LED
External
debug, out
External
debug, in
UART
path
QEI
Header
Pin
extension
header
OPA2365
Figure 2-2. Block Diagram
2.3 Hardware Features
2.3.1 MSPM0G3507 MCU
The MSPM0G3507 devices provide 128KB of embedded flash program memory with built-in error correction
code (ECC) and 32KB of SRAM with hardware parity. The devices also incorporate a memory protection unit,
7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit
4-Msps ADCs, a configurable internal shared voltage reference, one 12-bit DAC, three high speed comparators
with built-in reference DACs, two zero-drift op-amps with programmable gain, and one general-purpose amplifier.
The devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, three 16-bit
general purpose timers, one 32-bit high resolution timer, two windowed-watchdog timers, and one RTC with
alarm and calendar mode. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG)
and enhanced communication interfaces (four UART, two I2C, two SPI, and one CAN 2.0/FD).
Device feature include:
• 1.62-V to 3.6-V operation
• Arm 32-bit Cortex-M0+ with memory protection unit, up to 80 MHz
• 128KB of flash with built-in ECC and 32KB of SRAM with hardware parity
• Two 12-bit 4-Msps ADCs
• 12-bit DAC
• Two zero-drift zero-crossover chopper op-amps
• Two 16-bit advanced control timers
• Three 16-bit general-purpose timers
• One 32-bit high-resolution time
• 60 GPIO
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LQFP64
1
2
3
4
5
6
7
8
64 63 62 61 60 59 58 57
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
56 55 54 53 52 51 50 49
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
PB12 PB11 PB10 PB9 PB8 PB7 PB6 PA11 PA10 PA9 PA8 PB5 PB4 PB3 PB2 PA7
PB1
PB0
PA6 / HFXOUT
PA5 / HFXIN
PA4 / LFXOUT
PA3 / LFXIN
PA2 / ROSC
VSS
VDD
PA31
NRST
PA30
PA29
PA28
PA1
PA0
PB13
PB14
PB15
PB16
PA12 / CAN_TX
PA13 / CAN_RX
PA14
PA15 / A1_0
PA16 / A1_1
PA17 / A1_2
PA18 / A1_3
PA19 / SWDIO
PA20 / SWCLK
PB17 / A1_4
PB18 / A1_5
PB19 / A1_6
PA21 / A1_7 / VREF-
PA22 / A0_7 PB20 / A0_6
PB21 PB22 PB23
PB24 / A0_5
PA23 / VREF+
PA24 / A0_3 PA25 / A0_2 PB25 / A0_4
PB26 PB27
PA26 / A0_1 / CAN_TX
PA27 / A0_0 / CAN_RX
VCORE
Figure 2-3. LQFP64 Pinout (Top View)
2.3.2 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
To keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboard debug
probe, which eliminates the need for expensive programmers. The MSPM0G3507 has the XDS110 debug probe
(see Figure 2-4), which is a simple and low-cost debugger that supports all MSPM0 device derivatives.
Figure 2-4. LP-MSPM0G3507 Debugger
The XDS110 ET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. More details can be found in Section 2.3.4.
2.3.3 Debug Probe Connection Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the
XDS110-ET domain into the MSPM0G3507 target domain. This includes XDS110-ET SWD signals, application
UART signals, and 3.3-V and 5-V power.
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LDO
MSPM0G3507
Target MCU
BoosterPack Header BoosterPack Header
USB
IN OUT
USB Connector
XDS110-ETMSPM0G3507 Target
XDS110-ET
Debug Probe
MCU
XDS110
Debug
Out
External
Debug
In
SWD + BSL
Application
UART0
3.3-V
Power
5-V Power
EnergyTrace
To XDS
To BP
Header UART
Path
J101
Isolation
Pin Extension Header
Figure 2-5. Isolation Jumper Block
Reasons to open these connections:
• To remove any and all influence from the XDS110-ET debug probe for high accuracy target power
measurements
• To control 3.3-V and 5-V power flow between the XDS110-ET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART communication
• To expose the programming and UART interface of the XDS110-ET so that it can be used for devices other
than the onboard MCU.
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain
RXD<< Backchannel UART: The target M0G3507 receives data through this signal. The arrows indicate the direction of the
signal
TXD>> Backchannel UART: The target M0G3507 sends data through this signal. The arrows indicate the direction of the
signal
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Jumper Description
NRST RST signal
SWDIO Serial wire debug: SWDIO data signal.
SWCLK Serial wire debug: SWDCLK clock signal
BSL Bootstrap loader signal
2.3.4 Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the main functionality of the
target application. This is very useful during development and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that
communicate with the LaunchPad development kit.
Figure 2-5 shows the pathway of the backchannel UART. The backchannel UART is the UART on UART0
(PA10, PA11) depending on the jumper settings on headers J21 and J22.
On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad
development kit enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target
application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can
assist.
Figure 2-6. Application Backchannel UART in Device Manager
The backchannel UART is the "XDS110 Class Application/User UART" port. In this case, Figure 2-6 shows
COM14, but this port can vary from one host PC to the next. After you identify the correct COM port, configure it
in your host application according to its documentation. You can then open the port and begin communication to
it from the host.
On the target MSPM0G3507 side, the backchannel is connected to the UART0 module. The XDS110-ET has a
configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same
as what is configured on the UART0.
2.3.5 Using an External Debug Probe Instead of the Onboard XDS110-ET
Many users have a preferred external debug probe and want to bypass the XDS110-ET debug probe to program
the MSPM0 target MCU. The bypass is enabled by jumpers on isolation block J101 and the connector J103.
Using an external debug probe is simple, and full JTAG access is provided through J103.
1. Remove jumpers on the JTAG signals on the J101 isolation block, including NRST, SWDIO and SWCLK.
2. Plug any Arm debug probe into J103.
a. J103 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.
3. Plug USB power into the LaunchPad development kit, or power the kit externally.
a. Make sure that the jumpers across 3V3 and GND are connected if using USB power.
b. External debug probes do not provide power, the VCC pin is a power sense pin.
c. For more details on powering the LaunchPad development kit, see Section 2.4
2.3.6 Using the XDS110-ET Debug Probe With a Different Target
The XDS110-ET debug probe on the LaunchPad development kit can interface to most Arm Cortex-M devices,
not just the onboard target MSPM0G3507 device. This functionality is enabled by the J102 10-pin Cortex-M
JTAG connector and a 10-pin cable. Header J102 follows the Cortex-M Arm standard, however, pin 1 is not a
voltage sense pin. The XDS110- ET outputs only 3.3-V JTAG signals. If another voltage level is needed, the
user must provide level shifters to translate the JTAG signal voltages. Additionally, 3.3 V of output power can
be sourced from the XDS110-ET when jumper JP102 is connected. This allows the XDS110-ET to power the
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external target at 3.3 V through pin 1. EnergyTrace functionality is not available when programming an external
target.
1. Remove jumpers on the JTAG signals on the J101 isolation block, including RST, TMS, TCK, TDO, and TDI.
2. Plug the 10-pin cable into J102, and connect to an external target. J102 follows the Arm Cortex Debug
Connector standard outlined in Cortex-M Debug Connectors.
3. Plug USB power into the LaunchPad development kit, or power the kit externally. JTAG levels are 3.3 V
ONLY.
2.3.7 Special Features
2.3.7.1 Up to 4-Msps High-Speed Analog-to-Digital Converter
MSPM0 G-series device includes an up to 4-Msps high-speed ADC module. To help you evaluate the best
performance of the ADC, an external OPA is also included on the LaunchPad kit. This external OPA can be used
as a buffer or to amplify the input signal. With the built-in ADC module, it can achieve a maximum rate of 4 Msps.
The LaunchPad kit uses the OPA2365 in the ADC input channel in buffer mode by default (see Figure 2-7). The
OPA2365 has 2 OPAs inside, and footprints for external passives are provided to allow users to customize the
OPA configuration.
Figure 2-7. External OPA Circuit
For the signal input, a coaxial connector can be populated at P1 to reduce environmental noise. You can also
access the OPA input through the pin extension header at the bottom of the board.
The OPA output connects to the ADC0.4 channel, and the example code helps to evaluate ADC performance
quickly.
2.3.7.2 Thermistor
The LaunchPad kit includes a 10k linear thermistor (PTC), the TMP6131. Figure 2-8 shows the circuit. The
PTC is in a low-side configuration with a 10-kΩ 10-ppm pullup resistor. The default position of the jumper in the
header (1-2 position) connects this circuit directly to the ADC. In this mode, the output voltage is approximately
1.6 V at room temperature.
The jumper can also be set to the 2-3 position to allow an OPA connection to the thermistor. The OPA output can
be connected internally, through software, to the negative OPA terminal. This allows the OPA to be used as a
buffer for the thermistor with an internal connection to an ADC channel for sampling. If an external connection or
additional biasing or filtering is wanted, then the passives shown in Figure 2-8 need to be populated.
Note
The capacitor and resistor network associated with the OPA is not populated by default. This allows
the user to populate with passive values to fit the specific application needs.
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Note
When using the OPA and the passive network, be sure to check for conflicts with other pins on the
LaunchPad kit because pins are multiplexed with several functions.
Figure 2-8. Thermistor Circuit
2.3.7.3 Light Sensor
A light sensor circuit is provided on the board using the photodiode in the configuration shown in Figure 2-9. The
jumper connections between this circuit and the MSPM0 are populated by default so the photodiode is in circuit.
The jumpers can be removed to place the photodiode out of circuit so the MSPM0 connections can be used for
other evaluation purposes.
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Figure 2-9. Light Sensor Circuit
This circuit is intended to be used with the internal OPA of the MSPM0 in an transimpedance configuration to
drive the circuit. The OPA output is internally set to an ADC channel for sampling.
2.4 Power
The board accommodates various powering methods, including through the onboard XDS110-ET as well as
external or BoosterPack plug-in module power.
2.4.1 XDS110-ET USB Power
The most common power-supply scenario is from USB through the XDS110-ET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for XDS110-ET operation and 3.3 V to the target
side of the LaunchPad kit. Power from the XDS110-ET is controlled by jumper J101. For 3.3 V, make sure that a
jumper is connected across the J101 3V3 terminal.
2.5 External Power Supply and BoosterPack Plug-in Module
Header J11 is present on the board to supply external power directly. It is important to comply with the device
voltage operation specifications when supplying external power. The MSPM0G3507 has an operating range of
1.62 V to 3.6 V. More information can be found in the MSPM0G3507 data sheet.
2.6 Measure Current Draw of the MSPM0 MCU
To measure the current draw of the MSP430FR2355 MCU using a multimeter, use the 3V3 jumper on the
J101 jumper isolation block. The current measured includes the target device and any current drawn through the
BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSPM0G3507 may have
on the current draw. Consider disconnecting these at the isolation jumper block, or at least consider their
current sinking and sourcing capability in the final measurement.
a. Disconnect unnecessary jumpers as outlined in the jumper map of Table 2-1. In particular, Analog Power
jumper J13 must be removed if not using the thermistor or OPA2365 circuits.
3. Make sure there are no floating inputs or outputs on the MSPM0G3507. This causes unnecessary extra
current draw. Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or
low level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a stable
measurement. It is easier to measure quiescent states.
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EnergyTrace technology can also be used to compare various current profiles and better optimize your energy
performance!
2.7 Clocking
The MSPM0G3507 provides external clocks in addition to the internal clocks in the device.
• Y1: 32.768-kHz 12.5-pF crystal
• Y2: 48-MHz 12.5-pF crystal
The internal SYSOSC is 32 MHz by default at an accuracy of 2.5%. For higher accuracy, connect a 0.1% resistor
at ROSC pin. The MCLK is sourced by 32-MHz SYSOSC at default. CPUCLK is sourced directly from MCLK in
RUN mode and disabled in other modes. The low-power clock (ULPCLK) can be sourced by MCLK and active in
RUN and SLEEP mode by configuration. For more clock tree details, see Section 2.3 Clock Module (CKM) in the
MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.
2.8 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard. A standard
was created to aid compatibility between LaunchPad development kits and BoosterPack plug-in modules across
the TI ecosystem.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPM0G3507
LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in modules that are compliant with
the standard. If the reseller or owner of the BoosterPack plug-in module does not explicitly indicate compatibility
with the MSPM0G3507 LaunchPad development kit, compare the schematic of the candidate BoosterPack
plug-in module with the LaunchPad development kit to ensure compatibility. Keep in mind that sometimes
conflicts can be resolved by changing the MSPM0G3507 device pin function configuration in software.
1
3
4
5
7
8
9
10
20
19
18
17
16
15
14
13
12
11
3V3
PA25
PA26
ADC0.2
UART_TX
SPI_CLK
I2C_SCL
I2C_SDA
GND
NRST
21
22
23
24
25
26
27
28
29
30
40
39
38
37
36
35
34
33
32
31
5V
GND
2
6
UART_RX PB23/PA9+
PA8
PB24
ADC0.5
PB9
PB2
PB3
PB19
ADC1.6
PA22
ADC0.7
PB18
ADC1.5
PA18
ADC1.3
PA24
ADC0.3
PA17
ADC1.2
PA31
PB17 SPI_CS
PB8 SPI_PICO
PB7 SPI_POCI
PB6
PB0
PB4
PB1
PA28
PB20
PB13
PA10
PA11
PA12
PA13
+Connection to LaunchPad kit connector determined by header J14 or J15
PA27
PA15
PB12
PB16
PA16/PA18+
PB15
ADC1.1/ADC1.3+
DAC_OUT
PWM
PWM
PWM
PWM
PWM
PWM
PWM
CANTX
CANRX
LINRX
LINTX
SPI_CS
SPI_CS
Figure 2-10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout
2.9 Design Files
Schematics can be found in Section 5. All design files including schematics, layout, bill of materials (BOM),
Gerber files, and documentation are available on the LP-MSPM0L1306 Design File download page.
3 Software Examples
See the MSPM0 SDK documentationfor more details about available software.
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4 Resources
4.1 Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they’re
opened with a development environment like Code Composer Studio IDE (CCS) or IAR Embedded Workbench
IDE.
4.1.1 TI Cloud Development Tools
TI's Cloud-based software development tools provide instant access to MSPM0_SDK content and a web-based
IDE.
4.1.2 TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation found
in MSPWare without having to download files to your local drive. Visit TI Resource Explorer Cloud now at
dev.ti.com.
4.1.3 Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that lets you quickly create, edit, build ,and
debug applications for the LaunchPad development kit. No need to download and install large software
packages, simply connect your LaunchPad development kit and begin. Choose from a large variety of examples
in MSPWare software and Energia or develop your own application. CCS Cloud supports debug features such
as execution control, breakpoints, and viewing variables.
For more information, see the full comparison between CCS Cloud and CCS Desktop.
Explore Code Composer Studio Cloud now at dev.ti.com.
4.1.4 Code Composer Studio IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used
to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor,
project build environment, debugger, profiler, and many other features.
To learn more about CCS and view user’s guides, visit the CCS tool page.
CCS v11.1 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo project directory that contains main.c.
4.2 MSPM0 SDK and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design resources.
TI Resource Explorer helps you quickly find what you need inside packages. TI Resource Explorer is well
organized to find everything that you need quickly, and you can import software projects into your workspace in
one click!
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS Cloud.
See Section 4.1.2 for more information.
4.3 MSPM0G3507 MCU
4.3.1 Device Documentation
At some point, you will probably want more information about the MSPM0G3507 device. For every MSP device,
the documentation is organized as shown in Table 4-1.
Table 4-1. Device Documentation
Document For MSPM0L1306 Description
Device family
TRM
MSPM0 G-Series 80-MHz Microcontrollers Technical
Reference Manual
Architectural information about the device, including all
modules and peripherals such as clocks, timers, ADC, and
so on
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Table 4-1. Device Documentation (continued)
Document For MSPM0L1306 Description
Device-specific
data sheet
MSPM0G350x Mixed-Signal Microcontrollers With CAN-
FD Interface
MSPM0G310x Mixed-Signal Microcontrollers With CAN-
FD Interface
MSPM0G150x Mixed-Signal Microcontrollers
MSPM0G110x Mixed-Signal Microcontrollers
Device-specific information and all parametric information
for this device
4.3.2 MSPM0G3507 Code Examples
MSPM0_SDK has a set of simple C examplesthat demonstrate how to use the entire set of peripherals on the
MSPM0G3507 MCU. Every MSP derivative has a set of these code examples. When starting a new project or
adding a new peripheral, these examples serve as a great starting point.
4.4 Community Resources
4.4.1 TI E2E™ Forums
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community!
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5 Schematics
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