TYAN MicroServer FM65-B5531 Quick start guide

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FM65-B5531
MicroServer Series
Service Engineer’s Manual

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PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.
Copyright 2014 MiTAC International Corporation. All rights reserved. TYAN®is
a registered trademark of MiTAC International Corporation.
Version 1.0
Disclaimer
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN®products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to produce descriptions and/or specifications
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or
other malady resulting from errors or inaccuracies of information contained in
this document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
TYAN®is a trademark of MiTAC International Corporation.
Intel®is a trademark of Intel®Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

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FCC Declaration
Notice for the US
A
Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:
This device must not cause harmful interference.
This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003 du
Canada.
Notice for Europe (CE Mark)
This product is in conformity with the Council
Directive 2004/108/EC.
CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.

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About this Manual
This manual is intended for experienced users and integrators with hardware
knowledge of personal computers.
It is aimed to provide you with instructions on installing your TYAN FM65-B5531.
How this guide is organized
This guide contains the following parts:
Chapter 1: Overview
This chapter provides an introduction to the TYAN FM65-B5531 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.
Chapter 2: Setting Up
This chapter covers procedures on installing the processors, memory modules, hard
drivers and other optional parts.
Chapter 3: Replacing the Pre-installed Components
This chapter covers the removal and replacement procedures for pre-installed
components.
Chapter 4: Mainboard Information
This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.
Chapter5: BIOS Setup
This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.
Chapter 6: Diagnostics
This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.
Appendix:
This chapter provides the cable connection table, the FRU parts list for reference of
system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information
Before installing and using TYAN FM65-B5531, take note of the following
precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.
Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.
You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.
Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.
General Precautions
· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.

Machine Room Environment
· This device is for use only in a machine room or IT room.
 · Make sure that the area in which you install the system is properly
ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
·Do not install the system in or near a plenum, air duct, radiator, or heat
register.
·Never use the product in a wet location.
Equipment Chassis
· Do not block or cover the openings to the system.
·Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
·Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
·Lift equipment using both hands and with your knees bent.
Equipment Racks
To avoid injury or damage to the equipment:
·Observe local occupational health and safety requirements and guidelines
for manual materials handling.
·Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
·Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
·Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
·Make sure the rack is properly secured to the floor or ceiling.
·Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
·Make sure racks are coupled together if it is a multiple-rack installation.
·Make sure the rack is level and stable before installing an appliance in the
rack.
·Make sure the leveling jacks are extended to the floor.

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·Make sure the full weight of the rack rests on the leveling jacks.
·Always load the rack from the bottom up. Load the heaviest component in
the rack first.
·Make sure the rack is level and stable before pulling a component out of the
rack.
·Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
· The rack width and depth must allow for proper serviceability and cable
management.
· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
·The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
·If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
·Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.
Equipment Power Cords
· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
·Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
·In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.
·
Do not place objects on AC power cords or cables. Arrange them so that no

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one might accidentally step on or trip over them.
·Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
·To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.
Equipment Batteries
· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
·Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
·Do not expose the battery to temperatures higher than 60°C (140°F).
·The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
·Do not attempt to recharge the battery.
·Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.
Equipment Modifications
· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.
Equipment Repairs and Servicing
· The installation of internal options and routine maintenance and service of
this product should be performed by individuals who are knowledgeable about
the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.
·Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
·Allow the product to cool before removing covers and touching internal

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components.
·Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
·Do not use conductive tools that could bridge live parts.
·Use gloves when you remove or replace system components; they can
become hot to the touch.
·If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the
product.
–The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating
instructions.

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Table of Contents
Chapter 1: Overview....................................................................... 17
1.1 About the TYAN FM65-B5531................................................ 17
1.2 Product Models....................................................................... 17
1.3 Features.................................................................................. 18
1.4 Standard Parts List................................................................. 22
1.4.1Box Contents.................................................................... 22
1.4.2 Accessories ..................................................................... 22
1.5 About the Product................................................................... 23
1.5.1System Front View........................................................... 23
1.5.2System Rear View ........................................................... 24
1.6 About the Blade...................................................................... 25
1.6.1 Blade Front view.............................................................. 25
1.6.2 Blade Top View ............................................................... 26
1.6.3 Pass-through Module Top View ...................................... 27
1.6.4 Blade Block Diagram....................................................... 28
Chapter 2: Setting Up..................................................................... 29
2.0.1 Before you Begin............................................................. 29
2.0.2 Work Area........................................................................ 29
2.0.3 Tools................................................................................ 29
2.0.4 Precautions...................................................................... 30
2.1 Installing Motherboard Components ...................................... 31
2.1.1 Installing Hard Drives for Compute Blades ..................... 31
2.1.2 Installing the CPU and Heatsink...................................... 34
2.1.3 Installing the Memory ...................................................... 37
2.2 Rack Mounting........................................................................ 39
2.2.1 Installing the Server in a Rack......................................... 39
2.2.2 Installing the inner Rails to the Chassis .......................... 40
2.2.3 Installing the Outer Rails to the Rack.............................. 41
2.2.4 Rack mounting the Server............................................... 42
Chapter 3: Replacing Pre-Installed Components ........................ 45
3.0.1 Introduction...................................................................... 45
3.0.2 Disassembly Flowchart.................................................... 45
3.1 Removing the Cover............................................................... 46
3.2 Replacing the HDD Backplane Board.................................... 47
3.2.1 HDD BP Board Features................................................. 50
3.2.2 Connector Pin Definitions................................................ 51
3.3 Replacing the Power Distribution Board................................. 52
3.3.1 Power Distribution Board Features ................................. 55
3.3.2 Pin Definitions.................................................................. 56

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3.4 Replacing the System Fan ..................................................... 58
3.5 Replacing the Blade Boards................................................... 61
3.5.1Blade Board Features...................................................... 63
3.6 Replacing the Power Supply .................................................. 65
Chapter 4: Mainboard Information................................................ 67
4.1 Board Image........................................................................... 68
4.2 Block Diagram ........................................................................ 69
4.3 Mainboard Mechanical Drawing............................................. 70
4.4 Board Parts, Jumpers and Connectors.................................. 71
4.5 Thermal Interface Material...................................................... 74
4.6 Tips on Installing Motherboard in Chassis ............................. 75
4.7 Installing the Memory ............................................................. 77
4.8 Finishing Up............................................................................ 78
Chapter 5: BIOS Setup................................................................... 79
5.1 About the BIOS....................................................................... 79
5.1.1 Setup Basics.................................................................... 79
5.1.2 Getting Help..................................................................... 80
5.1.3 In Case of Problems........................................................ 80
5.1.4 Setup Variations .............................................................. 80
5.2 Main Menu.............................................................................. 81
5.3 Advanced Menu...................................................................... 82
5.3.1 PCI Subsystem Settings.................................................. 84
5.3.2 ACPI Settings .................................................................. 85
5.3.3 S5 RTC Wake Settings.................................................... 86
5.3.4 CPU Configuration........................................................... 87
5.3.5 SATA Configuration......................................................... 90
5.3.6 USB Configuration........................................................... 91
5.3.7 Hardware Health Configuration....................................... 93
5.3.8 Super IO Configuration.................................................... 95
5.3.9 Serial Port Console Redirection ...................................... 97
5.3.10 Network Stack Configuration.......................................102
5.3.11 Onboard Device Configuration.................................... 103
5.4 Chipset Menu ....................................................................... 104
5.4.1 PCH-IO Configuration....................................................105
5.4.2 System Agent (SA) Configuration .................................107
5.4.3 Watchdog Timer Configuration......................................110
5.4 Boot ......................................................................................111
5.4.1 CSM16 Parameters....................................................... 113
5.4.2 CSM Parameters........................................................... 114
5.4.3 Delete Boot Option........................................................ 116
5.6 Security.................................................................................117
5.6.1 Secure Boot Menu......................................................... 118

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5.7 Server Management............................................................. 121
5.7.1 System Event Log .........................................................122
5.7.2 BMC Network Configuration..........................................123
5.8 Save & Exit...........................................................................124
Chapter 6: Diagnostics ................................................................ 127
4.1 Flash Utility........................................................................... 127
6.2 AMIBIOS Post Code (Aptio)................................................. 128
Appendix I: Cable Connection Tables ........................................ 135
Appendix II: FRU Parts Table ...................................................... 137
Appendix III: Technical Support ................................................. 139

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NOTE

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Chapter 1: Overview
1.1 About the TYAN FM65-B5531
Congratulations on your purchase of the TYAN®FM65-B5531, a highly optimized
4U rack-mountable barebone system. The FM65-B5531 is designed to support
single Intel®Xeon E3-1200 v3 Series Processor and up to 32GB DDR3 VLP ECC
1333/1600 UDIMM memory per compute blade, providing a rich feature set and
incredible performance. Leveraging advanced technology from Intel®, the
FM65-B5531 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, and lightning-fast PCI-E bus implementation. The
FM65-B5531 not only empowers your company in nowadays IT demand but also
offers a smooth path for future application usage.
TYAN®also offers the FM65-B5531 in a version that can support up to thirty-six 2.5”
fixed hard drives. The FM65-B5531 uses TYAN’s latest chassis featuring a robust
structure and a solid mechanical enclosure. All of this provides FM65-B5531 the
power and flexibility to meet the needs of nowadays server application.
1.2 Product Models
The system board within the Tyan MicroServer blades contain different processors
and chipsets, which are defined by the following models:
B5531F65X18-160PV2R: Intel-based platform
B5531F65X18-160PV2R-HE: Intel-based platform

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1.3 Features
TYAN FM65B5531 (B5531F65X18-160PV2R)
System
Form Factor 4U Rackmount Frame w/ 18x Blades
Gross Weight 55 kg
Chassis Model FM65
Dimension (D x W x
H) 25.6" x 17.32" x 6.93" (651.2 x 440 x 176.3mm)
Motherboard S5531GM2N
Front Panel (per
blade)
Buttons (1) PWR
LEDs (1) PWR / (1) ID/ (1) HDD
I/O Ports (2) USB ports / (1) D-Sub 15 pin port / (1) RJ45
LAN
Internal Drive Bay
(per blade)
Type / Q'ty (2) 2.5" fixed
Supported HDD
Interface height: 15mm / SATA-III 6.0Gb/s
System Cooling
Configuration (per
blade)
FAN (8) 8cm hot-swap fans
Power Supply (per
blade)
Type RPSU
Input Range 100-127V /8A, 200-240V/ 4A
Frequency 47 - 63 Hertz
Output Watts 800 Watts
Efficiency 80-plus Platinum
Redundancy (2+1)
Processor (per
blade)
Supported CPU
Series Intel Xeon E3-1200 v3 series processors
Socket Type / Q'ty LGA 1150/ (1)
Thermal Design
Power (TDP)
wattage Max up to 84W
Chipset (per blade) PCH Intel C222
Memory (per
blade)
Supported DIMM
Qty (4) DIMM slots
DIMM Type / Speed DDR3 VLP ECC 1333/1600 UDIMM
Capacity Up to 32GB
Memory channel 2 Channels per CPU
Memory voltage 1.35V / 1.5V
LAN (per blade) Port Q'ty (2)
Controller Intel I350-AM2
Storage (per
blade) SATA
Connector (2) SATA
Controller Intel C222
Speed 6.0Gb/s

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RAID RAID 0/1/10/5 (Intel RSTe 3.x)
Graphic (per
blade)
Connector type D-Sub 15-pin
Resolution 1920x1200@60Hz
Chipset Aspeed AST2300
I/O ports (per
blade)
USB (2) ports
VGA (1) D-Sub 15-pin port
RJ-45 (1) blade front panel LAN port
System Monitoring
(per blade)
Chipset Onboard Aspeed AST2300
Temperature Monitors temperature for CPU & system
environment
LED Fan fail LED indicator / Over temperature warning
indicator
Server
Management (per
blade)
Onboard Chipset Onboard Aspeed AST2300
AST2300 IPMI
Feature
IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub
AST2300 iKVM
Feature 24-bit high quality video compression / 10/100 Mb/s MAC interface
BIOS (per blade)
Brand / ROM size AMI / 16MB
Feature
Multiple boot options / Plug and Play (PnP) /PCI2.3
/WfM2.0 /SMBIOS2.3 /PXE boot /
User-configurable H/W monitoring /
Auto-configurable of hard disk types / ACPI 5.0
power management
Operating System OS supported list Please refer to our Intel OS supported list.
Regulation FCC (DoC) Class A
CE (DoC) Yes
Operating
Environment
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating
Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
In/Non-operating
Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Compliant Yes
Package Contains
Barebone (1) FM65-B5531 Barebone
Manual (1) User's manual / (1) Quick Installation Guide
Installation CD (1) TYAN installation CD
Cable Power Cord (3) US type power cord / (3) EU type power cord

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TYAN FM65B5531 (B5531F65X18-160PV2R-HE)
System
Form Factor 4U Rackmount Frame w/ 18x Blades
Gross Weight 55 kg
Chassis Model FM65
Dimension (D x W x
H) 25.6" x 17.32" x 6.93" (651.2 x 440 x 176.3mm)
Motherboard S5531GP2NR-HE
Front Panel (per
blade)
Buttons (1) PWR
LEDs (1) PWR / (1) ID/ (1) HDD
I/O Ports (2) USB ports / (1) D-Sub 15 pin port / (1) RJ45
LAN
Internal Drive Bay
(per blade)
Type / Q'ty (2) 2.5" fixed
Supported HDD
Interface height: 15mm / SATA-III 6.0Gb/s
System Cooling
Configuration (per
blade)
FAN (8) 8cm hot-swap fans
Power Supply (per
blade)
Type RPSU
Input Range 100-127V /8A, 200-240V/ 4A
Frequency 47 - 63 Hertz
Output Watts 800 Watts
Efficiency 80-plus Platinum
Redundancy (2+1)
Processor (per
blade)
Supported CPU
Series Intel Xeon E3-1200 v3 series processors (Intel® HD Graphics)
Socket Type / Q'ty LGA 1150/ (1)
Thermal Design
Power (TDP)
wattage Max up to 84W
Chipset (per blade) PCH Intel C226
Memory (per
blade)
Supported DIMM
Qty (4) DIMM slots
DIMM Type / Speed DDR3 VLP ECC 1333/1600 UDIMM
Capacity Up to 32GB
Memory channel 2 Channels per CPU
Memory voltage 1.35V / 1.5V
LAN (per blade) Port Q'ty (2)
Controller Intel I350-AM2
Storage (per
blade) SATA
Connector (2) SATA
Controller Intel C226
Speed 6.0Gb/s
RAID RAID 0/1/10/5 (Intel RSTe 3.x)