Texas Instruments TMS320C5545 BoosterPack Installation manual

TMS320C5545 BoosterPack Hardware
User's Guide
Literature Number: SPRUI90
September 2016

2SPRUI90–September 2016
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Table of Contents
Contents
1 Overview............................................................................................................................. 5
1.1 Key Features.............................................................................................................. 5
1.2 Functional Block Diagram .............................................................................................. 7
1.3 Basic Operation .......................................................................................................... 7
1.4 Power Supply ........................................................................................................... 11
2 Introduction to C5545 BoosterPack Board............................................................................. 11
2.1 XDS100 On Board Emulator Interface............................................................................... 12
2.2 Clock Distribution ...................................................................................................... 13
2.3 Reset Circuit and Distribution......................................................................................... 14
2.4 SPI FLASH Interface................................................................................................... 15
2.5 LED and Switch Interface.............................................................................................. 16
2.6 CC2650 SPI and GPIO Interface..................................................................................... 17
2.7 Micro SD CARD Interface ............................................................................................. 18
2.8 OLED Display Interface................................................................................................ 18
2.9 Audio CODEC Interface ............................................................................................... 19
2.10 USB Interface ........................................................................................................... 20
2.11 UART Interface.......................................................................................................... 20
2.12 Connection Between C5545 and LaunchPad....................................................................... 22
2.13 I2C Interface............................................................................................................. 27
2.14 I2C Address Mapping .................................................................................................. 28
2.15 GPIO Mapping .......................................................................................................... 28
3 C5545 BoosterPack Board Physical Specifications................................................................. 28
3.1 Board Layout............................................................................................................ 29
3.2 Connector Index ........................................................................................................ 31
3.3 Push Buttons............................................................................................................ 36
3.4 Test Points............................................................................................................... 36
3.5 System LEDs............................................................................................................ 36
4 System Power Requirements............................................................................................... 38
4.1 Power Distribution Diagram ........................................................................................... 38
4.2 Power Supply Calculation ............................................................................................. 39
4.3 Power-Up Sequence ................................................................................................... 40

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List of Figures
List of Figures
1 C5545 BoosterPack Functional Block Diagram.......................................................................... 7
2 C5545 BoosterPack Top View ............................................................................................. 9
3 C5545 BoosterPack Bottom View........................................................................................ 10
4 JTAG Interface.............................................................................................................. 12
5 Clock Distribution and DSP Clock Selection............................................................................ 13
6 Reset Circuitry.............................................................................................................. 14
7 SPI FLASH Interface....................................................................................................... 15
8 Switch and LED Connection.............................................................................................. 16
9 CC2650 SPI and GPIO Interface......................................................................................... 17
10 Micro SD Card Interface .................................................................................................. 18
11 OLED Display Interface ................................................................................................... 18
12 Audio CODEC Interface................................................................................................... 19
13 USB Interface............................................................................................................... 20
14 UART Interface ............................................................................................................. 20
15 UART Interface - Schematics............................................................................................. 20
16 FT2232 and C5545 (default).............................................................................................. 20
17 LaunchPad and CC2650 .................................................................................................. 20
18 FT2232 and CC2650 ...................................................................................................... 21
19 LaunchPad and C5545.................................................................................................... 21
20 Connection Between C5545 and LaunchPad .......................................................................... 22
21 Level Shifter Direction for I2S and UART Interfaces .................................................................. 23
22 C5545 BoosterPack Powering Options.................................................................................. 24
23 C5545 BoosterPack Connected With MSP432P401R LaunchPad.................................................. 25
24 C5545 BoosterPack Pin Map............................................................................................. 26
25 I2C Interface ................................................................................................................ 27
26 C5545 BoosterPack Board Assembly Layout - Top View ............................................................ 29
27 C5545 BoosterPack Board Assembly Layout - Bottom View ........................................................ 30
28 Connectors on C5545 BoosterPack - Top ............................................................................. 31
29 Connectors on C5545 BoosterPack - Bottom .......................................................................... 32
30 Position of LEDs, Test-Points and Push Buttons on the Board...................................................... 37
31 Power Distribution Diagram............................................................................................... 38
32 Power Supply Calculation ................................................................................................ 39
33 Power-Up Sequencing..................................................................................................... 40

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List of Tables
List of Tables
1 Voltage Regulators......................................................................................................... 11
2 I2C Address Mapping...................................................................................................... 28
3 GPIO Mapping.............................................................................................................. 28
4 C5545 BoosterPack Board Connectors ................................................................................. 31
5 JTAG-XDS100 Micro USB Connector (FT2232H)..................................................................... 32
6 JTAG-Header (CC2650)................................................................................................... 33
7 Audio Line-In 3.5 mm Stereo Jack....................................................................................... 33
8 Audio Headphone-Out 3.5 mm Jack..................................................................................... 33
9 Micro SD Connector ....................................................................................................... 34
10 OLED Display Connector.................................................................................................. 34
11 LaunchPad Headers ....................................................................................................... 34
12 C5545 BoosterPack Board LEDs ........................................................................................ 36
13 C5545 BoosterPack Board Test Points ................................................................................. 36
14 C5545 BoosterPack Board LEDs ........................................................................................ 36

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TMS320C5545 BoosterPack Hardware
BoosterPack, LaunchPad, MSP430, SimpleLink, Code Composer Studio are trademarks of Texas Instruments.
ARM, Cortex are registered trademarks of ARM Limited.
Bluetooth is a trademark of Bluetooth SIG, Inc.
ZigBee is a registered trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.
User's Guide
SPRUI90–September 2016
TMS320C5545 BoosterPack Hardware
This user's guide supports the C5545 BoosterPack™, which was designed and developed by Mistral
Solutions Pvt. Ltd. for Texas Instruments, Inc.
1 Overview
This section provides an overview of the C5545 BoosterPack along with the key features, functional block
diagram and basic operation.
1.1 Key Features
The C5545 BoosterPack is a high performance, low-power platform that enables users to evaluate and
develop for the TMS320C5545A processor and its peripherals. The BoosterPack interfaces to
LaunchPad™ boards such as MSP432, CC3200, MSP430™ LaunchPads, as well as compatible
BoosterPacks.
The key features of C5545 BoosterPack are:
• The C5545 fixed-point DSP based on TI’s C55x architecture
• The CC2650 2.4 GHz multi-standard wireless MCU
– Used as wireless communication companion with C5545 DSP
• 2.4 GHz single ended PCB antenna
• 16M-bit SPI FLASH
• Micro-SD card slot with 8GB card
• OLED display (passive matrix, 96 x 16 pixels, monochrome display)
• Audio CODEC (TLV320AIC3206IRSBT)
• Micro USB connector
• Three user switches and three user LEDs
• One reset switch and two power LEDs
• FTDI chip FT2232HL for JTAG and UART over micro USB connector
• 10-pin JTAG for CC2650 (1.8 V only)
• Audio line-in (MIC) and headphone out
• On-board microphone (CMC-2242PBL-A)
• LaunchPad connectors
• INA current monitors (INA219AIDCNR)
• Powered by USB or LaunchPad
• On-board, XDS100 JTAG emulator for C5545

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TMS320C5545A DSP is a new device from TI’s TMS320C55x fixed-point digital signal processor with:
• C55x fixed-point DSP architecture (C5545 reached 120 MHz and C55x reaches up to 200 MHz)
• DSP internal memories
– 64KB dual-access RAM
– 256KB single-access RAM
– 128KB read-only memory
• FFT hardware accelerator
• Four DMA with four channels each (16 channels total)
• Three 32-bit general-purpose timers
• Two embedded multimedia card (eMMC) or secure digital (SD) interfaces
• Four inter-IC sound (I2S) for data transport, universal asynchronous receiver/transmitter (UART), serial
peripheral interface (SPI) with three chip select, master and slave inter-integrated circuit (I2C)
• LCD bridge with asynchronous interface
• 10-bit 3-input successive approximation (SAR) analog-to-digital converter (ADC)
• Device USB port with integrated 2.0 high-speed PHY supports both high and full speed device
• Software compatible with C55x devices
• Three integrated LDOs
• On-chip ROM bootloader
• 118-terminal, 7x7 mm, 0.5mm pitch Pb-free plastic ball grid array (BGA) (ZQW suffix)
NOTE: The TMS320C5545A device used on this BoosterPack is the 100 MHz version.
The CC2650 is a 2.4 GHz multi-standard wireless MCU from TI’s SimpleLink™ ultra-low power portfolio
that includes:
• ARM®Cortex®-M3 MCU (up to 48 MHz)
• 128KB of in-system programmable flash
• 20KB of ultra-low leakage SRAM and 8KB of SRAM for cache
• Targets Bluetooth™ low-energy (Bluetooth Smart), ZigBee®, and 6LoWPAN
• Very low active RF and MCU current provides excellent battery lifetime
• Excellent receiver sensitivity and reference antenna designs available
• Ultra-low power sensor controller engine (proprietary low-power core for communicating with external
sensors)
• Peripherals include UART, 2x serial peripheral interface (SPI), I2C, I2S, and true random number
generator
• 12-bit, 8-channel ADC (200 ksps) and ultra-low power comparator comes in 7x7 mm (31 GPIO), 5x5
mm (15 GPIO, used here), and 4x4 mm (10 GPIO) packages

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1.2 Functional Block Diagram
The functional block diagram of the C5545 BoosterPack is shown in Figure 1.
Figure 1. C5545 BoosterPack Functional Block Diagram
1.3 Basic Operation
The C5545 BoosterPack is a full-featured development platform for the TMS320C5545 fixed-point DSP. It
supports a comprehensive suite of software including the Code Composer Studio™ v6 Integrated
Development Environment, C55x Chip Support Library, and an included out of box audio demo application
with source code to accelerate your time to market.
The out of box demo package includes an audio playback demo running on the C5545 BoosterPack and a
companion equalizer app for Android device. The audio demo supports either playback of wave (.WAV)
audio files included on the SD card or streaming of audio from LINE IN to HEADPHONE port of the C5545
BoosterPack. Audio playback can be controlled using on-board push buttons or voice commands with
menu options displayed on the OLED screen. Using the android app provides control for playback
equalizer parameters through a Bluetooth Low Energy interface provided by the CC2650. For more details
on the out of box demo, see the TMS320C5545 DSP BoosterPack Software User’s Guide (SPRUI92) .

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Follow the instructions below to run the out of box demo:
1. Insert the SD card with the out-of-box demo image and wave audio files into the MicroSD slot (J3) of
the C5545 BoosterPack.
2. Connect headphones or speakers to the 'HEADPHONE' port of C5545 BoosterPack.
3. Power ON the C5545 BoosterPack with the SW6 sliding switch (the board receives power through
either USB port or an attached LaunchPad).
4. Choose audio source as SD using SW3 when C5545 BoosterPack is powered ON.
5. Launch the equalizer application on the Android device.
6. Allow the application to enable Bluetooth, if not already enabled.
7. Press the 'scan' button to start scanning for the C5545 BoosterPack.
8. Press the 'connect' button once the C5545 BoosterPack is detected by the application.
9. Start playback by pressing SW2 or by speaking 'play' near the C5545 BoosterPack on-board MIC.
10. Slide the equalizer bars on the application to change the equalizer values of playback.
11. Observe the change in audio at headphone output while changing the equalizer values from the
application.
12. Pause the playback by pressing SW2 or by speaking 'pause' near the C5545 BoosterPack on-board
MIC.
13. Resume playback by pressing SW2 or by speaking 'play' near the C5545 BoosterPack on-board MIC.
14. Stop playback by pressing SW3 or by speaking 'stop' near the C5545 BoosterPack on-board MIC.

10 Pin JTAG
HEADER
(CC2650)
CLOCK
SELECTION
JUMPER
RESET Switch
(SW1)
OLED DISPLAY
MIC
ON/OFF SWITCH
(SW6)
POWER LED
(LD5)
2.4GHz
Bluetooth Antenna
LEDs (LD1,2,3)
SWITCHES
(SW2, 3, 4))
UART SELECTION
JUMPERS
(JP3)
(JP2)
LINE ±IN JACK (J6)
HEAD PHONE JACK
(J5)
XDS100 POWER LED
(LD4)
CLIENT USB
CONN (J1) DEBUG USB
CONN (J9)
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TMS320C5545 BoosterPack Hardware
Figure 2. C5545 BoosterPack Top View

ZIF CONN for
OLED DISPLAY
(J11)
BOARD TO BOARD
CONN for
/DXQFK3DGŒ(J8)
16Mb, SPI Flash
(U8)
(MX25R1635FM1ILO)
BOARD TO BOARD
CONN for
/DXQFK3DGŒ(J7)
MICRO SD CARD
CONN (J3)
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TMS320C5545 BoosterPack Hardware
Figure 3. C5545 BoosterPack Bottom View

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TMS320C5545 BoosterPack Hardware
1.4 Power Supply
The C5545 BoosterPack can be powered from a single +5 V Micro USB AB - Standard USB cable
connected to the Host PC. This +5 V input is in turn converted into required supply voltages using
regulators.
The regulators used in the C5545 BoosterPack are shown in Table 1.
Table 1. Voltage Regulators
Regulator Purpose
TPS62161DSGT (U21) 1V8 Generation
TPS62162DSGT (U20) 3V3 Generation
TPS76601D (U22) External 1V3 Generation for C5545
The DC-DC Buck Regulator IC TPS62161DSGT and TPS62162DSGT (U21 and U20, respectively) takes
care of the generation of various powers to the C5545 Processor listed below:
• Core Voltage
– CVDD
• Internal LDO Voltages
– DSP_LDO
– ANA_LDO
– USB_LDO
• I/O Voltages
– DVDDIO
• RTC Voltages
– CVDDRTC
TPS62161DSGT (U21) is enabled by default to generate 1.8 V when C5545 BoosterPack is powered ON.
After that, TPS62162DSGT (U20) gets enabled to generate 3.3 V.
2 Introduction to C5545 BoosterPack Board
This section provides an introduction and details of interfaces in C5545 BoosterPack board. It contains:
• XDS100 On-Board Emulator
• CLOCK Distribution
• Reset Circuit and Distribution
• SPI FLASH Interface
• LED and Switch Interface
• CC2650 BLE Interface
• OLED Display Interface
• Audio CODEC Interface
• USB Interface
• UART Interface
• Connection Between C5545 and LaunchPad
• I2C Interface

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2.1 XDS100 On Board Emulator Interface
The C5545 BoosterPack contains an on-board XDS100 USB emulator based on the FTDI FT2232 dual
port chip. One of the FT2232 ports is configured for UART and the other for JTAG.
All the JTAG lines are connected to C5545 through level translator because FT2232 operates at 3.3 V I/O.
The EEPROM (1Kb) is interfaced to the FT2232 to store configuration data. The XDS100 does not
interface with or support the CC2650.
Figure 4. JTAG Interface

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2.2 Clock Distribution
The board clock distribution circuit is as shown in Figure 5. Two 12 MHz oscillators are used on board.
One 12 MHz oscillator is connected to the C5545 DSP and the AIC3206 Audio CODEC. The output of
another 12 MHz oscillator is connected to the XDS100.
A 32.768 kHz is connected to the C5545 DSP for the RTC section. The C5545 DSP clock source is
selected by the clock select jumper (J2) to choose between the internal RTC clock (32.768 kHz) or the
external clock (12 MHz). By default, the jumper is mounted and the C5545 DSP to operates with the
internal RTC clock. For more information, see the DSP clock selection shown in Figure 5.
Two crystals (32.768 kHz and 24 MHz) are connected to the CC2650.
One 12 MHz crystal is connected to the USB peripheral of the C5545 DSP.
Figure 5. Clock Distribution and DSP Clock Selection

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2.3 Reset Circuit and Distribution
All devices on the C5545 BoosterPack can be reset by the following:
• BoosterPack on-board RESET button (SW1)
• Power good signal from the DC-DC regulator
• Software initiated reset by LaunchPad MCU on pin 5
• Hardware initiated reset by LaunchPad’s RESET button or debugger on pin 16
C5545 DSP can be reset independently by the XDS100 USB debugger.
CC2650 wireless MCU can be reset independently by the following:
• Software initiated reset by C5545 DSP
• Hardware initiated reset by external debugger on 10-pin JTAG header
Figure 6. Reset Circuitry
NOTE: The SW1 (RESET) will only reset the C5545 BoosterPack and not the LaunchPad. The 1.8
V IO voltage on the C5545 is incompatible with the 3.3 V IO voltage on the MSP432
LaunchPad. All signals from MSP432 LaunchPad are connected to C5545 through level
translators because the MSP432 LaunchPad operates at 3.3 V IO.

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2.4 SPI FLASH Interface
The C5545 BoosterPack includes a 2MB Serial Flash (MX25R1635FM1IL0 from Macronix) which is
interfaced to the C5545 DSP as shown in Figure 7. The SPI port of the DSP is shared with the SPI Flash
and the CC2650, which is selected through chip select 0 and 2, respectively.
The Hold signal (to pause the serial communication without deselecting the device) is disabled with a pull-
up resistor. Pull up/pull down options are provided for the write protect signal, which is disabled in the
default configuration.
Figure 7. SPI FLASH Interface

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2.5 LED and Switch Interface
Three push-buttons and three green LEDs are provided for user input and status.
Figure 8. Switch and LED Connection
For more information on how to configure the GPIOs for Switch and LED functionality, see the GPIO
Mapping table (Table 3 in Section 2.15).

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2.6 CC2650 SPI and GPIO Interface
The CC2650 device is a wireless MCU targeting Bluetooth, ZigBee, 6LoWPAN and ZigBee RF4CE. The
device is a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. The
CC2650 device contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz.
Communication between the CC2650 and the C5545 devices is through a SPI interface using CS2. In
addition, two GPIO signals are connected between the C5545 DSP and the CC2650 MCU for power
management. For CC2650 reset details, see Section 2.3.
A 10-pin JTAG header is provided for debugging purposes. The IO voltage expected on this header is 1.8
V.
NOTE: Do not connect the MSP432 LaunchPad JTAG to this header as MSP432 LaunchPad
expects 3.3 V IO voltages.
Figure 9. CC2650 SPI and GPIO Interface
For more information on how to configure the GPIOs for power management functionality, see the GPIO
Mapping table (Table 3 in Section 2.15).

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2.7 Micro SD CARD Interface
A micro SD card connector is connected to the SD0 interface of the C5545 DSP as shown in Figure 10.
Level translators are used between the micro SD card connector and C5545 because the IO voltage of the
micro SD card is 3.3 V while the C5545 DSP IO voltage is 1.8 V. The TXS0108EPWR level translator
contains ESD protection diodes and integrated pull ups for the data and command signals.
The card detect pin from the micro SD card connector is connected to the C5545 DSP GPIO29 to detect
the presence of a micro SD card.
Figure 10. Micro SD Card Interface
To configure the GPIO for micro SD card detect, see Section 3.2.5 for the micro SD card connection
details and a GPIO mapping table.
2.8 OLED Display Interface
The OLED “OSD9616P0992-10” from OSD Displays is used on the C5545 Booster Pack as a display
device. The OLED display is controlled by C5545 through the I2C interface. It supports an internal
regulator to generate the backlight supply. For OLED reset details, see Section 2.3.
Figure 11. OLED Display Interface

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The OLED display with FPC cable is connected to the 10051922-1410ELF (J11), 14 pin FPC connector.
2.9 Audio CODEC Interface
The audio CODEC TLV320AIC3206 is a flexible, low power, low-voltage stereo audio CODEC with
programmable input and outputs, PowerTune capabilities, fixed predefined and parameterizable signal
processing blocks, integrated PLL, and flexible digital interfaces.
This audio CODEC is interfaced to the I2S2 port and I2C bus of the C5545. Audio line in and line out
connections are provided through 3.5 mm audio jacks. An on-board microphone CMC-2242PBLA from
CUI is provided for audio recording.
Figure 12. Audio CODEC Interface
NOTE: When the AIC3206 CODEC is not powered (when the C5545 BoosterPack is not powered),
a potential for crosstalk between Line In and Stereo Out exists, resulting in distorted audio
from Line In to Stereo Out when a high amplitude signal present on Line in.

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2.10 USB Interface
The C5545 DSP supports a device-mode USB controller that provides a low-cost connectivity solution for
consumer portable devices by providing a mechanism for data transfer to a USB host up to 480 Mbps.
The USB controller complies with the USB 2.0 standard high-speed and full-speed specifications.
The C5545 DSP USB signals are terminated at micro USB type-B connector (J1) as shown in Figure 13.
ESD diodes are provided for the USB signals. The USB ID pin on the connector is left floating as this is
device-only port.
Figure 13. USB Interface
2.11 UART Interface
The UART interfaces available on the C5545 DSP and CC2650 MCU can be connected either to the
LaunchPad or to the XDS100 (for UART over USB virtual com port) using the appropriate jumper
selections. For more information, see the UART Jumper selection in Figure 14.
Level translators (U12 and U18, SN74AVC4T/8T) are used between the C5545 and LaunchPad and
XDS100 signals because the IO voltages of the LaunchPad and XDS100 are 3.3 V while the C5545 DSP
IO voltage is 1.8 V.
Figure 14. UART Interface Figure 15. UART Interface - Schematics