Texas Instruments WCSP-Packaged bq24272 User manual

User's Guide
SLUU916–April 2012
WCSP-Packaged bq24272/273 Evaluation Modules
The bq24272/273 evaluation module is a complete charger module for evaluating compact, flexible, high-
efficiency, switch-mode charge management solution for single-cell, Li-ion and Li-polymer batteries used
in a wide range of portable applications.
Contents
1 Introduction .................................................................................................................. 2
1.1 bq2427x IC Features .............................................................................................. 2
1.2 bq24272/273 EVM Features ...................................................................................... 2
1.3 Schematic ........................................................................................................... 3
1.4 I/O Description ...................................................................................................... 5
1.5 Test Points .......................................................................................................... 5
1.6 Control and Key Parameters Setting ............................................................................ 6
1.7 Recommended Operating Conditions ........................................................................... 6
2 Test Summary ............................................................................................................... 7
2.1 Definitions ........................................................................................................... 7
2.2 Recommended Test Equipment ................................................................................. 8
2.3 Recommended Test Equipment Setup .......................................................................... 9
2.4 Recommended Test Procedure ................................................................................ 12
3 Printed-Circuit Board Layout Guideline ................................................................................. 13
4 Bill of Materials and Board Layout ...................................................................................... 14
4.1 Bill of Materials .................................................................................................... 14
4.2 Board Layout ...................................................................................................... 16
List of Figures
1 bq24272/273EVM (HPA759) Schematic (Sheet 1 of 2) ............................................................... 3
2 bq24272/273EVM (HPA759) Schematic (Sheet 2 of 2) ............................................................... 4
3 BAT_Load (PR1010) Schematic.......................................................................................... 8
4 Connections of HPA172 Kit................................................................................................ 9
5 Original Test Setup for bq24272/273EVM (HPA759)................................................................. 10
6 Main Window of bq2427xSW Evaluation Software ................................................................... 11
7 Top Assembly Layer ...................................................................................................... 16
8 Top Layer .................................................................................................................. 16
9 First Internal Layer ........................................................................................................ 17
10 Second Internal Layer .................................................................................................... 17
11 Bottom Layer............................................................................................................... 18
List of Tables
1 Bill of Materials - HPA759A ............................................................................................. 14
I2C is a trademark of Philips Electronics N.V.
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Introduction www.ti.com
1 Introduction
1.1 bq2427x IC Features
The bq24272/273 integrates a synchronous PWM controller, power MOSFETs, input-current sensing,
high-accuracy current and voltage regulation, charge termination and power-path management into a
small WCSP package. The charge parameters are programmable through an I2C interface. Key IC
features include:
• High-efficiency, fully integrated, NMOS-NMOS, synchronous buck charger with 1.5-MHz frequency
• Integrated power FETs for up to a 2.5-A charge rate
• Power-path management between battery and system voltages
For details, see the bq24272/273 data sheets (SLUSB09/SLUSB08).
1.2 bq24272/273 EVM Features
The bq24272/273 evaluation module (EVM) is a complete charger module for evaluating compact, flexible,
high-efficiency, switch-mode battery charge and power-path management solution for single-cell, Li-ion
and Li-polymer battery-powered systems used in a wide range of portable applications. Key EVM features
include:
• 76.2-mm × 76.2-mm × 1.2-mm footprint for entire solution
• Input power connector for AC adapter
• Programmable battery voltage, charge current, input current, and status via I2C™ interface
• IN operating range of 4.2 V – 10 V
• LED indication for status signals
• Test points for key signals available for testing purposes. Easy probe hook-up.
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www.ti.com Introduction
1.3 Schematic
Figure 1. bq24272/273EVM (HPA759) Schematic (Sheet 1 of 2)
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Figure 2. bq24272/273EVM (HPA759) Schematic (Sheet 2 of 2)
NOTE: EVMs with a printed-circuit board label that contain the suffix -X may have been assembled with incorrectly marked ICs. Regardless of the
IC’s marking, the EVM was assembled with the correct part number as specified in the EVM bill of material.
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www.ti.com Introduction
1.4 I/O Description
Header/Terminal Block Description
J1–IN Adapter positive header
J2–IN Adapter positive terminal
J2–GND Adapter negative terminal
J3-GND Adapter negative header
J4-SYS System output positive header (bq24272 only)
J5 USB-TO-GPIO box connector
J6-SYS System output positive terminal (bq24272 only)
J6-GND System output negative terminal (bq24272 only)
J7-TS External thermistor positive terminal
J7-GND Ground terminal for external thermistor
J8-GND System output negative header (bq24272 only)
J9-BAT Battery positive header
J10-BAT Battery positive terminal
J10-GND Battery negative terminal
J11-GND Battery negative header
J12-DRV DRV reference voltage positive header
J13-DRV DRV reference voltage positive terminal
J13-GND DRV reference voltage negative terminal
J14-GND DRV reference voltage negative header
1.5 Test Points
Test Point Description
TP1 Kelvin to VIN
TP2 AGND
TP3 SW
TP4 Kelvin to SYS (bq24272 only)
TP5 PGND
TP6 PGND
TP8 Kelvin to BAT
TP9 SDA
TP10 SCL
TP11 AGND
TP12 AGND
TP13 TS
TP14 CD
TP15 INT
TP16 STAT
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1.6 Control and Key Parameters Setting
Jumper Description Default Factory Setting
JP1 bq24272 only 2-3 (FET GATE = BGATE)
1-2 (FET GATE = SYS): External PFET's gate tied to SYS and therefore disabled.
2-3 (FET GATE = BGATE): External PFET's gate tied to BGATE pin and therefore
controlled by IC.
JP2 1-2 (CD = HI): Charge disable high to disable charge and enter Hi-Z mode 2-3 (CD = LO)
2-3 (CD = LO): Charge disable low for normal operation
JP4 1-2 (TS = DIS): Connects TS high to DRV and disables the temperature sense function 2-3 (TS = SIM)
on the IC
2 (JP4 Open): Connects a potentiometer to the TS so that the potentiometer can
emulate a thermistor. The potentiometer has been preset to approximately 3.4 kΩso
that the TS voltage is 0.5 x V (DRV).
2-3 (TS = SIM): Connects the TS pin to an external thermistor. The resistor divider
formed by R1 and R3 has been sized to accommodate a 10-kΩthermistor. If a different
thermistor is used, R1 and R3 must be resized.
1.7 Recommended Operating Conditions
Min Typ Max Unit
Supply voltage, VIN Input voltage from ac adapter 4.2 10 V
System voltage, VSYS Voltage output at SYS terminal (bq24272 only; depends on 3.4 VBATR V
VBAT voltage and status of VINDPM) EG+4.17
%
Battery voltage, VBAT Voltage output at VBAT terminal (registers set via I2C 3.4 4.2 4.44 V
communication)
Supply current, IIN(MAX) Maximum input current from ac adapter input (registers set 1.5 2.5 A
via I2C communication)
Fast charge current, Battery charge current (registers set via I2C communication) 0.550 2.5 A
ICHRG(MAX)
Operating junction temperature range, TJ-40 125 °C
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2 Test Summary
This procedure describes one test configuration of the HPA759 evaluation board for bench evaluation.
2.1 Definitions
The following naming conventions are followed.
VXXX : External voltage supply name (VADP, VBT, VSBT)
LOADW: External load name (LOADR, LOADI)
V(TPyyy): Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at
TP12.
V(Jxx): Voltage at header Jxx
V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test
point which is marked as ACDET.
V(XXX, YYY): Voltage across point XXX and YYY.
I(JXX(YYY)): Current going out from the YYY terminal of header XX.
Jxx(BBB): Terminal or pin BBB of header xx.
JPx ON : Internal jumper Jxx terminals are shorted.
JPx OFF: Internal jumper Jxx terminals are open.
JPx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted.
Measure: →A, B Check specified parameters A, B. If measured values are not within specified limits,
the unit under test has failed.
Observe →A, B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have locations for jumpers, test points, and individual components.
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2.2 Recommended Test Equipment
2.2.1 Power Supplies
1. Power supply #1 (PS #1) capable of supplying 6 V at 3 A is required.
2. If not using a battery as the load, then power supply #2 (PS #2) capable of supplying up to 5 V at 4 A
is required to power the circuit shown in Figure 3.
2.2.2 Load #1 Between BAT and GND
Testing with an actual battery is the best way to verify operation in the system. If a battery is not available,
then a circuit similar to the one shown in Figure 3 can simulate a battery when connected to a power
supply.
Figure 3. BAT_Load (PR1010) Schematic
2.2.3 Load #2 Between SYS and GND
Although not required, a resistive load capable of sinking up to 3 A can be used.
2.2.4 Meters
Four equivalent voltage meters (VM #) and two equivalent current meters (CM #) are required. The current
meters must be able to measure 4-A current.
2.2.5 Computer
A computer with at least one USB port and a USB cable is required. The bq2427x evaluation software
must be properly installed.
2.2.6 HPA172 Communication Kit (USB TO GPIO)
An HPA172 USB-to-I2C communication kit is required.
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To
Computer
USB port
USB Interface
Adapter
I/O
USB
Texas Instruments
© 2006
10-pin
Ribbon
Cable
To EVM
www.ti.com Test Summary
2.2.7 Software
Download bq2427xSW.zip from the charger's product folder, unzip the file, and double-click on the
SETUP.EXE file. Follow the installation steps.
Because the watchdog timer is enabled, it is recommended that you set the software's Reset Watchdog
Timer to reset every 5 seconds. Otherwise, after 30 seconds of operation, the IC enters Default mode.
Note that the 27-minute safety timer is not reset by this function and eventually times out if charging does
not complete, unless the Safety Timer Time Limit is expanded or disabled via the GUI. One way to reset
the safety timer is to allow the 30-second watchdog timer to expire. See Figure 3 in the data sheet for
more information about the timers.
Also, it is generally helpful to activate the Write On Change functions, in the upper left of the GUI window,
to ON. The Write On Change function writes any changes to the GUI's check boxes, drop-down boxes,
and registers to the IC. Otherwise, the user must click the WRITE button to write changes to the software.
Periodically click the READ button to find the IC's instantaneous status. Alternatively, the AutoRead
function can be activated, periodically updating the GUI with the IC's status.
2.3 Recommended Test Equipment Setup
1. For all power connections, use short, twisted-pair wires of appropriate gauge wire for the amount of the
current.
2. Set PS #1 for 6-V, 3-A current limit and then turn the supply off.
3. If BAT_Load as shown in Figure 1 is used, connect PS #2 set to approximately 3.1 V to the input side
(PS #2) of BAT_Load, then turn off PS #2.
4. Connect the output side of the battery or BAT_Load in series with CM #2 to J9 and J11 or J10 (BAT,
GND). Ensure that a voltage meter is connected across J9 or TP8 and J11 (BAT, GND).
5. bq24272 only: Connect the electronic load or resistor decade box in series with a current meter
(multimeter) to J6(SYS, GND). Ensure the electronic load is in current mode and set to 0 A or the
resistor decade box is set to the maximum resistance.
6. bq24272 only: Connect VM #3 across J4 or TP4 and J8 (SYS, GND).
7. Connect VM #4 across J12 and J14 (DRV, GND).
8. Connect J5 to the HPA172 kit by the 10-pin ribbon cable. Connect the USB port of the HPA172 kit to
the USB port of the computer. The connections are shown in Figure 4.
Figure 4. Connections of HPA172 Kit
9. Ensure jumpers are at the default factory settings per Section 1.6
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VM#4
V+
í
AV
VM#2
CM#2
ICHRG í
í+
+
BAT_Load
PS#2
AV
VM#3
CM#3
ISYS í
í+
+
Elec Load/
Res Box
PS#1
A
V
CM#1 IIN
+í
VM#1
+
í
Windows
PC
USB-TO-
GPIO
Test Summary www.ti.com
10. After the preceding steps have been performed, the test setup for HPA759 is configured as shown in
Figure 5
Figure 5. Original Test Setup for bq24272/273EVM (HPA759)
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11. Turn on the computer. Open the bq2427x evaluation software and click "IN DEVICE" when prompted
at start-up. The main window of the software is shown in Figure 6.
Figure 6. Main Window of bq2427xSW Evaluation Software
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2.4 Recommended Test Procedure
The following test procedure is useful for evaluating the charger IC outside of a real system, if no battery
is available to connect to the output and a simulated battery is needed.
2.4.1 System Voltage and Output Current (bq24272 only)
1. Ensure that the Section 2.3 steps are followed.
2. Connect the output of PS #1 in series with CM #1 to J2 (IN, GND).
3. Connect voltage meter 1 (VM #1) across J1 or TP1 and J3 (IN, GND).
4. With PS #2 disabled, turn on PS #1.
5. Ensure the electronic load is on current mode and set the current to 1 A or turn down the resistor
decade box until CM #3 measures 1000 ±100 mA.
6. Measure:
Measure on VM #3 →V(J4(SYS), J8(GND)) = 3.7 ±150 mV.
Observe →D1 and D2 are on.
7. Move JP2 (CD) = HI.
8. Measure on VM #3 →V(J4(SYS), J8(GND)) = 0 V.
9. Disable PS #1 and disconnect electronic load or resistor box and CM #3 from the HPA759 board.
2.4.2 Charge Voltage and Current Regulation of IN
1. Ensure that the Section 2.3 steps are followed.
2. Connect the output of PS #1 in series with current meter (multimeter) #1 (CM #1) to J1 and J3 or J2
(IN, GND).
3. Connect voltage meter 1 (VM #1) across J1 or TP1 and J3 (IN, GND).
4. Move JP2 to HI.
5. Turn on PS #1 and PS #2 if used.
6. Return JP2 to LO.
7. Software setup:
• Press the READ button to obtain the current settings.
• Set Write On Change to ON if not already set.
• Set Reset Watchdog Timer to update every 5 seconds.
• Uncheck Disable Charging if checked.
• Check Enable STAT/INT Outputs.
• Set Battery Regulation Voltage to 4.20 V.
• Set USB Input Current Limit to 2.5 A.
• Set Charge Current to 1000 mA.
• Click the READ button at the top of the window, and confirm that the previous settings remain.
8. Adjust PS #2 so that the voltage measured by VM #2, across BAT and GND, measures 3.2 V ±50 mV.
9. Adjust the power supply so that VM #1 still reads 6 V ±100 mV if necessary then
Measure on CM #2 →ICHRG = 1000 mA ±100 mA
Measure on CM #1 →IIN < 850 mA
Observe →D1 and D2 are on.
10. Turn off PS #1 and PS #2.
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www.ti.com Printed-Circuit Board Layout Guideline
2.4.3 Helpful hints
1. To observe the taper current as the battery voltage approaches the set regulation voltage, allow the
battery to charge or, if using BAT_Load (PR1010), slowly increase the PS #2 voltage powering
BAT_Load (PR1010). Use VM #2 across BAT and GND to measure the battery voltage seen by the IC.
2. To observe the VINDPM function, lower the current limit on PS #1.
3. To observe battery supplement mode, apply a resistive load across SYS and GND that is higher than
the maximum charge current.
3 Printed-Circuit Board Layout Guideline
1. To obtain optimal performance, the power input capacitors, connected from the PMID input to PGND,
must be placed as close as possible to the bq2427x.
2. Place a 4.7-µF input capacitor as close as possible to the PMID pin and PGND pin to make the high-
frequency current loop area as small as possible. Place 1-µF input capacitor GNDs as close as
possible to the respective PMID capacitor GND and PGND pins to minimize the ground difference
between the input and PMID.
3. The local bypass capacitor from SYS for bq24272 (or CS+ for bq24273) to GND must be connected
between the SYS (or CS+) pin and PGND of the IC. The intent is to minimize the current path loop
area from the SW pin through the LC filter and back to the PGND pin.
4. Place all decoupling capacitors close to their respective IC pins and as close as possible to PGND (do
not place components such that routing interrupts power stage currents). All small control signals must
be routed away from the high-current paths.
5. The PCB must have a ground plane (return) connected directly to the return of all components through
vias (two vias per capacitor for power-stage capacitors, one via per capacitor for small-signal
components). It is also recommended to put vias inside the PGND pads for the IC, if possible. A star
ground design approach is typically used to keep circuit block currents isolated (high-power/low-power
small-signal) reducing noise-coupling and ground-bounce issues. A single ground plane for this design
gives good results. With this small layout and a single ground plane, no ground-bounce issue exists.
Having the components segregated minimizes coupling between signals.
6. The high-current charge paths into IN, BAT, SYS (or CS+), and from the SW pins must be sized
appropriately for the maximum charge current in order to avoid voltage drops in these traces. The
PGND pins must be connected to the ground plane to return current through the internal low-side FET.
7. For high-current applications, the balls for the power paths must be connected to as much copper in
the board as possible. This allows better thermal performance because the board conducts heat away
from the IC.
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Bill of Materials and Board Layout www.ti.com
4 Bill of Materials and Board Layout
4.1 Bill of Materials
Table 1. Bill of Materials - HPA759A
COUNT
- - RefDes Value Description Size Part Number MFR
001 002
0 0 C1 Open Capacitor, ceramic, 25 V, X5R, 10% 0805 Std Std
1 1 C2 1 µF Capacitor, ceramic, 25 V, X5R, 10% 0603 Std Std
1 1 C3 4.7 µF Capacitor, ceramic, 25 V, X5R, 10% 0805 Std Std
1 0 C4 10 µF Capacitor, ceramic, 6.3 V, X5R, 20% 0603 Std Std
0 1 C4 1 µF Capacitor, ceramic, 6.3 V, X5R, 20% 0603 Std Std
1 0 C5 47 µF Capacitor, ceramic, 6.3 V, X5R, 20% 0805 Std Std
1 1 C10 47 µF Capacitor, ceramic, 6.3 V, X5R, 20% 0805 Std Std
2 2 C6, C7 1 µF Capacitor, ceramic, 6.3 V, X5R, 10% 0402 Std Std
1 1 C8 0.1 µF Capacitor, ceramic, 25 V, X7R, 10% 0603 Std Std
1 1 C9 0.01 µF Capacitor, ceramic, 10 V, X5R, 10% 0603 Std Std
2 2 D1, D2 Green Diode, LED, green, 2.1 V, 20 mA, 6 mcd 0603 LTST-C190GKT Liteon
6 6 J1, J3, J9, J11, PEC02SAAN Header, 2-pin, 100-mil spacing 0.100 × 2 PEC02SAAN Sullins
J12, J14
4 4 J2, J7, J10, J13 ED555/2DS Terminal block, 2 pin, 6 A, 3.5 mm 0.27 × 0.25 ED555/2DS OST
2 0 J4, J8 PEC02SAAN Header, 2-pin, 100-mil spacing 0.100 × 2 PEC02SAAN Sullins
1 1 J5 N2510-6002-RB Connector, male straight 2 × 5 pin, 100-mil spacing, 4 wall 0.338 × 0.788 in N2510-6002-RB 3M
1 0 J6 ED555/2DS Terminal block, 2 pin, 6 A, 3.5 mm 0.27 × 0.25 ED555/2DS OST
1 0 JP1 PEC03SAAN Header, male, 3 pin, 100-mil spacing 0.100 in × 3 PEC03SAAN Sullins
2 2 JP2, JP4 PEC03SAAN Header, male, 3 pin, 100 mil spacing 0.100 in × 3 PEC03SAAN Sullins
1 1 L1 1.5 µH Inductor, SMT, 3.5 A, 70 mΩ4.1 × 4.4 mm SPM4012T-1R5M Alternate: TDK
FDSD0415-H-1R5M Alternate:
Toko
1 0 Q1 CSD25401Q3 MOSFET, PChan, -20 V, 60 A, 8.7 mΩQFN 3.3 × 3.3mm CSD25401Q3 TI
1 1 R2 0 ΩResistor, chip, 1/16W, 1% 0402 Std Std
1 1 R4 1870 ΩResistor, chip, 1/16W, 1% 0603 Std Std
1 1 R5 4120 ΩResistor, chip, 1/16W, 1% 0603 Std Std
1 1 R6 0 ΩResistor, chip, 1/16W, 1% 0402 Std Std
2 2 R7, R8 1.50 kΩResistor, chip, 1/16W, 1% 0603 Std Std
1 1 R9 50 kΩPotentiometer, 3/8 cermet, single-turn 0.25 × 0.17 in 3266W-1-503LF Bourns
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Table 1. Bill of Materials - HPA759A (continued)
0 0 R10 Open Resistor, Chip, 1/16W, 1% 0603 Std Std
2 2 R11, R12 200 ΩResistor, Chip, 1/16W, 1% 0603 Std Std
1 0 TP4 5000 Test point, red, thru hole color keyed 0.100 × 0.100 in 5000 Keystone
6 6 TP1, TP2, TP3, 5000 Test point, red, thru hole color keyed 0.100 × 0.100 in 5000 Keystone
TP7, TP8, TP15,
TP16
2 2 TP5, TP6 5001 Test point, black, thru hole color keyed 0.100 × 0.100 in 5001 Keystone
1 1 TP9, TP10 5002 Test point, white, thru hole color keyed 0.100 × 0.100 in 5002 Keystone
4 4 TP11, TP12, 5002 Test point, white, thru hole color keyed 0.100 × 0.100 in 5002 Keystone
TP13, TP14
1 0 U1 BQ24272RGE IC, 2.5 A, single input, single cell switchmode Li-Ion battery charger QFN-24 BQ24272RGE TI
with power-path management
0 1 U1 BQ24273RGE IC, 2.5 A, single input, single cell switchmode Li-Ion battery charger QFN-24 BQ24273RGE TI
with power-path management
3 2 – Shunt, 100 mil, Black 0.100 929950-00 3M
1 1 – PCB 3.00 in × 3.00 in × 0.062 in HPA759 Any
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4.2 Board Layout
Figure 7. Top Assembly Layer
Figure 8. Top Layer
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Figure 9. First Internal Layer
Figure 10. Second Internal Layer
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Figure 11. Bottom Layer
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EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO
BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH
ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL
DAMAGES.
Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety
programs, please visit www.ti.com/esh or contact TI.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and
therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design,
software performance, or infringement of patents or services described herein.
REGULATORY COMPLIANCE INFORMATION
As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal
Communications Commission (FCC) and Industry Canada (IC) rules.
For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT,
DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer
use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency
interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will
be required to take whatever measures may be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and
power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local
laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this
radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and
unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory
authorities, which is responsibility of user including its acceptable authorization.
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
For EVMs annotated as IC – INDUSTRY CANADA Compliant
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs including radio transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs including detachable antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
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