VIA Technologies Mobile360 M820 User manual

USER MANUAL
VIA Mobile360 M820
Fanless ultra-compact in-vehicle
safety system with exible ADAS,
SVS, and DMS integraon opons
1.01-28042021

Copyright
Copyright © 2020 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any
form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of
VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respecve holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,
implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this
document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no
responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this
document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons
within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to
cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Noce 1
The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
Noce 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Noce 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or
damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an
order.
ii

Baery Recycling and Disposal
• Only use the appropriate baery specied for this product.
• Do not re-use, recharge, or reheat an old baery.
• Do not aempt to force open the baery.
• Do not discard used baeries with regular trash.
• Discard used baeries according to local regulaons.
Safety Precauons
• Always read the safety instrucons carefully.
• Keep this User’s Manual for future reference.
• All cauons and warnings on the equipment should be noted.
• Keep this equipment away from humidity.
• Put this equipment on a reliable at surface before seng it up.
• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to
the power inlet.
• Do not place the power cord where people will step on it.
• Always unplug the power cord before inserng any add-on card or module.
• If any of the following situaons arise, get the equipment checked by authorized service personnel:
− The power cord or plug is damaged.
− Liquid has entered into the equipment.
− The equipment has been exposed to moisture.
− The equipment is faulty or you cannot get it work according to User’s Manual.
− The equipment has been dropped and damaged.
− The equipment has an obvious sign of breakage.
• Do not leave this equipment in extreme temperatures or in a storage temperature above 70°C (158°F).
The equipment may be damaged.
• Do not leave this equipment in direct sunlight.
• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
• Do not place anything over the power cord.
• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from
overheang.
iii

VIA Mobile360 M820 User Manual
iv
Box Contents
• VIA Moblie360 M820 system
• Phoenix plug to DC jack
• COM cable (for debugging)
• GPS antenna
• 2 x Wi-Fi/BT antennas
Ordering Informaon
Part Number Descripon
M360-820-1Q20A1 Fanless mobile system with 2.054GHz Qualcomm® APQ8096A Embedded
Processor, 4GB LPDDR4 SDRAM, HDMI, 2 USB 3.0, Micro USB 2.0 (debugging),
DIO, COM, CAN bus, Gigabit Ethernet, 9 FAKRA connectors for camera-in, Wi-Fi,
Bluetooth 4.1, GPS, SIM card slot, Micro SD card slot, 2 M.2 slots, 2 2.5" SSD/HDD
bays ,12V DC-out, 9~36V DC-in with IGN
Oponal Accessories
Camera and Accessories
Part Number Descripon
M360-ADAS-1C19A1 1.0MP FOV-35 720p CMOS Front ADAS camera with microphone, speaker and
mounting bracket
M360-DMS-1C19A1 1.0MP FOV-60 720p CMOS DMS camera with IR and mounting bracket
99G40-08115Z 1.0MP FOV-35 720p CMOS automotive-grade camera for BSD
99G40-08116Z 1.0MP FOV-190 720p CMOS automotive-grade camera for SVS + Rear ADAS
99G33-230406 15M FAKRA cable
M360-CBKT-00A1 Camera mounting braket for SVS/BSD 42mm x 28.2mm x 32.3mm (1.65" x 1.11"
x 1.27")
Display Accessories
Part Number Descripon
99G73-01034C 10" Resisve touch monitor (1280x800)
99G73-01030C 7" Resisve touch monitor (1280x800)
Storage Opons
Part Number Descripon
99G61-080554 512GB Transcend 2.5" MLC SSD (-40°C~90°C)
99G61-080904 128GB Transcend 2.5" MLC SSD (-40°C~90°C)
Wireless Modules
Part Number Descripon
99G40-071467 4G LTE/DC-HSPA+/EGPRS Mobile broadband full-size miniPCIe module
(For North America Regions)
99G40-071967 4G LTE/DC-HSPA+/EGPRS Mobile broadband full-size miniPCIe module
(For APAC+ South America Regions)
99G40-071457 4G LTE/DC-HSPA+/EGPRS Mobile broadband full-size miniPCIe module
(For EU/APAC Regions)

VIA Mobile360 M820 User Manual
v
Mounng Opons
Part Number Descripon
M360-SBKT-00A1 Mounng bracket, 337.2mm x 185mm x 62mm

VIA Mobile360 M820 User Manual
vi
Table of Contents
1. Product Overview........................................................................................................................................... 1
1.1 Key Features ......................................................................................................................................... 1
1.1.1 High-Performance.......................................................................................................................... 1
1.1.2 Fanless, Compact, Ruggedized Chassis .......................................................................................... 1
1.1.3 Opmized Integraon with Mulple I/O Access............................................................................ 1
1.1.4 Mulple Camera Support .............................................................................................................. 1
1.1.5 Support for a Wide Range of Power Sources................................................................................. 1
1.1.6 Storage Expansion.......................................................................................................................... 2
1.1.7 Networking Support ...................................................................................................................... 2
1.1.8 Mounng Soluon ......................................................................................................................... 2
1.1.9 Embedded Operang System Ready.............................................................................................. 2
1.2 Product Specicaons ......................................................................................................................... 2
1.3 Layout Diagram..................................................................................................................................... 4
2. External I/O Pin Descripons and Funconality............................................................................................. 7
2.1 HDMI®Port............................................................................................................................................ 7
2.2 USB 3.0 Ports ........................................................................................................................................ 7
2.3 Micro USB 2.0 Port ............................................................................................................................... 7
2.4 Gigabit Ethernet Port............................................................................................................................ 8
2.5 Micro SD Card Slot................................................................................................................................ 8
2.6 SIM Card Slot ........................................................................................................................................ 9
2.7 DIO Port .............................................................................................................................................. 10
2.8 Headphone and Mic-in Port ............................................................................................................... 10
2.9 COM Port ............................................................................................................................................ 10
2.10 CAN Bus Port ...................................................................................................................................... 11
2.11 FAKRA Connectors .............................................................................................................................. 11
2.12 Power Buon...................................................................................................................................... 11
2.13 DC-in Jack ........................................................................................................................................... 12
2.14 DC-out Jack......................................................................................................................................... 12
2.15 Antenna Connectors........................................................................................................................... 13
3. Onboard I/O ................................................................................................................................................ 14
3.1 MiniPCIe Slot ...................................................................................................................................... 14
4. Hardware Installaon ................................................................................................................................... 15
4.1 Installing the 2.5" SATA HDD/SSD ....................................................................................................... 15
4.2 Installing the Wi-Fi Antennas.............................................................................................................. 17
4.3 Installing the GPS Antenna ................................................................................................................. 17
4.4 Installing the FOV Cameras and FAKRA Cables ................................................................................... 18
4.5 Unplugging the FAKRA Cable.............................................................................................................. 19
4.6 Connecng the VIA Mobile360 M820 to the Vehicle's Ignion (IGN) ................................................ 20
4.7 Installing the Phoenix Plug to DC Jack ................................................................................................ 21
5. Soware and Technical Support................................................................................................................... 22
5.1 Yocto Support ..................................................................................................................................... 22
5.2 Technical Support and Assistance....................................................................................................... 22

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vii
Table of Contents
Appendix A Installing Wireless Accessories ..................................................................................................... 23
A.1 Installing the Mobile Broadband MiniPCIe Module ........................................................................... 23
Appendix B Installing Automove-Grade Cameras to the Camera Brackets.................................................... 26
B.1 Installing the FOV-190 Automove-Grade Camera to the Camera Bracket........................................ 26
B.2 Installing the FOV-35 Automove-Grade Camera to the Camera Bracket.......................................... 29
B.3 Installing the Front ADAS Automove-Grade Camera........................................................................ 33
B.4 Installing the DMS Automove-Grade Camera .................................................................................. 37
Appendix C Installing Mounng Bracket.......................................................................................................... 40

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viii
List of Figures
Figure 01: Front panel I/O layout ......................................................................................................................... 4
Figure 02: Back panel I/O layout .......................................................................................................................... 5
Figure 03: Dimensions of the VIA Mobile360 M820 (front view)......................................................................... 5
Figure 04: Dimensions of the VIA Mobile360 M820 (side view) .......................................................................... 5
Figure 05: Dimensions of the VIA Mobile360 M820 (boom view)..................................................................... 6
Figure 06: HDMI port diagram ............................................................................................................................. 7
Figure 07: USB 3.0 port diagram .......................................................................................................................... 7
Figure 08: Micro USB 2.0 port diagram ............................................................................................................... 8
Figure 09: Gigabit Ethernet port diagram ............................................................................................................ 8
Figure 10: Micro SD card slot diagram ................................................................................................................ 9
Figure 11: SIM card slot diagram.......................................................................................................................... 9
Figure 12: DIO port diagram............................................................................................................................... 10
Figure 13: Headphone and Mic-in port diagram................................................................................................ 10
Figure 14: COM port diagram............................................................................................................................. 10
Figure 15: CAN bus port diagram ....................................................................................................................... 11
Figure 16: FAKRA connector diagram................................................................................................................. 11
Figure 17: Power buon diagram....................................................................................................................... 11
Figure 18: DC-in jack diagram............................................................................................................................. 12
Figure 19: DC-out jack diagram .......................................................................................................................... 12
Figure 20: Wi-Fi antenna connectors diagram ................................................................................................... 13
Figure 21: GPS and 4G antenna connectors diagram ......................................................................................... 13
Figure 22: MiniPCIe slot diagram ....................................................................................................................... 14
Figure 23: Unlocking the SATA HDD/SSD bay .................................................................................................... 15
Figure 24: Removing the SATA HDD/SSD bays.................................................................................................... 15
Figure 25: Installing the 2.5" SATA HDD/SSD ..................................................................................................... 16
Figure 26: Reinstalling the SATA HDD/SSD bays ................................................................................................. 16
Figure 27: Installing the Wi-Fi antennas............................................................................................................. 17
Figure 28: Installing the GPS antenna ................................................................................................................ 17
Figure 29: Connecng the FOV camera to the FAKRA cable............................................................................... 18
Figure 30: Connecng the FAKRA cable to the FAKRA connector ...................................................................... 18
Figure 31: Unplugging the FAKRA cable ............................................................................................................. 19
Figure 32: DIO port's pin 8 ................................................................................................................................. 20
Figure 33: VIA Mobile360 M820 and IGN connecon method diagram ............................................................ 20
Figure 34: Connecng the baery cables onto the Phoenix plug to DC jack ..................................................... 21
Figure 35: Connecng the Phoenix plug to DC jack............................................................................................ 21
Figure 36: Unscrewing the boom plate cover .................................................................................................. 23
Figure 37: Removing the boom plate cover..................................................................................................... 24
Figure 38: Installing the mobile broadband module .......................................................................................... 24
Figure 39: Connecng the 4G antenna cable to the micro-RF connector on the module.................................. 25
Figure 40: Installing the 4G antenna .................................................................................................................. 25
Figure 41: Aaching the internal bracket to the external bracket...................................................................... 26
Figure 42: Installing the double-sided adhesive tape on the camera bracket.................................................... 26
Figure 43: Installing the FOV-190 camera on the camera bracket...................................................................... 27
Figure 44: Removing the double-sided adhesive tape protecve cover ............................................................ 27

VIA Mobile360 M820 User Manual
ix
List of Figures
Figure 45: Installing the camera bracket with FOV-190 camera on your vehicle ............................................... 28
Figure 46: Adjusng the FOV-190 camera angle ................................................................................................ 28
Figure 47: Aaching the internal bracket to the external bracket...................................................................... 29
Figure 48: Installing the double-sided adhesive tape on the camera bracket.................................................... 29
Figure 49: Preparing the FOV-35 camera ........................................................................................................... 30
Figure 50: Installing the FOV-35 camera on the camera bracket........................................................................ 30
Figure 51: Removing the double-sided adhesive tape protecve cover ............................................................ 31
Figure 52: Installing the camera bracket with FOV-35 camera on your vehicle ................................................. 32
Figure 53: Adjusng the FOV-35 camera angle .................................................................................................. 33
Figure 54: Removing the protecve lens cover .................................................................................................. 34
Figure 55: Installing the Front ADAS camera...................................................................................................... 34
Figure 56: Adjusng the Front ADAS camera angle............................................................................................ 35
Figure 57: Connecng the power and microphone/speaker adapter cable....................................................... 35
Figure 58: Connecng the 2-pole power connector for the Front ADAS camera............................................... 36
Figure 59: Connecng the HP/MIC/GND wires for the Front ADAS camera....................................................... 36
Figure 60: Removing the double-sided adhesive tape protecve cover ............................................................ 37
Figure 61: Installing the DMS camera in your vehicle ........................................................................................ 38
Figure 62: Adjusng the DMS camera angle ...................................................................................................... 38
Figure 63: Connecng the USB power adapter cable......................................................................................... 39
Figure 64: Connecng the USB cable to the VIA Mobile360 M820.................................................................... 39
Figure 65: Mounng bracket parts..................................................................................................................... 40
Figure 66: Installing the VIA Mobile360 M820 onto the top casing................................................................... 40
Figure 67: Installing the base cover.................................................................................................................... 41
Figure 68: Securing the top casing and base cover together ............................................................................. 41
Figure 69: Mounng the VIA Mobile360 M820 ................................................................................................. 42

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x
List of Tables
Table 01: HDMI port pinouts .............................................................................................................................. 7
Table 02: USB 3.0 port pinouts ........................................................................................................................... 7
Table 03: Micro SD card slot pinouts .................................................................................................................. 8
Table 04: Gigabit Ethernet port pinouts ............................................................................................................. 8
Table 05: Gigabit Ethernet port LED color denion .......................................................................................... 8
Table 06: SIM card slot pinouts........................................................................................................................... 9
Table 07: SIM card slot pinouts........................................................................................................................... 9
Table 08: DIO port pinouts................................................................................................................................ 10
Table 09: Headphone and Mic-in port pinouts................................................................................................. 10
Table 10: COM port pinouts.............................................................................................................................. 10
Table 11: CAN bus ports pinouts....................................................................................................................... 11
Table 12: FAKRA connector pinout ................................................................................................................... 11
Table 13: Power buon behavior descripon................................................................................................... 12
Table 14: Power buon behavior descripon................................................................................................... 12
Table 15: DC-out jack pinouts........................................................................................................................... 12
Table 16: MiniPCIe slot pinouts ........................................................................................................................ 14

VIA Mobile360 M820 User Manual
1
1. Product Overview
The VIA Mobile360 M820 is a fanless ultra-compact in-vehicle 360° surround view surveillance and ADAS
system. It delivers real-me in-vehicle 360° video monitoring and recording for up to nine automove-grade
camera streams, and boost vehicle safety and eciency with ADAS technology.
With its ruggedized design that has been opmized for the most demanding on-road and o-road condions,
the VIA Mobile360 M820 provides a exible and high-performance soluon for a wide variety of applicaons
ranging from Freight Transportaon & Delivery, Construcon, Industrial, & Mining, and Agriculture & Forestry
to Refuse Collecon, Armored Cars & Secure Freight Shipping, and Buses and Coaches.
The VIA Mobile360 M820 is powered by the Qualcomm® APQ8096A Embedded Processor, which features
two high-performance Kryo™ cores up to 2.054GHz two low-power Kryo cores up to 1.593GHz. It combines
advanced compung, graphics and AI processing performance, rich connecvity opons, and I/O peripheral
integraon capabilies in an ultra-compact fanless system.
Measuring just 240mm (W) x 53mm (H) x 180mm (D), the system integrates a rich set of I/O features through
the front and back panels of its ultra-compact chassis, including an HDMI port, two USB 3.0 ports, Gigabit
Ethernet, CAN bus, nine FAKRA connectors for camera-in, and a Micro SD card slot. Other features include 4GB
LPDDR4 SDRAM, 16GB eMMC ash memory, a SIM card slot, DIO, COM, and a headphone & mic-in port.
The VIA Mobile360 M820 supports high compung power operaon with low power consumpon, and it has a
built-in power management system that protects from power surges – guarding against damage from transient
car power. With the power management system, it is capable of handling a wide range of DC power inputs
from 9~36V.
1.1 Key Features
1.1.1 High-Performance
The VIA Mobile360 M820 system is powered by a Qualcomm® APQ8096A Embedded Processor that provides a
full range of rich features including superb mul-tasking performance that delivers consistent performance for
a host of connected device applicaons.
1.1.2 Fanless, Compact, Ruggedized Chassis
The VIA Mobile360 M820 delivers fanless operaon in a sealed aluminum alloy chassis that also acts as a
thermal soluon. The compact chassis design makes it suitable for installaons in space-crical environments,
while also ensuring maximum reliability.
1.1.3 Opmized Integraon with Mulple I/O Access
With front and back panel I/O access, the VIA Mobile360 M820 can be easily congured to support a wide
variety of applicaons with easy integraon and quick setup.
1.1.4 Mulple Camera Support
The VIA Mobile360 M820 is equipped with nine FAKRA connectors for camera-in, making it ideal for in-vehicle
360° SVS, DMS, and ADAS applicaons.
1.1.5 Support for a Wide Range of Power Sources
The VIA Mobile360 M820 supports a wide range of input power, from 9V to 36V DC. Flexible power input
enables the VIA Mobile360 M820 to be deployable in a broad variety of automaon environments.

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1.1.6 Storage Expansion
The VIA Mobile360 M820 has 16GB of eMMC ash storage onboard, and features a Micro SD card slot
supporng an addional 32GB, and two HDD/SSD bays for 2.5" SATA HDD/SSD.
1.1.7 Networking Support
The VIA Mobile360 M820 is equipped with Wi-Fi, GPS, and an RJ-45 port that provides high-speed Gigabit
Ethernet. The 4G connecvity can be added through the miniPCIe slot using the oponal mobile broadband
miniPCIe module.
1.1.8 Mounng Soluon
The VIA Mobile360 M820 supports mulple methods for secure chassis mounng. The rugged VIA Mobile360
M820 can be mounted on the side-panel of a vehicle, oor bed, or any at surface.
1.1.9 Embedded Operang System Ready
The VIA Mobile360 M820 features a complete soware evaluaon image based on Yocto 2.3.
1.2 Product Specicaons
Processor
• Qualcomm® APQ8096A Embedded Processor
−Two high-performance Kryo cores up to 2.054GHz
−Two low power Kryo cores up to 1.593GHz
System Memory
• 4GB LPDDR4 SDRAM
Storage
• 16GB eMMC ash memory
• 2 x M.2 SATA slots
• 2 x 2.5" SATA HDD/SSD storage bays
Graphics
• Qualcomm® Adreno™ 530 GPU
−3D graphics accelerator with 64-bit addressing 624MHz
−Graphics engine supporng OpenGL ES 3.1/GEP, GL4.4, DX11.3/4, OpenCL 2.0, Renderscript-Next
−Supports H.264, VP8, HEVC 8/10-bit, VP9 video decoding up to: 4K@60fps, 1080p@240fps, 8 x
1080p@30fps
Camera-in Interface
• 3 x DS90UB964-Q1 Quad FPD-Link III deserializer Hub
LAN
• RTL8111G Ethernet Controller
Wireless Connecvity
• AMPAK AP12356_I MiniPCIe Wi-Fi/BT 4.1 module
• MAX-M8Q-0-10 u-blox 8 GNSS module

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Audio
• TI 6PAIC3104IRHBRQ1 Audio Codec
HDMI
• Integrated HDMI 2.0 transmier
Expansion I/O
• 1 x MiniPCIe slot (USB only) for 4G module
• 1 x MiniPCIe slot (PCIe/USB) for Wi-Fi/BT module
Front Panel I/O
• 2 x USB 3.0 ports
• 1 x Micro USB 2.0 port (for debugging)
• 1 x Micro SD card slot
• 1 x SIM card slot
• 2 x 2.5" SATA HDD/SSD bays
• 1 x Power buon
Back Panel I/O
• 1 x HDMI port
• 1 x DIO port
• 1 x COM port
• 1 x CAN bus port
• 1 x Gigabit Ethernet port
• 9 x FAKRA connectors for camera-in
• 1 x Headphone and Mic-in port
• 4 x Antenna connectors for Wi-Fi, 4G, GPS
• 1 x 4-pole Phoenix 9~36 V DC-in
• 1 x 2-pole Phoenix 12V DC-out
Power Supply
• 9~36V DC-in with IGN
Operang System
• Yocto 2.3
Operang Temperature
• -20°C ~ 70°C
Storage Temperature
• -20°C ~ 70°C
Operang Humidity
• 0 ~ 95% (non-condensing)
Vibraon Loading During Operaon
• ISO-16750-3 Test VII compliance
Shock During Operaon
• ISO-16750-3 Test VII compliance

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Mechanical Construcon
• Aluminum alloy top cover
• Metal chassis housing
Dimensions
• 240mm (W) x 53mm (H) x 180mm (D) (9.45" x 2.09" x 7.09")
Weight
• 3.0kg (6.61lbs)
Compliance
• CE, FCC
Notes:
1. As the operang temperature provided in the specicaons is a result of tesng performed in a tesng chamber, a
number of variables can inuence this result. Please note that the working temperature may vary depending on
the actual situaon and environment. It is highly recommended to execute a solid tesng program and take all
variables into consideraon when building the system. Please ensure that the system is stable under at the
required operang temperature in terms of applicaon.
2. Please note that the lifespan of the onboard eMMC/UFS memory chip may vary depending on the amount of
access. More frequent and larger data access on the eMMC memory will shorten lifespan. Therefore, it is highly
recommended to use replaceable external storage (e.g., SD card) for large data access.
1.3 Layout Diagram
Figure 01: Front panel I/O layout

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Figure 02: Back panel I/O layout
Figure 03: Dimensions of the VIA Mobile360 M820 (front view)
Figure 04: Dimensions of the VIA Mobile360 M820 (side view)

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Figure 05: Dimensions of the VIA Mobile360 M820 (boom view)

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2. External I/O Pin Descripons and Funconality
The VIA Mobile360 M820 has a wide selecon of interfaces, and includes a selecon of frequently-used ports
as part of the external I/O coastline.
2.1 HDMI®Port
The VIA Mobile360 M820 is equipped with one HDMI port on the back panel. A HDMI port Type A receptacle
connector provides connecon to High Denion video and digital audio using a single cable. The pinouts of
the HDMI port are shown below.
Pin Signal Pin Signal
1D2+ 11 GND
2GND 12 CLK-
3D2- 13 CEC
4D1+ 14 NC
5 GND 15 DDC_CLK
6D1- 16 DDC_DATA
7 D0+ 17 GND
8GND 18 HDMI_5V
9 D0- 19 PLUG_DET
10 CLK+
Figure 06: HDMI port diagram
Table 01: HDMI port pinouts
2.2 USB 3.0 Ports
The VIA Mobile360 M820 is equipped with two USB 3.0 ports on the front panel. Each USB 3.0 port has a
maximum data transfer rate of up to 5Gbps and is backwards compable with the USB 2.0 specicaon. The
USB ports provides complete Plug and Play and hot swap capabilies for external devices. The pinouts of the
USB 3.0 ports are shown below.
Pin Signal
1 VBUS
2D-
3D+
4GND
5RX-
6RX+
7 GND
8TX-
9 TX+
Figure 07: USB 3.0 port diagram
Table 02: USB 3.0 port pinouts
2.3 Micro USB 2.0 Port

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The VIA Mobile360 M820 is equipped with one Micro USB 2.0 port located on the front panel. The Micro USB
2.0 port supports OTG (On-The-Go) for debugging. The pinouts of the Micro USB 2.0 port are shown below.
Pin Signal
1 VBUS
2D-
3D+
4ID
5 GND
Figure 08: Micro USB 2.0 port diagram
Table 03: Micro SD card slot pinouts
2.4 Gigabit Ethernet Port
The VIA Mobile360 M820 comes with one Gigabit Ethernet port on the back panel which uses an 8 Posion
and 8 Contact (8P8C) receptacle connector commonly known as RJ-45. It is fully compliant with the IEEE 802.3
(10BASE-T), 802.3u (100BASE-TX), and 802.3ab (1000BASE-T) standards. The pinouts of the Gigabit Ethernet
port are shown below.
Pin Signal
1TX1+
2TX1-
3TX2+
4TX2-
5 TX3+
6TX3-
7 TX4+
8TX4- Figure 09: Gigabit Ethernet port diagram
Table 04: Gigabit Ethernet port pinouts
The Gigabit Ethernet port (RJ-45) is equipped with two LED indicators on the front side to show its Acve/Link
status and Speed status.
Acve LED
(Le LED on RJ-45 port)
Link LED
(Right LED on RJ-45 port)
Link o LED is o LED is o
Speed_10Mbit Green ash LED is o
Speed_100Mbit Red ash LED is o
Speed_1000Mbit LED is o Orange ash
Table 05: Gigabit Ethernet port LED color denion
2.5 Micro SD Card Slot

VIA Mobile360 M820 User Manual
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The VIA Mobile360 M820 comes with a Micro SD card slot located on the front panel with support for a
maximum storage capacity of 32GB. The pinouts of the Micro SD card slot are shown below.
Pin Signal
1SD_DAT2
2SD_DAT3
3SD_CMD
4VDD
5 SD_CLK
6GND
7 SD_DAT0
8SD_DAT1
9 SD_CD-
Figure 10: Micro SD card slot diagram
Table 06: SIM card slot pinouts
2.6 SIM Card Slot
The VIA Mobile360 M820 comes with an oponal SIM card slot located on the front panel that supports 4G
SIM cards. SIM card usage on the VIA Mobile360 M820 requires that a 4G module is installed in the miniPCIe
slot, enabling the 4G funconality, otherwise the SIM card slot will be disabled. The SIM card slot is designed
for use with 4G modules that do not support built-in SIM card slots. The pinouts of the SIM card slot are shown
below.
Pin Signal
1VSIM_VCC
2GND
3VSIM_RST
4VSIM_VCC
5 VSIM_CLK
6VSIM_DATA
7 GND
8 NC
Figure 11: SIM card slot diagram
Table 07: SIM card slot pinouts

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2.7 DIO Port
The VIA Mobile360 M820 is equipped with a DIO port located on the back panel. The DIO port oers a Digital
I/O communicaon interface to support 8-bit GPIO. The pinouts of the DIO port are show below.
Pin Signal
1GPO0
2GPO1
3GPO2
4GPO3
5GPI0
6 GPI1
7GPI2
8 IGN
9 DIO_GND
Figure 12: DIO port diagram
Table 08: DIO port pinouts
2.8 Headphone and Mic-in Port
The VIA Mobile360 M820 is equipped with a Headphone and Mic-in port located on the back panel. The
Headphone and Mic-in port is for connecng external speakers such as a headphone or a microphone. The
pinouts of the Headphone and Mic-in port are shown below.
Pin Signal
1 MIC1
2Jack_det
3HPH_GND_SENSE_CONN
4CDC_HPH_R_CONN
5 CDC_HPH_L_CONN
Figure 13: Headphone and Mic-in port diagram
Table 09: Headphone and Mic-in port pinouts
2.9 COM Port
The VIA Mobile360 M820 is equipped with a COM port located on the back panel which supports TX/RX for
debugging. The pinouts of the COM port are shown below.
Pin Signal
1TX
2RX
3GND
4+5V
5 +12V
Figure 14: COM port diagram
Table 10: COM port pinouts