TQ-Systems MBa62 Series User manual

MBa62xx
Preliminary User's Manual
MBa62xx UM 0001
21.11.2023

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and licence expenses.............................................................................................................................................................1
1.2 Registered trademarks...............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Symbols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips ...............................................................................................................................................................................2
1.8 Naming of signals........................................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge .................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................4
3. TECHNICAL DATA........................................................................................................................................................................................4
3.1 System architecture and functionality..................................................................................................................................................4
3.1.1 Block diagram...............................................................................................................................................................................................4
3.1.2 Functionality.................................................................................................................................................................................................5
4. ELECTRONICS................................................................................................................................................................................................7
4.1 System components...................................................................................................................................................................................7
4.1.1 TQMa62xx......................................................................................................................................................................................................7
4.1.2 I2C address mapping ..................................................................................................................................................................................8
4.1.3 RTC backup supply .....................................................................................................................................................................................8
4.1.4 Reset structure .............................................................................................................................................................................................9
4.1.5 Power supply................................................................................................................................................................................................9
4.2 Communication interfaces.................................................................................................................................................................... 13
4.2.1 UART- / Debug-interface........................................................................................................................................................................ 13
4.2.2 USB interface ............................................................................................................................................................................................. 14
4.2.2.1 USB OTG...................................................................................................................................................................................................... 14
4.2.2.2 USB Hub ...................................................................................................................................................................................................... 15
4.2.3 Ethernet interface .................................................................................................................................................................................... 16
4.2.4 LVDS ............................................................................................................................................................................................................. 17
4.2.5 MIPI-CSI ....................................................................................................................................................................................................... 19
4.2.6 CAN............................................................................................................................................................................................................... 21
4.2.7 RS485 ........................................................................................................................................................................................................... 23
4.2.8 WLAN module ........................................................................................................................................................................................... 23
4.2.9 IoT radio module + SIM card................................................................................................................................................................. 24
4.2.10 SD card......................................................................................................................................................................................................... 26
4.2.11 PRU ............................................................................................................................................................................................................... 27
4.2.12 JTAG interface ........................................................................................................................................................................................... 27
4.3 Audio............................................................................................................................................................................................................ 28
4.4 Analog Frontend ...................................................................................................................................................................................... 29
4.4.1 Digital IOs ................................................................................................................................................................................................... 33
4.4.2 Headers X26, X27, X28 ............................................................................................................................................................................ 34
4.5 Diagnosis- and user interfaces ............................................................................................................................................................. 36
4.5.1 Diagnosis LEDs.......................................................................................................................................................................................... 36
4.5.2 Navigation button.................................................................................................................................................................................... 36
4.5.3 Reset buttons............................................................................................................................................................................................. 37
4.5.4 Boot-Mode configuration...................................................................................................................................................................... 37
5. SOFTWARE.................................................................................................................................................................................................. 39
6. MECHANICS................................................................................................................................................................................................ 39
6.1 Dimensions ................................................................................................................................................................................................ 39
6.2 Thermal management............................................................................................................................................................................ 39
6.3 MBa62xx assembly................................................................................................................................................................................... 40
6.4 Label placement....................................................................................................................................................................................... 42
7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 43
7.1 EMC............................................................................................................................................................................................................... 43
7.2 ESD................................................................................................................................................................................................................ 43
7.3 Operational safety and personal security ......................................................................................................................................... 43
7.4 Intended Use ............................................................................................................................................................................................. 43
7.5 Export Control and Sanctions Compliance ...................................................................................................................................... 44
7.6 Warranty...................................................................................................................................................................................................... 44
8. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 45
8.1 Protection against external effects ..................................................................................................................................................... 45

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page ii
8.2 Reliability and service life....................................................................................................................................................................... 45
9. ENVIRONMENT PROTECTION................................................................................................................................................................ 46
9.1 RoHS............................................................................................................................................................................................................. 46
9.2 WEEE®.......................................................................................................................................................................................................... 46
9.3 REACH®........................................................................................................................................................................................................ 46
9.4 EuP ................................................................................................................................................................................................................ 46
9.5 Statement on California Proposition 65............................................................................................................................................ 46
9.6 Packaging ................................................................................................................................................................................................... 46
9.7 Batteries ...................................................................................................................................................................................................... 46
9.7.1 General notes ............................................................................................................................................................................................ 46
9.7.2 Lithium batteries ...................................................................................................................................................................................... 46
9.8 Other entries.............................................................................................................................................................................................. 47
10. APPENDIX ................................................................................................................................................................................................... 48
10.1 Acronyms and definitions...................................................................................................................................................................... 48
10.2 References .................................................................................................................................................................................................. 50

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page iii
TABLE DIRECTORY
Table 1: Terms and Conventions.....................................................................................................................................................................2
Table 2: Overview interfaces.............................................................................................................................................................................5
Table 3: .....................................................................................................................................6
Table 4: I2C1 slave address mapping of the TQMa62xx module ..........................................................................................................8
Table 5: Reset signals..........................................................................................................................................................................................9
Table 6: Electrical parameters of the supply voltages ........................................................................................................................... 12
Table 7: LVDS pinout X21 ............................................................................................................................................................................... 18
Table 8: LVDS pinout X22).............................................................................................................................................................................. 18
Table 9: MIPI-CSI pinout X20 ......................................................................................................................................................................... 20
Table 10: CAN0 pinout (X12)............................................................................................................................................................................ 22
Table 11: CAN1 pinout (X13)............................................................................................................................................................................ 22
Table 12: CAN termination ............................................................................................................................................................................... 22
Table 13: JTAG signals........................................................................................................................................................................................ 27
Table 14: Pinout JTAG interface X29 (Segger TI-CTI-20 Adapter)......................................................................................................... 27
Table 15: Placement ootions for audio interface....................................................................................................................................... 29
Table 16: Pinout X30........................................................................................................................................................................................... 30
Table 17: Pinout Digital IOs, X35..................................................................................................................................................................... 33
Table 18: Pinout header X26............................................................................................................................................................................ 35
Table 19: Pinout header X27............................................................................................................................................................................ 35
Table 20: Pinout header X28............................................................................................................................................................................ 35
Table 21: Status LEDs ......................................................................................................................................................................................... 36
Table 22: Reset buttons..................................................................................................................................................................................... 37
Table 23: Boot mode configuration............................................................................................................................................................... 38
Table 24: Pinout X33........................................................................................................................................................................................... 39
Table 25: Labels.................................................................................................................................................................................................... 42
Table 26: Climatic and operational conditions MBa62xx........................................................................................................................ 45
Table 27: Acronyms ............................................................................................................................................................................................ 48
Table 28: Further applicable documents ..................................................................................................................................................... 50

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page iv
FIGURE DIRECTORY
Figure 1: Block diagram TQMa62xx TQMa62xxL-ADAP MBa62xx ...................................................................................................4
Figure 2: Block diagram MBa62xx.....................................................................................................................................................................4
Figure 3: Block diagram TQMa62xx..................................................................................................................................................................7
Figure 4: Block diagram I2C bus of the TQMa62xx module.......................................................................................................................8
Figure 5: Placement battery holder X3 ...........................................................................................................................................................8
Figure 6: Position X5 and X6............................................................................................................................................................................ 10
Figure 7: Block diagram power supply chain............................................................................................................................................. 11
Figure 8: MBa62xx Input circuit...................................................................................................................................................................... 11
Figure 9: MBa62xx Power up sequenz ......................................................................................................................................................... 13
Figure 10: Block diagram UART- / Debug-interface ................................................................................................................................... 13
Figure 11: Position X7 .......................................................................................................................................................................................... 14
Figure 12: Block diagram USB OTG interface................................................................................................................................................ 14
Figure 13: Position of USB interface ................................................................................................................................................................ 15
Figure 14: Block Diagram USB hub.................................................................................................................................................................. 15
Figure 15: Position USB, X11.............................................................................................................................................................................. 16
Figure 16: Block diagram Ethernet interface ................................................................................................................................................ 16
Figure 17: Position of X14 and X15.................................................................................................................................................................. 17
Figure 18: Block diagram LVDS......................................................................................................................................................................... 17
Figure 19: Position X21 and X22....................................................................................................................................................................... 19
Figure 20: Block diagram MIPI-CSI interface................................................................................................................................................. 19
Figure 21: Position X20........................................................................................................................................................................................ 21
Figure 22: Block diagram CAN........................................................................................................................................................................... 21
Figure 23: Position of CAN connectors and DIP switch............................................................................................................................. 22
Figure 24: Block diagram RS485 ....................................................................................................................................................................... 23
Figure 25: Position of RS485, X8 ....................................................................................................................................................................... 23
Figure 26: Block diagram WLAN module....................................................................................................................................................... 24
Figure 27: Position WLAN module and antenna sockets ANT1 and ANT2.......................................................................................... 24
Figure 28: Block diagram IoT radio module.................................................................................................................................................. 25
Figure 29: Position IoT radio module + u.FL + Micro-SIM card port...................................................................................................... 25
Figure 30: Block diagram SD card slot, X3 ..................................................................................................................................................... 26
Figure 31: Position SD-Card, X9 ........................................................................................................................................................................ 26
Figure 32: Block diagram JTAG ......................................................................................................................................................................... 27
Figure 33: Position of JTAG, X29....................................................................................................................................................................... 28
Figure 34: Block diagram audio interface...................................................................................................................................................... 28
Figure 35: Block diagram Analog Frontend.................................................................................................................................................. 29
Figure 36: Position X30........................................................................................................................................................................................ 30
Figure 37: Analogue interface voltage-current measurement ............................................................................................................... 31
Figure 38: Analogue interface voltage ........................................................................................................................................................... 31
Figure 39: Analogue interface RTD measurement...................................................................................................................................... 32
Figure 40: Analogue interface TC measurement......................................................................................................................................... 32
Figure 41: Block diagram Digital IOs ............................................................................................................................................................... 33
Figure 42: Position X16........................................................................................................................................................................................ 34
Figure 43: Position of headers X26, X27, X28 ............................................................................................................................................... 34
Figure 44: Position of navigation buttons S11............................................................................................................................................. 36
Figure 45: Position Reset buttons S1 / S2 / S3.............................................................................................................................................. 37
Figure 46: Block diagram boot source............................................................................................................................................................ 37
Figure 47: Placement DIP switches for boot source................................................................................................................................... 38
Figure 48: Position X4 .......................................................................................................................................................................................... 39
Figure 49: MBa62xx, component placement top........................................................................................................................................ 40
Figure 50: MBa62xx, component placement bottom................................................................................................................................ 41
Figure 51: Label placement................................................................................................................................................................................ 42

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page v
REVISION HISTORY
Rev.
Date
Name
Pos.
Modification
0001
21.11.2023
M. Kreuzer
All
First issue

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 1
1. ABOUT THIS MANUAL
1.1 Copyright and licence expenses
Copyright protected © 2023 by TQ-Systems GmbH.
This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in
electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.
The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless
specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the
present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a
third party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or
of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-
Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information
given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there
is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it
without special notification.
Important Notice:
Before using the Starterkit MBa62xx or parts of the schematics of the MBa62xx, you must evaluate it and determine if it is suitable
for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other
warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where
prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBa62xx or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
Web: TQ-Group

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 2
1.5 Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6 Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol
Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa62xx and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 3
1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•Chip errata:
It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.
•Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa62xx circuit diagram
•TQMa62xx Preliminary User's Manual
•Sitara AM62 Data Sheets
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•PTXdist documentation: www.ptxdist.de
•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma62xx

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 4
2. BRIEF DESCRIPTION
The MBa62xx is designed as a carrier board for the TQMa62xx and TQMa62xxL All TQMa62xx interfaces are available on the
MBa62xx. The AM62x CPU characteristics can be evaluated, and therefore the software development for a TQMa62xx project can
be started immediately.
The MBa62xx supports all TQMa62xx as well as TQMa62xxL (via adapter TQMa62xxL-ADAP) modules. In the further course of this
User Manual, only the TQMa62xx module is mentioned for the sake of simplicity - however, all statements apply accordingly to
the TQMa62xxL module as well.
Figure 1: Block diagram TQMa62xx TQMa62xxL-ADAP MBa62xx
3. TECHNICAL DATA
3.1 System architecture and functionality
3.1.1 Block diagram
Figure 2: Block diagram MBa62xx

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 5
3.1.2 Functionality
The system core is the TQMa62xx processor module with Texas Instruments Sitara AM62x CPU.
The TQMa62xx connects all peripheral components to each other.
In addition to the standard communication interfaces like USB, Ethernet, RS485 etc. all other available signals of the TQMa62xx
are routed to standard headers.
The following interfaces / functions and user's interfaces are provided on the MBa62xx:
Table 2: Overview interfaces
Interface
Qty.
Type of connector
Remark
Ethernet
1000BASE-T
1
RJ45 receptacle
Receptacle with integrated magnetics and PoE+
1
RJ45 receptacle
Receptacle with integrated magnetics
CAN
2
Phoenix basic housing
gal. separated, 3-pole
USB2.0 OTG
1
USB receptacle Type AB
(Micro)
USB2.0 OTG
USB 2.0 Host
2
USB receptacle Type A
(stacked)
max. 500 mA per port
Debug-USB
1
USB receptacle Type Micro
B
2 x COM ports for Debug-UART
Analogue IN
1
Phoenix basic housing
Lay flat version, 8x ADC
Digital IOs
1
Phoenix basic housing
Lay flat version, 4x IN, 4x OUT, 24 V output for mainboard supply,
24 V input for HSS
WLAN module
1
2 x u.FL
Antennas for WLAN and wireless mobile
Radio module
1
2 x u.FL
SIM card holder, antennas for GNSS / Main
RS485
1
Phoenix basic housing
2-pole
SD card
1
Push-Push-Type (Micro)
SDR104 Speed-grade (UHS-I)
Audio
3
Jack socket 3.5 mm
1x Line-Out (Stereo, green)
1x Line-In (Stereo, blue)
1x MIC-In (Mono, pink)
LVDS
2
DF19 hearder
Dual LVDS data (2x 4 lanes),
LVDS control signals (USB2.0, backlight control)
CSI
1
PCB connector
TQ uniform CSI pinout (1x 4 lanes / 1x 2 lanes).
Headers
2
Header, 2.54 mm pitch
1 x PRG0 interface
1 x Factory tests connector
Control signals
Header
1
Header, 1.27 mm pitch
1x SEC (Interface of TQMa62xx)
Battery holder
1
CR2032 holder
Backup battery RTC of TQMa62xx

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Table 3:
Interface
Qty.
Component
Remark
Status-LEDs
2
LED blue
Input supply 24 V Power IN
USB debug interface
1
LED yellow
GPIO-LED
2
LED green / red
PGOOD (of module and mainboard)
1
LED orange
Input supply 24 V Power PoE
2
LED green / yellow
Ethernet LEDs (activity / speed)
5
LED green
IoT Net Status
WLAN
Wireless mobile
Analog Frontend status
GPIO-LED
Reset buttons
2
Push button
PMIC power button
CPU / module reset (cold)
User buttons
2
Push button
CPU Reset (warm)
GPIO (user button)
Boot-Mode configuration
4
DIP switch
4 x Boot mode configuration
CAN termination
2
DIP switch
120 Ohm termination
RS485 termination
1
DIP switch
120 Ohm termination
JTAG
1
20-pole header, 1.27 mm pitch
cTI 20-pin header, Pin 6 is keyed
Fan
1
Header 2.54 mm pitch
4-pole header for PWM control
Power In
1
Jack socket (2.5 mm / 5.5 mm, X5)
Screw terminal 2-pole (X6)
16 V to 30 V

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4. ELECTRONICS
4.1 System components
4.1.1 TQMa62xx
Figure 3: Block diagram TQMa62xx
The TQMa62xx with the AM62x CPU is the central system component. It provides LPDDR4 SDRAM, eMMC, NOR flash and
EEPROM memory.
The available signals are routed to module connector pins. When using the processor signals, it is essential to observe the
multiple assignment of the pins by different processor-internal function units (multiplexing). More detailed information is to be
taken from the accompanying TQMa62xx Preliminary User's Manual.
The TQMa62xx boot behaviour can be customised.
To use the LGA module TQMa62xxL on the MBa62xx an additional adapter board, TQMa62xxL-ADAP, is required. The adapter
board serves as an intermediate board which passes the signals from the LGA pads directly to the connectors.
Attention: Destruction or malfunction
To avoid damage due to mechanical stresses, the module may only be removed from the mainboard
using the MOZIA62X extraction tool.

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4.1.2 I2C address mapping
The accessible I2C buses depend on the pin multiplexing. Only the I2C1 bus is used by the module on the MBa62xx. On the
TQMa62xx or TQMa62xxL the I2C0 bus is permanently provided for its I2C devices. The following devices are connected on the
MBa62xx:
Figure 4: Block diagram I2C bus of the TQMa62xx module
The following table shows the used addresses of all I2C buses:
Table 4: I2C1 slave address mapping of the TQMa62xx module
Bus
Component
Address
Note
I2C1
CSI
depends on Usage
X20
Audio codec
0x18 / 001 1000b
4.1.3 RTC backup supply
For the backup supply of the RTC on the TQMa62xx a lithium battery (3 V coin cell type CR2032) with very low self-discharge is
used on the MBa62xx. The TQMa62xx is supplied via pin V_RTC_IN.
Figure 5: Placement battery holder X3

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4.1.4 Reset structure
On the MBa62xx different possibilities are available for a complete or partial reset (periphery) of the module.
The following signals from the TQMa62xx are used on the MBa62xx:
Table 5: Reset signals
Signal
Type
Level
Description
TQMa62xx_HARD_RST#
I
3.3 V
•Activates power sequencing on module after approx. 200 ms delay (LOW -->
HIGH)
•Pull-up on module
•Connect to GND to activate (e.g. push button)
TQMa62xx_PWRBT#
I
3.3 V
•PMIC Push-Button monitor input:
o600 ms HIGH = ON request
o8 s LOW = OFF request
•Pull-up on module
MCU_PORz
I
1.8 V
•Control of a cold reset
•Pull-up on module
•Connect to GND to activate (e.g. push button)
MCU_RESETz
I
1.8 V
•Control of a warm reset of the MCU domain
•Pull-up on module
•Connect to GND to activate (e.g. push button)
RESET_REQz
I
1.8 V
•Control of a warm reset of the main domain
•Pull-up on module
•Connect to GND to activate (e.g. push button)
TRST#
I
1,8 V
•Connects directly to the TRST# of the module
•Pull-down on module
PORz_OUT
O
1.8 V
•Status signal for a cold reset of the main domain
•Driver on module
MCU_RESETSTATz
O
1.8 V
•Status signal for a warm reset of the MCU domain
•Pull-down on module
RESETSTATz
O
1.8 V
•Status signal for a warm reset of the main domain
•Pull-down on module
TQMa62xx_PGOOD
O
1.8 V
•Status signal that is used to indicate the power sequencing on the module
GPIOx
O
1.8 V
•Activates RESET of various peripherals on the mainboard
•Is controlled by software
Attention: Damage
The periphery on the base board should never be supplied before the module, otherwise the module
may be damaged. This is ensured by the signal PGOOD.
4.1.5 Power supply
The main supply of the MBa62xx is VIN via connector X5 (Type: CUI INC PJ-102BH) or X6 (Type: Lumberg
KRM02), optionally the MBa62xx can be supplied as a powered device via Power Over Ethernet (X14) by a suitable switch (PSE).
Attention: Malfunction
The grouping of Power Over Ethernet is PoE+. This means that the MBa62xx is supplied with a
maximum of 25 W via PoE+. This means that not all interfaces can be used at the same time.

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 10
Figure 6: Position X5 and X6
On the MBa62xx there is a two part supply:
•5V supply
oPermanently activated as soon as the MBa62xx is supplied
oModule supply / Reset button / LED
•Remaining Power Supply
oSupply of the periphery
oSwitched by PGOOD
oSwitched off if PGOOD is not present on the module
The following figure shows all voltage rails on the mainboard. In order to comply with the required power sequencing, the signal
PGOOD is used to control the respective rails.

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 11
Figure 7: Block diagram power supply chain
The following protective circuits are implemented for the input voltage of the MBa62xx:
•Fuse 5A, slow blow
•Excess voltage protection diode
•PI filter
•Inverse-polarity protection
•Capacitors for voltage smoothing
Figure 8: MBa62xx Input circuit
The overvoltage limitation is 31.1 V to 34.4 V.
The mainboard MBa62xx, including TQMa62xx, consumes 86 W under full load (all supply voltages are loaded with maximum
current, e.g. by connecting external modules to the pin headers). The power supply used must be selected accordingly. In most
applications, however, the power consumption will be significantly lower.

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 12
Attention: Overload
The internal voltages (3.3 V, 1.8 V) provided at the starter kit pin headers are not additionally
protected. Technically, an overload of the fuse is therefore possible. The resulting total current
consumption of the MBa62xx should be observed.
Table 6: Electrical parameters of the supply voltages
Parameter
Min.
Typ.
Max.
Unit
Remark
V_5V0
Output voltage
4.941
5
5.059
V
Max. load current
5.3
A
Current Limit
8.3
A
V_3V8
Output voltage
3.756
3.8
3.844
V
Max. load current
2
A
Current Limit
3.9
A
V_3V3
Output voltage
3.276
3.3
3.354
V
Max. load current
5.4
A
Current Limit
7.9
A
V_3V3_SW
Output voltage
3.276
3.3
3.354
V
Max. load current
2.9
A
Current Limit
3
A
V_1V8
Output voltage
1.758
1.8
1.842
V
Max. load current
1.3
A
Current Limit
3.9
A
V_2V5
Output voltage
2.442
2.5
2.560
V
Max. load current
0.63
A
V_1V0
Output voltage
1.044
1.0
1.076
V
Max. load current
0.33
A
V_12V0
Output voltage
11.858
11.995
12.143
V
Max. load current
1.35
A
Current Limit
6.1
A
V_-12V0
Output voltage
-12
V
Max. load current
0.01
A
V_5V0_VBUS_OTG / V_USB_Hx_VBUS
Output voltage
5.0
V
Max. load current
0.5
A
Current Limit
0.5
A
V_1V8_VPP
Output voltage
1.758
1.8
1.842
V
Max. load current
0.4
A
V_5V_CAN
Output voltage
4.825
5.0
5.175
V
Max. load current
0.15
A

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 13
The power sequencing of the mainboard MBa62xx is defined as following:
Figure 9: MBa62xx Power up sequenz
•The 3.3 V for the TQMa62xx is permanently on - so "always" ON.
•The TQMa62xx executes the power sequencing independently and returns a PGOOD signal for the MBa62xx.
•As soon as the PGOOD signal is present, the MBa62xx performs the power sequencing independently. The used
switching regulators / LDOs are controlled by EN and PGOOD signals.
•The time constant between PGOOD and reset of the CPU is approx. 50 ms.
4.2 Communication interfaces
4.2.1 UART- / Debug-interface
To get debug outputs of the CPU, the UART0 and WKUP_UART0 interface of the CPU is used. The used UART of the CPU is
connected to a Micro USB connector (X7) via a USB-to-UART bridge.
Figure 10: Block diagram UART- / Debug-interface

Preliminary User's Manual l MBa62xx UM 0001 l © 2023, TQ-Systems GmbH Page 14
Figure 11: Position X7
4.2.2 USB interface
4.2.2.1 USB OTG
The MBa62xx provides a USB2.0 OTG interface. The USB2.0 interface also serves as boot source (see also chapter 4.5.4).
•Protection circuit for USB0_VBUS according to Reference Manual (1).
•5V power switch depending on the USB ID (GPIO) pin.
Figure 12: Block diagram USB OTG interface