
2SPMU365C–March 2014–Revised October 2016
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Copyright © 2014–2016, Texas Instruments Incorporated
Contents
Contents
1 Board Overview ................................................................................................................... 4
1.1 Kit Contents................................................................................................................... 5
1.2 Using the Connected LaunchPad ......................................................................................... 5
1.3 Features....................................................................................................................... 5
1.4 BoosterPacks................................................................................................................. 6
1.5 Energīa........................................................................................................................ 6
1.6 Specifications................................................................................................................. 6
2 Hardware Description........................................................................................................... 7
2.1 Functional Description ...................................................................................................... 7
2.1.1 Microcontroller....................................................................................................... 7
2.1.2 Ethernet Connectivity............................................................................................... 8
2.1.3 USB Connectivity ................................................................................................... 8
2.1.4 Motion Control....................................................................................................... 8
2.1.5 User Switches and LED's.......................................................................................... 8
2.1.6 BoosterPacks and Headers ....................................................................................... 9
2.2 Power Management........................................................................................................ 20
2.2.1 Power Supplies.................................................................................................... 20
2.2.2 Low Power Modes ................................................................................................ 21
2.2.3 Clocking ............................................................................................................ 21
2.2.4 Reset................................................................................................................ 21
2.3 Debug Interface............................................................................................................. 21
2.3.1 In-Circuit Debug Interface (ICDI)................................................................................ 21
2.3.2 External Debugger ................................................................................................ 22
2.3.3 Virtual COM Port .................................................................................................. 22
3 Software Development........................................................................................................ 23
3.1 Software Description....................................................................................................... 23
3.2 Source Code................................................................................................................ 23
3.3 Tool Options ................................................................................................................ 23
3.4 Programming the Connected LaunchPad............................................................................... 24
4 References, PCB Layout, and Bill of Materials ....................................................................... 25
4.1 References.................................................................................................................. 25
4.2 Component Locations ..................................................................................................... 26
4.3 Bill of Materials ............................................................................................................. 27
5 Schematic ......................................................................................................................... 30
Revision History.......................................................................................................................... 31