TYAN GT90-B7113 Quick start guide

1
http://www.tyan.com
GT90-B7113
Service Engineer’s Manual

2
http://www.tyan.com

3
http://www.tyan.com
PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.
Copyright 2019 MITAC COMPUTING TECHNOLOGY CORPORATION. All
rights reserved.TYAN®is a registered trademark of MITAC COMPUTING
TECHNOLOGY CORPORATION.
Version 1.0c
Disclaimer
Information contained in this document is furnished by MITAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and
reliability prior to printing. MITAC assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to sale and/or use of TYAN®
products including liability or warranties relating to fitness for a particular
purpose or merchantability. MITAC retains the right to make changes to
produce descriptions and/or specifications at any time, without notice. In no
event will MITAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting from
errors or inaccuracies of information contained in this document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
TYAN®is a trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Intel®is a trademark of Intel®Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

4
http://www.tyan.com
●FCC Declaration
Notice for the USA
Compliance Information Statement (Supplier's Declaration of Conformity, SDoC)
FCC Part 15: This device complies with part 15 of the FCC Rules.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following conditions:
‧This device may not cause harmful interference.
‧This device must accept any interference received, including interference that may
cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme à la norme NMB-003 du Canada.
●Notice for Europe (CE Mark)
This product is in conformity with the Council Directive 2014/30/EU and 2014/35/EU.

5
http://www.tyan.com
Warning
This equipment is compliant with Class A of CISPR 32. In a residential environment
this equipment may cause radio interference.
CAUTION
Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.
●VCCI-A
この装置は、クラスＡ機器です。この装置を住宅環境で使用すると電波妨害を引き
起こすことがあります。この場合には使用者が適切な対策を講ずるよう要求される
ことがあります。 VCCI-A
●Safety: IEC/EN 60950-1
This equipment is compliant with CB/LVD of Safety: IEC/EN 60950-1.

http://www.tyan.com
6
About this Manual
This manual is intended for trained service technician/personnel with hardware
knowledge of personal computers.
It is aimed to provide you with instructions on installing your TYAN GT90-B7113.
How this guide is organized
This guide contains the following parts:
Chapter 1: Overview
This chapter provides an introduction to the TYAN GT90-B7113 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.
Chapter 2: Setting Up
This chapter covers procedures on installing the processors, memory modules, hard
drivers and other optional parts.
Chapter 3: Replacing the Pre-installed Components
This chapter covers the removal and replacement procedures for pre-installed
components.
Chapter 4: Motherboard Information
This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.
Chapter 5: BIOS Setup
This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.
Chapter 6: Diagnostics
This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.
Appendix:
This chapter provides the cable connection table, the FRU parts list for reference of
system setup, and technical support in case a problem arises with your system.

http://www.tyan.com
7
Safety and Compliance Information
Before installing and using TYAN GT90-B7113, take note of the following
precautions:
·Read all instructions carefully.
·
Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·
Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

http://www.tyan.com
8
Safety Information
Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.
Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.
You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.
Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.
General Precautions
· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.
Machine Room Environment
· This device is for use only in a restricted access location, such as a
machine room or IT room.

http://www.tyan.com
9
· Make sure that the area in which you install the system is properly
ventilated and climate-controlled.
· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
·Do not install the system in or near a plenum, air duct, radiator, or heat
register.
·Never use the product in a wet location.
Equipment Chassis
· Do not block or cover the openings to the system.
·Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
·Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
·Lift equipment using both hands and with your knees bent.
Equipment Racks
To avoid injury or damage to the equipment:
·Observe local occupational health and safety requirements and guidelines
for manual materials handling.
·Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
·Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
·Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
·Make sure the rack is properly secured to the floor or ceiling.
·Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
·Make sure racks are coupled together if it is a multiple-rack installation.
·Make sure the rack is level and stable before installing an appliance in the
rack.

http://www.tyan.com
10
·Make sure the leveling jacks are extended to the floor.
·Make sure the full weight of the rack rests on the leveling jacks.
·Always load the rack from the bottom up. Load the heaviest component in
the rack first.
·Make sure the rack is level and stable before pulling a component out of the
rack.
·Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
· The rack width and depth must allow for proper serviceability and cable
management.
· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
·The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
·If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
·Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.
Equipment Power Cords
· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
·Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
·In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.

http://www.tyan.com
11
·Do not place objects on AC power cords or cables. Arrange them so that no
one might accidentally step on or trip over them.
·Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
·To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.
Equipment Batteries
· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
·Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
·Do not expose the battery to temperatures higher than 60°C (140°F).
·The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
·Do not attempt to recharge the battery.
·Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.
Equipment Modifications
· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.
Equipment Repairs and Servicing
· The installation of internal options and routine maintenance and service of
this product should be performed by trained service technician/personnel who
are knowledgeable about the procedures, precautions, and hazards
associated with equipment containing hazardous energy levels.
·Do not exceed the level of repair specified in the procedures in the product

http://www.tyan.com
12
documentation. Improper repairs can create a safety hazard.
·Allow the product to cool before removing covers and touching internal
components.
·Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
·Do not use conductive tools that could bridge live parts.
·Use gloves when you remove or replace system components; they can
become hot to the touch.
·If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the
product.
–The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating
instructions.
·Retain all screws or other fasteners when removing access cover(s). Upon
completion of accessing inside the product, refasten access cover with original
screws or fasteners.

http://www.tyan.com
13
Table of Contents
Chapter 1: Overview....................................................................... 17
1.1 About the TYAN GT90-B7113................................................ 17
1.2 Product Models....................................................................... 17
1.3 Features.................................................................................. 18
1.4Standard Parts List ................................................................. 25
1.4.1 Box Contents and Accessories ....................................... 25
1.5 About the Product................................................................... 26
1.5.1 System Front View .......................................................... 26
1.5.2 Front Panel and HDD LED Indications............................ 27
1.5.3 System Rear View ........................................................... 28
1.5.4 PSU and LAN LED Indications........................................ 29
1.5.5 System Top View............................................................. 30
1.5.6 Chassis Dimensions ........................................................ 32
Chapter 2: Setting Up..................................................................... 33
2.0.1 Before you Begin............................................................. 33
2.0.2 Work Area........................................................................ 33
2.0.3 Tools................................................................................ 33
2.0.4 Precautions...................................................................... 33
2.1 Installing Motherboard Components ...................................... 35
2.1.1 Removing the Chassis Cover.......................................... 35
2.1.2 Replacing the Chassis Cover .......................................... 38
2.1.3 Installing the CPU and Heat sink..................................... 40
2.1.4 Installing the Memory ...................................................... 43
2.1.5Installing the Expansion Card.......................................... 46
2.1.6Installing 2.5” Hard Drives ............................................... 48
2.1.7Installing 3.5” Hard Drives ............................................... 50
2.2 Rack Mounting........................................................................ 52
2.2.1 Installing the Server in a Rack......................................... 52
2.2.2 Installing Slide Rails to the Rack ..................................... 53
2.2.3 Rack mounting the Server............................................... 55
2.2.4 Removing the Server from Rack ..................................... 57
Chapter 3: Replacing Pre-Installed Components ........................ 59
3.1 Introduction............................................................................. 59
3.2 Disassembly Flowchart........................................................... 59
3.3 Removing the Cover............................................................... 60
3.4 Replacing the Power Supply .................................................. 60
3.5 Replacing the Front Panel Board ........................................... 61
3.5.1 Front Panel Board Features ............................................ 62
3.6Replacing the HDD Backplane Board .................................... 63

http://www.tyan.com
14
3.6.1 HDD BP Board Features ................................................. 66
3.6.2 Connector Definitions ...................................................... 67
3.7Replacing Power Distribution Board....................................... 68
3.7.1 Power Distribution Board Features ................................. 70
3.7.2 Connector Definitions ...................................................... 71
3.8Replacing the Riser Card ....................................................... 72
3.8.1 Riser card Feature........................................................... 74
3.9Replacing the Storage Mezz Card ......................................... 75
3.9.1 Storage Mezz Card Feature ............................................ 76
3.10 Replacing the Fan .................................................................. 77
3.11 Replacing the Motherboard.................................................... 78
Chapter 4: Motherboard Information ............................................ 81
4.1 Board Image ........................................................................... 82
4.2 Block Diagram ........................................................................ 83
4.3 Motherboard Mechanical Drawing.......................................... 84
4.4 Board Parts, Jumpers and Connectors .................................. 85
4.5 Thermal Interface Material...................................................... 91
4.6 Tips on Installing Motherboard in Chassis ............................. 92
4.7 Installing the Memory ............................................................. 94
4.8 Finishing Up............................................................................ 98
Chapter 5: BIOS Setup................................................................... 99
5.1 About the BIOS....................................................................... 99
5.1.1 Setup Basics.................................................................... 99
5.1.2 Getting Help................................................................... 100
5.1.3 In Case of Problems ...................................................... 100
5.1.4 Setup Variations ............................................................ 100
5.2 Main Menu............................................................................ 101
5.3 Advanced Menu.................................................................... 102
5.3.1 Network Stack Configuration........................................... 104
5.3.2 Intel® Virtual RAID on CPU........................................... 106
5.3.3 Intel® Optane™ DC persistent Memory Configuration . 114
5.3.4 Trusted Computing ........................................................ 131
5.3.5 ACPI Settings ................................................................ 132
5.3.6 OnBoard Device Configuration...................................... 133
5.3.7 Hardware Health Configuration ..................................... 134
5.3.8 AST2500 Super IO Configuration.................................. 137
5.3.9S5 RTC Wake Settings.................................................. 139
5.3.10 Serial Port Console Redirection .................................... 140
5.3.11 Option ROM Dispatch Policy......................................... 146
5.3.12 PCI Subsystem Settings................................................ 147
5.3.13USB Configuration......................................................... 148
5.3.14 CSM Configuration ........................................................ 150

http://www.tyan.com
15
5.3.15 NVDIMM ADR Configuration......................................... 152
5.3.16 CPU Registration........................................................... 153
5.3.17 Memory Registration ..................................................... 154
5.4 Platform Configuration.......................................................... 155
5.4.1PCH Configuration......................................................... 156
5.4.2 Miscellaneous Configuration ......................................... 167
5.4.3 Server ME Configuration ............................................... 168
5.5 Socket Configuration ............................................................ 169
5.5.1 Processor Configuration................................................ 170
5.5.2 Common RefCode Configuration .................................. 172
5.5.3 UPI Configuration .......................................................... 174
5.5.4 Memory Configuration ................................................... 178
5.5.5 IIO Configuration ........................................................... 183
5.5.6 Advanced Power Management Configuration............... 199
5.6Server Management ............................................................. 205
5.6.1 System Event Log ......................................................... 207
5.6.2 BMC Network Configuration.......................................... 208
5.7 Security................................................................................. 210
5.7.1 Secure Boot................................................................... 211
5.8 Boot ...................................................................................... 215
5.8.1 Add New Boot Option .................................................... 217
5.8.2 Delete Boot Option ........................................................ 218
5.9 Save & Exit ........................................................................... 219
Chapter 6: Diagnostics ................................................................ 221
6.1 Flash Utility ........................................................................... 221
6.2 AMIBIOS Post Code (Aptio) ................................................. 222
Appendix I: How to recover UEFI BIOS ...................................... 231
Appendix II: Cable Connection Tables ....................................... 233
Appendix III: Fan and Temp Sensors ......................................... 235
Appendix IV: FRU Parts Table..................................................... 241
Appendix V: Technical Support .................................................. 243

http://www.tyan.com
16
NOTE

http://www.tyan.com
17
Chapter 1: Overview
1.1 About the TYAN GT90-B7113
Congratulations on your purchase of the TYAN®GT90-B7113, a highly optimized 1U
rack-mountable barebone system. The GT90-B7113 is designed to support dual
Intel®Xeon Scalable Processor/2nd Gen Intel Xeon Scalable Processor and up to
512GB RDIMM/1,024GB LRDIMM DDR4, providing a rich feature set and incredible
performance. Leveraging advanced technology from Intel®, the GT90-B7113 server
system is capable of offering scalable 32 and 64-bit computing, high bandwidth
memory design, and lightning-fast PCI-E bus implementation. The GT90-B7113 not
only empowers your company in nowadays IT demand but also offers a smooth path
for future application usage.
TYAN®also offers the GT90-B7113 in a version that can support up to twelve (12)
internal hot-swappable 3.5” SAS/SATA HDD and four (4) external hot-swappable
2.5” 7mm SATA/NVMe SSD/HDD. The GT90-B7113 uses TYAN’s latest chassis
featuring a robust structure and a solid mechanical enclosure. All of this provides
GT90-B7113 the power and flexibility to meet the needs of nowadays server
application.
1.2 Product Models
The system board within the Tyan Barebone is defined by the following models:
 B7113G90V12E4HR: Intel-based platform
 B7113G90U12E4HR: Intel-based platform

http://www.tyan.com
18
1.3Features
TYAN GT90-B7113 (B7113G90V12E4HR)
System
Form Factor
1U Rackmount
Chassis Model
GT90
Dimension (D x W x H)
35.43" x 19.21" x 1.71"
(900 x 448 x 43.5mm)
Motherboard Name
S7113GMRE #
Motherboard
Notification
# The motherboard not sold
separately
Gross Weight
32 kg (70.5 lbs)
Net weight
22 kg (48.5 lbs)
Front Panel
Buttons
(1) PWR w/ LED, (1) ID w/ LED
LEDs
(1) HDD, (1) BMC event
External Drive Bay
Q'ty / Type
(12) 3.5 Hot-Swap HDD +
(4) 2.5” Hot-Swap NVMe (7mm)
HDD Backplane
Support
NVMe, SATA 6Gb/s
Supported HDD
Interface
(12) SATA 6Gb/s + (4) NVMe
System Cooling
Configuration
FAN
(6) 4cm fans
Power Supply
Type
RPSU
Input Range
AC 100-240V/8A
Frequency
50-60 Hz
Output Watts
650 Watts
Efficiency
80 plus Platinum
Redundancy
1+1
Serviceability
Hot-swap
Processor
Q'ty / Socket Type
(2) LGA3647
Supported CPU
Series
Intel Xeon Scalable Processor, 2nd
Gen Intel Xeon Scalable Processor
Thermal Design
Power (TDP) Wattage
Max up to 165W
System Bus
Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support
Chipset
PCH
Intel C621

http://www.tyan.com
19
Memory
Supported DIMM Qty
(8)+(8) DIMM slots
DIMM Type / Speed
DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS
2933/2666 / Intel Optane DC
Persistent Memory Module (DCPMM)
Capacity
Up to 512GB RDIMM, 1,024GB
LRDIMM
Memory channel
6 Channels per CPU
Memory voltage
1.2V
Notification:
DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration. / Intel Optane DC
Persistent Memory Module (DCPMM)
only supported with specific 2nd Gen
Intel Xeon Scalable Processor
(codename: Cascade Lake). Please
contact Tyan Technical Support for
more detail.
Expansion Slots
Others:
(1) PCI-E Gen3 x16 OCP 2.0 slot
(conn.A+conn.B)
(1) PCI-E Gen3 x8 storage mezz. slot
LAN
Q'ty / Port
(1) PHY
PHY
Realtek RTL8211E
Storage
SATA
Connector
(2) Slim SAS (8-ports)
Controller
Intel C621
Speed
6Gb/s
RAID
RAID 0/1/10/5 (Intel
RSTe)
sSATA
Connector
(1) SATA-DOM,
(1) Slim SAS (4-ports)
Controller
Intel C621
Speed
6Gb/s
RAID
RAID 0/1/10/5
(Intel RSTe)
NVMe
Connector
(OCuLink)
(4) SFF-8654 for (4)
NVMe ports
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2500

http://www.tyan.com
20
I/O Ports
USB
(2) USB3.0 ports (at rear)
COM
(1) DB-9 COM port
VGA
(1) D-Sub 15-pin port
RJ-45
(1) GbE port dedicated for IPMI
TPM (Optional)
TPM Support
Please refer to our TPM supported
list.
System Monitoring
Chipset
Aspeed AST2500
Temperature
Monitors temperature for CPU &
memory & system environment
Voltage
Monitors voltage for CPU, memory,
chipset & power supply
LED
Over temperature warning
indicator, Fan & PSU fai
l LED
indicator
Others
Watchdog timer support
Server Management
Onboard Chipset
Onboard Aspeed AST2500
AST2500 iKVM
Feature
24-bit high quality video
compression, Supports storage over
IP and remote platform-flash, USB
2.0 virtual hub
AST2500 IPMI
Feature
IPMI 2.0 compliant baseboard
management controller (BMC),
10/100/1000 Mb/s MAC interface
BIOS
Brand / ROM size
AMI, 32MB
Feature
Hardware Monitor, SMBIOS
3.0/PnP/Wake on LAN, Boot from
USB device/PXE via LAN/Storage,
Console Redirection, ACPI 6.1, FAN
speed control automatic, ACPI
sleeping states S0,S4,S5
Operating System
OS supported list
Please refer to our AVL support
lists.
Regulation
FCC (SDoC)
Class A
CE (DoC)
Class A
CB/LVD
Yes
RCM
Class A
VCCI
Class A
Operating Environment
Operating Temp.
10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)