Toshiba TDP-ET20 User manual

SERVICE MANUAL
FILE NO. 330-200613GR
DLP DATA PROJECTOR
The above models are classified as green product (s) (*1), as indicated by the underlined serial number (s).
This Service Manual describes replacement parts for green product (s). When repairing any green product (s), use
the parts described in this manual and lead-free solder (*2).
For (*1) and (*2) , see the next page.
Published in Japan, November 2006GREEN© TOSHIBA CORPORATION
TDP-ET20

(*1) GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for
recycling and reuse of Waste Electrical and Electronic Equipment and for the Restriction of
the use of certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit
any marketing of new products containing lead.
Increasing attention is given to issues related to the global environmental. Toshiba
Corporation recognizes environmental protection as a key management tasks, and is doing
its utmost to enhance and improve the quality and scope of its environmental activities. In
line with this, Toshiba proactively promotes Green Procurement, and seeks to purchase and
use products, parts and materials that have low environmental impacts. Green procurement
of parts is not only confined to manufacture. The same green parts used in manufacture
must also be used as replacement parts.
(*2) LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the CE
industry at large to be environmentally responsible. Lead-free solder must be used in the
servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT
!
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to
104 °F (30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair
product made with lead-free solder may result in damage to the component and or PCB
being soldered. Great care should be made to ensure high-quality soldering when servicing
this product—especially when soldering large components, through-hole pins, and on
PCBs—as the level of heat required to melt lead-free solder is high.
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