TYAN MicroServer Series User manual

http://www.tyan.com
Tyan MicroServer Series
FM65-B5519
4U SERVER – 18 NODES
User’s Manual

http://www.tyan.com
NOTE:
Copyright
This publication, including all photographs, illustrations, and software, is protected under
international copyright laws, with all rights reserved. Neither this manual, nor any material
contained herein, may be reproduced without written consent of manufacturer.
Copyright 2012 MiTAC International Corporation. All rights reserved. TYAN®is a registered
trademark of MiTAC International Corporation.
Version 1.00
Disclaimer
Information contained in this document is furnished by MiTAC International Corporation and
has been reviewed for accuracy and reliability prior to printing. MiTAC assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of
TYAN®products including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce descriptions and/or
specifications at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or other malady
resulting from errors or inaccuracies of information contained in this document.
Conventions
The following conventions are used in this manual:
! WARNING:
Indicates a potential for property damage, personal injury or death.
! CAUTION:
Indicates a potential loss of data or damage to equipment.
NOTE:
Indicates information that is important to know for the proper completion of a procedure,
choice of an option, or completing a task.

http://www.tyan.com
Chapter1:Overview.......................................................................................................................... 6
1.1AbouttheTyanMicroServerSystem.................................................................................. 6
1.2Features.............................................................................................................................. 6
1.3ProductModels ................................................................................................................. 11
1.4CatalogPartsList ............................................................................................................... 11
Chapter2:AboutYourSystem ........................................................................................................ 12
Chapter3:SystemOverview............................................................................................................ 14
3.1SystemFrontView ............................................................................................................. 15
3.2SystemRearView............................................................................................................... 15
3.3SystemInternalView......................................................................................................... 16
3.4ComputeBladeOverview.................................................................................................. 17
3.5FM65‐B5519Blade ............................................................................................................ 17
3.5.1FrontView ...................................................................................................................... 17
3.5.2InternalView .................................................................................................................. 18
3.5.3ComputeBladeLEDBehavior......................................................................................... 19
3.6MidPlane...........................................................................................................................20
3.7Pass‐through‐M1902F65‐CMMPTOverview..................................................................... 21
3.7.1Pass‐through‐M1902F65‐CMMPTLEDBehavior............................................................ 22
3.7.2I/OConnectivity.............................................................................................................. 22
Chapter4:MountingtheSystemintoa4‐PostRack ....................................................................... 23
4.1PreparingfortheInstallation ............................................................................................ 23
4.2InstallingtheInnerRail...................................................................................................... 23
4.3InstallingtheOuterRail..................................................................................................... 24
4.4InstallingtheSystemusingthe4‐PostRackKit................................................................. 25
Chapter5:ChassisManagementModule ....................................................................................... 27

http://www.tyan.com
5.1AcquiringanIPAddress..................................................................................................... 27
5.2ChassisManagementConsole........................................................................................... 28
Chapter6:ComputeBladeComponents ........................................................................................ 34
6.1Introduction....................................................................................................................... 34
6.2DisassemblyFlowchart...................................................................................................... 34
6.3ComputeBlade,PowerSupply&FanModuleOrderIdentification ................................. 35
6.4ComputeBladeBlanks(Option) ........................................................................................ 36
6.4.1RemovingaComputeBladeBlank ................................................................................. 36
6.4.2InstallingaComputeBladeBlank................................................................................... 36
6.4.3ComputeBladeModules................................................................................................ 37
6.4.4RemovingaComputeBlade ........................................................................................... 37
6.4.5InstallingaComputeBlade............................................................................................. 37
6.4.6SystemMemory ............................................................................................................. 38
6.5HardDrives ........................................................................................................................ 41
6.6Processors ......................................................................................................................... 43
6.6.1InstallingaProcessor...................................................................................................... 45
6.7Heat‐Sinks.......................................................................................................................... 46
6.7.1RemovingaHeat‐Sink .................................................................................................... 46
6.8SystemBoard..................................................................................................................... 48
6.8.1RemovingaBridgeBoard ............................................................................................... 48
6.8.2InstallingaBridgeBoard ................................................................................................ 48
6.8.3RemovingaSystemBoard.............................................................................................. 49
6.8.4InstallingaSystemBoard ............................................................................................... 50
Chapter7:ChassisComponents...................................................................................................... 51
7.1Introduction....................................................................................................................... 51

http://www.tyan.com
7.2DisassemblyFlowchart...................................................................................................... 51
7.3PowerSupplyModules...................................................................................................... 52
7.3.1RemovingaPowerSupplyModule ............................................................................... 53
7.3.2InstallingaPowerSupplyModule.................................................................................. 53
7.4FanModules ...................................................................................................................... 54
7.4.1RemovingaFanModule................................................................................................. 54
7.4.2InstallingaFanModule .................................................................................................. 54
7.5OpeningandClosingtheSystem....................................................................................... 55
7.6Pass‐through‐M1902F65‐CMMPTModule ....................................................................... 56
7.7RemovingPass‐through‐M1902F65‐CMMPTModule ...................................................... 56
7.8InstallingPass‐through‐M1902F65‐CMMPTModule........................................................ 56
7.9RemovinganI/OandCMMSystemBoard....................................................................... 57
7.10InstallinganPass‐through‐M1902F65‐CMMPTSystemBoard ....................................... 59
AppendixA:GettingHelpandSupport ........................................................................................... 60
AppendixB:SafetyInformation ...................................................................................................... 61


http://www.tyan.com
Chapter 1: Overview
1.1 About the Tyan MicroServer System
Congratulations on the purchase of the Tyan MicroServer, a highly optimized 4U rack mount
system. The Tyan MicroServer is available in two models, the FM65-B5519 featuring the
Intel®Sandy Bridge-DT processor, designed to support 18 compute blades. Up to 32 GB
UDIMM DDR3-800/1066/1333 memory can be installed per node. Utilizing advanced
technology the Tyan MicroServer system provides scalable 32/64-bit computing, high
bandwidth memory design, and lightning-fast PCI-E bus capabilities. The Tyan MicroServer
not only can be utilized to manage today’s IT environments as well as tomorrow’s.
The Tyan MicroServer uses the latest chassis designs for solid mechanical enclosures and
robust features. The Tyan MicroServer delivers the power and flexibility to meet the needs
enterprise-level requirements.
1.2 Features
The Tyan MicroServer contains the following features:
Table 1-1. MicroServer Features
Item Description
Chassis Industry 4U rack-mountable chassis
Dimension:
Height: 175.7 mm (7.17 inch)
Width: 440 mm (17.32 inch)
Depth: 650 mm (25.6 inch)
(18) Compute Blades(1) Pass-through- M1902F65-CMMPT
module
(8) 8038 System FANs
Power supply
(2+1) 800W high efficiency (80+ Gold) w/ PFC (AC SKU)
DC 12V sourced from rack (DC SKU, option)
System board Tyan B5519GM2N
Processors FM65-B5519
Support (1) Intel® Sandy-Bridge-DT CPU (Socket H2)
Quad-core Sandy Bridge-DT w/ TDP 45W
Dual-core Sandy Bridge-DT w/ TDP 20W

http://www.tyan.com
Table 1-1. MicroServer Features (Continued)
Item Description
Chipset FM65-B5519
Intel® Cougar Point PCH
 AST2150 iBMC
Memory FM65-B5519
(4) U-DDR-III w/ECC 1066/1333 VLP UDIMM
Integrated LAN Controllers (2) Intel® 82574L Gigabit controllers
BIOS AMI BIOS® on 8Mbit Flash ROM
Supports ACPI 2.0
Supports boot from USB device
Power-on mode control for AC power loss recovery
Internal Connector (1) One SATA connector for 2.5” SATA/SATAII hard drive
on the
motherboard
(1) One SATA connector for 2.5” SATA/SATAII hard drive on the
Bridge Board
Internal I/O (2) USB ports
(1) VGA port
Switches
Power
LED
Power LED
Hard drive activity LED
System health/ID LED
Form Factor (Compute
Blade)
W128.88 x H28 x D358.8 mm (5.07 x 1.10 x 14.13 inch)
NOTE:
Supports 9 mm high hard drive.

http://www.tyan.com
Table 1-1. MicroServer Features (Continued)
Item Description
Pass-through-
M1902F65-CMMPT
Processors (Switch)
Management CPU (Option) for Smart Switch blade support
Chipset (Switch)
(1) BCM 53724 24GbE
Gigabit PHY
(2) BCM 54616s GPHY
(2) Octal Giga PHY (BMC54980)
CMM subsystem
(1) ASPEED AST2150
(1) 64 MB FLASH
Rear I/O
(1) RJ45 to support remote management from CMM
(18) RJ45 1000 Base-T port w/ activity LED
(1) One Power Switch
(1) Power LED
(1) System Health LED
Mid-Plane (M1247F65-BP) System management
(1) CMM connector for IPMB
(4) I2C switch for I2C Bus extender
(4) Power connector (PDB)
Blade connection
(18) PCI-E x 8 connector
H/W Monitor
(4) System temperature sensor with SMBUS
Form Factor: W108 x L358.4 (mm)
PDB Board
(M1608F65-PDB)
Power Rating SPEC
1600W Power output rating (2+1 Redundant PSU)
PSU Power Input
(3) System PSU comply connectors
12DC power input from Chassis Power delivery system
12V and 12Vsb power input
Blade System DC power input
DC power Connector
12V DC power input from chassis delivery system
Power output
(4) Power connector for Blade power
12V DC power
Form Factor: W176.5 mm x L150 mm (6.95 in x 5.91 inch)
Bridge Board
(M1708F65-BDG)
One(1) SATA connector for 2.5'' SATA/SATAII hard drive
Form factor: W118.88 mm x L96.8 mm (4.68 in x 3.81 inch)

http://www.tyan.com
Table 1-1. MicroServer Features (Continued)
Item Description
CMM Dedicated LAN port for chassis management
Remote management & monitoring
System Blades
Blade Present status
Blade Power On/Power Off
Blade Power Stagger Start-up
Blade Reset
Blade Graceful Shutdown
Blade identify (LED on/off)
Power Supplies
Power Present status
Power Status (on or off)
Cooling fans
FAN speed control & monitor
FAN failed alert
Networking switches (option)
Reset Ethernet Switch
Gigabit Switch Management UI Links
H/W Healthy Monitor (Blade/Chassis/PSU module/FAN
module):
System Healthy monitor (Temperature sensors, power status
and FAN speed)
System Event Log
Advance Control
Power Fail alert.
Power consumption Monitor (AC-in/DC-in/DC-out)
IPMI 2.0 MANAGEMENT Through LAN or I2C
E-MAIL report
Chassis Graceful Shutdown

http://www.tyan.com
Table 1-1. MicroServer Features (Continued)
Item Description
Blade BMC Remote management & monitoring
System Blades
Blade Power On/Power Off
Blade Reset
Blade Graceful Shutdown
Blade identify (LED on/off)
H/W Healthy Monitor:
System Healthy monitor (Temperature sensors, and voltages)
System Event Log
IPMI 2.0 MANAGEMENT Through LAN or I2C
iKVM
Serial Over LAN (SOL)
Virtual Media Over LAN
Email report
Chassis Graceful Shutdown
Operating Environment Operating Temperature
10°C to 35°C
Non-Operating Temperature
FM65-B5519
-40°C to 70°C
Operating Humidity
FM65-B5519
10% to 80%
Non-Operating Humidity
FM65-B5519
5% to 95%

http://www.tyan.com
1.3 Product Models
The system board within the Tyan MicroServer blades contain different processors and
chipsets, which are defined by the following models:
FM65-B5519-Intel based platform
1.4 Catalog Parts List
1.4.1 Contents
FM65 Chassis Kit
(1) 4U Chassis
(1) Pass-through / CMM module
(8) Fan Modules
(3) Power Supply Modules
(1) Power Distribution Board (M1608F65-PDB)
(1) Mid Plane Board (M1247F65-BP)
Compute Blade Single Kit
(6) Compute Blade Blanks
(6) Tyan System Boards configured for the FM65-B5519 models
(6) Bridge Boards (M1708F65-BDG)
(6) Heat-sinks
(1) HDD Screw Kit
1.4.2 Accessories
Rail Mounting Kit
Accessory Kit
(3) US Power Cord
(3) EU Power Cord
(1) USB Cable
(1) Rail Screw

http://www.tyan.com
Chapter 2: About Your System
Necessary Information
Safety Information and Precautions
Before installing and using Tyan MicroServer, review the following precautions:
Read all instructions carefully.
Do not place the unit on an unstable surface, cart, or stand.
Do not block the slots and opening on the unit, which are provided for ventilation.
Only use the power source indicated on the marking label.
The unit uses a three-wire ground cable, which is equipped with a third pin to ground
the unit and prevent electric shock.
Do not place anything on the power cord. Place the power cord where it will not cause
an accident.
Follow all warnings and cautions in this manual and on the unit case.
Do not push objects in the ventilation slots as they may touch high voltage components
and result in shock and damage to the components.
When replacing parts, ensure that parts specified by the manufacturer are used.
When service or repairs have been done, perform routine safety checks to verify that
the system is operating correctly.
Avoid using the system near water, in direct sunlight, or near a heating device.
Cover the unit when not in use.
Components and circuit boards can be damaged by static electricity discharge. Follow the
guidelines below to avoid damage to the system or bodily injury.
Proper grounding is required before removing the top cover of the system. Disconnect the
power cable from the power supply and then touch a grounded object to release
static charge.
A grounded wrist strap is recommended during any maintenance or troubleshooting to the
system. To ensure proper handling of the components, refer to the following guidelines:
Avoid touching system board components, IC chips, connectors memory modules and
leads.
The system board is pre-installed in the system. When removing the system board,
always place it on a grounded anti-static surface until it is ready to be reinstalled.
Hold electronic circuit boards by the edges only. Do not touch the components on the
board unless it is necessary to do so. Do not flex, bend or stress circuit boards.
Leave all components inside the static-proof packaging that they ship with until they are
ready for installation.
After replacing components and devices, make sure all screws, springs, or other small
parts are in place and are not left loose inside the case. Metallic parts or metal flakes
can cause electrical shorts.

http://www.tyan.com
Recycling Information
A lithium battery is included with the Tyan MicroServer. Do not puncture or dispose of battery
in fire. There is a danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by manufacturer. Disposal and recycling of used
batteries, parts and components should be done in accordance with local regulations.
General Information
The illustrations are representative of the latest system revision available at the time of
publishing. The system you receive may not look exactly like the illustrations described later.
Work Area
All maintenance and/or troubleshooting of the Tyan MicroServer should be conducted in a
stable, clean working environment. Use containers to store small components separated,
which prevents them from becoming lost or mixing with other components. The use of proper
tools and adequate lighting is recommended.
Recommended Equipment
The following tools are suggested to perform maintenance on the Tyan MicroServer:
Phillips screwdriver
Wrist-grounding strap or conductive mat/anti-static pad

http://www.tyan.com
Chapter3: System Overview
! CAUTION:
Most repairs to the Tyan MicroServer should only be performed by a professional
service technician. Basic repairs and troubleshooting can be done if authorized in
the product documentation or if directed by telephone or online support from
Tyan. If damage has occurred due to repairs or services that are not approved by
Tyan, the product warranty becomes invalid. Review all safety guidelines that are
provided with the Tyan MicroServer.
The Tyan MicroServer contains components that can be removed and replaced. The following
image indicates the location of the components that can be removed, which are further
described in detail in Chapters 5 and 6 of this user’s manual.
Power Supply
Modules
Compute
Blades
System Fan
Modules
Pass-through-
M1902F65-CMMPT
Module
Figure 2-1. Tyan Micro Server Overview

http://www.tyan.com
3.1 System Front View
1 2
Figure 2-2. Front View
Table 2-1. System Front View Modules
ID Description
1 Compute Blade (x18)
2 Pass-through-M1902F65-CMMPT
3.2 System Rear View

1 2
Figure 2-3. Rear View
Table 2-2. System Rear View Modules
ID Description
1 Fan Modules (x8)
2 Power Supply Modules (2+1)

http://www.tyan.com
3.3 System Internal View
2
1
Figure 2-4. Internal View
Table 2-3. System Internal View Modules
ID Description
1 Mid Plane (M1247F65-BP):
18x PCI-e x 8 connector)
2 Power Distribution Board (PDB): M1608F65-PDB

http://www.tyan.com
3.4 Compute Blade Overview
Features
FM65-B5519 Blade
(1) Intel® Sandy Bridge DT, Socket H2, Intel E3 series CPU
Intel® Cougar Point PCH
Common Features
Compact compute blade: 118.88 mm X 263.52 mm(4.68 in x 10.37 inch)
AST2150 iBMC
(4) DDR3 VLP UDIMM slots (up to 32 GB)
(2) Internal 2.5” hard drive bays (with connected bridge board)
(2) Intel® 82574L Gigabit controllers
3.5 FM65-B5519 Blade
3.5.1 Front View
Figure 2-5. FM65-B5519 Blade Front View

http://www.tyan.com
3.5.2 Internal View
Figure 2-6. FM65-B5519 Blade Internal View

http://www.tyan.com
3.5.3 Compute Blade LED Behavior
The following information provides LED behavior for both compute blade models.
Table 2-4. Compute Blade LED Behavior
Field Color Behavior
Blinking Green AccessHDD Activity
Off System normal
ID Solid blue Active
Solid Red AlertSystem Status
Off Normal
ID/System Status Blinking blue/red ID located/System Alert
Solid Green Power onSystem Power
Off Power off

http://www.tyan.com
3.6 Mid Plane
1 2
Figure 2-7. Mid Plane Front View
Table 2-5. Mid Plane Front View
ID Description
1 PCI-E x8 connectors (x18)
2 PCI-E x16 connectors (x2)
1
3
2
Figure 2-8. Mid Plane Rear View
Table 2-6. Mid Plane Rear View
ID Description
1 2 x 6 PIN Power connector (x4)
2 2 x 5 PIN I2C connector
3 2 x 15 PIN FAN connector