Texas Instruments TRF3762 EVM User manual

1 Hardware Setup
User's GuideSLWU056 – June 2008
TRF3762 EVM User's Guide
Contents1 Hardware Setup .............................................................................................................. 12 Software Setup ............................................................................................................... 2Appendix A Synthesizing Desired Frequencies ............................................................................. 10Appendix B Output Configuration Options ................................................................................... 11Appendix C TRF3762 QFN Installation Using a Hakko Hot Air Rework Station ........................................ 12
List of Figures
1 Single Output Without Balun .............................................................................................. 2
List of Tables
1 Required Test Hardware .................................................................................................... 1
This manual can help users to operate the TRF3762 evaluation module (EVM) with the supplied software.The required hardware for testing the EVM is listed in Table 1 .
Table 1. Required Test Hardware
Hardware Specifications Units
Power supply (1) 4.5 to 5.2 VSpectrum analyzer (1) 0 to 6 Spurs GHz–160 resolution (phase noise) dBmAgilent’s 5052 (1)Low phase noise reference source (1) 1 kHz –120.22 dBc100 kHz –145.6590 kHz –1581 MHz –1583 MHz –1605 MHz –161Rms jitter 236.69 psPersonal computer (PC) (1) 2-GHz processor, CD drive, Parallel portPower cable (1) Supplied by Texas InstrumentsParallel-to-parallel connector cable(1) Not supplied by Texas Instruments DB25 to DB25Coaxial cable (2) 50 Ω
X-ACTO is a trademark of Elmer's Products, Inc..LabVIEW is a trademark of National Instruments Corporation.
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Single ended RF out
To spectrum analyzer or Agilent 5052
DB25 TO PC
DC input for
Open loop test
Reference input
To low phase noise
Reference.
Power supply
Connection
To power supply.
Differential RF out
Not connected.
2 Software Setup
Software Setup www.ti.com
To achieve the test data, all hardware that is supplied with EVM is required. TRF3762 measuredperformance depends on the phase noise characteristics of the reference source used as well as theresolution of the hardware used for phase noise measurements.
The setup of the device is simple. See Figure 1 .
Figure 1. Single Output Without Balun
The board shown in Figure 1 has a 3-dB lower output power when configured as a single-ended output,approximately 0 dBm. When converting to a differential output by removing the 50- Ωresistor R32 in thedifferential path the output power should increase by 3-dB minus the balun losses. Components can beadded to achieve a tuned reactive load which improves the output power. See Appendix B for outputconfiguration options.
The following items are provided in the TRF3762EVM kit.•CD-ROM
•EVM board•Power cable•Programming cable
The LabVIEW™ software provided by Texas Instruments on the accompanying CD is the software thatconfigures the TRF3762. It is used to set the registers inside the device for normal operation. TheLabVIEW software interfaces to the EVM via a DB25 connector. The chip uses a SPI interface protocolwith data formatted as little endian, which means the LSB is clocked in first.
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2.1 Software Installation
Or
www.ti.com Software Setup
When loaded, the CD that accompanies the EVM displays on the PC monitor either a folder with a date fora file name or the full folder of files.
In either case, find the installer folder. This is the folder containing the program and its support files. Oncefound, open the installer folder, and the following screen displays.
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Software Setup www.ti.com
TI recommends that all files in the installer folder be copied to one folder on the PC or laptop that will berunning the program before installing it. Do this by clicking on the installer folder and dragging it to the PC.
Once the folder installer has been copied on the computer, open it and find the LabVIEW runtime enginesetup.exe file. Double-click it ,and execute the program by following the on-screen prompts.
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C:\Customers Computer
New folder
www.ti.com Software Setup
Once the LabVIEW runtime engine is installed, go back to the installer folder and create a folder calledaccessHW.
Open the accessHW.zip file. This file contains the software to set up the port on the PC.
Extract all files in the zip folder to the folder you created ( accessHW). The files should look like thefollowing.
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Software Setup www.ti.com
Double-click on the setup.exe file, and run the setup of the port. You are prompted for which object orlibrary to use.
Select Microsoft Visual C++ 2x, 4x, and then click Next. Follow the prompts.
Once the program is installed, open it and you should see the following display.
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www.ti.com Software Setup
This is the main control screen to use for programming the TRF3762; the frequency of interest is underthe tab labeled Top Level App.
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2.2 The Controls
’
Use the spinner buttons to adjust the divide by ratio.
Type in the value of R27 on the board.
Make sure this button ’s indicator is green.
Make sure this buttons indicator is green.
Type in the frequency of your reference in MHz.
Type in the step frequency you require.
Use the spinner buttons to set.
Type in the frequency of interest.
Use spinner buttons to change the frequency divider.
Use execute button to run program.
Shows the output frequency of TRF3761
Software Setup www.ti.com
The left side of the main control screen is where inputs can be adjusted.
•Fcrystal is the reference used on the EVM. It can between 10 MHz to 104 MHz.•Fpfd is the phase frequency detector frequency and sets the frequency step size. For example, if themain frequency is 2000 MHz and the Fpfd is 200 kHz, then the next frequency step can be 2000.2MHz.
•Prescalar Div Ratio is the ratio used in the Fout equation, Fout = Fpfd (A+PB), where the numerator ofthe Prescalar Div Ratio is equal to P, and A and B are calculated. For more information, see AppendixA.•Rbias is used for a calculation which is on the right side of the Main Control Screen in the windowIcp(Rbias).The value of Rbias is set to the same value as R27 on the EVM board is 2.73 k Ω. Theresistor value can be changed on the board if a different charge pump current is desired.•Icp sets the amount of current on the charge pump as well. Eight setting are used to increase anddecrease the current; they are 0.7, 1.4, 2.1, 2.8, 3.5, 4.2, 4.9, and 5.6. These numbers represent thecurrent seen if a 4.75-k Ωresistor is used. The calculation to determine the desired Icp
actual
is[Icp(4.75k)]/Rbias = Icp
actual
, which should give the same answer as the Icp(Rbias) on the right sidecalculations.
•Fvco is the output frequency of VCO.•Output Mode sets the frequency divider. For example, if 500 MHz is required, then set the Fvco to2000 MHz and the Output Mode to “/4”.•The Selected Output window at the bottom by the Execute button shows the output frequency that theuser sets up.•To enter the data into the TRF3762, press the Execute button. Once pressed, the output changes tothe frequency shown in the Selected Output window.
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2.3 The Calculations
www.ti.com Software Setup
The right side of the main control screen shows the system setup calculations.
•FREF is the reference oscillator frequency in MHz.•Fref_Frac is not used.•RDIV is the number the reference frequency is divided by to get Fpfd.•NDIV is the number the output frequency is divided by to get Fpfd.•A and B are the variables in the equation Fout = Fpfd (A+PB) as discussed in the prescalar section ofthe controls. See Appendix A.•Fout is the actual frequency out.•Fvco 1x is the undivided frequency out of the VCO.•Fvco DIV2 is the frequency out of the VCO divided by 2.•Fvco DIV4 is the frequency out of the VCO divided by 4.•Spur offset is the offset of the phase frequency detector spur.•Icp (Rbias) is the actual current of the charge pump. Calculated from [Icp(4.75k)]/Rbias = Icp
actual
.
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Appendix A Synthesizing Desired Frequencies
Appendix A www.ti.com
Prescalar Div is a multiselection dual modulus to limit the frequency of the Prescalar to below 250MHz. The setting are 8/9, 6/17, 32/33, and 64/65. The TRF3762 has an integer-N PLL synthesizer,and because of its flexibility (14-bit R, 6-bit A, 13-bit B counter, and dual modulus prescalar), isideal for synthesizing virtually any desired frequency. Assume that one needs to synthesize a900-MHz local oscillator, with spacing capability (minimum frequency increment) of 200 kHz, as in atypical GSM application. The choice of the external reference oscillator to be used is beyond thescope of this user's guide, but assuming that a 10-MHz reference is selected, one can calculate thesettings that yield the desired output frequency and channel spacing. Although more than onesolution can often apply to a specific set of conditions, the following is one means of achieving thedesired result.
First, select the appropriate R counter value. Because a channel spacing of 200 kHz is desired, thePFD can also be set to 200 kHz. Calculate the R value through R = REFIN/PFD = 10 MHz/ 200kHz = 50. Assume that a prescalar value of 8/9 is selected. This is a valid choice because theprescalar output will be well within the 200-MHz limit (900 MHz / 8 = 112.5 MHz). Select theappropriate A and B counter values. It is known that RFOUT = Fpfd ×N = (F
REFIN
/ R) ×(A + P ×B). Therefore, solve the following equation:900 MHz = 200 kHz x (A + 8 x B)
Clearly, many solutions exist for this single equation with two unknowns; however, because 3 ≤B≤8191, and also B ≥A, there are some basic constraints on the solution. So, if A = 4, solving theequation yields B = 562. Thus, one complete solution would be to choose: R = 50, A = 4, B = 562,and P = 8/9, resulting in the desired N = 4500.
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Appendix B Output Configuration Options
www.ti.com Appendix B
Single/Differential Output Configurations Load Pout
Single-ended Differential 50- Ωshunt Resistive 0Single-ended Differential 50- Ωshunt Tuned (LC) 3Differential External balun Resistive 3Differential External balun Tuned (LC) 6
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Appendix C TRF3762 QFN Installation Using a Hakko Hot Air Rework Station
C.1 USEFUL LINKS
Appendix C www.ti.com
The TRF3762 devices are optionally sampled separately from the board (TRF3671EVM-X). This guidelineis designed to help the person evaluating these parts to install the sample device on the board provided.
The EVM board has an immersion gold plating. Due to gold leaching into the solder joint, it is a bestpractice to tin the pads and wick off the extra solder. Using a solder with silver content helps but isunnecessary.
Apply solder paste to each pad including the center ground; do not skimp when applying paste to thecenter ground. It is recommended to use a type 6 Sn62Pb36Ag2 alloy with an 82% loading in an EFDdispensing system; solder paste can be applied manually with a dental pick.
Under a microscope, place the device inside the square silkscreen labeled U2. Pin 1 of the device isdesignated by a round dot on the package; pin 1 on the board is designated by an asterisk and a slightlymitered corner.
Use a tool like a dental pick or the point of a hobby knife (like an X-ACTO™ knife) to position the part sothat the device leads are centered on the traces. The solder paste may smear; this is not an issue at thispoint.
Place the board in the Hakko Omnivise, and position it over the Hakko preheater. With the preheater setat 200 °C, let the part heat up for 30 seconds. Place the Hakko hot air nozzle (A1130, this is a 0,44-mmdiameter nozzle) over the device. With the temperature set at 343 °C and the air flow set at 15liters/minute, turn on the hot air rework station. This setting can be adjusted lower if adjacent componentsare being disturbed. Letting the board thermally soak over the preheater along with letting the hot air comeup to temperature while blowing on the part provides a thermal ramp profile. This helps to ensure a goodsolder joint.
Watch the device as it heats up; when the solder paste reflows, let the part continue to heat for 15seconds. Remove it from the heat. Inspect the part immediately, and verify that there are no solder shortsand that there is connection at all pins. A soldering iron with a tip radius of 0.008 at 370 °C works well forthis; add extra flux when doing rework.
To clean the flux residue from the board: spray the board with a flux cleaner, lay a thin absorbent tissueover the board, and brush the board through the tissue. The absorbent tissue wicks up theflux-contaminated solvent. Blow the board dry with compressed air. If spurs are present, additionalcleaning in an ultrasonic cleaner and subsequent baking may be necessary.
Hakko Products:
http://www.hakkousa.com/2006/default_1.asp?Assistant=Dinky
Solder Paste, Flux, Dispenser:http://www.efd-inc.com/mikros/index.html
http://www.efdsolder.com/
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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh .No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 4.5 V to 5.25 V.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than 40 °C. The EVM is designed to operateproperly with certain components above 40 °C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.
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