
User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH Page I
TABLE OF CONTENTS
1. ABOUT THIS MANUAL................................................................................................................................................................................1
1.1 Copyright and license expenses.............................................................................................................................................................1
1.2 Registered trademarks...............................................................................................................................................................................1
1.3 Disclaimer......................................................................................................................................................................................................1
1.4 Imprint............................................................................................................................................................................................................1
1.5 Tips on safety................................................................................................................................................................................................2
1.6 Symbols and typographic conventions ...............................................................................................................................................2
1.7 Handling and ESD tips...............................................................................................................................................................................2
1.8 Naming of signals........................................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge .................................................................................................................3
2. BRIEF DESCRIPTION ....................................................................................................................................................................................4
3. ELECTRONICS................................................................................................................................................................................................5
3.1 TQMLX2160A................................................................................................................................................................................................5
3.1.1 TQMLX2160A mating connectors..........................................................................................................................................................6
3.1.2 TQMLX2160A pinout..................................................................................................................................................................................6
3.1.3 Boot source ................................................................................................................................................................................................ 12
3.1.4 eMMC configuration ............................................................................................................................................................................... 13
3.1.5 NOR flash swap ......................................................................................................................................................................................... 14
3.2 Power supply and PMC........................................................................................................................................................................... 15
3.2.1 Protective circuitry................................................................................................................................................................................... 16
3.2.2 MBLX2160A power-up sequencing.................................................................................................................................................... 16
3.2.3 Battery.......................................................................................................................................................................................................... 16
3.3 Clock generation ...................................................................................................................................................................................... 17
3.4 I2C devices.................................................................................................................................................................................................. 19
3.5 SerDes.......................................................................................................................................................................................................... 20
3.5.1 SerDes Multiplexing options ................................................................................................................................................................ 20
3.5.2 SerDes #1 .................................................................................................................................................................................................... 21
3.5.3 SerDes #2 .................................................................................................................................................................................................... 22
3.5.4 SerDes #3 .................................................................................................................................................................................................... 23
3.6 QSFP28 100 Gbit Ethernet..................................................................................................................................................................... 24
3.7 SFP+ 10 Gbit Ethernet............................................................................................................................................................................. 25
3.8 RGMII / SGMII Ethernet........................................................................................................................................................................... 25
3.9 Communication interfaces.................................................................................................................................................................... 27
3.9.1 PCIe............................................................................................................................................................................................................... 27
3.9.2 Mini PCIe ..................................................................................................................................................................................................... 28
3.9.3 SD card......................................................................................................................................................................................................... 28
3.9.4 SATA ............................................................................................................................................................................................................. 29
3.9.5 USB 3.0......................................................................................................................................................................................................... 30
3.9.6 CAN............................................................................................................................................................................................................... 31
3.9.7 UART............................................................................................................................................................................................................. 32
3.9.8 GPIO port expanders............................................................................................................................................................................... 32
3.9.9 Headers ....................................................................................................................................................................................................... 34
3.10 User interfaces........................................................................................................................................................................................... 36
3.10.1 OLED display.............................................................................................................................................................................................. 36
3.10.2 GP LEDs and GP buttons........................................................................................................................................................................ 38
3.10.3 Status LEDs................................................................................................................................................................................................. 38
3.10.4 DIP switches............................................................................................................................................................................................... 39
3.10.5 JTAG.............................................................................................................................................................................................................. 40
3.11 Fan ................................................................................................................................................................................................................ 40
4. SOFTWARE.................................................................................................................................................................................................. 40
5. MECHANICS................................................................................................................................................................................................ 41
5.1 TQMLX2160A and MBLX2160A dimensions.................................................................................................................................... 41
5.2 Notes of treatment................................................................................................................................................................................... 41
5.3 Thermal management............................................................................................................................................................................ 41
5.4 Assembly..................................................................................................................................................................................................... 42
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 43
6.1 EMC............................................................................................................................................................................................................... 43
6.2 ESD................................................................................................................................................................................................................ 43
6.3 Operational safety and personal security......................................................................................................................................... 43
7. CLIMATE AND OPERATIONAL CONDITIONS..................................................................................................................................... 44
7.1 Protection against external effects..................................................................................................................................................... 44