TQ-Systems STK-MBa53 User manual

STK-MBa53
User's Manual
STK-MBa53 UM 100
28.03.2013

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page i
T BLE OF CONTENTS
1. BOUT THIS M NU L ...................................................................................................................................................................................... 1
1.1 Copyright ............................................................................................................................................................................................................. 1
1.2 Copyright and licence expenses .................................................................................................................................................................. 1
1.3 Registered trademarks .................................................................................................................................................................................... 1
1.4 Disclaimer ............................................................................................................................................................................................................ 1
1.5 Imprint .................................................................................................................................................................................................................. 1
1.6 Tips on safety ...................................................................................................................................................................................................... 1
1.7 Symbols and typographic conventions ..................................................................................................................................................... 2
1.8 Handling and ESD tips ..................................................................................................................................................................................... 2
1.9 Naming of signals ............................................................................................................................................................................................. 3
1.10 Further applicable documents / presumed knowledge ....................................................................................................................... 3
1.11 cronyms and definitions .............................................................................................................................................................................. 4
2. BRIEF DESCRIPTION .......................................................................................................................................................................................... 6
3. TECHNIC L D T .............................................................................................................................................................................................. 6
3.1 System architecture and functionality ....................................................................................................................................................... 6
3.1.1 Block diagram..................................................................................................................................................................................................... 6
3.1.2 Functionality ....................................................................................................................................................................................................... 6
4. ELECTRONICS SPECIFIC TION ....................................................................................................................................................................... 8
4.1 System components ........................................................................................................................................................................................ 8
4.1.1 Processor module ............................................................................................................................................................................................. 8
4.1.2 IC address mapping ..................................................................................................................................................................................... 11
4.1.3 I/O extension ................................................................................................................................................................................................... 13
4.1.4 Temperature sensor ...................................................................................................................................................................................... 14
4.1.5 RTC backup supply ........................................................................................................................................................................................ 15
4.1.6 Power and Reset ............................................................................................................................................................................................. 16
4.1.7 Power supply ................................................................................................................................................................................................... 18
4.1.7.1 Electrical parameters switching regulator.............................................................................................................................................. 20
4.1.7.2 Connector and pin assignment ................................................................................................................................................................. 21
4.2 Communication and supply interfaces ................................................................................................................................................... 21
4.2.1 Ethernet 1 ......................................................................................................................................................................................................... 21
4.2.2 Ethernet 2 / USB 2.0 Hi-Speed Host .......................................................................................................................................................... 23
4.2.3 USB 2.0 Hi-Speed OTG .................................................................................................................................................................................. 26
4.2.4 C N1 / C N2 .................................................................................................................................................................................................... 27
4.2.4.1 Galvanic separation ....................................................................................................................................................................................... 28
4.2.4.2 Connectors and pin assignment ............................................................................................................................................................... 29
4.2.5 RS232 ................................................................................................................................................................................................................. 30
4.2.6 RS485 ................................................................................................................................................................................................................. 31
4.2.7 DVI ...................................................................................................................................................................................................................... 34
4.2.8 LVDS ................................................................................................................................................................................................................... 37
4.2.9 udio .................................................................................................................................................................................................................. 39
4.2.10 SD card .............................................................................................................................................................................................................. 41
4.2.11 S T ................................................................................................................................................................................................................... 42
4.2.12 JT G ................................................................................................................................................................................................................... 43
4.2.13 Pin headers ....................................................................................................................................................................................................... 45
4.3 Diagnostic and user interfaces ................................................................................................................................................................... 49
4.3.1 Diagnostic LEDs .............................................................................................................................................................................................. 49
4.3.2 Stimuli buttons ............................................................................................................................................................................................... 51
4.3.3 Power-On and Reset button ....................................................................................................................................................................... 51
4.3.4 C N1 / C N2, RS485 termination ............................................................................................................................................................. 51
4.3.5 Boot-Mode configuration ............................................................................................................................................................................ 52
4.3.6 Buzzer ................................................................................................................................................................................................................ 55

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page ii
T BLE OF CONTENTS (continued)
5. MECH NICS SPECIFIC TION ....................................................................................................................................................................... 56
5.1 General notes .................................................................................................................................................................................................. 56
5.2 Dimensions ...................................................................................................................................................................................................... 56
5.3 Housing ............................................................................................................................................................................................................. 57
5.4 Thermal management .................................................................................................................................................................................. 57
5.5 Component placement ................................................................................................................................................................................ 57
6. S FETY REQUIREMENTS ND PROTECTIVE REGUL TIONS ............................................................................................................... 58
6.1 EMC..................................................................................................................................................................................................................... 58
6.2 ESD ...................................................................................................................................................................................................................... 58
6.3 Operational safety and personal security ............................................................................................................................................... 58
6.4 Climatic and operational conditions ........................................................................................................................................................ 58
6.5 Protection against external effects ........................................................................................................................................................... 58
6.6 Reliability and service life ............................................................................................................................................................................ 58
6.7 Environment protection .............................................................................................................................................................................. 58
6.7.1 RoHS compliance ........................................................................................................................................................................................... 58
6.7.2 WEEE regulation ............................................................................................................................................................................................. 58
6.7.3 Batteries ............................................................................................................................................................................................................ 59
6.7.3.1 General notes .................................................................................................................................................................................................. 59
6.7.3.2 Lithium batteries ............................................................................................................................................................................................ 59
6.8 Other entries .................................................................................................................................................................................................... 59
7. SOFTW RE........................................................................................................................................................................................................ 59
8. PPENDIX ......................................................................................................................................................................................................... 60
8.1 References ........................................................................................................................................................................................................ 60

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page iii
T BLE DIRECTORY
Table 1: Terms and Conventions ..................................................................................................................................................................... 2
Table 2: cronyms ............................................................................................................................................................................................... 4
Table 3: Overview communication and supply interfaces ...................................................................................................................... 7
Table 4: Overview user's interfaces ................................................................................................................................................................ 7
Table 5: Possible mating connectors on the carrier board ..................................................................................................................... 8
Table 6: TQMa53 and module connector ..................................................................................................................................................... 8
Table 7: Pin assignment module connector X1 .......................................................................................................................................... 9
Table 8: Pin assignment module connector X2 ....................................................................................................................................... 10
Table 9: IC address mapping (IC2 bus) .................................................................................................................................................... 11
Table 10: IC address mapping (IC3 bus) .................................................................................................................................................... 12
Table 11: Possible configurations of the IC addresses for the I/O expander ................................................................................... 12
Table 12: Possible configurations of the IC addresses for the temperature sensor ...................................................................... 12
Table 13: Configuration INT# signal .............................................................................................................................................................. 13
Table 14: Electric characteristics of the temperature sensor LM75 .................................................................................................. 14
Table 15: Electrical parameters of the RTC backup supply ..................................................................................................................... 15
Table 16: Battery and battery holder............................................................................................................................................................. 15
Table 17: Resets on the TQMa53 .................................................................................................................................................................... 16
Table 18: Electrical parameters PGOOD signals ......................................................................................................................................... 17
Table 19: Power- and Reset-Buttons S8, S9 ................................................................................................................................................. 17
Table 20: Electrical parameters of the protective circuit ......................................................................................................................... 19
Table 21: Electrical parameters VIN / VCC12V ............................................................................................................................................ 19
Table 22: Electrical parameters VCC5V ......................................................................................................................................................... 20
Table 23: Electrical parameter VCC3V3......................................................................................................................................................... 20
Table 24: Power supply connectors X8, X21 ............................................................................................................................................... 21
Table 25: L N8720 modes ............................................................................................................................................................................. 22
Table 26: Ethernet connector X11 .................................................................................................................................................................. 22
Table 27: Pin assignment RJ45 receptacle X11 (Ethernet 1) .................................................................................................................. 22
Table 28: USB, RJ45, pin header, connectors X9, X10, X19 ..................................................................................................................... 24
Table 29: Pin assignment USB host 1 / 2 connector X9 ........................................................................................................................... 25
Table 30: Pin assignment RJ45 receptacle X10 (Ethernet 2) .................................................................................................................. 25
Table 31: Pin assignment USB host 3 pin header X19 .............................................................................................................................. 25
Table 32: USB type Micro- B connector X16 .............................................................................................................................................. 26
Table 33: Pin assignment USB OTG connector X16 .................................................................................................................................. 26
Table 34: Electrical parameter C N1 / C N2 .............................................................................................................................................. 27
Table 35: Settings of DIP switches for C N1 / C N2 termination ........................................................................................................ 27
Table 36: Characteristics of the galvanic separation for C N1 and C N2 ......................................................................................... 28
Table 37: Pin headers X3, X4 ............................................................................................................................................................................ 29
Table 38: Pin assignment C N1 / C N2 connector X3, X4 ..................................................................................................................... 29
Table 39: Electrical parameters RS232 .......................................................................................................................................................... 30
Table 40: D-Sub 9-pin connector X1.............................................................................................................................................................. 31
Table 41: Pin assignment RS232 connector X1 .......................................................................................................................................... 31
Table 42: Configuration of the RS485 modes ............................................................................................................................................. 31
Table 43: Electrical parameters RS485 .......................................................................................................................................................... 32
Table 44: Settings of DIP switch S4 for RS485 ............................................................................................................................................ 32
Table 45: Characteristics of the galvanic separation for RS485 ............................................................................................................ 33
Table 46: Pin headers connector X2 .............................................................................................................................................................. 33
Table 47: Pin assignment RS485 connector X2 .......................................................................................................................................... 33
Table 48: DVI connector X5 .............................................................................................................................................................................. 35
Table 49: Pin assignment DVI connector X5 ............................................................................................................................................... 36
Table 50: LVDS connector X17 ........................................................................................................................................................................ 38
Table 51: Pin assignment LVDS header X17 ................................................................................................................................................ 38
Table 52: Configuration for headphone or line-out ................................................................................................................................. 39
Table 53: Electric characteristics of the audio interface .......................................................................................................................... 39
Table 54: Jacks X13, X14, X15 .......................................................................................................................................................................... 40
Table 55: Pin assignment audio connector X13 (line-out / headphone) ........................................................................................... 40
Table 56: Pin assignment audio connector X14 (line-in) ........................................................................................................................ 40
Table 57: Pin assignment audio connector X15 (microphone) ............................................................................................................. 40
Table 58: SD card connector X6 ...................................................................................................................................................................... 41
Table 59: Pin assignment SD card connector X6 ....................................................................................................................................... 41

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page iv
T BLE DIRECTORY (continued)
Table 60: S T connector X12 ........................................................................................................................................................................ 42
Table 61: Pin assignment S T connector X12 ......................................................................................................................................... 42
Table 62: High- and Low level for 2.775V signals of the JT G interface............................................................................................. 43
Table 63: Pin header X7 ..................................................................................................................................................................................... 44
Table 64: Pin assignment JT G ....................................................................................................................................................................... 44
Table 65: Pin headers X18, X19, X20 .............................................................................................................................................................. 45
Table 66: Pin header X18................................................................................................................................................................................... 46
Table 67: Pin header X19................................................................................................................................................................................... 47
Table 68: Pin header „Power-Out“ X20 ......................................................................................................................................................... 48
Table 69: Diagnostic LEDs................................................................................................................................................................................. 49
Table 70: Diagnostic LEDs................................................................................................................................................................................. 49
Table 71: Stimuli buttons .................................................................................................................................................................................. 51
Table 72: Configuration Boot-Mode .............................................................................................................................................................. 52
Table 73: Configuration general i.MX53 Boot-Parameter ....................................................................................................................... 52
Table 74: Configuration Boot-Devices (for internal Boot) ...................................................................................................................... 53
Table 75: Buzzer ................................................................................................................................................................................................... 55
Table 76: Climatic and operational conditions .......................................................................................................................................... 58
Table 77: Further applicable documents ..................................................................................................................................................... 60

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page v
ILLUSTR TION DIRECTORY
Illustration 1: Block diagram STK-MBa53 ......................................................................................................................................................... 6
Illustration 2: Block diagram TQMa53 .............................................................................................................................................................. 8
Illustration 3: Block diagram IC buses .......................................................................................................................................................... 11
Illustration 4: Block diagram I/O extension .................................................................................................................................................. 13
Illustration 5: Block diagram temperature sensor ..................................................................................................................................... 14
Illustration 6: Characteristic curve of the temperature sensor .............................................................................................................. 14
Illustration 7: Position of temperature sensor ............................................................................................................................................ 14
Illustration 8: Position of battery holder ....................................................................................................................................................... 15
Illustration 9: Block diagram Power and Reset ........................................................................................................................................... 16
Illustration 10: Position of buttons S8, S9 ....................................................................................................................................................... 17
Illustration 11: Block diagram power supply ................................................................................................................................................. 18
Illustration 12: Block diagram power supply (recommended for customer specific carrier board) ............................................. 18
Illustration 13: Protective circuit for VIN / VCC12V ...................................................................................................................................... 19
Illustration 14: Position of power-supply connectors X8, X21 ................................................................................................................. 21
Illustration 15: Block diagram Ethernet 1 ....................................................................................................................................................... 21
Illustration 16: Position of Ethernet connector X11 .................................................................................................................................... 22
Illustration 17: Block diagram USB 2.0 Hi-Speed 1 – 3, Ethernet 2 .......................................................................................................... 23
Illustration 18: Position of USB, RJ45, pin header, connectors X9, X10, X19 ........................................................................................ 24
Illustration 19: Block diagram USB 2.0 Hi-Speed OTG ................................................................................................................................. 26
Illustration 20: Position of USB Micro- B connector X16........................................................................................................................... 26
Illustration 21: Block diagram C N1/C N2 .................................................................................................................................................... 27
Illustration 22: Position of S10 ............................................................................................................................................................................ 28
Illustration 23: Position of pin headers X3, X4 ............................................................................................................................................... 29
Illustration 24: Block diagram RS232 ................................................................................................................................................................ 30
Illustration 25: Position of D-Sub 9-pin connector X1 ................................................................................................................................ 30
Illustration 26: Block diagram RS485 ................................................................................................................................................................ 31
Illustration 27: Position of pin headers S4 ...................................................................................................................................................... 32
Illustration 28: Position of pin header X2 ........................................................................................................................................................ 33
Illustration 29: Block diagram DVI (analog signals) ..................................................................................................................................... 34
Illustration 30: Block diagram DVI (digital signals) ...................................................................................................................................... 35
Illustration 31: Position of DVI connector X5 ................................................................................................................................................. 35
Illustration 32: Block diagram LVDS ................................................................................................................................................................. 37
Illustration 33: Position of LVDS connector X17 ........................................................................................................................................... 37
Illustration 34: Block diagram audio................................................................................................................................................................. 39
Illustration 35: Position of jacks X13, X14, X15 .............................................................................................................................................. 40
Illustration 36: Block diagram SD card ............................................................................................................................................................. 41
Illustration 37: Position of SD card connector X6 ......................................................................................................................................... 41
Illustration 38: Block diagram S T -Interface ............................................................................................................................................... 42
Illustration 39: Position of S T connector X12 ........................................................................................................................................... 42
Illustration 40: Block diagram JT G .................................................................................................................................................................. 43
Illustration 41: Position of pin header X7 ........................................................................................................................................................ 43
Illustration 42: Position of pin headers 18, X19, X20 ................................................................................................................................... 45
Illustration 43: Position of LEDs power supply (V32 – V35) ....................................................................................................................... 49
Illustration 44: Position of LEDs USB Host 1 / Host 2 (V28, V29) .............................................................................................................. 50
Illustration 45: Position of LEDs USB Host 3 and OTG (V30, V31) ............................................................................................................ 50
Illustration 46: Block diagram stimuli buttons .............................................................................................................................................. 51
Illustration 47: Position of S5, S6, S7 ................................................................................................................................................................. 51
Illustration 48: Configuring the boot loader with DIP switches S1, S2, S3 ........................................................................................... 52
Illustration 49: Position of DIP switch S1 ......................................................................................................................................................... 54
Illustration 50: Position of DIP switches S2, S3 .............................................................................................................................................. 54
Illustration 51: Block diagram buzzer............................................................................................................................................................... 55
Illustration 52: Position of buzzer ...................................................................................................................................................................... 55
Illustration 53: Height of STK-MBa53 ............................................................................................................................................................... 56
Illustration 54: Dimension drawing of STK-MBa53 ...................................................................................................................................... 56
Illustration 55: Component placement top ................................................................................................................................................... 57

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page vi
REVISION HISTORY
Rev. Date Name Pos. Modification
100 28.03.2013 Petz Document created

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 1
1.
1.1.
1. BOUT THIS M NU L
BOUT THIS M NU LBOUT THIS M NU L
BOUT THIS M NU L
1.1
1.11.1
1.1 Copyright
CopyrightCopyright
Copyright
Copyright protected © 2013 by TQ-Systems GmbH. This User's Manual may not be copied, reproduced, translated, changed
or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of
TQ-Systems GmbH.
1.2
1.21.2
1.2 Copyright and licence expenses
Copyright and licence expensesCopyright and licence expenses
Copyright and licence expenses
The drivers and utilities for the used components as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be separately
calculated / declared.
1.3
1.31.3
1.3 Registered trademarks
Registered trademarksRegistered trademarks
Registered trademarks
TQ-Systems GmbH aims to adhere to the copyrights of all the graphics and texts used in all publications, and strives to use
original or license-free graphics and texts.
ll the brand names and trademarks mentioned in the publication, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by of a third
party.
1.4
1.41.4
1.4 Disclaimer
DisclaimerDisclaimer
Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in the
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
1.5
1.51.5
1.5 Imprint
ImprintImprint
Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
82229 Seefeld
Tel: [phone]
Fax: [phone]
Email: i[email protected]
Web: http://www.tq-group.com/
1.6
1.61.6
1.6 Tips on safety
Tips on safetyTips on safety
Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 2
1.7
1.71.7
1.7 Symbols and typographic conventions
Symbols and typographic conventionsSymbols and typographic conventions
Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. cting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command font with fixed-width is used to denote commands, file names, or menu items.
1.8
1.81.8
1.8 Handling and ESD tips
Handling and ESD tipsHandling and ESD tips
Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the module and be dangerous to your
health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
lways wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 3
1.9
1.91.9
1.9 Naming of signals
Naming of signalsNaming of signals
Naming of signals
hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.10
1.101.10
1.10 Further applicable documents / presumed knowle
Further applicable documents / presumed knowleFurther applicable documents / presumed knowle
Further applicable documents / presumed knowledge
dgedge
dge
Specifications and manual of the used modules:
Specifications and manual of the used modules:Specifications and manual of the used modules:
Specifications and manual of the used modules:
These documents describe the service, functionality and special characteristics of the used module (incl. BIOS).
Specifications of the used components:
Specifications of the used components:Specifications of the used components:
Specifications of the used components:
The manufacturer's specifications of the used components, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
Chip errata:
Chip errata:Chip errata:
Chip errata:
It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
Software behaviour:
Software behaviour:Software behaviour:
Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
General expertise:
General expertise:General expertise:
General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•Circuit diagram MBa53.SP
•CPU Manual IMX53RM
•User's Manual TQMa53
•Documentation of boot loader U-Boot (http://www.denx.de/wiki/U-Boot/Documentation)
•Documentation of ELDK (http://www.denx.de/wiki/DULG/ELDK)

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 4
1.11
1.111.11
1.11 cronyms and definitions
cronyms and definitionscronyms and definitions
cronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 2: cronyms
cronym Meaning
HCI dvanced Host Controller Interface
I nalog In
MB dvanced Microcontroller Bus rchitecture
O nalog Out
RM® dvanced RISC Machine
C N Controller rea Network
CD Card Detect
CPU Central Processing Unit
CSI Camera Sensor Interface
DC Direct Current
DDR Double Data Rate
DIN Deutsche Industrie Norm
DIP Dual In-line Package
DVI Digital Visual Interface
ECSPI enhanced Configurable SPI
EEPROM Electrically Erasable Programmable Read-only Memory
EMC Electro-Magnetic Compatibility
EMI Electro-Magnetic Interference
eMMC embedded Multimedia Card
EN Europäische Norm
ESD Electro-Static Discharge
ESPI enhanced Serial Peripheral Interface
FEC Fast Ethernet Controller
FIRI Fast Infrared Interface
FR4 Flame Retardant 4
GPIO General Purpose Input/Output
HD High Density
HDD Hard Disk Drive
HDMI High Definition Multimedia Interface
I Input
I/O Input/Output
IEEE® Institute of Electrical and Electronics Engineers
IP Ingress Protection
IPD Input with Pull-Down (resistor)
IPU Input with Pull-Up (resistor)
IC Inter-Integrated Circuit
IS Inter Integrated Circuit Sound
JT G Joint Test ction Group
LCD Liquid Crystal Display
LCL Inductance-Capacitance-Inductance
LED Light Emitting Diode
LICELL Lithium Cell
LSB Least Significant Bit
LVDS Low Voltage Differential Signal

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 5
Table 2: cronyms (continued)
cronym Meaning
MMC Multimedia Card
MMU Memory Management Unit
MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
MSB Most Significant Bit
MTBF Mean operating Time Between Failures
n.a. Not ssembled
n.c. Not Connected
O Output
OOD Output with Open Drain
OTG On-The-Go
P Power
PCB Printed Circuit Board
PD Pull-Down (resistor)
PHY Physical (layer of the OSI model)
PMIC Power Management Integrated Circuit
PU Pull-Up (resistor)
RC Resistor Capacitor
RGB Red Green Blue
RJ Registered Jack
RMS Root Mean Square
RoHS Restriction of (the use of certain) Hazardous Substances
ROM Read-Only Memory
RTC Real-Time Clock
S T Serial T
SD Secure Digital
SD-Card Secure Digital Card
SD/MMC Secure Digital Multimedia Card
SDHC Secure Digital High Capacity
SDR M Synchronous Dynamic Random ccess Memory
SMD Surface-Mounted Device
SPDIF Sony-Philips Digital Interface Format
SPI Serial Peripheral Interface
SPL Sound Pressure Level
THD Through Hole Device
THT Through-Hole Technology
TMDS Transition-Minimized Differential Signalling
TMS Test Mode Select
U RT Universal synchronous Receiver/Transmitter
USB Universal Serial Bus
USBH Universal Serial Bus Host
USBOTG USB On-The-Go
VES Video Electronics Standards ssociation
VG Video Graphics rray (640 × 480)
WEEE Waste Electrical and Electronic Equipment
WEIM Wireless External Interface Module
WP Write-Protection
WUXG Widescreen Ultra Extended Graphics rray (1920 × 1200)

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 6
2.
2.2.
2. BRIEF DESCRIPTION
BRIEF DESCRIPTIONBRIEF DESCRIPTION
BRIEF DESCRIPTION
The STK-MBa53 is designed to be used in combination with the TQ module TQMa53, which is based on the Freescale RM-CPU
MCIMX53 (i.MX53). Together with the module TQMa53 the STK-MBa53 provides all basic functions and interfaces.
Together with the TQMa53 the STK-MBa53 forms a modular system for developments of own products.
Unless otherwise stated, this User’s Manual refers to the TQMa53 revision 0200.
3.
3.3.
3. TECHNIC L D T
TECHNIC L D TTECHNIC L D T
TECHNIC L D T
3.1
3.13.1
3.1 System architecture an
System architecture anSystem architecture an
System architecture and functionality
d functionalityd functionality
d functionality
3.1.1 Block diagram
Illustration 1: Block diagram STK-MBa53
3.1.2 Functionality
The core of the complete unit is the Freescale i.MX53 CPU based processor module TQMa53 of TQ-Systems GmbH.
This module, which is plugged onto the STK-MBa53, provides the connection to all peripheral components.
In addition to the standard communication interfaces like USB, Ethernet, RS232 etc. all other available signals of the TQMa53 are
routed on headers with a 2.54 mm pitch.
The STK-MBa53 provides the following interfaces, functions and user's interfaces:

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 7
Table 3: Overview communication and supply interfaces
Interface Section Number Type of connector Remark
USB 2.0 HS Host 4.2.2 2 USB receptacle type Dual port receptacle, right angle
USB 2.0 HS OTG 4.2.2 1 USB receptacle type Micro- B
Ethernet 4.2.1, 4.2.2 2 RJ45 receptacle Receptacle with integrated magnetics
C N 4.2.4 2 Phoenix basic housing Vertical version
RS232 4.2.5 1 D-Sub 9-pin connector Right angle, Debug-U RT
RS485 4.2.6 1 Phoenix basic housing Vertical version
DVI 4.2.7 1 DVI receptacle type I Right angle, VG and HDMI compatible
LVDS 4.2.8 1 DF19 receptacle Hirose DF19
udio Out 4.2.9 3 3.5 mm jack
Right angle
1 × Line-out (stereo)
1 × Line-in (stereo)
1 × Microphone (mono)
SD card 4.2.10 1 Push-Push type –
S T 4.2.11 1 S T socket Vertical version
JT G 4.2.12 1 Pin header 2.54 mm –
Pin headers 4.2.13 2 Pin header 2.54 mm
•14 × GPIO
•1 × USB 2.0 HS Host
•1 × CSI
•1 × U RT
•1-wire
•2 × SPI
•2 × IC
•SPDIF
•FIRI
•1 × 4-wire touch
•1 × parallel display interface
•LCD backlight control
•Optional: WEIM bus
Power-IN 4.1.7 1 DC jack (2.5 mm / 5.5 mm) VIN = 12 V ±5 % DC
Power-OUT Table 68 1 Pin header 2.54 mm
•3.3 V DC
•5 V DC
•12 V DC
•3 × Power-On / Reset signals
Battery holder 4.1.5 1 CR2032 holder Backup battery RTC
Table 4: Overview user's interfaces
Interface Section Number
Remark
Diagnostic LEDs 4.3.1 12 4 × each for power supply, Ethernet and USB
Push buttons 4.3.2 3
Power-On and Reset button 4.3.3 1
C N1 / C N2 and RS485 termination 4.3.4 1 t each interface 120 Ω can be connected by DIP switches
Boot mode configuration 4.3.5 1
Buzzer 4.3.6 1

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 8
4.
4.4.
4. ELECTRONICS SPECIFIC
ELECTRONICS SPECIFICELECTRONICS SPECIFIC
ELECTRONICS SPECIFIC TION
TIONTION
TION
4.1
4.14.1
4.1 System components
System componentsSystem components
System components
4.1.1 Processor module
Illustration 2: Block diagram TQMa53
The main components of the processor module TQMa53 are the i.MX53-CPU, DDR3 SDR M and eMMC memory.
The technical characteristics of the TQMa53 are to be taken from the User's a Manual1.
The available signals are routed over the two 120-pin module connectors X1 and X2 to the STK-MBa53.
Table 7 and Table 8 show the pins assignment of the connectors as well as signal names and directions seen from the TQMa53.
The boot-mode configuration of the i.MX53 is set via DIP switches. See section 4.3.5, Boot-Mode configuration.
The TQMa53 can be plugged put on mating connectors of different stack height on the carrier board.
In this way different board to board distances can be achieved, which are shown in Table 5.
Table 5: Possible mating connectors on the carrier board
Manufacturer / number Contact Plating Board to board distance
tyco / 5177986-5 0.2 µm Gold 5 mm
tyco / 5-5177986-5 0.76 µm Gold 5 mm
tyco / 1-5177986-5 0.2 µm Gold 6 mm
tyco / 6-5177986-5 0.76 µm Gold 6 mm
tyco / 2-5177986-5 0.2 µm Gold 7 mm
n.a. 0.76 µm Gold 7 mm
tyco / 3-5177986-5 0.2 µm Gold 8 mm
tyco / 6123001-5 0.76 µm Gold 8 mm
Table 6: TQMa53 and module connector
Manufacturer / number Description Package
TQ-Systems / TQMa53
•CPU module with Freescale i.MX53
•2 GiB eMMC flash
•512 MiB DDR3 SDR M
•800 MHz CPU frequency
•–25 °C to +85 °C
Tyco / 5177986-5
•Connectors for TQMa53 module
•120-pin
•Plugged height: 5.0 mm
•–40 °C to +125 °C
•100 mating cycles
SMD120
1 See (1), TQMa53 User's Manual.

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 9
Table 7: Pin assignment module connector X1
Ball I/O Level Group Signal Pin Signal Group Level I/O Ball
–
P
0 V
POWER
DGND
1
2
DGND
POWER
0 V
P
–
P02
I
3.3 V
CSI0
CSI0_HSYNC
3
4
CSI0_PIXCLK
CSI0
3.3 V
I
P01
P04
I
3.3 V
CSI0
CSI0_VSYNC
5
6
DGND
POWER
0 V
P
–
–
P
0 V
POWER
DGND
7
8
CSI0_D T _EN
CSI0
3.3 V
I
P03
R01
I
3.3 V
CSI0
CSI0_D4
9
10
CSI0_D5
CSI0
3.3 V
I
R02
R06
I
3.3 V
CSI0
CSI0_D6
11
12
CSI0_D7
CSI0
3.3 V
I
R03
T01
I
3.3 V
CSI0
CSI0_D8
13
14
CSI0_D9
CSI0
3.3 V
I
R04
R05
I
3.3 V
CSI0
CSI0_D10
15
16
CSI0_D11
CSI0
3.3 V
I
T02
T03
I
3.3 V
CSI0
CSI0_D12
17
18
CSI0_D13
CSI0
3.3 V
I
T06
U01
I
3.3 V
CSI0
CSI0_D14
19
20
CSI0_D15
CSI0
3.3 V
I
U02
T04
I
3.3 V
CSI0
CSI0_D16
21
22
CSI0_D17
CSI0
3.3 V
I
T05
U03
I
3.3 V
CSI0
CSI0_D18
23
24
CSI0_D19
CSI0
3.3 V
I
U04
P05
I
3.3 V
CSI0
CSI0_PWDN
25
26
CSI0_MCLK
CSI0
3.3 V
I
V14
P06
I
3.3 V
CSI0
CSI0_RST#
27
28
DGND
POWER
0 V
P
–
–
P
0 V
POWER
DGND
29
30
GPIO3_GPIO20
GPIO
3.3 V
I/O
W01
01
I/O
3.3 V
GPIO
GPIO3_GPIO28
31
32
GPIO3_GPIO29
GPIO
3.3 V
I/O
02
W02
I/O
3.3 V
GPIO
GPIO3_GPIO22
33
34
GPIO3_GPIO21
GPIO
3.3 V
I/O
V03
B04
I/O
3.3 V
GPIO
GPIO2_GPIO26
35
36
GPIO2_GPIO27
GPIO
3.3 V
I/O
06
V08
I/O
3.3 V
GPIO
GPIO2_GPIO25
37
38
GPIO2_GPIO23
GPIO
3.3 V
I/O
W08
C06
I/O
3.3 V
GPIO
GPIO3_GPIO11
39
40
GPIO3_GPIO13
GPIO
3.3 V
I/O
C07
B09
I/O
3.3 V
GPIO
GPIO5_GPIO0
41
42
GPIO3_GPIO14
GPIO
3.3 V
I/O
Y10
U05
I
3.3 V
ESPI
ESPI_MISO
43
44
GPIO3_GPIO12
GPIO
3.3 V
I/O
V10
V01
O
3.3 V
ESPI
ESPI_MOSI
45
46
ESPI_SS1#
ECSPI1
3.3 V
O
V02
Y02
O
3.3 V
ESPI
ESPI_SS2#
47
48
ESPI_SS0#
ECSPI1
3.3 V
O
Y03
–
P
0 V
POWER
DGND
49
50
ESPI_SS3#
ECSPI1
3.3 V
O
W03
B07
O
3.3 V
DISP1
DISP1_DRDY_DE
51
52
DGND
POWER
0 V
P
–
08
O
3.3 V
DISP1
DISP1_D T1
53
54
ESPI_SCLK
ECSPI1
3.3 V
O
U06
Y09
O
3.3 V
DISP1
DISP1_D T3
55
56
DISP1_CLK
DISP1
3.3 V
O
05
B06
O
3.3 V
DISP1
DISP1_D T5
57
58
DGND
POWER
0 V
P
–
07
O
3.3 V
DISP1
DISP1_D T7
59
60
DISP1_HSYNC
DISP1
3.3 V
O
Y01
Y08
O
3.3 V
DISP1
DISP1_D T9
61
62
DISP1_VSYNC
DISP1
3.3 V
O
Y04
C03
O
3.3 V
DISP1
DISP1_D T11
63
64
DGND
POWER
0 V
P
–
B03
O
3.3 V
DISP1
DISP1_D T13
65
66
DISP1_D T0
DISP1
3.3 V
O
W10
Y06
O
3.3 V
DISP1
DISP1_D T15
67
68
DISP1_D T2
DISP1
3.3 V
O
C05
03
O
3.3 V
DISP1
DISP1_D T17
69
70
DISP1_D T4
DISP1
3.3 V
O
V09
Y05
O
3.3 V
DISP1
DISP1_D T19
71
72
DISP1_D T6
DISP1
3.3 V
O
W09
W04
O
3.3 V
DISP1
DISP1_D T21
73
74
DISP1_D T8
DISP1
3.3 V
O
C04
V04
O
3.3 V
DISP1
DISP1_D T23
75
76
DISP1_D T10
DISP1
3.3 V
O
B05
–
P
0 V
POWER
DGND
77
78
DISP1_D T12
DISP1
3.3 V
O
V07
09
O
3.3 V
VG
VG _HSYNC
79
80
DISP1_D T14
DISP1
3.3 V
O
W07
Y07
O
3.3 V
VG
VG _VSYNC
81
82
DISP1_D T16
DISP1
3.3 V
O
04
C19
O
0.7 V
VG
TVD C_IOB
83
84
DISP1_D T18
DISP1
3.3 V
O
V06
B20
O
0.7 V
VG
TVD C_IOG
85
86
DISP1_D T20
DISP1
3.3 V
O
W05
C21
O
0.7 V
VG
TVD C_IOR
87
88
DISP1_D T22
DISP1
3.3 V
O
V05
–
P
0 V
POWER
DGND
89
90
DGND
POWER
0 V
P
–
C16
O
1.2 V
LVDS0
LVDS0_CLK_P
91
92
LVDS1_CLK_P
LVDS1
1.2 V
O
Y13
B16
O
1.2 V
LVDS0
LVDS0_CLK_N
93
94
LVDS1_CLK_N
LVDS1
1.2 V
O
13
–
P
0 V
POWER
DGND
95
96
DGND
POWER
0 V
P
–
17
O
1.2 V
LVDS0
LVDS0_TX0_P
97
98
LVDS1_TX0_P
LVDS1
1.2 V
O
B14
Y17
O
1.2 V
LVDS0
LVDS0_TX0_N
99
100
LVDS1_TX0_N
LVDS1
1.2 V
O
C14
–
P
0 V
POWER
DGND
101
102
DGND
POWER
0 V
P
–
C17
O
1.2 V
LVDS0
LVDS0_TX1_P
103
104
LVDS1_TX1_P
LVDS1
1.2 V
O
B13
B17
O
1.2 V
LVDS0
LVDS0_TX1_N
105
106
LVDS1_TX1_N
LVDS1
1.2 V
O
C13
–
P
0 V
POWER
DGND
107
108
DGND
POWER
0 V
P
–
16
O
1.2 V
LVDS0
LVDS0_TX2_P
109
110
LVDS1_TX2_P
LVDS1
1.2 V
O
B12
Y16
O
1.2 V
LVDS0
LVDS0_TX2_N
111
112
LVDS1_TX2_N
LVDS1
1.2 V
O
C12
–
P
0 V
POWER
DGND
113
114
DGND
POWER
0 V
P
–
C15
O
1.2 V
LVDS0
LVDS0_TX3_P
115
116
LVDS1_TX3_P
LVDS1
1.2 V
O
Y12
B15
O
1.2 V
LVDS0
LVDS0_TX3_N
117
118
LVDS1_TX3_N
LVDS1
1.2 V
O
12
–
P
0 V
POWER
DGND
119
120
DGND
POWER
0 V
P
–

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 10
Table 8: Pin assignment module connector X2
Ball I/O Level Group Signal Pin Signal Group Level I/O Ball
–
P
5 V
POWER
VCC5V
1
2
VCC5V
POWER
5 V
P
–
–
P
5 V
POWER
VCC5V
3
4
VCC5V
POWER
5 V
P
–
–
P
5 V
POWER
VCC5V
5
6
VCC5V
POWER
5 V
P
–
–
P
0 V
POWER
DGND
7
8
DGND
POWER
0 V
P
–
–
P
0 V
POWER
DGND
9
10
DGND
POWER
0 V
P
–
–
P
0 V
POWER
DGND
11
12
DGND
POWER
0 V
P
–
K04[
∗
] I 2.4 V TOUCH TSX1 13 14 TSY1 TOUCH 2.4 V I J07[
∗
]
L05[
∗
] I 2.4 V TOUCH TSX2 15 16 TSY2 TOUCH 2.4 V I J06[
∗
]
–
P
0 V
POWER
DGND
17
18
DGND
POWER
0 V
P
–
11[
∗
] P 3.3 V PMIC LICELL 19 20 GLBRST# PMIC 3.3 V IIPU G07[
∗
]
G08[
∗
] IIPU 1.5 V PMIC PWRON 21 22 RESET_OUT# PMIC 3.3 V OOD –
L03
O
3.3 V
LCD
LCD_BLT_EN
23
24
LCD_PWR_EN
LCD
3.3 V
O
M04
B07
O
3.3 V
LCD
LCD_CONTR ST
25
26
LCD_RESET
LCD
3.3 V
O
L04
–
P
0 V
POWER
DGND
27
28
DGND
POWER
0 V
P
–
J01
O
3.3 V
U RT2
U RT2_TXD
29
30
U RT1_RXD
U RT1
3.3 V
I
J02
K04
I
3.3 V
U RT2
U RT2_RXD
31
32
U RT1_TXD
U RT1
3.3 V
O
J03
K03
I
3.3 V
U RT2
U RT2_RTS#
33
34
U RT3_RXD
U RT3
3.3 V
I
L02
K05
O
3.3 V
U RT2
U RT2_CTS#
35
36
U RT3_TXD
U RT3
3.3 V
O
L05
–
P
0 V
POWER
DGND
37
38
DGND
POWER
0 V
P
–
E05
O
3.3 V
C N2
C N2_TX
39
40
C N1_TX
C N1
3.3 V
O
C04
E06
I
3.3 V
C N2
C N2_RX
41
42
C N1_RX
C N1
3.3 V
I
D05
D06
I
3.3 V
I2S
I2S_DIN
43
44
I2S_SCLK
I2S
3.3 V
O
C05
E07
O
3.3 V
I2S
I2S_LRCLK
45
46
I2S_DOUT
I2S
3.3 V
O
B03
–
P
0 V
POWER
DGND
47
48
DGND
POWER
0 V
P
–
C08
O
3.3 V
I2S
I2S_MCLK
49
50
SPDIF_OUT
SPDIF
3.3 V
O
03
–
P
0 V
POWER
DGND
51
52
SPDIF_IN
SPDIF
3.3 V
I
C06
B05
O
3.3 V
FIRI
FIRI_TXD
53
54
FIRI_RXD
FIRI
3.3 V
I
04
D04
I
/
O
PU
3.3 V
I2C2
I2C2_SD
55
56
I2C3_SD
I2C3
3.3 V
I/O
B06
F06
I
/
O
PU
3.3 V
I2C2
I2C2_SCL
57
58
I2C3_SCL
I2C3
3.3 V
I/O
05
–
P
0 V
POWER
DGND
59
60
DGND
POWER
0 V
P
–
06
I/O
3.3 V
GPIO
GPIO1_GPIO3
61
62
OWIRE
1
-
WIRE
3.3 V
I/O
D07
07
O
2.775 V
JT G
JT G_TDO
63
64
RESET_IN#
CONFIG
3.3 V
I
PU
–
08
I
PU
2.775 V
JT G
JT G_TMS
65
66
JT G_TDI
JT G
2.775 V
I
PU
B08
E09
I
PU
2.775
V
JT G
JT G_TRST#
67
68
JT G_TCK
JT G
2.775 V
I
PD
D09
–
P
0 V
POWER
DGND
69
70
DGND
POWER
0 V
P
–
10
O
[
2
]
S T
S T _TXP
71
72
S T _RXP
S T
[2]
I
B12
B10
O
[2]
S T
S T _TXM
73
74
S T _RXM
S T
[2]
I
12
–
P
0 V
POWER
DGND
75
76
DGND
POWER
0 V
P
–
M05
I
3.3 V
FEC
FEC_INT#
77
78
FEC_RST#
FEC
3.3 V
O
K06
C10
O
3.3 V
FEC
FEC_TX_EN
79
80
FEC_RXD0
FEC
3.3 V
I
C11
F10
O
3.3 V
FEC
FEC_TXD0
81
82
FEC_RXD1
FEC
3.3 V
I
E11
D10
O
3.3 V
FEC
FEC_TXD1
83
84
FEC_RX_DV
FEC
3.3 V
I
D11
E10
O
3.3 V
FEC
FEC_MDC
85
86
FEC_MDIO
FEC
3.3 V
I
/
O
PU
D12
F12
I
3.3 V
FEC
FEC_RX_ER
87
88
FEC_REF_CLK
FEC
3.3 V
I
E12
–
P
0 V
POWER
DGND
89
90
DGND
POWER
0 V
P
–
C07
I
3.3 V
SD
SD_WP
91
92
SD_D T0
SD
3.3 V
I/O
D13
D08
I
3.3 V
SD
SD_CD#
93
94
SD_D T1
SD
3.3 V
I/O
C14
C15
I/O
3.3 V
SD
SD_CMD
95
96
SD_D T2
SD
3.3 V
I/O
D14
E14
O
3.3 V
SD
SD_CLK
97
98
SD_D T3
SD
3.3 V
I/O
E13
–
P
0 V
POWER
DGND
99
100
DGND
POWER
0 V
P
–
19
I/O
[
3
]
USBOTG
USB_OTG_DN
101
102
USB_H1_DN
USBH1
[3]
I/O
B17
B19
I/O
[3]
USBOTG
USB_OTG_DP
103
104
USB_H1_DP
USBH1
[3]
I/O
17
–
P
0 V
POWER
DGND
105
106
DGND
POWER
0 V
P
–
C16
I
3.3 V
USBOTG
USB_OTG_ID
107
108
USB_H1_VBUS
USBH1
5.0 V
I
D15
E15
I
5.0 V
USBOTG
USB_OTG_VBUS
109
110
BOOT_MODE0
CONFIG
2.775 V
I
PD
C18
–
P
2.775 V
POWER
VCC2V775
111
112
BOOT_MODE1
CONFIG
2.775 V
I
PU
B20
C17
O
3.3 V
SPI
SPI_SS0#
113
114
SPI_SS2#
SPI
3.3 V
O
F16
20
I
3.3 V
SPI
SPI_MISO
115
116
SPI_SS1#
SPI
3.3 V
O
F17
E16
O
3.3 V
SPI
SPI_SCLK
117
118
SPI_MOSI
SPI
3.3 V
O
F18
–
P
0 V
POWER
DGND
119
120
DGND
POWER
0 V
P
–
∗ No. of PMIC ball.
2 See (3), Serial T specification 2.6.
3 See (4), USB 2.0 specification.

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 11
4.1.2 IC address mapping
Illustration 3: Block diagram IC buses
Both IC buses of the TQMa53 are used on the STK-MBa53 (IC2 and IC3).
Table 9 and Table 10 show the internally used device addresses.
The IC buses IC2 and IC3 are also routed on the headers X18 and X19.
IC3 is level-shifted to 5 V and also available at the DVI receptacle X5 (see also section 4.2.7, DVI).
It is also possible to customise 0 to 2 of the IC addresses for the temperature sensor and the I/O expander according to own
requirements by placement option.
Table 11 and Table 12 show the possible address configurations.
Table 9: IC address mapping (IC2 bus)
Device Ref. Device address
Hex MSB Binary LSB
TQMa53
TQMa53TQMa53
TQMa53
PMIC
(MC34708VM) – 0x08 0 0 0 1 0 0 0 ( 0)
Temperature sensor
(LM75 ) – 0x48 1 0 0 1 0 ( 2) 0 ( 1) 0 ( 0)
EEPROM
(M24C64) – 0x50 1 0 1 0 0 ( 2) 0 ( 1) 0 ( 0)
STK
STKSTK
STK-
--
-MBa53
MBa53MBa53
MBa53
udio Codec
(SGTL5000XN 3) D12 0x0 0 0 0 1 0 1 0
I/O extension
(PC 9554) D9 0x20
(configurable) 0 1 0 0 0 ( 2) 0 ( 1) 0 ( 0)
Temperature sensor
(LM75 ) D10 0x49
(configurable) 1 0 0 1 0 ( 2) 0 ( 1) 1 ( 0)

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 12
Table 10: IC address mapping (IC3 bus)
Device Ref Device address
Hex MSB Binary LSB
STK
STKSTK
STK-
--
-MBa53
MBa53MBa53
MBa53
DVI transmitter
(TFP410) D8 0x38 0 1 1 1 0 ( 3) 0 ( 2) 0 ( 1)
DVI connector
(Version DDC2B) X5 0x50 1 0 1 0 0 0 0
DVI connector
(Version DDC / CI) X5 0x37 0 1 1 0 1 1 1
DVI connector
(Version E-DDC) X5 0x30 0 1 1 0 0 0 0
Table 11: Possible configurations of the IC addresses for the I/O expander
Device address Resistors Remark
Hex 2 1 0 R66 R67 R64 R65 R62 R63
0x20 0 0 0 0 Ω n.a. 0 Ω n.a. 0 Ω n.a. Default
0x21 0 0 1 0 Ω n.a. 0 Ω n.a. n.a. 10 kΩ
0x22 0 1 0 0 Ω n.a. n.a. 10 kΩ 0 Ω n.a.
0x23 0 1 1 0 Ω n.a. n.a. 10 kΩ n.a. 10 kΩ
0x24 1 0 0 n.a. 10 kΩ 0 Ω n.a. 0 Ω n.a.
0x25 1 0 1 n.a. 10 kΩ 0 Ω n.a. n.a. 10 kΩ
0x26 1 1 0 n.a. 10 kΩ n.a. 10 kΩ 0 Ω n.a.
0x27 1 1 1 n.a. 10 kΩ n.a. 10 kΩ n.a. 10 kΩ
Table 12: Possible configurations of the IC addresses for the temperature sensor
Device address Resistors Remark
Hex 2 1 0 R72 R73 R70 R71 R68 R69
0x48 0 0 0 0 Ω n.a. 0 Ω n.a. 0 Ω n.a.
0x49 0 0 1 0 Ω n.a. 0 Ω n.a. n.a. 10 kΩ Default
0x4 0 1 0 0 Ω n.a. n.a. 10 kΩ 0 Ω n.a.
0x4B 0 1 1 0 Ω n.a. n.a. 10 kΩ n.a. 10 kΩ
0x4C 1 0 0 n.a. 10 kΩ 0 Ω n.a. 0 Ω n.a.
0x4D 1 0 1 n.a. 10 kΩ 0 Ω n.a. n.a. 10 kΩ
0x4E 1 1 0 n.a. 10 kΩ n.a. 10 kΩ 0 Ω n.a.
0x4F 1 1 1 n.a. 10 kΩ n.a. 10 kΩ n.a. 10 kΩ
ttention: destruction or malfunction
ttention: destruction or malfunctionttention: destruction or malfunction
ttention: destruction or malfunction
There are no pull-ups for the IC3 bus on the STK-MBa53.
On a carrier board these pull-ups have to be provided, however.
The pin headers X18 and X19 as well as the DVI receptacle X5 are described in sections 4.2.13, or 4.2.7.

User's Manual l STK-MBa53 UM 100 l © 2013 TQ-Group Page 13
4.1.3 I/O extension
GPIOs are required for some communication interfaces (e.g., DVI) to read status signals, or to display control signals.
GPIO port expander PC 9554, which is connected to IC bus IC2, is provided on the STK-MBa53 for this purpose.
The IC address can be configured (see Table 9 in section 4.1.2, IC address mapping).
Illustration 4: Block diagram I/O extension
To detect events using an interrupt the INT# output of the expander can optionally be used over GPIO5_GPIO0.
Table 13 shows the placement option.
Table 13: Configuration INT# signal
Mode R140 R180 Remark
INT# available 0 Ω 10 kΩ GPIO5_GPIO0 is additionally
available at header X18
INT# not available n.a. n.a.