TQ-Systems TQMa6x User manual

TQMa6x & TQMa6xP
User's Manual
TQMa6x & TQMa6xP UM 0403
19.09.2019

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL ........................................................................................................................................................................1
1.1 Copyright and license expenses .....................................................................................................................................................1
1.2 Registered trademarks.......................................................................................................................................................................1
1.3 Disclaimer...............................................................................................................................................................................................1
1.4 Imprint.....................................................................................................................................................................................................1
1.5 Tips on safety ........................................................................................................................................................................................2
1.6 Symbols and typographic conventions........................................................................................................................................2
1.7 Handling and ESD tips........................................................................................................................................................................2
1.8 Naming of signals ................................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge..........................................................................................................3
2. BRIEF DESCRIPTION.............................................................................................................................................................................4
2.1 Key functions and characteristics ...................................................................................................................................................4
3. ELECTRONICS ........................................................................................................................................................................................4
3.1 System overview..................................................................................................................................................................................4
3.1.1 System architecture / block diagram.............................................................................................................................................4
3.1.2 Functionality .........................................................................................................................................................................................5
3.2 System components...........................................................................................................................................................................6
3.2.1 i.MX6........................................................................................................................................................................................................6
3.2.1.1 i.MX6 derivatives..................................................................................................................................................................................6
3.2.1.2 eFUSEs.....................................................................................................................................................................................................6
3.2.1.3 i.MX6 errata............................................................................................................................................................................................6
3.2.1.4 Boot modes............................................................................................................................................................................................7
3.2.1.5 Boot configuration ..............................................................................................................................................................................8
3.2.1.6 Boot interfaces......................................................................................................................................................................................9
3.2.1.7 Boot device eMMC ..............................................................................................................................................................................9
3.2.1.8 Boot device SPI NOR flash.............................................................................................................................................................. 10
3.2.1.9 Boot device SD card......................................................................................................................................................................... 11
3.2.2 Memory................................................................................................................................................................................................ 12
3.2.2.1 DDR3L SDRAM ................................................................................................................................................................................... 12
3.2.2.2 eMMC NAND flash............................................................................................................................................................................ 13
3.2.2.3 SPI NOR flash...................................................................................................................................................................................... 13
3.2.2.4 EEPROM ............................................................................................................................................................................................... 14
3.2.3 RTC......................................................................................................................................................................................................... 15
3.2.4 Temperature sensor......................................................................................................................................................................... 15
3.2.5 Interfaces............................................................................................................................................................................................. 16
3.2.5.1 Overview.............................................................................................................................................................................................. 16
3.2.5.2 AUDMUX.............................................................................................................................................................................................. 17
3.2.5.3 CCM....................................................................................................................................................................................................... 17
3.2.5.4 ECSPI..................................................................................................................................................................................................... 17
3.2.5.5 ENET...................................................................................................................................................................................................... 18
3.2.5.6 FLEXCAN.............................................................................................................................................................................................. 20
3.2.5.7 GPIO ...................................................................................................................................................................................................... 20
3.2.5.8 HDMI..................................................................................................................................................................................................... 21
3.2.5.9 I2C........................................................................................................................................................................................................... 21
3.2.5.10 I2C / ENET-Patch Variants................................................................................................................................................................ 22
3.2.5.11 IPU ......................................................................................................................................................................................................... 23
3.2.5.12 LDB ........................................................................................................................................................................................................ 24
3.2.5.13 MIPI_CSI............................................................................................................................................................................................... 25
3.2.5.14 MIPI_DSI............................................................................................................................................................................................... 25
3.2.5.15 MLB ....................................................................................................................................................................................................... 25
3.2.5.16 PCIe ....................................................................................................................................................................................................... 26
3.2.5.17 PWM...................................................................................................................................................................................................... 26
3.2.5.18 SATA...................................................................................................................................................................................................... 26
3.2.5.19 SJC ......................................................................................................................................................................................................... 27
3.2.5.20 S/PDIF................................................................................................................................................................................................... 27

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page ii
TABLE OF CONTENTS (continued)
3.2.5.21 Tamper................................................................................................................................................................................................. 27
3.2.5.22 UART ..................................................................................................................................................................................................... 28
3.2.5.23 USB ........................................................................................................................................................................................................ 29
3.2.5.24 uSDHC .................................................................................................................................................................................................. 29
3.2.5.25 Watchdog............................................................................................................................................................................................ 30
3.2.5.26 XTAL...................................................................................................................................................................................................... 30
3.2.6 Reset ..................................................................................................................................................................................................... 31
3.2.7 Power supply...................................................................................................................................................................................... 32
3.2.7.1 Overview TQMa6x power supply................................................................................................................................................. 32
3.2.7.2 Voltage monitoring VCC5V............................................................................................................................................................ 33
3.2.7.3 Power consumption TQMa6x ....................................................................................................................................................... 34
3.2.7.4 Power-Up sequence TQMa6x / carrier board........................................................................................................................... 35
3.3 TQMa6x interface.............................................................................................................................................................................. 35
3.3.1 Pin multiplexing................................................................................................................................................................................ 35
3.3.2 Pinout connector X1........................................................................................................................................................................ 36
3.3.3 Pinout connector X2........................................................................................................................................................................ 38
3.3.4 Pinout connector X3........................................................................................................................................................................ 40
3.3.5 Pinout differences connector X2, TQMa6x Rev. 02xx / Rev. 04xx ...................................................................................... 40
4. MECHANICS........................................................................................................................................................................................ 41
4.1 Connectors.......................................................................................................................................................................................... 41
4.2 Dimensions......................................................................................................................................................................................... 41
4.3 Component placement................................................................................................................................................................... 43
4.4 Adaptation to the environment................................................................................................................................................... 44
4.5 Protection against external effects.............................................................................................................................................. 44
4.6 Thermal management..................................................................................................................................................................... 44
4.7 Structural requirements.................................................................................................................................................................. 44
4.8 Notes of treatment........................................................................................................................................................................... 44
5. SOFTWARE .......................................................................................................................................................................................... 45
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS.................................................................................................. 45
6.1 EMC ....................................................................................................................................................................................................... 45
6.2 ESD ........................................................................................................................................................................................................ 45
6.3 Operational safety and personal security.................................................................................................................................. 45
6.4 Climatic and operational conditions .......................................................................................................................................... 46
6.5 Shock and Vibration......................................................................................................................................................................... 47
6.6 Reliability and service life............................................................................................................................................................... 47
6.7 Environmental protection.............................................................................................................................................................. 48
6.7.1RoHS...................................................................................................................................................................................................... 48
6.7.2 WEEE®................................................................................................................................................................................................... 48
6.7.3 REACH®................................................................................................................................................................................................ 48
6.7.4 EuP......................................................................................................................................................................................................... 48
6.7.5 Battery.................................................................................................................................................................................................. 48
6.7.6 Packaging............................................................................................................................................................................................ 48
6.7.7 Other entries ...................................................................................................................................................................................... 48
7. APPENDIX............................................................................................................................................................................................ 49
7.1 Acronyms and definitions.............................................................................................................................................................. 49
7.2 References........................................................................................................................................................................................... 51

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page iii
TABLE DIRECTORY
Table 1: Terms and Conventions .............................................................................................................................................................2
Table 2: Processor derivatives...................................................................................................................................................................6
Table 3: Boot modes and BT_FUSE_SEL ................................................................................................................................................7
Table 4: General boot settings..................................................................................................................................................................8
Table 5: Boot configuration eMMC at uSDHC3 ...................................................................................................................................9
Table 6: uSDHC3 eMMC modes................................................................................................................................................................9
Table 7: Boot configuration SPI NOR flash at eCSPI1...................................................................................................................... 10
Table 8: Boot configuration SD card at uSDHC2.............................................................................................................................. 11
Table 9: uSDHC2 SD card modes .......................................................................................................................................................... 11
Table 10: i.MX6 SDRAM interface according to i.MX6 derivative.................................................................................................. 12
Table 11: DDR3L SDRAM memory size options.................................................................................................................................. 12
Table 12: DDR3L SDRAM address range ............................................................................................................................................... 12
Table 13: SPI NOR flash assembly options............................................................................................................................................ 13
Table 14: EEPROM, component ............................................................................................................................................................... 14
Table 15: EEPROM, TQMa6x-specific data............................................................................................................................................ 14
Table 16: Current consumption RTC at pin LICELL ............................................................................................................................ 15
Table 17: Temperature sensor.................................................................................................................................................................. 15
Table 18: Internally used interfaces........................................................................................................................................................ 16
Table 19: Externally available interfaces ............................................................................................................................................... 16
Table 20: Signals AUD3 .............................................................................................................................................................................. 17
Table 21: Signals CCM................................................................................................................................................................................. 17
Table 22: Signals ECSPI1, ECSPI5 ............................................................................................................................................................. 17
Table 23: Signals RGMII .............................................................................................................................................................................. 18
Table 24: ENET-Patch variants.................................................................................................................................................................. 19
Table 25: Signals FLEXCAN........................................................................................................................................................................ 20
Table 26: Signals GPIO................................................................................................................................................................................ 20
Table 27: Signals HDMI............................................................................................................................................................................... 21
Table 28: Signals I2C..................................................................................................................................................................................... 21
Table 29: I2C address assignment............................................................................................................................................................ 21
Table 30: Signals DISP0 .............................................................................................................................................................................. 23
Table 31: Signals LVDS0, LVDS1............................................................................................................................................................... 24
Table 32: Signals MIPI_CSI......................................................................................................................................................................... 25
Table 33: Signals MIPI_DSI ........................................................................................................................................................................ 25
Table 34: Signals MLB ................................................................................................................................................................................. 25
Table 35: Signals PCIe ................................................................................................................................................................................. 26
Table 36: Signals PWM................................................................................................................................................................................ 26
Table 37: Signals SATA ............................................................................................................................................................................... 26
Table 38: JTAG modes ................................................................................................................................................................................ 27
Table 39: Signals JTAG................................................................................................................................................................................ 27
Table 40: Signals S/PDIF............................................................................................................................................................................. 27
Table 41:Signal TAMPER ........................................................................................................................................................................... 27
Table 42: Signals UARTs ............................................................................................................................................................................. 28
Table 43: Signals USB_H1 .......................................................................................................................................................................... 29
Table 44: Signals USB_OTG....................................................................................................................................................................... 29
Table 45: Signals uSDHC2.......................................................................................................................................................................... 29
Table 46:Signal WDOG .............................................................................................................................................................................. 30
Table 47: Signals XTAL................................................................................................................................................................................ 30
Table 48: Reset signals................................................................................................................................................................................ 31
Table 49: Power consumption TQMa6x................................................................................................................................................ 34

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page iv
TABLE DIRECTORY (continued)
Table 50: Pinout connector X1................................................................................................................................................................. 36
Table 51: Pinout connector X2................................................................................................................................................................. 38
Table 52: Pinout connector X3................................................................................................................................................................. 40
Table 53: Pinout differences TQMa6x revision 02xx and TQMa6x revision 04xx ..................................................................... 40
Table 54: TQMa6x, connectors................................................................................................................................................................. 41
Table 55: Carrier board mating connectors......................................................................................................................................... 41
Table 56: TQMa6x, heights ....................................................................................................................................................................... 41
Table 57: Labels on TQMa6x..................................................................................................................................................................... 43
Table 58: Climate and operational conditions extended temperature range –25 °C to +85 °C.......................................... 46
Table 59: Climate and operational conditions industrial temperature range –40 °C to +85 °C .......................................... 46
Table 60: Shock resistance ........................................................................................................................................................................ 47
Table 61: Vibration resistance.................................................................................................................................................................. 47
Table 62: Acronyms..................................................................................................................................................................................... 49
Table 63: Further applicable documents.............................................................................................................................................. 51
ILLUSTRATION DIRECTORY
Illustration 1: Block diagram TQMa6x...............................................................................................................................................................4
Illustration 2: Block diagram i.MX6....................................................................................................................................................................6
Illustration 3: Block diagram DDR3L SDRAM connection........................................................................................................................ 12
Illustration 4: Block diagram eMMC NAND flash connection................................................................................................................. 13
Illustration 5: Block diagram SPI NOR flash connection........................................................................................................................... 13
Illustration 6: Block diagram EEPROM interface......................................................................................................................................... 14
Illustration 7: Block diagram RTC .................................................................................................................................................................... 15
Illustration 8: Block diagram temperature sensor interface................................................................................................................... 15
Illustration 9: ENET-Patch Variant “A”............................................................................................................................................................ 22
Illustration 10: ENET-Patch Variant “B” ............................................................................................................................................................ 22
Illustration 11: ENET-Patch Variant “C” ............................................................................................................................................................ 22
Illustration 12: Block diagram UART interfaces............................................................................................................................................. 28
Illustration 13: Block diagram Reset ................................................................................................................................................................. 31
Illustration 14: Block diagram power supply ................................................................................................................................................. 32
Illustration 15: Block diagram PMIC signals ................................................................................................................................................... 32
Illustration 16: Block diagram VCC5V monitoring........................................................................................................................................ 33
Illustration 17: Block diagram power supply carrier board....................................................................................................................... 35
Illustration 18: TQMa6x dimensions, side view............................................................................................................................................. 41
Illustration 19: TQMa6x dimensions, top view.............................................................................................................................................. 42
Illustration 20: TQMa6x dimensions, top view
through
TQMa6x........................................................................................................... 42
Illustration 21: TQMa6x, component placement top.................................................................................................................................. 43
Illustration 22: TQMa6x, component placement bottom.......................................................................................................................... 43

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page v
REVISION HISTORY
Rev. Date Name Pos. Modification
0203 10.02.2018 Petz Initial document
0400 19.04.2018 Petz All Complete rework, DualPlus and QuadPlus CPUs added
0401 21.10.2018 Petz
All
Table 10
3.2.7.4
3.2.5.23, 6.5, Illustration 22
Table 58, Table 59
Formatting, links updated,
Clocks corrected
Warning updated
Updated
“Package temperature” replaced with “Case temperature”
Case temperature DDR3L SDRAM changed to +95 °C
0402 29.04.2019 Petz 6.5 Added
0403 19.09.2019 Petz
1.9
Table 4
Footnote 4
Footnote 5
3.3.5
Table 53
Link to Yocto added
CPU derivate-dependent BOOT_CFG3[1:0] settings added
Updated
Added
Chapter headline added
“X2-“ in column “Pin” added

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page 1
1.
ABOUT THIS MANUAL
1.1
Copyright and license expenses
Copyright protected © 2019 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2
Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3
Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the Starterkit MBa6x or parts of the schematics of the MBa6x, you must evaluate it and determine if it is suitable for
your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other
warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where
prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBa6x or schematics used, regardless of the legal theory asserted.
1.4
Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
Web: TQ-Group

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page 2
1.5
Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6
Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and may damage
or destroy the component.
This symbol indicates a possible source of danger.
Ignoring the instructions described can cause health damage, or damage the hardware.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, contents, file names, or menu items.
1.7
Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is not to touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the TQMa6x and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page 3
1.8
Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9
Further applicable documents / presumed knowledge
•
Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•
Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•
Chip errata:
It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•
Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•
General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa6x circuit diagram
•MBa6x User's Manual
•i.MX6 Data Sheets
•i.MX6 Reference Manuals
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•Yocto documentation: support.tq-group.com/en/arm/tqma6x/yocto/meta-tq_qs
•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma6x

User's Manual l TQMa6x & TQMa6xP UM 0403 l © 2019, TQ-Systems GmbH Page 4
2.
BRIEF DESCRIPTION
This User's Manual describes the hardware of the TQMa6x revision 04xx, and refers to some software settings.
A certain derivative of the TQMa6x does not necessarily provide all features described in this User's Manual.
Functional differences between Dual/Quad and DualPlus/QuadPlus are referred to in the relevant passages.
This User's Manual does also not replace the NXP i.MX6 Reference Manuals (4), (5), and (6).
The TQMa6x is a universal Minimodule based on the NXP ARM CPU MCIMX6 (i.MX6).
The Cortex™ A9 core of this i.MX6 is typically clocked with 800 MHz.
The TQMa6x extends the TQC product range and offers an outstanding computing performance.
A suitable i.MX6 derivative (Single, Dual, Quad core) can be chosen for each requirement.
2.1
Key functions and characteristics
The TQMa6x provides the following key functions and characteristics:
•NXP i.MX6 (Solo, DualLite, Dual, Quad, DualPlus, QuadPlus)
•Up to 2 Gbyte DDR3L SDRAM, 64 bit interface (except “Solo”: 32 bit interface)
•Up to 8 Gbyte eMMC NAND flash
•Up to 128 Mbyte SPI NOR flash 1
•64 kbit EEPROM
•Temperature sensor
•NXP PMIC (Power Management Integrated Circuit)
•Extended temperature range
•Single 5 V power supply
•Hardware is backward compatible with TQMa6x revision 02xx
All essential i.MX6 pins are routed to the connectors.
There are therefore no restrictions for customers using the TQMa6x with respect to an integrated customised design.
3.
ELECTRONICS
The information provided in this User's Manual is only valid in connection with the tailored boot loader,
which is preinstalled on the TQMa6x, and the BSP provided by TQ-Systems GmbH, see also chapter 5.
3.1
System overview
3.1.1 System architecture / block diagram
i.MX6x
DDR3L SDRAM
Connector 160 pins
eMMC
EEPROM
Temperature
sensor
PMIC
PF0100
DC/DC 4V2
Connector 160 pins
5V
SPI NOR flash
Connector
40 pins Supervisor
Illustration 1: Block diagram TQMa6x
1: It is not possible to boot from an SPI NOR flash bigger than 16 Mbyte.