TQ-Systems MBLX2160A User manual

MBLX2160A
User's Manual
MBLX2160A UM 0101
28.02.2022

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page I
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and license expenses.............................................................................................................................................................1
1.2 Registered trademarks...............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Symbols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips...............................................................................................................................................................................2
1.8 Naming of signals........................................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge .................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................4
3. ELECTRONICS................................................................................................................................................................................................5
3.1 TQMLX2160A................................................................................................................................................................................................5
3.1.1 TQMLX2160A mating connectors..........................................................................................................................................................6
3.1.2 TQMLX2160A pinout..................................................................................................................................................................................6
3.1.3 Boot source ................................................................................................................................................................................................ 12
3.1.4 eMMC configuration ............................................................................................................................................................................... 13
3.1.5 NOR flash swap ......................................................................................................................................................................................... 14
3.2 Power supply and PMC........................................................................................................................................................................... 15
3.2.1 Protective circuitry................................................................................................................................................................................... 16
3.2.2 MBLX2160A power-up sequencing.................................................................................................................................................... 16
3.2.3 Battery.......................................................................................................................................................................................................... 16
3.3 Clock generation ...................................................................................................................................................................................... 17
3.4 I2C devices.................................................................................................................................................................................................. 19
3.5 SerDes.......................................................................................................................................................................................................... 20
3.5.1 SerDes Multiplexing options ................................................................................................................................................................ 20
3.5.2 SerDes #1 .................................................................................................................................................................................................... 21
3.5.3 SerDes #2 .................................................................................................................................................................................................... 22
3.5.4 SerDes #3 .................................................................................................................................................................................................... 23
3.6 QSFP28 100 Gbit Ethernet..................................................................................................................................................................... 24
3.7 SFP+ 10 Gbit Ethernet............................................................................................................................................................................. 25
3.8 RGMII / SGMII Ethernet........................................................................................................................................................................... 25
3.9 Communication interfaces.................................................................................................................................................................... 27
3.9.1 PCIe............................................................................................................................................................................................................... 27
3.9.2 Mini PCIe ..................................................................................................................................................................................................... 28
3.9.3 SD card......................................................................................................................................................................................................... 28
3.9.4 SATA ............................................................................................................................................................................................................. 29
3.9.5 USB 3.0......................................................................................................................................................................................................... 30
3.9.6 CAN............................................................................................................................................................................................................... 31
3.9.7 UART............................................................................................................................................................................................................. 32
3.9.8 GPIO port expanders............................................................................................................................................................................... 32
3.9.9 Headers ....................................................................................................................................................................................................... 34
3.10 User interfaces........................................................................................................................................................................................... 36
3.10.1 OLED display.............................................................................................................................................................................................. 36
3.10.2 GP LEDs and GP buttons........................................................................................................................................................................ 38
3.10.3 Status LEDs................................................................................................................................................................................................. 38
3.10.4 DIP switches............................................................................................................................................................................................... 39
3.10.5 JTAG.............................................................................................................................................................................................................. 40
3.11 Fan ................................................................................................................................................................................................................ 40
4. SOFTWARE.................................................................................................................................................................................................. 40
5. MECHANICS................................................................................................................................................................................................ 41
5.1 TQMLX2160A and MBLX2160A dimensions.................................................................................................................................... 41
5.2 Notes of treatment................................................................................................................................................................................... 41
5.3 Thermal management............................................................................................................................................................................ 41
5.4 Assembly..................................................................................................................................................................................................... 42
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 43
6.1 EMC............................................................................................................................................................................................................... 43
6.2 ESD................................................................................................................................................................................................................ 43
6.3 Operational safety and personal security......................................................................................................................................... 43
7. CLIMATE AND OPERATIONAL CONDITIONS..................................................................................................................................... 44
7.1 Protection against external effects..................................................................................................................................................... 44

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page II
7.2 Reliability and service life....................................................................................................................................................................... 44
8. ENVIRONMENT PROTECTION................................................................................................................................................................ 45
8.1 RoHS ............................................................................................................................................................................................................. 45
8.2 WEEE®.......................................................................................................................................................................................................... 45
8.3 REACH®........................................................................................................................................................................................................ 45
8.4 EuP ................................................................................................................................................................................................................ 45
8.5 Packaging ................................................................................................................................................................................................... 45
8.6 Batteries ...................................................................................................................................................................................................... 45
8.6.1 General notes ............................................................................................................................................................................................ 45
8.6.2 Lithium batteries ...................................................................................................................................................................................... 45
8.7 Other entries.............................................................................................................................................................................................. 45
9. APPENDIX ................................................................................................................................................................................................... 46
9.1 Acronyms and definitions...................................................................................................................................................................... 46
9.2 References.................................................................................................................................................................................................. 48

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page III
TABLE DIRECTORY
Table 1: Terms and Conventions ............................................................................................................................................................................2
Table 2: TQMLX2160A mating connectors..........................................................................................................................................................6
Table 3: Connector X1, MBLX2160A ......................................................................................................................................................................7
Table 4: Connector X2, MBLX2160A ......................................................................................................................................................................8
Table 5: Connector X3, MBLX2160A ................................................................................................................................................................... 10
Table 6: Boot source selection, DIP switch S1.................................................................................................................................................. 12
Table 7: eMMC configuration ............................................................................................................................................................................... 13
Table 8: NOR flash swap configuration.............................................................................................................................................................. 14
Table 9: Valid SerDes RCW Encodings and Reference Clocks..................................................................................................................... 17
Table 10: I2C devices, address mapping, MBLX2160A..................................................................................................................................... 19
Table 11: SerDes Block 1 multiplexing options ................................................................................................................................................. 20
Table 12: SerDes Block 2 multiplexing options ................................................................................................................................................. 20
Table 13: SerDes Block 3 multiplexing options ................................................................................................................................................. 20
Table 14: MDIO addresses........................................................................................................................................................................................ 26
Table 15: Pinout 20-pin header, X32..................................................................................................................................................................... 26
Table 16: MBLX2160A interface impedances..................................................................................................................................................... 27
Table 17: Pinout SD card, X44 ................................................................................................................................................................................. 28
Table 18: Pinout USB 3.0 Micro B OTG connector............................................................................................................................................. 30
Table 19: GPIO port expander signals .................................................................................................................................................................. 33
Table 20: Pinout 40-pin header, X27..................................................................................................................................................................... 34
Table 21: Pinout 40-pin header, X28..................................................................................................................................................................... 34
Table 22: Pinout 20-pin header, X30..................................................................................................................................................................... 35
Table 23: Pinout 20-pin header, X31..................................................................................................................................................................... 35
Table 24: Status LEDs................................................................................................................................................................................................. 38
Table 25: Function DIP switch, S1 ~ S5................................................................................................................................................................. 39
Table 26: Connector X26 .......................................................................................................................................................................................... 40
Table 27: Pinout FAN connectors, X22, X23........................................................................................................................................................ 40
Table 28: Labels on MBLX2160A ............................................................................................................................................................................ 42
Table 29: Climatic and operational conditions MBLX2160A ......................................................................................................................... 44
Table 30: Acronyms.................................................................................................................................................................................................... 46
Table 31: Further applicable documents............................................................................................................................................................. 48

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page IV
FIGURE DIRECTORY
Figure 1: Block diagram MBLX2160A......................................................................................................................................................................4
Figure 2: Block diagram TQMLX2160A...................................................................................................................................................................5
Figure 3: Block diagram power supply................................................................................................................................................................ 15
Figure 4: Pinout 24 V Supply................................................................................................................................................................................... 15
Figure 5: Block diagram protective circuit.......................................................................................................................................................... 16
Figure 6: MBLX2160A Power-up sequencing.................................................................................................................................................... 16
Figure 7: Clock distribution on the MBLX2160A............................................................................................................................................... 18
Figure 8: LVDS receiver............................................................................................................................................................................................. 18
Figure 9: Block diagram I2C buses......................................................................................................................................................................... 19
Figure 10: SerDes #1 multiplexing options........................................................................................................................................................... 21
Figure 11: DIP switch setting for SerDes #1.......................................................................................................................................................... 21
Figure 12: Information about Serdes 1 can be displayed with the Status Display................................................................................... 21
Figure 13: SerDes #2 multiplexing options........................................................................................................................................................... 22
Figure 14: DIP switch setting for SerDes #2.......................................................................................................................................................... 22
Figure 15: SerDes #3 multiplexing options........................................................................................................................................................... 23
Figure 16: DIP switch setting for SerDes #3.......................................................................................................................................................... 23
Figure 17: QSFP28 interface ...................................................................................................................................................................................... 24
Figure 18: Block diagram QSFP28 module ........................................................................................................................................................... 24
Figure 19:QSFP28 module ........................................................................................................................................................................................ 24
Figure 20: Pinout QSFP28........................................................................................................................................................................................... 24
Figure 21: Ethernet sockets ETH1 to ETH10.......................................................................................................................................................... 25
Figure 22: PCIe slots arrangement .......................................................................................................................................................................... 27
Figure 23: Position of mPCIe slots and SIM card holder ................................................................................................................................... 28
Figure 24: SATA interfaces on the MBLX2160A................................................................................................................................................... 29
Figure 25: Position of SATA ports ............................................................................................................................................................................ 29
Figure 26: Block diagram USB................................................................................................................................................................................... 30
Figure 27: Pinout USB 3.0 Micro connector.......................................................................................................................................................... 30
Figure 28: Block diagram CAN.................................................................................................................................................................................. 31
Figure 29: CAN termination DIP switches............................................................................................................................................................. 31
Figure 30: CAN connector pinout............................................................................................................................................................................ 31
Figure 31: Block diagram UART with RS-232........................................................................................................................................................ 32
Figure 32: Block diagram GPIO expander at the I2C buses ............................................................................................................................. 32
Figure 33: OLED display NHD-1.69-160128G....................................................................................................................................................... 36
Figure 34:Push buttons S10 to S12 ........................................................................................................................................................................ 36
Figure 35: OLED display interface............................................................................................................................................................................ 36
Figure 36: GP LEDs and GP buttons, position...................................................................................................................................................... 38
Figure 37: Status LEDs, position............................................................................................................................................................................... 38
Figure 38: DIP switches S1 to S5 .............................................................................................................................................................................. 39
Figure 40: NXP Code Warrior TAP adapter............................................................................................................................................................ 40
Figure 41: MBLX2160A dimensions (± 0,1 mm) .................................................................................................................................................. 41
Figure 42: MBLX2160A labels.................................................................................................................................................................................... 42

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page V
REVISION HISTORY
Rev. Date Name Pos. Modification
0100 17.09.2021 Petz First edition
0101 28.2.2022 Kreuzer Figure 5, 8, 13, 26
Figure 27
Translated
Changed

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 1
1.
ABOUT THIS MANUAL
1.1
Copyright and license expenses
Copyright protected © 2022 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2
Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3
Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the Starterkit MBLX2160A or parts of the MBLX2160A schematics, you must evaluate it and determine if it is suitable
for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other
warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where
prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage
arising from the usage of the Starterkit MBLX2160A or schematics used, regardless of the legal theory asserted.
1.4
Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: Info@TQ-Group
Web: TQ-Group

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 2
1.5
Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6
Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7
Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBLX2160A and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 3
1.8
Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9
Further applicable documents / presumed knowledge
•
Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•
Specifications of the components used:
The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•
Chip errata:
It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•
Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•
General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBLX2160A circuit diagram
•TQMLX2160A User’s Manual
•LX2160A Data Sheet
•LX2160A Reference Manual
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•Yocto documentation: www.yoctoproject.org/docs/
•TQ-Support Wiki: Support-Wiki TQMLX2160A

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 4
2.
BRIEF DESCRIPTION
This User's Manual describes the hardware of the MBLX2160A revisions 01xx and 02xx.
The MBLX2160A is designed as a carrier board for the TQMLX2160A.
All TQMLX2160A interfaces, which can be used, are available on the MBLX2160A, thus the features of the LX2160A
can be evaluated and software development for a TQMLX2160A-based project can be started directly.
The MBLX2160A supports TQMLX2160A modules with an LX2108A, LX2120A or LX2160A CPU.
Figure 1: Block diagram MBLX2160A

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 5
3.
ELECTRONICS
The boot behaviour of the TQMLX2160A can be customised. The required boot-mode configuration can be set with DIP switches
on the MBLX2160A, see chapter 3.1.3.
3.1
TQMLX2160A
The TQMLX2160A with its LX2160A CPU is the central system component. It provides DDR4 SDRAM, eMMC, NOR flash and an
EEPROM. All TQMLX2160A internal voltages are derived from the 5 V supply voltage. Further information can be found in the
TQMLX2160A User’s Manual. The available signals are routed to the MBLX2160A via three connectors. On the MBLX2160A the
interfaces provided by the TQMLX2160A are routed to industry standard connectors. Furthermore the MBLX2160A provides all
power supplies and configurations required for the operation of the TQMLX2160A. The MBLX2160A supports TQMLX2160A
modules with an LX2108A, LX2120A or LX2160A CPU.
Figure 2: Block diagram TQMLX2160A
The following functionalities and interfaces are provided by the MBLX2160A:
•1 × QSFP28 slot for 100 Gbit Ethernet module
•2 × SFP+ slots for 10 Gbit Ethernet modules
•6 × 1 Gbit Ethernet
•3 × SATA
•3 × PCIe / 2 × mPCIe
•2 × CAN
•SD card
•2 × USB 3.0 / 1 × USB OTG
•Power supply and voltage supervision
•Multiplexing configuration by DIP switches
•OLED display for additional information

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 6
3.1.1 TQMLX2160A mating connectors
The TQMLX2160A is held in the mating connectors on the MBLX2160A by 560 pins on three connectors. The standard board-to-
board distance is 8 mm, but a reduced distance of 5 mm is possible.
Table 2: TQMLX2160A mating connectors
Manufacturer Part number Type Remark
EPT
401-55401-51 •120 pin, 0.5 mm pitch
•Data transfer rate 10+ Gbit/s Assembled on MBLX2160A
401-55103-51 •220 pin, 0.5 mm pitch
•Data transfer rate 16+ Gbit/s
402-51401-51 •120 pin, 0.5 mm pitch
• Data transfer rate 10+ Gbit/s Assembled on TQMLX2160A
402-51101-51 •220 pin, 0.5 mm pitch
• Data transfer rate 16+ Gbit/s
To avoid damaging the connectors of the MBLX2160A or the TQMLX2160A while removing the TQMLX2160A, the use of the
extraction tool MOZILX2160A is strongly recommended.
Note: 16 Gbit+ specification
It is strongly recommended to use 220-pin connectors on carrier boards that comply with the
16 Gbit+ specification. For the 120-pin connectors the 10 Gbit+ specification is sufficient.
3.1.2 TQMLX2160A pinout
All available TQMLX2160A signals are routed to three connectors on the MBLX2160A.
More detailed information is to be taken from the TQMLX2160A User’s Manual (4).
The direction of the signals in the following tables are seen from the TQMLX2160A's perspective.
Note: Available interfaces
Depending on the TQMLX2160A derivative not all interfaces are available. Refer to the TQMLX2160A
User’s Manual and the TQMLX2160A pinout table to see which interfaces are available.
When using the processor signals, it is essential to pay attention to the multiple pin assignment by
different CPU functions (multiplexing).
The pin assignments shown in the following tables refer to the MBLX2160A.

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 7
3.1.2 TQMLX2160A pinout (continued)
Table 3: Connector X1, MBLX2160A
Dir. Level Group Signal Pin Signal Group Level Dir.
I
5 V
Power
V
IN
A1
B1
V
IN
Power
5 V
I
I
5 V
Power
VIN
A2
B2
VIN
Power
5 V
I
I
5 V
Power
VIN
A3
B3
VIN
Power
5 V
I
I
5 V
Power
VIN
A4
B4
VIN
Power
5 V
I
I
5 V
Power
VIN
A5
B5
VIN
Power
5 V
I
–
0 V
Ground
DGND
A6
B6
DGND
Ground
0 V
–
I
5 V
Power
VIN
A7
B7
VIN
Power
5 V
I
I
5 V
Power
V
IN
A8
B8
V
IN
Power
5 V
I
I
5 V
Power
V
IN
A9
B9
V
IN
Power
5 V
I
I
5 V
Power
VIN
A10
B10
VIN
Power
5 V
I
I
5 V
Power
VIN
A11
B11
VIN
Power
5 V
I
I
5 V
Power
VIN
A12
B12
VIN
Power
5 V
I
I
5 V
Power
VIN
A13
B13
VIN
Power
5 V
I
I
5 V
Power
VIN
A14
B14
VIN
Power
5 V
I
I
5 V
Power
VIN
A15
B15
VIN
Power
5 V
I
–
0 V
Ground
DGND
A16
B16
DGND
Ground
0 V
–
I
5 V
Power
V
IN
A17
B17
V
IN
Power
5 V
I
I
5 V
Power
VIN
A18
B18
VIN
Power
5 V
I
I
5 V
Power
VIN
A19
B19
VIN
Power
5 V
I
I
5 V
Power
VIN
A20
B20
VIN
Power
5 V
I
I
5 V
Power
VIN
A21
B21
VIN
Power
5 V
I
I
5 V
Power
VIN
A22
B22
VIN
Power
5 V
I
I
5 V
Power
VIN
A23
B23
VIN
Power
5 V
I
I
5 V
Power
VIN
A24
B24
VIN
Power
5 V
I
I
5 V
Power
V
IN
A25
B25
V
IN
Power
5 V
I
–
0 V
Ground
DGND
A26
B26
DGND
Ground
0 V
–
I
5 V
Power
VIN
A27
B27
VIN
Power
5 V
I
I
5 V
Power
VIN
A28
B28
VIN
Power
5 V
I
I
5 V
Power
VIN
A29
B29
VIN
Power
5 V
I
I
5 V
Power
VIN
A30
B30
VIN
Power
5 V
I
I
5 V
Power
VIN
A31
B31
VIN
Power
5 V
I
–
0 V
Ground
DGND
A32
B32
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A33
B33
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A34
B34
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A35
B35
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A36
B36
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A37
B37
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A38
B38
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A39
B39
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A40
B40
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A41
B41
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A42
B42
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A43
B43
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A44
B44
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A45
B45
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A46
B46
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A47
B47
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A48
B48
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A49
B49
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A50
B50
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A51
B51
DGND
Ground
0 V
–
O
1.8 V
Power
1V8_OUT
A52
B52
1V8_OUT
Power
1.8 V
O
O
1.8 V
Power
1V8_OUT
A53
B53
1V8_OUT
Power
1.8 V
O
–
0 V
Ground
DGND
A54
B54
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A55
B55
DGND
Ground
0 V
–
O
3.3 V
Power
3V3_OUT
A56
B56
3V3_OUT
Power
3.3 V
O
O
3.3 V
Power
3V3_OUT
A57
B57
3V3_OUT
Power
3.3 V
O
I
3.3 V
Power
TA_BB_VDD_IN
A58
B58
(NC)
DNC
–
–
I
1.8 V
Power
TA_PROG_SFP_IN
A59
B59
(NC)
DNC
–
–
–
0 V
Ground
DGND
A60
B60
DGND
Ground
0 V
–

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 8
3.1.2 TQMLX2160A pinout (continued)
Table 4: Connector X2, MBLX2160A
Dir. Level Group Signal Pin Signal Group Level Dir.
–
0 V
Ground
DGND
A1
B1
DGND
Ground
0 V
–
O
3.3 V
Reset
LX_CPU_RESET_OUT#
A2
B2
TQMLX_RST_IN#
Reset
3.3 V
I
O
3.3 V
Reset
RESET_REQ_OUT
A3
B3
SYSC_MON_UART_RX
SYSC
3.3 V
I
O
3.3 V
Reset
HRESET_OUT#
A4
B4
SYSC_MON_UART_TX
SYSC
3.3 V
O
–
0 V
Ground
DGND
A5
B5
DGND
Ground
0 V
–
I/O
1.8 V
I2C
I2C1_CPU_SCL
A6
B6
SYSC_UART_MUX_RX
SYSC
3.3 V
I
I/O
1.8 V
I2C
I2C2_CPU_SDA
A7
B7
SYSC_UART_MUX_TX
SYSC
3.3 V
O
–
0 V
Ground
DGND
A8
B8
DGND
Ground
0 V
–
I
3.3 V
JTAG_CPLD
JTAG_CPLD_TCK
A9
B9
I2C5_CPU_SCL
I2C
1.8 V
I/O
I
3.3 V
JTAG_CPLD
JTAG_CPLD_TMS
A10
B10
I2C5_CPU_SDA
I2C
1.8 V
I/O
–
0 V
Ground
DGND
A11
B11
DGND
Ground
0 V
–
O
3.3 V
JTAG_CPLD
JTAG_CPLD_TDO
A12
B12
UART1_SOUT
UART
1.8 V
I/O
I
3.3 V
JTAG_CPLD
JTAG_CPLD_TDI
A13
B13
UART1_SIN
UART
1.8 V
I/O
–
0 V
Ground
DGND
A14
B14
UART2_SOUT
UART
1.8 V
I/O
I
3.3 V
SYSC
SYSC_SWCLK
A15
B15
UART2_SIN
UART
1.8 V
I/O
I/O
3.3 V
SYSC
SYSC_SWDIO
A16
B16
UART3_SOUT
UART
1.8 V
I/O
–
0 V
Ground
DGND
A17
B17
UART3_SIN
UART
1.8 V
I/O
–
0 V
Ground
DGND
A18
B18
UART4_SOUT
UART
1.8 V
I/O
I/O
1.8 V
SDHC1
SDHC1_CD#
A19
B19
UART4_SIN
UART
1.8 V
I/O
I/O
1.8 V
SDHC1
SDHC1_WP
A20
B20
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A21
B21
DGND
Ground
0 V
–
I/O
EVDD
SDHC1
SDHC1_CLK
A22
B22
SDHC1_DATA0
SDHC1
EVDD
I/O
–
0 V
Ground
DGND
A23
B23
SDHC1_DATA1
SDHC1
EVDD
I/O
I/O
1.8 V
SDHC1
SDHC1_DS
A24
B24
SDHC1_DATA2
SDHC1
EVDD
I/O
–
0 V
Ground
DGND
A25
B25
SDHC1_DATA3
SDHC1
EVDD
I/O
I/O
EVDD
SDHC1
SDHC1_CMD
A26
B26
SDHC1_DATA4
SDHC1
1.8 V
I/O
–
0 V
Ground
DGND
A27
B27
SDHC1_DATA5
SDHC1
1.8 V
I/O
I
3.3 V
CONFIG
eMMC_SEL0
A28
B28
SDHC1_DATA6
SDHC1
1.8 V
I/O
I
3.3 V
CONFIG
eMMC_SEL1
A29
B29
SDHC1_DATA7
SDHC1
1.8 V
I/O
–
0 V
Ground
DGND
A30
B30
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A31
B31
DGND
Ground
0 V
–
I
3.3 V
CONFIG
BOOT_SRC0
A32
B32
DGND
Ground
0 V
–
I
3.3 V
CONFIG
BOOT_SRC1
A33
B33
DGND
Ground
0 V
–
I
3.3 V
CONFIG
BOOT_SRC2
A34
B34
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A35
B35
TA_BB_TMP_DETECT#
TRUST
TA_BB_VDD
I
I
3.3 V
CONFIG
NOR_SWAP#
A36
B36
TA_TMP_DETECT#
TRUST
1.8 V
I
–
0 V
Ground
DGND
A37
B37
TQMLX_WAKE
CONFIG
3.3 V
I
I
1.8 V
CONFIG
EVDD_SEL
A38
B38
TQMLX_SLEEP#
CONFIG
3.3 V
I
O
3.3 V
SYSC
SYSC_I2C2_SCL
A39
B39
EXT_POWER_FAIL_IN#
CONFIG
3.3 V
I
I/O
3.3 V
SYSC
SYSC_I2C2_SDA
A40
B40
TQMLX_PGOOD
CONFIG
3.3 V
O
–
0 V
Ground
DGND
A41
B41
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A42
B42
DGND
Ground
0 V
–
O
–
USB1
USB1_TX_P
A43
B43
DGND
Ground
0 V
–
O
–
USB1
USB1_TX_N
A44
B44
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A45
B45
USB1_ID
USB1
3.3 V
I/O
I
–
USB1
USB1_RX_P
A46
B46
DGND
Ground
0 V
–
I
–
USB1
USB1_RX_N
A47
B47
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A48
B48
USB1_PWRFAULT
USB1
1.8 V
I/O
I/O
–
USB1
USB1_DP
A49
B49
USB1_DRVBUS
USB1
1.8 V
I/O
I/O
–
USB1
USB1_DN
A50
B50
USB1_VBUS
USB1
5 V
I
–
0 V
Ground
DGND
A51
B51
DGND
Ground
0 V
–
O
–
USB2
USB2_TX_P
A52
B52
DGND
Ground
0 V
–
O
–
USB2
USB2_TX_N
A53
B53
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A54
B54
USB2_ID
USB2
3.3 V
IO
I
–
USB2
USB2_RX_P
A55
B55
DGND
Ground
0 V
–

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 9
3.1.2 TQMLX2160A pinout (continued)
Table 4: Connector X2, MBLX2160A (continued)
Dir. Level Group Signal Pin Signal Group Level Dir.
I
–
USB2
USB2_RX_N
A56
B56
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A57
B57
USB2_PWRFAULT
USB2
1.8 V
I/O
I/O
–
USB2
USB2_DP
A58
B58
USB2_DRVBUS
USB2
1.8 V
I/O
I/O
–
USB2
USB2_DN
A59
B59
USB2_VBUS
USB2
5 V
I
–
0 V
Ground
DGND
A60
B60
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A61
B61
DGND
Ground
0 V
–
I
–
SERDES3
SD3_PLLF_REFCLK_P
A62
B62
SD3_PLLS_REFCLK_P
SERDES3
–
I
I
–
SERDES3
SD3_PLLF_REFCLK_N
A63
B63
SD3_PLLS_REFCLK_N
SERDES3
–
I
–
0 V
Ground
DGND
A64
B64
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX0_P
A65
B65
SD3_RX0_P
SERDES3
–
I
O
–
SERDES3
SD3_TX0_N
A66
B66
SD3_RX0_N
SERDES3
–
I
–
0 V
Ground
DGND
A67
B67
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX1_P
A68
B68
SD3_RX1_P
SERDES3
–
I
O
–
SERDES3
SD3_TX1_N
A69
B69
SD3_RX1_N
SERDES3
–
I
–
0 V
Ground
DGND
A70
B70
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A71
B71
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX2_P
A72
B72
SD3_RX2_P
SERDES3
–
I
O
–
SERDES3
SD3_TX2_N
A73
B73
SD3_RX2_N
SERDES3
–
I
–
0 V
Ground
DGND
A74
B74
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX3_P
A75
B75
SD3_RX3_P
SERDES3
–
I
O
–
SERDES3
SD3_TX3_N
A76
B76
SD3_RX3_N
SERDES3
–
I
–
0 V
Ground
DGND
A77
B77
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX4_P
A78
B78
SD3_RX4_P
SERDES3
–
I
O
–
SERDES3
SD3_TX4_N
A79
B79
SD3_RX4_N
SERDES3
–
I
–
0 V
Ground
DGND
A80
B80
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A81
B81
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX5_P
A82
B82
SD3_RX5_P
SERDES3
–
I
O
–
SERDES3
SD3_TX5_N
A83
B83
SD3_RX5_N
SERDES3
–
I
–
0 V
Ground
DGND
A84
B84
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX6_P
A85
B85
SD3_RX6_P
SERDES3
–
I
O
–
SERDES3
SD3_TX6_N
A86
B86
SD3_RX6_N
SERDES3
–
I
–
0 V
Ground
DGND
A87
B87
DGND
Ground
0 V
–
O
–
SERDES3
SD3_TX7_P
A88
B88
SD3_RX7_P
SERDES3
–
I
O
–
SERDES3
SD3_TX7_N
A89
B89
SD3_RX7_N
SERDES3
–
I
–
0 V
Ground
DGND
A90
B90
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A91
B91
DGND
Ground
0 V
–
I/O
1.8 V
SDHC2
SDHC2_MOD_CLK
A92
B92
SDHC2_DATA0
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A93
B93
SDHC2_DATA1
SDHC2
1.8 V
I/O
I/O
1.8 V
SDHC2
SDHC2_MOD_DS
A94
B94
SDHC2_DATA2
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A95
B95
SDHC2_DATA3
SDHC2
1.8 V
I/O
I/O
1.8 V
SDHC2
SDHC2_MOD_CMD
A96
B96
SDHC2_DATA4
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A97
B97
SDHC2_DATA5
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A98
B98
SDHC2_DATA6
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A99
B99
SDHC2_DATA7
SDHC2
1.8 V
I/O
–
0 V
Ground
DGND
A100
B100
DGND
Ground
0 V
–
I
3.3 V
CONFIG
LX_CONFIG_RFU1
A101
B101
DGND
Ground
0 V
–
I
3.3 V
CONFIG
LX_CONFIG_RFU2
A102
B102
TB_SCAN_EN#
TEST
1.8 V
I
I
3.3 V
CONFIG
LX_CONFIG_RFU3
A103
B103
DGND
Ground
0 V
–
I
3.3 V
CONFIG
LX_CONFIG_RFU4
A104
B104
JTAG_LX_HRESET
JTAG_CPU
1.8 V
I
I
3.3 V
CONFIG
LX_CONFIG_RFU5
A105
B105
JTAG_LX_TDI
JTAG_CPU
1.8 V
I
–
0 V
Ground
DGND
A106
B106
JTAG_LX_TDO
JTAG_CPU
1.8 V
O
I/O
1.8 V
I2C
I2C6_CPU_SCL
A107
B107
JTAG_LX_TMS
JTAG_CPU
1.8 V
I
I/O
1.8 V
I2C
I2C5_CPU_SDA
A108
B108
JTAG_LX_TRST#
JTAG_CPU
1.8 V
I
O
1.8 V
JTAG_CPU
JTAG_LX_VREF
A109
B109
JTAG_LX_TCK
JTAG_CPU
1.8 V
I
–
0 V
Ground
DGND
A110
B110
DGND
Ground
0 V
–

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 10
3.1.2 TQMLX2160A pinout (continued)
Table 5: Connector X3, MBLX2160A
Dir. Level Group Signal Pin Signal Group Level Dir.
–
0 V
Ground
DGND
A1
B1
DGND
Ground
0 V
–
I/O
1.8 V
EC1
EC1_TX_EN
A2
B2
EC1_RX_CLK
EC1
1.8 V
I/O
–
0 V
Ground
DGND
A3
B3
DGND
Ground
0 V
–
I/O
1.8 V
EC1
EC1_TXD0
A4
B4
EC1_RXD0
EC1
1.8 V
I/O
I/O
1.8 V
EC1
EC1_TXD1
A5
B5
EC1_RXD1
EC1
1.8 V
I/O
I/O
1.8 V
EC1
EC1_TXD2
A6
B6
EC1_RXD2
EC1
1.8 V
I/O
I/O
1.8 V
EC1
EC1_TXD3
A7
B7
EC1_RXD3
EC1
1.8 V
I/O
–
0 V
Ground
DGND
A8
B8
EC1_RX_DV
EC1
1.8 V
I/O
I/O
1.8 V
EC1
EC1_GTX_CLK
A9
B9
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A10
B10
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A11
B11
DGND
Ground
0 V
–
I/O
1.8 V
EC2
EC2_TX_EN
A12
B12
EC2_RX_CLK
EC2
1.8 V
I/O
–
0 V
Ground
DGND
A13
B13
DGND
Ground
0 V
–
I/O
1.8 V
EC2
EC2_TXD0
A14
B14
EC2_RXD0
EC2
1.8 V
I/O
I/O
1.8 V
EC2
EC2_TXD1
A15
B15
EC2_RXD1
EC2
1.8 V
I/O
I/O
1.8 V
EC2
EC2_TXD2
A16
B16
EC2_RXD2
EC2
1.8 V
I/O
I/O
1.8 V
EC2
EC2_TXD3
A17
B17
EC2_RXD3
EC2
1.8 V
I/O
–
0 V
Ground
DGND
A18
B18
EC2_RX_DV
EC2
1.8 V
I/O
I/O
1.8 V
EC2
EC2_GTX_CLK
A19
B19
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A20
B20
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A21
B21
DGND
Ground
0 V
–
O
1.8 V
EMI
EMI1_MDC
A22
B22
EC_GTX_CLK125_IN_P
EC1
–
I
I/O
1.8 V
EMI
EMI1_MDIO
A23
B23
EC_GTX_CLK125_IN_N
EC1
–
I
–
0 V
Ground
DGND
A24
B24
DGND
Ground
0 V
–
O
1.8 V
EMI
EMI2_MDC
A25
B25
CLK_OUT
CLKOUT
1.8 V
I/O
I/O
1.8 V
EMI
EMI2_MDIO
A26
B26
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A27
B27
CAN1_TX
CAN
1.8 V
I/O
I/O
1.8 V
EVT
EVT0#
A28
B28
CAN1_RX
CAN
1.8 V
I/O
I/O
1.8 V
EVT
EVT1#
A29
B29
CAN2_TX
CAN
1.8 V
I/O
I/O
1.8 V
EVT
EVT2#
A30
B30
CAN2_RX
CAN
1.8 V
I/O
–
0 V
Ground
DGND
A31
B31
DGND
Ground
0 V
–
I/O
1.8 V
EVT
EVT3#
A32
B32
EVT4#
EVT
1.8 V
I/O
–
0 V
Ground
DGND
A33
B33
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A34
B34
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A35
B35
DGND
Ground
0 V
–
I
–
SERDES1
SD1_PLLF_REFCLK_P
A36
B36
SD1_PLLS_REFCLK_P
SERDES1
–
I
I
–
SERDES1
SD1_PLLF_REFCLK_N
A37
B37
SD1_PLLS_REFCLK_N
SERDES1
–
I
–
0 V
Ground
DGND
A38
B38
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX0_P
A39
B39
SD1_TX0_P
SERDES1
–
O
I
–
SERDES1
SD1_RX0_N
A40
B40
SD1_TX0_N
SERDES1
–
O
–
0 V
Ground
DGND
A41
B41
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX1_P
A42
B42
SD1_TX1_P
SERDES1
–
O
I
–
SERDES1
SD1_RX1_N
A43
B43
SD1_TX1_N
SERDES1
–
O
–
0 V
Ground
DGND
A44
B44
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX2_P
A45
B45
SD1_TX2_P
SERDES1
–
O
I
–
SERDES1
SD1_RX2_N
A46
B46
SD1_TX2_N
SERDES1
–
O
–
0 V
Ground
DGND
A47
B47
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX3_P
A48
B48
SD1_TX3_P
SERDES1
–
O
I
–
SERDES1
SD1_RX3_N
A49
B49
SD1_TX3_N
SERDES1
–
O
–
0 V
Ground
DGND
A50
B50
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A51
B51
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX4_P
A52
B52
SD1_TX4_P
SERDES1
–
O
I
–
SERDES1
SD1_RX4_N
A53
B53
SD1_TX4_N
SERDES1
–
O
–
0 V
Ground
DGND
A54
B54
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX5_P
A55
B55
SD1_TX5_P
SERDES1
–
O

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 11
3.1.2 TQMLX2160A pinout (continued)
Table 5: Connector X3, MBLX2160A (continued)
Dir. Level Group Signal Pin Signal Group Level Dir.
I
–
SERDES1
SD1_RX5_N
A56
B56
SD1_TX5_N
SERDES1
–
O
–
0 V
Ground
DGND
A57
B57
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX6_P
A58
B58
SD1_TX6_P
SERDES1
–
O
I
–
SERDES1
SD1_RX6_N
A59
B59
SD1_TX6_N
SERDES1
–
O
–
0 V
Ground
DGND
A60
B60
DGND
Ground
0 V
–
I
–
SERDES1
SD1_RX7_P
A61
B61
SD1_TX7_P
SERDES1
–
O
I
–
SERDES1
SD1_RX7_N
A62
B62
SD1_TX7_N
SERDES1
–
O
–
0 V
Ground
DGND
A63
B63
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A64
B64
DGND
Ground
0 V
–
I
–
SERDES2
SD2_PLLF_REFCLK_P
A65
B65
SD2_PLLS_REFCLK_P
SERDES2
–
I
I
–
SERDES2
SD2_PLLF_REFCLK_N
A66
B66
SD2_PLLS_REFCLK_N
SERDES2
–
I
–
0 V
Ground
DGND
A67
B67
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX0_P
A68
B68
SD2_TX0_P
SERDES2
–
O
I
–
SERDES2
SD2_RX0_N
A69
B69
SD2_TX0_N
SERDES2
–
O
–
0 V
Ground
DGND
A70
B70
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX1_P
A71
B71
SD2_TX1_P
SERDES2
–
O
I
–
SERDES2
SD2_RX1_N
A72
B72
SD2_TX1_N
SERDES2
–
O
–
0 V
Ground
DGND
A73
B73
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A74
B74
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX2_P
A75
B75
SD2_TX2_P
SERDES2
–
O
I
–
SERDES2
SD2_RX2_N
A76
B76
SD2_TX2_N
SERDES2
–
O
–
0 V
Ground
DGND
A77
B77
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX3_P
A78
B78
SD2_TX3_P
SERDES2
–
O
I
–
SERDES2
SD2_RX3_N
A79
B79
SD2_TX3_N
SERDES2
–
O
–
0 V
Ground
DGND
A80
B80
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX4_P
A81
B81
SD2_TX4_P
SERDES2
–
O
I
–
SERDES2
SD2_RX4_N
A82
B82
SD2_TX4_N
SERDES2
–
O
–
0 V
Ground
DGND
A83
B83
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A84
B84
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX5_P
A85
B85
SD2_TX5_P
SERDES2
–
O
I
–
SERDES2
SD2_RX5_N
A86
B86
SD2_TX5_N
SERDES2
–
O
–
0 V
Ground
DGND
A87
B87
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX6_P
A88
B88
SD2_TX6_P
SERDES2
–
O
I
–
SERDES2
SD2_RX6_N
A89
B89
SD2_TX6_N
SERDES2
–
O
–
0 V
Ground
DGND
A90
B90
DGND
Ground
0 V
–
I
–
SERDES2
SD2_RX7_P
A91
B91
SD2_TX7_P
SERDES2
–
O
I
–
SERDES2
SD2_RX7_N
A92
B92
SD2_TX7_N
SERDES2
–
O
–
0 V
Ground
DGND
A93
B93
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A94
B94
DGND
Ground
0 V
–
I/O
1.8 V
GPIO
GPIO3_DATA08
A95
B95
VBAT_RTC
RTC
3.3 V
I
I/O
1.8 V
GPIO
GPIO3_DATA09
A96
B96
RTC_INT_OUT#
RTC
3.3 V
O
I/O
1.8 V
GPIO
GPIO3_DATA10
A97
B97
RTC_CLKOUT
RTC
3.3 V
O
I/O
3.3 V
I2C
I2C1_MOD_SDA
A98
B98
EEPROM_WP
EEPROM
3.3 V
I
O
3.3 V
I2C
I2C1_MOD_SCL
A99
B99
EVENT_TEMPSENSOR
TEMP
3.3 V
O
–
0 V
Ground
DGND
A100
B100
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A101
B101
IRQ0
IRQ
1.8 V
I/O
–
0 V
Ground
DGND
A102
B102
IRQ1
IRQ
1.8 V
I/O
I/O
–
SECURE
SE14443_LA
A103
B103
IRQ2
IRQ
1.8 V
I/O
I/O
–
SECURE
SE14443_LB
A104
B104
IRQ3
IRQ
1.8 V
I/O
–
0 V
Ground
DGND
A105
B105
IRQ4
IRQ
1.8 V
I/O
I/O
3.3 V
SECURE
SE_7816_IO1
A106
B106
IRQ5
IRQ
1.8 V
I/O
I/O
3.3 V
SECURE
SE_7816_IO2
A107
B107
IRQ6
IRQ
1.8 V
I/O
O
3.3 V
SECURE
SE_7816_CLK
A108
B108
IRQ7
IRQ
1.8 V
I/O
I
3.3 V
SECURE
SE_7816_RST#
A109
B109
DGND
Ground
0 V
–
–
0 V
Ground
DGND
A110
B110
DGND
Ground
0 V
–

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 12
3.1.3 Boot source
The boot source of the MBLX2160A is selected with signals BOOT_SRC[2:0] via DIP switch S1. Pull-ups to 3.3 V are populated on
the TQMLX2160A.
Table 6: Boot source selection, DIP switch S1
BOOT_SRC2 (S1-3) BOOT_SRC1 (S1-2) BOOT_SRC0 (S1-1) Boot source
1 1 1 NOR flash
1 1 0 SD card
1 0 1 eMMC
1 0 0 I²C
0 1 1 XSPI – NAND 2 KB
0 1 0 XSPI – NAND 4 KB
0 0 1 Hard Coded Option
0 0 0 TBD
Graphical illustration of the DIP switch positions for the three most common boot sources:
The boot source is shown on the status display in the "Settings" "DIP S1" menu.

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 13
3.1.4 eMMC configuration
The TQMLX2160A allows a variable configuration of the SDHC2 interface via the control signals eMMC_SEL[1:0].
These signals are pulled-up to 3.3 V on the TQMLX2160A by default.
The eMMC_SEL[1:0] configuration cannot be changed during runtime.
Table 7: eMMC configuration
eMMC_SEL1 (X2-A29) eMMC_SEL0 (X2-A28) Configuration
0 0 SDHC2 at TQMLX2160A connectors
0 1 eMMC on TQMLX2160A connected with 4 bit data + 2 × I2C
1 0 (Undefined)
1 1 eMMC on TQMLX2160A connected with 8 bit data (default)
Graphical illustration of the DIP switch positions for the three defined SDHC2 configurations:
The current setting is shown on the status display in the "Settings" "DIP S2" menu.

User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page 14
3.1.5 NOR flash swap
The TQMLX2160A allows an easy toggle of the two XSPI NOR Flash devices. Only the chip select of both devices are swapped, so
that from the view of the CPU no differences appear. This is controlled by the signal NOR_SWAP#. The signal has a pullup to 3.3V
on the TQMLX2160A. Alternatively a software configuration via I²C slave register is provided.
Table 8: NOR flash swap configuration
NOR_SWAP# (X2-A36) I2C slave register NOR flash multiplexing
Low – X mapping
High – 1:1 mapping
Low 1:1 mapping set 1:1 mapping
High 1:1 mapping set 1:1 mapping
Low X mapping set X mapping
High X mapping set X mapping
The current setting of the NOR_SWAP# pins is shown on the status display in the "Settings" "DIP S1" menu.