Unitek MICROPULL IV MP4/115 User manual

USER’S MANUAL NO. 990-180
REVISION B: July 2000
OPERATION AND MAINTENANCE MANUAL
FOR THE
MICROPULL®IV
WIRE BOND PULL TESTER
Model Stock Number
MP4/115 6-099-04
MP4/230 6-099-04-01
MP4(CE)/115 6-099-05
MP4(CE)/230 6-099-05-01

MICROPULL®IV WIRE BOND PULL TESTER
ii 990-180
Copyright © 2000, Unitek Miyachi Corporation
The engineering designs, drawings and data contained herein are the proprietary work of
UNITEK MIYACHI CORPORATION and may not be reproduced, copied, exhibited or
otherwise used without the written authorization of UNITEK MIYACHI CORPORATION.
Printed in the United States of America
Revision Record
Revision EO Date Basis of Revision
A Original publication
B 18347 6/00 Addition of CE version.

MICROPULL®IV WIRE BOND PULL TESTER
990-180 iii
FOREWORD
Thank you for purchasing a Unitek Equipment Micropull® IV Wire Bond Pull Tester
Upon receipt of your equipment, please thoroughly inspect it for shipping damage prior to its
installation. Should there be any damage, please immediately contact the shipping company to file a
claim, and notify Unitek Equipment at:
1820 South Myrtle Avenue
P.O. Box 5033
Monrovia, CA 91017-7133
Telephone: [phone]
FAX: [phone]
e-mail: [email protected]
The purpose of this manual is to supply operating and maintenance personnel with the information
needed to properly and safely operate and maintain the Micropull IV Wire Bond Pull Tester.
We have made every effort to ensure that the information in this manual is accurate and adequate.
Should questions arise, or if you have suggestions for improvement of this manual, please contact us at
the above location/numbers.
Unitek Miyachi Corporation is not responsible for any loss due to improper use of this product.

MICROPULL®IV WIRE BOND PULL TESTER
iv 990-180
SAFETY NOTES
This instruction manual describes how to operate, maintain and service the Micropull IV, and provides
instructions relating to its SAFE use. Procedures described in this manual MUST be performed, as
detailed, by QUALIFIED and TRAINED personnel.
For SAFETY, and to effectively take advantage of the full capabilities of the tester, please read these
instruction manuals before attempting to use the workstation.
Procedures other than those described in this manual or not performed as prescribed in it, may expose
personnel to electrical hazards.
After reading this manual, retain it for future reference when any questions arise regarding the proper
and SAFE operation of the tester.
Please note the following conventions used in this manual:
WARNING: Comments marked this way warn the reader of actions which, if not followed, might
result in immediate death or serious injury.
CAUTION: Comments marked this way warn the reader of actions which, if not followed, might result
in either damage to the equipment, or injury to the individual if subject to long-term exposure to the
indicated hazard.

MICROPULL®IV WIRE BOND PULL TESTER
990-180 v
CONTENTS
CHAPTER 1: Description............................................................................................................ 1-1
Section I. Features.................................................................................................................... 1-1
Section II. System Components............................................................................................... 1-2
Description.......................................................................................................................... 1-2
Electronic Control Unit................................................................................................. 1-3
Beam Drive Module...................................................................................................... 1-4
Beam Specifications............................................................................................................ 1-6
Hook Specifications............................................................................................................ 1-6
Model MPIT Insertion Tool.......................................................................................... 1-7
Software ........................................................................................................................ 1-7
RS-232C Serial Interface .............................................................................................. 1-8
Calibration Weights ...................................................................................................... 1-9
Standard Device Holder................................................................................................ 1-9
Optics ............................................................................................................................ 1-10
Controls and Indicators....................................................................................................... 1-10
Electronic Control Unit................................................................................................. 1-10
Beam Drive Module...................................................................................................... 1-14
CHAPTER 2: Getting Started .................................................................................................... 2-1
Section I. Planning for Installation .......................................................................................... 2-1
Space Requirements............................................................................................................ 2-1
Power Requirements ........................................................................................................... 2-1
Other Considerations .......................................................................................................... 2-1
Section II. Set-up ..................................................................................................................... 2-1
Incoming Inspection and Unpacking .................................................................................. 2-1
Mounting Optic Mounting Assembly ........................................................................... 2-2
Beam Module Installation............................................................................................. 2-3
Beam Module Removal ................................................................................................ 2-3
Switch and Cable Installation ....................................................................................... 2-3
Section III. Software Installation............................................................................................. 2-4
CHAPTER 3: Operating Instructions ....................................................................................... 3-1
Section I. Operating Precautions ............................................................................................. 3-1
General Operator Safety ..................................................................................................... 3-1
Section II. Preparing for Operation.......................................................................................... 3-1
Initial Operating Procedures ............................................................................................... 3-1
Installing the Hook on B10 and B100 Beam ...................................................................... 3-1
Installing the Rotatable Hook – B100R Beam.................................................................... 3-2
Setup Controls..................................................................................................................... 3-3
Beam Travel Adjust ............................................................................................................ 3-4
DOWNSTOP Adjust........................................................................................................... 3-5

MICROPULL®IV WIRE BOND PULL TESTER
vi 990-180
Zero Adjust ......................................................................................................................... 3-6
Section III. Operation Procedures............................................................................................ 3-6
Example of Non-Destruct Mode Testing............................................................................ 3-6
Example of Destructive Mode Testing ............................................................................... 3-8
Section IV. Printer Operation .................................................................................................. 3-9
Set-up and Interpreting Readouts ....................................................................................... 3-9
Non-Destruct Testing Program..................................................................................... 3-11
Destruct Testing Program ............................................................................................. 3-14
Printed Reports ............................................................................................................. 3-19
Disk Files and LOTUS 1-2-3.............................................................................................. 3-22
Suggestions ......................................................................................................................... 3-23
Program Documentation ..................................................................................................... 3-23
Reference Listing for MP4.BAS Release 1.0 ..................................................................... 3-24
CHAPTER 4: User Maintenance ............................................................................................... 4-1
Section I. Precautions .............................................................................................................. 4-1
General Operator Safety ..................................................................................................... 4-1
Section II. Operator Maintenance............................................................................................ 4-1
Calibration .......................................................................................................................... 4-1
Test Equipment Required ............................................................................................. 4-1
Preliminary.................................................................................................................... 4-2
Beam Travel Calibration............................................................................................... 4-3
Digital Measurement Circuit Calibration ..................................................................... 4-4
Calibration of the Beam Module .................................................................................. 4-4
Units Display ................................................................................................................ 4-5
Auto Zero...................................................................................................................... 4-6
Non-Destruct Test Performance ................................................................................... 4-6
Troubleshooting .................................................................................................................. 4-7
Repair.................................................................................................................................. 4-7
APPENDIX A: Specifications ..................................................................................................... A-1
APPENDIX B: Background and Reference Information ........................................................ B-1
APPENDIX C: Conversion for Different Input Voltage.......................................................... C-1

MICROPULL®IV WIRE BOND PULL TESTER
990-180 vii
ILLUSTRATIONS
Figure Title Page
1-1 Micropull IV, Major Components ................................................................................ 1-2
1-2 Nondestructive Pull Testing Reshaping the Wire Bonds.............................................. 1-5
1-3 B10 and B100 Beam ..................................................................................................... 1-6
1-4 B100R Beam and Insertion Tool .................................................................................. 1-6
1-5 1000g Beam Hook and Calibration System.................................................................. 1-6
1-6 MP4, Controls and Indicators ....................................................................................... 1-10
1-7 Rear View of MP4 ........................................................................................................ 1-13
2-1 Optic Mounting Assembly............................................................................................ 2-2
2-2 Attaching Beam Module to the Beam Arm .................................................................. 2-3
3-1 Installing Hook on B10 and B100 Beams..................................................................... 3-1
3-2 B1000 Beam.................................................................................................................. 3-2
3-3 B100R Rotatable Beam and Hook Assemblies ............................................................ 3-3
3-4 Beam Assembly Adjustments ....................................................................................... 3-4
4-1 Location of Components............................................................................................... 4-2
4-2 Servo PCB Assembly A3.............................................................................................. 4-3
4-3 Logic PCB Assembly A2.............................................................................................. 4-4
TABLES
Figure Title Page
1-1 Failure Codes ................................................................................................................ 1-3
1-2 Data Output Connector, J7, Signals.............................................................................. 1-4
1-3 Beam Specifications...................................................................................................... 1-6
1-4 Hook Specifications...................................................................................................... 1-7
1-5 Serial Interface Codes................................................................................................... 1-8
1-6 RS-232 Interface Connector, J1, Signals...................................................................... 1-9
1-7 Message Codes Understood by MP4............................................................................ 1-9
3-1 Test Limits for Non-Destruct Mode ............................................................................. 3-10
4-1 Troubleshooting Table.................................................................................................. 4-7

MICROPULL®IV WIRE BOND PULL TESTER
990-180 1-1
CHAPTER 1
DESCRIPTION
Section I: Features
The Micropull IV (herein called the MP4) is a semiautomatic machine designed to perform wire bond pull
tests in the 0.5 to 1000 gram-force range, using three interchangeable beams, at rates of up to one test per
second. The operator needs only to position the hook under the wire bond to be tested, and the MP4 will
automatically center itself and perform DESTRUCTIVE or NONDESTRUCTIVE wire bond pull tests and
display the test results, as well as transmit them to an optional RS-232C serial interface output connector.
The MP4 can automatically detect wire bond failures which occur during the test as well as excessive wire
bond loop height. This information is part of the output test data.
Bond pull tests are used routinely to evaluate and/or control the mechanical strength of wire bonds in
microcircuit devices. The bond pull test is performed by placing the microelectronic device in an
appropriate holder and positioning a hook under the wire midway between the two bonds. The hook is then
raised until the wire bond breaks (destructive pull test - DPT), or until the bond is stressed to a
predetermined value (nondestructive pull test-NDPT). The term "wire bond" commonly refers to the entire
interconnection consisting of both welds and the wire span. The term "bond" is used to identify a welded
area.
According to industry statistics, insufficient bond strength is a major cause of device failure. The intent of
the NDPT is to use a force great enough to cause weak bonds to fail, yet insufficient to damage good bonds.
Recommended values for the maximum safe forces for NDPT may be found in MIL-STD 883, Method 2011
and 2023. See Appendix B.

CHAPTER 1: SYSTEM DESCRIPTION
MICROPULL®IV WIRE BOND PULL TESTER
1-2 990-180
Section II: System Components
Description
The MP4 shown in figure 1-1, includes the Electronic Control Unit, the Beam Drive Module, Data Logging
software, the RS-232C interface and cable, a base plate, Optic Mounting Assembly, a device holder for flat
substrates, a set of calibration weights, spare fuses and this instruction manual. In addition, the user must
order a separate beam, available in 10 gram, 100 gram, or 1000 gram. Included with each beam is an
assortment of hooks, a hook insertion tool and spare lamps. Optional accessories include hooks, beams,
optics, device holders, and a serial printer.
The accuracy of the MP4 system is r2% of the reading or r2% of the beam scale, whichever is greater. For
example, the accuracy of the 10 gram beam is r0.2 grams, the 100 gram beam is r2 grams, and the 1000
gram beam is r20 grams. The conversion from grams-force to Newtons is accurate to within r2% using the
force of gravity as 981 gmxcm/sec2. The worst case error caused by the deflection of the beam is 0.4%
which is included in the system error specification. The error caused by operator misalignment of the hook
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ull IV
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