Tq-systems Tqma93 ca series User manual

TQMa93xxCA

User's Manual

TQMa93xxCA UM 0001

13.04.2023

TABLE OF CONTENTS

1. ABOUT THIS MANUAL......................................................................................................................................................................................1

1.1 Copyright and license expenses..................................................................................................................................................................1

1.2 Registered trademarks ....................................................................................................................................................................................1

1.3 Disclaimer ............................................................................................................................................................................................................1

1.4 Imprint...................................................................................................................................................................................................................1

1.5 Tips on safety......................................................................................................................................................................................................2

1.6 Symbols and typographic conventions....................................................................................................................................................2

1.7 Handling and ESD tips.....................................................................................................................................................................................2

1.8 Naming of signals..............................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge.....................................................................................................................3

2. BRIEF DESCRIPTION ..........................................................................................................................................................................................4

2.1 Key functions and characteristics................................................................................................................................................................4

2.2 CPU block diagram ...........................................................................................................................................................................................5

3. ELECTRONICS......................................................................................................................................................................................................6

3.1 Interfaces to other systems and devices...................................................................................................................................................6

3.1.1 Pin multiplexing ................................................................................................................................................................................................6

3.1.2 Pinout TQMa93xxCA........................................................................................................................................................................................7

3.2 System components ........................................................................................................................................................................................9

3.2.1 i.MX 93...................................................................................................................................................................................................................9

3.2.1.1 i.MX 93 derivatives............................................................................................................................................................................................9

3.2.1.2 i.MX 93 errata......................................................................................................................................................................................................9

3.2.1.3 Boot modes ......................................................................................................................................................................................................10

3.2.1.4 Boot configuration......................................................................................................................................................................................... 10

3.2.2 Memory..............................................................................................................................................................................................................11

3.2.2.1 LPDDR4 SDRAM..............................................................................................................................................................................................11

3.2.2.2 eMMC..................................................................................................................................................................................................................11

3.2.2.3 QSPI NOR Flash / NAND Flash.................................................................................................................................................................... 11

3.2.2.4 EEPROM M24C64-D....................................................................................................................................................................................... 12

3.2.2.5 EEPROM with temperature sensor SE97BTP ........................................................................................................................................ 12

3.2.3 Trust Secure Element SE050....................................................................................................................................................................... 12

3.2.4 Accelerometer/Gyroscope.......................................................................................................................................................................... 13

3.2.5 RTC.......................................................................................................................................................................................................................13

3.2.5.1 i.MX 93 internal RTC ......................................................................................................................................................................................13

3.2.5.2 Discrete RTC PCF85063A............................................................................................................................................................................. 13

3.2.6 Interfaces...........................................................................................................................................................................................................14

3.2.6.1 Overview ...........................................................................................................................................................................................................14

3.2.6.2 ADC......................................................................................................................................................................................................................15

3.2.6.3 CAN FD...............................................................................................................................................................................................................15

3.2.6.4 Ethernet / RGMII..............................................................................................................................................................................................16

3.2.6.5 I2C......................................................................................................................................................................................................................... 17

3.2.6.6 JTAG ....................................................................................................................................................................................................................18

3.2.6.7 GPIO ....................................................................................................................................................................................................................18

3.2.6.8 MIPI CSI ..............................................................................................................................................................................................................19

3.2.6.9 MIPI DSI..............................................................................................................................................................................................................19

3.2.6.10 LVDS.................................................................................................................................................................................................................... 20

3.2.6.11 SAI........................................................................................................................................................................................................................ 20

3.2.6.12 SPI ........................................................................................................................................................................................................................21

3.2.6.13 Tamper...............................................................................................................................................................................................................22

3.2.6.14 UART ...................................................................................................................................................................................................................22

3.2.6.15 USB ......................................................................................................................................................................................................................23

3.2.6.16 SD2 (SD-Card)..................................................................................................................................................................................................24

3.2.6.17 External clock sources .................................................................................................................................................................................. 25

3.2.7 Reset and unspecific signals ...................................................................................................................................................................... 25

3.2.8 Power.................................................................................................................................................................................................................. 26

3.2.8.1 Power supply ...................................................................................................................................................................................................26

3.2.8.2 Configurable voltages..................................................................................................................................................................................26

3.2.8.3 Power consumption...................................................................................................................................................................................... 27

3.2.8.4 Voltage monitoring....................................................................................................................................................................................... 27

3.2.8.5 Supply outputs................................................................................................................................................................................................27

3.2.8.6 Power-Up sequence TQMa93xxCA / carrier board............................................................................................................................28

3.2.8.7 Standby and BBSM ........................................................................................................................................................................................ 28

3.2.8.8 PMIC....................................................................................................................................................................................................................28

3.2.9 Impedances...................................................................................................................................................................................................... 29

4. SOFTWARE........................................................................................................................................................................................................ 30

5. MECHANICS......................................................................................................................................................................................................31

5.1 Dimensions....................................................................................................................................................................................................... 31

5.2 Component placement and labeling......................................................................................................................................................32

5.3 Adaptation to the environment ...............................................................................................................................................................34

5.4 Protection against external effects..........................................................................................................................................................34

5.5 Thermal management..................................................................................................................................................................................34

5.6 Structural requirements............................................................................................................................................................................... 34

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................35

6.1 EMC .....................................................................................................................................................................................................................35

6.2 ESD....................................................................................................................................................................................................................... 35

6.3 Shock and Vibration................................................................................................................................................................................... 35

6.4 Climate and operational conditions........................................................................................................................................................ 36

6.5 Operational safety and personal security..............................................................................................................................................36

6.6 Reliability and service life............................................................................................................................................................................36

7. ENVIRONMENT PROTECTION.....................................................................................................................................................................37

7.1RoHS.................................................................................................................................................................................................................... 37

7.2 WEEE®.................................................................................................................................................................................................................37

7.3 REACH®.............................................................................................................................................................................................................. 37

7.4 EuP....................................................................................................................................................................................................................... 37

7.5 Battery................................................................................................................................................................................................................ 37

7.6 Packaging..........................................................................................................................................................................................................37

7.7 Other entries....................................................................................................................................................................................................37

8. APPENDIX.......................................................................................................................................................................................................... 38

8.1 Acronyms and definitions...........................................................................................................................................................................38

8.2 References ........................................................................................................................................................................................................40

TABLE DIRECTORY

Table 1: Terms and conventions ..................................................................................................................................................................................2

Table 2: Pinout TQMa93xxCA, X1.................................................................................................................................................................................7

Table 3: Pinout TQMa93xxCA, X2.................................................................................................................................................................................8

Table 4: i.MX 93 derivatives............................................................................................................................................................................................9

Table 5: Boot configuration i.MX 93.........................................................................................................................................................................10

Table 6: QSPI signals ......................................................................................................................................................................................................11

Table 7: ISO_7816 and ISO_14443 signals.............................................................................................................................................................13

Table 8: TQMa93xxCA interfaces...............................................................................................................................................................................14

Table 9: Pin assignment ADC......................................................................................................................................................................................15

Table 10: CAN FD signals................................................................................................................................................................................................15

Table 11: ENET signals in RGMII mode.......................................................................................................................................................................16

Table 12: Address assignment I2C1 bus.................................................................................................................................................................... 17

Table 13: Pin assignment I2C .........................................................................................................................................................................................17

Table 14: JTAG signals ..................................................................................................................................................................................................... 18

Table 15: GPIO signals......................................................................................................................................................................................................18

Table 16: MIPI CSI signals................................................................................................................................................................................................ 19

Table 17: MIPI DSI signals ............................................................................................................................................................................................... 19

Table 18: LVDS signals..................................................................................................................................................................................................... 20

Table 19: SAI signals .........................................................................................................................................................................................................21

Table 20: Pinning SPI........................................................................................................................................................................................................21

Table 21: Pinning Tamper .............................................................................................................................................................................................. 22

Table 22: UART signals..................................................................................................................................................................................................... 23

Table 23: USB signals........................................................................................................................................................................................................23

Table 24: SD2 signals........................................................................................................................................................................................................ 24

Table 25: CLK signals........................................................................................................................................................................................................25

Table 26: Reset and unspecific signals ......................................................................................................................................................................26

Table 27: Power consumption...................................................................................................................................................................................... 27

Table 28: Voltages provided by TQMa93xxCA .......................................................................................................................................................27

Table 29: PMIC signals .....................................................................................................................................................................................................29

Table 30: Trace impedance recommendations......................................................................................................................................................29

Table 31: TQMa93xxCA heights ...................................................................................................................................................................................31

Table 32: Labels on TQMa93xxCA ...............................................................................................................................................................................33

Table 33: Shock resistance .............................................................................................................................................................................................35

Table 34: Vibration resistance....................................................................................................................................................................................... 35

Table 35: Climate and operational conditions........................................................................................................................................................ 36

Table 36: Acronyms ..........................................................................................................................................................................................................38

Table 37: Further applicable documents..................................................................................................................................................................40

FIGURE DIRECTORY

Figure 1: Block diagram i.MX 93.....................................................................................................................................................................................5

Figure 2: Block diagram TQMa93xxCA (simplified).................................................................................................................................................6

Figure 3: Block diagram eMMC.................................................................................................................................................................................... 11

Figure 4: Block diagram EEPROM................................................................................................................................................................................ 12

Figure 5: Block diagram SE050..................................................................................................................................................................................... 12

Figure 6: Block diagram RTC supply (TQMa93xxCA with discrete RTC)........................................................................................................14

Figure 7: Block diagram ADC........................................................................................................................................................................................ 15

Figure 8: Block diagram CAN........................................................................................................................................................................................15

Figure 9: Block diagram RGMII..................................................................................................................................................................................... 16

Figure 10: Block diagram I2C ...........................................................................................................................................................................................17

Figure 11: Block diagram JTAG interface.................................................................................................................................................................... 18

Figure 12: Block diagram MIPI CSI.................................................................................................................................................................................19

Figure 13: Block diagram MIPI DSI ................................................................................................................................................................................ 19

Figure 14: Block diagram LVDS ...................................................................................................................................................................................... 20

Figure 15: Block diagram SAI3........................................................................................................................................................................................20

Figure 16: Block diagram SPI...........................................................................................................................................................................................21

Figure 17: Block diagram Tamper .................................................................................................................................................................................22

Figure 18: Block diagram UART interfaces.................................................................................................................................................................22

Figure 19: Block diagram USB interfaces....................................................................................................................................................................23

Figure 20: Block diagram SD card interface............................................................................................................................................................... 24

Figure 21: Block diagram external clocks...................................................................................................................................................................25

Figure 22: Block diagram Reset......................................................................................................................................................................................25

Figure 23: Possible power supply of the CPU-rail NVCC_GPIO ..........................................................................................................................26

Figure 24: Block diagram power supply carrier board .......................................................................................................................................... 28

Figure 25: TQMa93xxCA dimensions, top view (dimensions in mm)............................................................................................................... 31

Figure 26: TQMa93xxCA dimensions, side view ......................................................................................................................................................31

Figure 27: TQMa93xxCA dimensions (in mm), view through PCB .................................................................................................................... 32

Figure 28: TQMa93xxCA, component placement top...........................................................................................................................................32

Figure 29: TQMa93xxCA, bottom view........................................................................................................................................................................ 33

Figure 30: Labels on TQMa93xxCA ...............................................................................................................................................................................33

REVISION HISTORY

Rev.

Date

Name

Pos.

Modification

0001

13.4.2023

Kreuzer

First issue

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBa93xxCA or parts of the schematics of the MBa93xxCA, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBa93xxCA or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308 0

Fax: +49 8153 9308 4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and conventions

Symbol

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and may damage

or destroy the component.

This symbol indicates a possible source of danger.

Ignoring the instructions described can cause health damage, or damage the hardware.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa93xxCA and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBa93xxCA circuit diagram

•MBa93xxCA

•i.MX 93 Data Sheet

•i.MX 93 Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMa93xxCA (in progress)

2. BRIEF DESCRIPTION

This User's Manual describes the hardware of the TQMa93xxCA as of revision 0100, in combination with the MBa93xxCA as of

revision 0100 and refers to some software settings. A certain TQMa93xxCA derivative does not necessarily provide all features

described in this User's Manual.

This User's Manual does neither replace the i.MX 93 Reference Manual (1), nor the i.MX 93 Data Sheet (2), nor any other

documents from NXP.

The TQMa93xxCA is a universal Minimodule based on the NXP ARM®Cortex®-A55 based i.MX 93 CPU family, see also Table 4.

2.1 Key functions and characteristics

The TQMa93xxCA extends the TQ-Systems GmbH product range and offers an outstanding computing performance.

All essential i.MX 93 signals are routed to the TQMa93xxCA connectors. There are therefore no restrictions for customers using

the TQMa93xxCA with respect to an integrated customised design. All essential components like CPU, LPDDR4, eMMC, and PMIC

are already integrated on the TQMa93xxCA.

The main features of the TQMa93xxCA are:

•64 bit NXP i.MX 93 CPU, up to 2 × ARM Cortex®-A55 and 1 × Cortex®-M33

•Up to 2 Gbyte of LPDDR4- or LPDDR4X RAM

•Up to 256 Gbyte of eMMC NAND Flash, eMMC standard 5.1

•Up to 256 Mbyte QSPI NOR Flash (optional)

•64 Kbit EEPROM (optional)

•Temperature sensor + EEPROM

•NXP Power Management Integrated Circuit PCA9451

•RTC (optional)

•Trust Secure Element (optional)

•Gyroscope (optional)

•All essential i.MX 93 signals are routed to the TQMa93xxCA connectors

•Single supply voltage 5 V

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